JP3082685B2 - Ring insertion device - Google Patents

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a process for manufacturing a solid electrolytic capacitor such as tantalum, which is provided with an electrode lead for inserting a ring of a fluorine resin or the like into an anode lead drawn out to the chip. The present invention relates to a ring insertion device for inserting a ring into an electrode lead.

[0002]

2. Description of the Related Art As an example of a solid electrolytic capacitor, a tantalum solid electrolytic capacitor has a capacitor chip (hereinafter referred to as a chip) 1 made by sintering a tantalum powder as shown in FIG. formed buried to, Ta ₂ on the surface of the chip 1 by chemical conversion treatment tip 1 O
_{(5) A} film is formed, a negative electrode (not shown) is attached to the surface thereof, and a cathode lead (not shown) is attached thereto, and a resin sheath (not shown) is applied to complete the coating.

The size of the chip 1 naturally depends on the characteristics of the capacitor, but is, for example, 1 mm × 1 mm × 1 mm.
The anode lead 2 has a length of 0.23 mmφ and the exposed portion is 6.
8 mm.

The chemical conversion treatment is performed by applying a positive voltage to the anode lead 2 and immersing the chip 1 in a treatment liquid. At this time, when the treatment liquid is applied to the lead 2 by the action of surface tension, the surface of the anode lead 2 becomes Ta. _{Since a 2} O ₅ film is formed and loses conductivity, it becomes an obstacle in subsequent steps. Therefore, as shown in FIG. 4, a resin ring (hereinafter referred to as a ring) 3 made of a material which is water-repellent, such as fluororesin, and which can withstand the treatment including the heat treatment in the subsequent steps is inserted up to the root of the anode lead 2 to form a chemical conversion treatment. The liquid is prevented from rising to the anode lead 2.

In this case, the ring 3 has a thickness of 0.2 to 0.3 m.
m, the outer diameter is, for example, 0.8 mmφ, and the inner diameter is free and slightly smaller than the diameter of the anode lead 2, 0.23 mmφ. However, in terms of the diameter of the punched punch, 0.24 mmφ slightly larger than the diameter of the anode lead 2 is appropriate. in this way,
By inserting a ring 3 having a hole diameter smaller than the diameter of the anode lead 2 into the anode lead, the ring 3 comes into contact with the anode lead 2 in a water-tight manner to prevent the chemical conversion treatment solution from rising.

A conventional apparatus for inserting the ring 3 into the anode lead 2 will be described. FIG. 5 is a plan view conceptually showing a conventional ring insertion device. For example, a transfer device such as a turntable 4 that moves intermittently includes a chuck 5 that holds the chips 1 at equal intervals. Supply position P1
A supply means 6 for supplying chips one by one, such as a parts feeder, is arranged in the table, and the chips 1 supplied with the chuck 5 are horizontally held with the anode lead 2 directed outward in the normal direction of the turntable 4. Tip processing position P
2. Move to the ring punching / temporary insertion position P3, ring confirmation position P4, main insertion position P5, and unloading position P6. Although only one chip 1 is shown in the drawing, each chuck 5 holds the chip 1. A crushing device 7 for crushing the tip of the anode lead 2 vertically and horizontally to sharpen the tip of the anode lead 2 is disposed at the tip processing position P2. Tape-like fluorine is provided at the ring punching / temporary insertion position P3. A ring punching / temporary insertion device 8 for punching a ring from the resin and inserting the ring into the tip of the anode lead 2 is arranged. An optical sensor (not shown) is arranged at the ring confirmation position P4 to confirm the presence or absence of the ring 3. The ring pushing device 9 is disposed at the main insertion position P5.

Next, while describing the operation of the ring insertion device, details of the ring insertion device including details of the ring punching / temporary insertion device 8 and the ring pushing device 9 will be described. At the supply position P1, the chips 1 are supplied one by one by a supply means 6 such as a parts feeder, and the turntable 4 is supplied.
The chuck 5 provided on the outer periphery of the substrate holds the chip 1 so that the anode lead 2 faces outward and horizontally. In this state, the turntable 4 rotates, moves to the tip processing position P2, and stops. Although a detailed description is omitted here, the tip of the anode lead 2 is crushed and sharpened by the crushing device 7 in the vertical and horizontal directions. Then, the turntable 4 further rotates to transfer the tip 1 to the ring punching / temporary insertion position P3 and stop.

