JP3085383U - CPU heat sink - Google Patents

Abstract

(57) [Problem] To provide a CPU heat-dissipating plate excellent in heat-dissipating effect and low in cost. SOLUTION: A cavity 110 is provided near the center bottom end, and lids 200 and 201 are attached to the top and bottom ends of the cavity to completely seal the top and bottom ends of the cavity 110. Lid 200,
Before the upper and lower portions of the cavity 110 are completely sealed by welding or fitting the high heat conductive material 120 or 121 into the interior of the cavity 110 in advance. High heat conductive material 120
Or, 121 is formed in a shape in which the periphery is completely in close contact with the inner wall of the cavity 110, and is arranged directly close to the central portion where the heat of the CPU is concentrated, and quickly absorbs the heat of the CPU. The heat-dissipating fins 102 are provided around the CPU heat-dissipating plate 100,
The heat absorbed by the highly heat-conductive material 120 or 121 is transmitted and dissipated. As a result, the heat-dissipating effect is excellent, and the increase in material cost is much lower than that of the conventional heat-dissipating plate, thereby facilitating the expansion of production and use.

Description

[Detailed description of the invention]

[0001]

[Technical field to which the invention belongs]

 The present invention relates to improving the structure of a CPU heat exhaust plate.

[0002]

[Prior art]

 Exhausted heat is extremely important to ensure proper operation of the CPU inside the computer. For this reason, many CPUs are provided at the top with overlapping heat-dissipating plates that quickly remove heat from the CPU, do not accumulate a large amount of heat inside the CPU, and prevent the CPU from burning. All CPU heat-dissipating plates on the market are integrally made of a single heat-conducting material, with a flat surface formed at the bottom end to be placed on the CPU, and a uniform surface around and at the top end. Are provided with several heat-dissipating fins. The heat-conducting material is divided into copper, which has excellent heat-conductivity, and aluminum, which has superior heat-conductivity. Even if the heat-dissipating plate is made of (aluminum), it does not affect the heat-dissipating effect. In addition, CPUs developed at several stages in the early stages of computer development have little difference in the amount of work and speed improvement, so even a small heat-dissipating plate can respond to the CPU's heat-dissipation, resulting in expensive heat transfer. The increased material costs will not be significant even if high quality copper is used, and producers can accept them.

[0003]

[Problems to be solved by the invention]

 An object of the present invention is to provide a CPU heat-dissipating plate which is excellent in heat-dissipating effect and low in cost.

[0004]

[Means for Solving the Problems]

 The CPU heat-dissipating plate of the present invention for solving the above-mentioned problems includes a cavity chamber provided near the center bottom end, and a top and bottom end of the cavity chamber attached to the top and bottom ends of the cavity chamber. A lid that is completely closed and a lid that is welded or fitted into the chamber in advance before completely sealing the top and bottom of the cavity, forming a shape that completely adheres to the inner wall of the cavity The highly heat-conducting material that is disposed directly close to the central part of the CPU where heat is concentrated and absorbs the heat of the CPU quickly, and the heat that is provided on the periphery and that is absorbed by the highly heat-conducting material is transmitted and transmitted. And a heat-dissipating fin that disperses heat.

[0005] This improves the problem that heat is likely to be generated poorly by being integrally formed with a single second-order heat conductive material as in a conventional CPU heat-dissipating plate. Since the heat-dissipating substance contains a highly heat-conducting substance, its volume naturally becomes smaller than that of the entire heat-dissipating plate, and the volume of expensive materials is reduced. Lower cost than hot plate. The excellent heat dissipation effect and the increase in material costs are much lower than those of conventional heat-extraction plates made of a single high-heat-conductivity material, which makes it easier to expand production and use. I do.