FIG. 6 is a longitudinal sectional view along the anode lead 2 of the chip 1 showing the operating state of the ring punching / temporary insertion device 8 with time. As shown in FIG. 6A, gather claws 81, 81 are opened vertically from the middle end of the anode lead 2. The anode lead 2 of the chip 1 held by the chuck 5 on the turntable 4 moves between the gather claws 81, 81 in an open state. A die 82 is arranged near the tip of the anode lead 2. The die 82 is provided with a hole 83 with an outer shape, and a hole 84 with a center and a hole 85 for a guide pin at the upper and lower sides of the hole 83 at the same intervals in a penetrating state. The hole 83 having the outer shape faces the anode lead 2. A punch 86 for centering, a punch 87 for outer shape, and a guide pin 88 are provided in the holes 84, 83, 85, respectively, so as to be able to enter and exit from the opposite side of the anode lead 2 in a parallel operation to the anode lead 2. . The punch 87 has an opening 87a at the center where the tip of the anode lead 2 fits. Center punch 86,
The distance between the tip of each of the punches 87 for external shape removal and the guide pins 88 and the die 82 is provided so as to be sequentially closer in this order, and the three members move forward and backward together. Between the punches 86 and 87 and the guide pin 88 and the die 82, a fluororesin tape 3
0 is placed. The fluororesin tape 30 has a center hole 31 and an outer hole 32 previously opened. Then, while the turntable 4 is rotating to move the chip 1 to this position, the fluororesin tape 30 is fed downward by a predetermined size by a transport mechanism (not shown), and the center hole 31 is moved to the position of the outer shape hole 83 of the die 82. Next, the outer shape punching hole 32 is brought to the position of the hole 85 for the guide pin of the die 82.

Next, as shown in FIG. 6B, the gather claws 81, 8
1 closes and regulates the position of the tip of the anode lead 2,
The punch 86, the punch 87, and the guide pin 88 advance to the center. First, the guide pin 88 penetrates through the hole 32 of the fluorine resin tape 30 and enters the guide pin hole 85 of the die 82 so that the fluorine resin tape is formed. The position of the center hole 31 is accurately adjusted to the center of the hole 83 without the outer shape.

Subsequently, the punches and the like advance, the punch 86 for centering newly opens the center hole 31 in the fluororesin tape 30, and the punch 87 for punching the outer shape removes the outer shape to form the ring 3, and further forms the anode lead 2. The tip of the anode lead 2 is pushed near the tip of the anode lead 2 by pushing the ring 3 until the tip of the anode lead 2 fits into the through hole 87a. (See FIG. 6C)

Next, the punches and the like exit and the gather claws 8
The steps 1 and 81 are completed with the ring 3 temporarily inserted into the tip of the anode lead 2 by opening the anode lead 2 by opening. (See Figure D)

Next, when the turntable 4 rotates and stops at the ring confirmation position P4, the presence or absence of the ring 3 is confirmed by an optical sensor (not shown). If there is no ring 3, the chuck 5 releases the chip 1 and drops. Then, if the ring 3 is temporarily inserted normally, the holding of the chip 1 is maintained as it is.

When the turntable 4 further rotates and stops at the main insertion position P5, the ring pushing device 9 pushes the ring 3 to the root of the anode lead 2. The ring pushing device 9 will be described in detail. FIG. 7 is a vertical sectional view of a main part showing the operating state of the ring pushing device 9 in the order of elapse of time. The ring push-in device 9 is provided with pushers 91, 91 which can be moved back and forth in the longitudinal direction of the anode lead 2 and can be opened and closed so as to sandwich the anode lead 2. Initially, the pusher 91 is open at a position on the distal end side from the temporary insertion position of the ring 3 of the anode lead 2, and in this state, the chip 1 is transported to this position (see FIG. 7A). When the turntable 4 stops, the pusher 19 closes (see FIG. 7B). Subsequently, the pusher 91 moves toward the tip 1 and pushes the ring 3. The pusher 91 is elastically supported so that it does not move further after the ring 3 reaches the tip 1 (see FIG. 7C). Next, the pusher 91 returns to its original position and opens, ending the main insertion operation. (See FIG. 7D)

Next, when the turntable 4 rotates and stops at the take-out position P6, the chuck 5 opens and the chip 1 is opened.
Falls into the container. The above operation is sequentially performed by the successive chucks to insert the ring.

[0016]

However, according to the above-described apparatus, the tip 1 is held and transported by the chuck 5, and the tip of the anode lead 2 is pinched and processed at the tip processing position P2. Further, in the ring punching / temporary insertion position P3, the position of the anode lead 2 is restricted by the gather claw 81 near the tip while holding the chip 1. At this time, anode lead 2 for chip 1
There is no problem if there is no mounting error of the chip 1 or an error of the holding position of the chip 1 by the chuck 5, but if the error is large, the anode lead 2
If the position near the tip of the tip is restricted, stress is applied to the root of the anode lead 2 of the tip 1, and the fragile tip 1 may be defective due to the sintered body of the metal powder. Further, at the ring punching / temporary insertion position P3, the ring 3 is inserted near the front end of the anode lead 2 with the punch protruding in a state where the tip 1 is held, but the diameter of the anode lead 2 and the diameter of the center hole of the ring 3 are determined. The relationship is a state in which the resistance to insertion is considerably high, and the stress applied to the root of the anode lead 2 of the chip 1 is large, which is not preferable. Further, in the main insertion position P5, the ring 3 is pushed in by the pushers 91 of the ring pushing device 9 while holding the tip 1. For this reason, similarly, not only stress is applied to the chip 1, but also the anode lead 2 is likely to bend and become a defective product.

[0017]

In order to solve the above-mentioned problems, the present invention conveys a chip for an electronic component having an electrode lead in an intermittent operation, and places a resin ring halfway through the electrode lead at a ring temporary insertion position. In the ring insertion device which inserts and pushes the resin ring to the root of the anode lead at the ring main insertion position, when inserting the resin ring at the ring temporary insertion position, the root side of the electrode lead is held by a chuck. The stress is not applied to the tip when inserting the ring. It is convenient to use the chuck for holding the root side of the electrode lead as it is for holding the root side of the anode lead as a chuck for transport. Furthermore, a ring for transporting an electronic component chip having electrode leads in an intermittent operation, inserting a resin ring halfway in the anode lead at a ring temporary insertion position, and pushing the resin ring to the root of the electrode lead at a ring main insertion position. In the insertion device, at the time of pushing the resin ring at the ring main insertion position, the tip side of the electrode lead is held by a chuck so that stress at the time of inserting the ring is not applied to the chip. I do.

[0018]

DESCRIPTION OF THE PREFERRED EMBODIMENTS A ring insertion device according to the present invention will be described with reference to the drawings. FIG. 1 is a plan view conceptually showing a ring insertion device as an example of the present invention. For example, chucks 15 are provided at equal intervals in a transfer device that moves intermittently, such as a turntable 14. The chuck 15 holds the root of an electrode lead (in this case, an anode lead) (not shown) in a vertical manner. At the supply position P1, supply means 16 for supplying chips for electronic components (in this case, solid electrolytic capacitor chips) such as a parts feeder is arranged, and a solid electrolytic capacitor (hereinafter, chip) 1 supplied with a chuck 15 is provided. The root portion of the anode lead (not shown) is vertically moved while sequentially holding the anode lead in the vertical processing position P2, the ring punching / temporary insertion position P3, the ring confirmation position P4, the main insertion position P5, and the removal position P6. I do. A crushing device 17 for crushing and sharpening the tip corner of the anode lead in the vertical and horizontal directions respectively is disposed at the tip processing position P2, and a tape-shaped fluorine resin is provided at the ring punching / temporary insertion position P3. A ring punching / temporary insertion device 18 for punching out a ring from the base and inserting it into the tip of an anode lead (not shown) is arranged, and an optical sensor (not shown) is arranged at a ring confirmation position P4 to confirm the presence or absence of the ring 3. I do. Full insertion position P5
, A ring pushing device 19 is arranged.

Next, while explaining the operation of the ring insertion device, details of the ring insertion device including details of the punching / temporary insertion device 18 and the ring pushing device 19 will be described.
At the supply position P1, chips 1 are supplied one by one by a supply means 16 such as a parts feeder, and the turntable 14 is supplied.
A chuck 15 provided on the outer periphery of the chip 1 holds a root portion of the anode lead (not shown) of the chip 1 so that the anode lead (not shown) faces downward. Turntable 1 in that state
4 rotates, moves to the tip processing position P2, and stops. Although a detailed description is omitted here, the crushing device 17 processes the tip of the anode lead (not shown) so that it is pinched and crushed in the vertical and horizontal directions. Then, the turntable 14 further rotates to transfer the tip 1 to the ring punching / temporary insertion position P3 and stop.