[0006]

[Embodiment of the invention]

 Hereinafter, embodiments of the present invention will be described with reference to the drawings. FIG. 1 is a perspective view of an entire CPU heat dissipation plate according to an embodiment of the present invention. Referring to FIG. 2, an exploded view of FIG. 2 and a plan view of FIG. As shown in the drawings, the structure of the CPU heat-dissipating plate 100 of the present embodiment has a flat surface formed on the CPU at the bottom end thereof, and a uniform number of heat-dissipating fins 101, four weeks. Are provided to dissipate the work heat of the CPU (not shown in the above drawings, see FIGS. 4 to 7) by increasing the surface area. By expanding the effect of increasing the surface area heat dissipation, the CPU heat dissipation plate 100 with the heat dissipation fins 101, 102,... Is made of a less economical, more economical next-generation heat conduction material. The place where the cavity 110 is provided near the center bottom end of the CPU heat dissipation plate 100, and the top and bottom ends of the cavity 110 are covered with lids to be completely sealed, and the lids 200 and 201 are welded. Alternatively, before completely sealing the upper and lower portions of the cavity 110 by tight fitting, the highly heat-conductive substance 120 or 121 is put into the cavity 110 in advance, and the periphery of the high heat-conductive substance 120 is sealed in the cavity. Completely adhere to the inner wall of 110. Further, the highly heat-conductive substance 120 in the cavity 110 of the CPU heat-dissipating plate 100 is made to directly approach the central portion of the CPU where heat is concentrated. When the surface of the hermetically sealed CPU heat exhaust plate 100 is polished and smoothed, it becomes as shown in FIG. 1. As a whole, the cavity 110 is not exposed, or there is a narrow welding trace 110A around the center in the center. Only. If the highly heat-conducting substance 121 to be put into the cavity 110 is a solid such as copper, the peripheral wall of the high heat-conductivity substance 121 is shaped to fit into the inner wall of the cavity 110 by concave and convex. The highly heat-conductive substance 121 is packed by a tightly fitting method. The tight mix fit has an excellent effect, and it is not necessary to weld or tightly fit the lids 200, 201 and the heat conductive material 121 does not fall off.

The operation of the configuration in which the highly heat-conductive substance 120 is put in the cavity 110 inside the CPU heat-dissipating plate 100 is as shown in FIGS. FIG. 4 shows a case where the above-mentioned highly heat-conductive material 120 is a solid having excellent heat conductivity, which is filled in the cavity 110 by a tight blending method, and the flat bottom surface of the highly heat-conductive material 120 is directly connected to the CPU 300. The heat of the CPU 300 can be exhausted because it is in contact with the surface of the CPU. Alternatively, as shown in FIG. 5, the highly heat-conductive substance 120 filled in the cavity 110 may be a solid (or a solid wax mass which becomes liquid when heated). The upper and lower portions of the cavity 110 are completely closed so that the highly heat-conductive substance 120 does not fall from the cavity 110 by welding or tight fitting. Alternatively, as shown in FIG. 6, the highly heat-conducting substance 120 filled in the cavity 110 may be a liquid (for example, alcohol or water), and does not fill the cavity 110, leaving a space 112 for expansion beforehand. Fill as shown. In this case, due to the heat accumulation process in which the liquid continuously becomes a gas, the work heat of the CPU 300 below the exhaust heat plate 100 is rapidly absorbed, and high-temperature steam is introduced into the cavity 110 by vaporization. During the ascent process, it hits the slightly cold inner circumference at the top end of the cavity 110, and heat is radiated from the wall of the cavity through the external heat-dissipating fins 101, 102, condenses again, falls to the bottom of the cavity 110, and is quickly discharged The effect is achieved. When the gap between the cavity chambers 110 is sealed, reinforced welding is performed so that the entire body withstands the pressure that increases during evaporation and does not explode. Further, as shown in FIG. 7, the highly heat-conductive substance 120 filled in the cavity 110 may be a gas having a high heat absorption, and may be directly below the CPU heat-dissipating plate 100 by the heat absorption of gas molecules. The heat of a certain CPU 300 is dissipated.