FIG. 2 is a longitudinal sectional view showing the operating state of the ring punching / temporary insertion device 18 with time and taken along the line AA in FIG. As shown in FIG. 2A, gather claws 181 and 181 are opened near the tip of the anode lead 2. The gather claws 181 and 181 are arranged so as to open and close in the direction of the normal of the turntable 14 (in the direction of the front and back of the drawing), but are shown so as to open and close in the tangential direction of the turntable 14 to simplify the drawing. Please be careful. The anode lead 2 of the chip 1 held on the chuck 15 on the turntable 14 moves between the gather claws 181 and 181 in an open state. A die 182 is arranged near the tip of the anode lead 2. The die 182 is provided with a hole 183 having an outer shape, a hole 184 having a center, and a hole 185 for a guide pin at the same intervals on the left and right sides thereof at the same intervals. The hole 183 without the outer shape is the anode lead 2
Facing. The gather claw 181 and the die 182 can move up and down without changing their relative positional relationship in the height direction. Holes 184, 183, 185 of die 182
A punch 186 for removing the center, a punch 187 for removing the outer shape, and a guide pin 188 are provided so as to be able to enter and retreat from the opposite side of the anode lead 2 by operations parallel to the anode lead 2. The punch 187 has an opening 187a at the center where the tip of the anode lead 2 fits. Center punch 186, outline punch 18
7. The distance between the tip of each of the guide pins 188 and the die 182 is provided so as to become closer in this order, and the three members move forward and backward together. These punches 186, 187 and die 182
A fluorine resin tape 30 is disposed between them. The fluororesin tape 30 has a center hole 31 and an outer hole 32 previously opened. Then, while the turntable 14 is rotating to move the chip 1 to this position, the fluororesin tape 30 is fed to the right by a predetermined size by a transport mechanism (not shown), and the center hole 31 is formed in the outer shape hole 183 of the die 182. In the position, the outline punching hole 32 is inserted into the hole 1 for the guide pin of the die 182.
It is at 85.

Next, the gather claws 181, the die 182 and the fluorine resin tape 30 are raised and the gather claws 181 are raised.
Then, the position of the tip of the anode lead 2 is regulated, and the tip of the anode lead 2 enters the outer shape hole 183. At the same time, the punch 186 for removing the center, the punch 187 for removing the outer shape, and the guide pin 188 advance further, and the guide pin 188 is first inserted into the outer hole 32 of the fluorine resin tape 30.
Penetrates into the guide pin hole 185 of the die 182 to regulate the position of the fluororesin tape 30, and
Is accurately aligned with the center of the hole 83 having the outer shape. (See FIG. 2B)

Subsequently, gather claws 181, dies 182,
The fluororesin tape 30 rises, and the tip of the anode lead 2 penetrates the outer hole 183 of the die 182 and the center hole 31 of the fluororesin 30 and stops at a predetermined position. During this time, the punch and the like also rise, the tip of the anode lead 2 fits into the through hole 187a of the outer shape punch 187, and further rises after the die 182 and the like are stopped. The center punch 186 is newly attached to the fluorine resin tape 30. The punch 187 for removing the outer shape is made into a ring 3 by removing the outer shape, and further pushing the ring 3 to bring it to a predetermined position of the anode lead 2. In FIG. 2C, the guide pin 188 is illustrated as penetrating the gather claw 182. However, since the gather claw 182 is oriented in the front and back directions of the drawing, this is not the case.
(See Fig. 2C)

Next, the punch or the like is withdrawn and the gather claws 18 are formed.
1, 181 is opened to open the anode lead 2, the gather claws 181, the die 182, and the fluororesin 30 are lowered to their original positions, and this step is performed in a state where the ring 3 is temporarily inserted into a predetermined position of the anode lead 2. finish. (See FIG. 2D)

According to this apparatus, since the chuck 15 holds the anode lead 2, no stress is applied to the chip 1 when the ring 3 is temporarily inserted.

Next, when the turntable 14 rotates and stops at the ring confirmation position P4, the presence or absence of the ring 3 is confirmed by an optical sensor (not shown).
If there is no, the chuck 15 opens and drops the chip 1,
If the ring 3 is temporarily inserted normally, the tip 1
Maintain retention.

When the turntable 14 further rotates and stops at the full insertion position P5, the ring pushing device 19
Pushes the ring 3 to the root of the anode lead 2. next,
The ring pushing device 19 will be described in detail. FIG. 3 is a vertical sectional view of an essential part showing the operating state of the ring pushing device 19 in the order of elapse of time, and is a sectional view along the line BB in FIG. The ring pushing device 19 includes pushers 191, 19
1 can be moved back and forth in the length direction of the anode lead 2
It is provided to open and close freely so as to sandwich it. Further, a second chuck 192 is provided on the lower side thereof so as to be able to advance and retreat in the longitudinal direction of the anode lead 2 and open and close so as to sandwich the anode lead 2. Initially, the pusher 191 and the second chuck 192 are opened to a position on the distal end side from the temporary insertion position of the ring 3 of the anode lead 2, and the chip 1 is conveyed to this position in this state (FIG. 3).
A). Although the chuck 15 is shown to open and close in the left and right directions in the figure, it actually opens and closes in the tangential direction of the turntable 14 and opens and closes in the front and back sides of the paper, but in order to simplify the drawing, It is drawn like this.

When the turntable 14 stops, the pusher 191 and the second chuck 192 close. The second chuck 192 holds the tip portion of the anode lead 2, and the pusher 191 is slidably sandwiched with respect to the fixed anode lead 2 even when closed. (See FIG. B).

Subsequently, the pusher 191 is moved upward (tip 1
Side), push the ring 3 in and the chuck 15
Is opened to open the anode lead 2, and the anode lead 2 is held by only the second chuck 192. In this state, the pusher 191 further moves up and pushes the ring 3 to the root of the anode lead 2. The pusher 191 is elastically supported so that it does not move further after the ring 3 reaches the tip 1 (see FIG. 3C).

Next, the pusher 191 is returned by a predetermined amount, and the second chuck 192 is raised by a distance to avoid the ring 3 with the tip of the anode lead 2 held, and then the chuck 15 is closed to hold the anode lead 2. cure. (FIG. 3
D)

Subsequently, the pusher 191 and the second chuck 192 are opened to return to the original position shown in FIG. 3A, and the main insertion operation ends.

In the full insertion operation of the ring 3 by this device, the tip of the anode lead 2 is held and the ring 3 is pressed, so that the anode lead 2 is bent or deformed, and the root of the anode lead 2 of the chip 1 is stressed. Will not be added.

Next, when the turntable 14 rotates and stops at the take-out position P6, the chuck 15 opens and the chip 1 falls into the container. The above operation is sequentially performed by the successive chucks to insert the ring.

In the above embodiment, the chuck 15 for transporting the chip 1 holds the anode lead 2 in the vertical direction, but may hold the anode lead 2 in the horizontal direction.

[0033]

As described above, according to the present invention, a ring can be inserted without applying stress to a chip or causing deformation of an anode lead.

[Brief description of the drawings]

FIG. 1 is a plan view of an embodiment of the present invention.

FIG. 2 is a longitudinal sectional view of a main part showing the main part in the order of operation.

FIG. 3 is a longitudinal sectional view of a main part showing another main part of the device in the order of operation.

FIG. 4 is a perspective view of a capacitor chip applied to this device.

FIG. 5 is a plan view of a conventional device.

FIG. 6 is an essential part longitudinal sectional view showing the essential parts in the order of operation.

FIG. 7 is a longitudinal sectional view of a main part showing another main part of the device in the order of operation.

[Explanation of symbols]

 DESCRIPTION OF SYMBOLS 1 Chip (chip for electronic components) 2 Anode lead (electrode lead) 3 Ring (resin ring) 14 Turntable 15 Chuck 182 Die 187 Punch for shape removal 191 Pusher 192 Second chuck P3 Ring temporary insertion position P5 Ring insertion position

Claims (4)

(57) [Claims] An electronic component chip provided with an electrode lead is conveyed in an intermittent operation, a resin ring is inserted halfway into the electrode lead at a ring temporary insertion position, and the resin ring is connected to the electrode lead at a ring full insertion position. In the ring insertion device for pushing the resin to the root, when inserting the resin ring at the ring temporary insertion position, the root side of the lead is held by a chuck. 2. The ring insertion device according to claim 1, wherein the chuck for holding the root side of the electrode lead is a chuck for transporting, and does not hold when the ring is temporarily inserted. 3. An electronic component chip provided with an electrode lead is conveyed by an intermittent operation, a resin ring is inserted halfway into the electrode lead at a ring temporary insertion position, and the resin ring is connected to the electrode lead at a ring full insertion position. A ring insertion device for pushing the resin lead to the root, wherein a tip end of the anode lead is held by a chuck when the resin ring is pushed in at the ring insertion position. 4. The method according to claim 1, wherein the transfer to the main insertion position is performed by holding a root side of the electrode lead with a chuck, and a second chuck provided at the main insertion position changes the tip of the electrode lead. Item 4. The ring insertion device according to Item 3.