FIG. 8 shows a CPU heat dissipation plate according to another embodiment of the present invention. As shown in the figure, the inner wall around the cavity 110 is formed in a plurality of tooth spaces 110A, 110B,... Such as gears, and around the solid high heat conductive material 120 put in the cavity 110. Are provided corresponding to the plurality of tooth grooves 110A, 110B,... So as to be able to be tightly fitted to each other, and these tooth grooves 110A, 110B,. The surface enlarges the heat dissipating contact area between the highly thermally conductive material in the cavity 110 and the cavity wall, increasing the rate at which heat is dissipated out of the cavity wall.

As can be seen from the above, the CPU heat-dissipating plate of the present invention embeds a highly heat-conducting substance, whereby the conventional CPU heat-dissipating plate is integrally formed with a single next-order heat-conducting material, and the heat dissipation is poor. This is an improvement over the drawback that it is easy to produce, or the entire heat-dissipating plate that is commonly seen is made of a single expensive high-heat-conductivity material, which increases the cost.The heat-dissipating effect is excellent. It has a novelty that has never been used publicly.

[Brief description of the drawings]

FIG. 1 is a perspective view illustrating a CPU heat dissipation plate according to an embodiment of the present invention;

FIG. 2 is an exploded view showing a CPU heat dissipation plate according to an embodiment of the present invention;

FIG. 3 is a plan view illustrating a CPU heat dissipation plate according to an embodiment of the present invention;

FIG. 4 is a cross-sectional view illustrating a configuration of a CPU heat dissipation plate according to an embodiment of the present invention;

FIG. 5 is a sectional view showing another configuration of the CPU heat dissipation plate according to the embodiment of the present invention;

FIG. 6 is a cross-sectional view showing still another configuration of the CPU heat dissipation plate according to the embodiment of the present invention;

FIG. 7 is a cross-sectional view showing still another configuration of the CPU heat dissipation plate according to the embodiment of the present invention;

FIG. 8 is a perspective view showing a CPU heat dissipation plate according to another embodiment of the present invention.

[Explanation of symbols]

 REFERENCE SIGNS LIST 100 CPU heat-dissipating plate 101, 102 heat-dissipating fin 110 cavity chamber 120, 121 highly heat-conductive substance 200, 201 lid 300 CPU

Claims (4)

[Utility model registration claims] 1. a cavity provided in the interior near a central bottom end; a lid attached to the top and bottom ends of the cavity to completely seal the top and bottom ends of the cavity; Is welded or fitted into the cavity beforehand to completely seal the upper and lower portions of the cavity, and is formed into a shape in which the periphery is completely in close contact with the inner wall of the cavity, and a CPU is provided.
Placed directly close to the center where heat is concentrated,
A CPU having a high heat-conducting material that quickly absorbs heat of the PU; and a heat-dissipating fin that is provided around each of the heat-conducting materials and that transfers the heat absorbed by the high-heat-conducting material and radiates the heat. Hot plate. 2. The cavity has a plurality of gear-shaped tooth grooves formed on a peripheral inner wall thereof, the highly heat-conductive substance put into the interior of the cavity is solid, and the plurality of teeth are provided around the cavity. Groove teeth are provided which closely fit each other in correspondence with the grooves, and the surface of the tooth grooves increases the heat-dissipation contact surface area between the highly heat-conductive substance inside the cavity and the wall of the cavity. The CPU heat exhaust plate according to claim 1, wherein: 3. The CPU is disposed below the CPU heat-dissipating plate, and the highly heat-conducting substance is filled in the cavity and is a liquid. The space between the cavity chambers is filled so that the space is filled and the heat of the CPU is rapidly absorbed by a heat accumulation process in which the liquid continuously turns into a gas, and the entirety withstands a pressure rising when the liquid evaporates. The CPU heat-dissipating plate according to claim 1, wherein strengthening welding is performed in the hermetic construction. 4. The CPU heat-dissipating plate according to claim 1, wherein the highly heat-conducting substance is filled in the cavity and is a gas having a high heat absorption.