JP3079025U - Computer chassis cooling system - Google Patents

Abstract

(57) [Problem] To provide a cooling device that effectively dissipates generated heat and efficiently lowers the temperature inside a computer chassis. A cooling device for a computer chassis includes a housing having a compression device, a condensation device, an evaporation device, and a pipe member connecting the compression device, the condensation device, and the evaporation device to form a circulation. The computer chassis is communicated with the housing by an air outlet, and the air flowed by the fan inside the housing flows into the chassis to cool down the temperature inside the chassis, and the air flows into the housing for processing by the cooling device. It flows down through the inlet and enters the housing.

Description

[Detailed description of the invention]

[0001]

[Technical field to which the invention belongs]

 The present invention relates to a cooling device for a computer chassis, and more particularly, to a cooling device having a condensing device, a compressing device, and an evaporating device. Tubes are used to connect these devices in a circular fashion, and a central processing unit ("CPU") and peripherals are used to protect computer components from failure due to excessive heat. Ensure that the heat generated by the device is effectively dissipated.

[0002]

[Prior art]

 In order to increase the overall speed of existing computers, the speed of the CPU has been significantly increased. In order to match the speed of the newly developed CPU, the speed of the dynamic access memory (hereinafter "DRAM") must also be increased to 100 MHz, 133 MHz or higher. Due to the increased performance of other components, increased hard disk capacity and reduced hard disk query processing time, hard disk speeds have increased significantly, often reaching 7200 rpm. The higher the speed, the shorter the response time of the CPU, and the DRAM and all other peripherals will significantly increase the heat generated by the computer. Even with existing heat dissipation devices in computers, there is no way to efficiently dissipate such large amounts of heat within seconds. According to the analysis, about 37% of the total generated heat is generated by the operation of the CPU. Thus, when the heat generated is not effectively dissipated, the accuracy of the CPU is severely affected, and the overheated CPU sometimes results in computer failure, malfunction, or a complete shutdown.

[0003]

[Problems to be solved by the invention]

 In order to deal with situations that are becoming increasingly serious due to the ever-increasing performance of computer peripherals, the present invention aims to provide an improved cooling system to solve these problems.

[0004]

[Means for Solving the Problems]

 The main object of the present invention is achieved by providing an improved cooling device for a computer chassis. Such a cooling device has a compression device, a condensing device, a vapor deposition device, and a pipe member connecting these together to a computer, and the cool air generated from the cooling device efficiently lowers the temperature inside the computer chassis. It can be done.

[0005] Other objects, advantages and novel features of the present invention will become more apparent from the following detailed description, taken in conjunction with the accompanying drawings.

[0006]

[Embodiment of the invention]

 Referring to FIGS. 1, 2 and 3, the cooling device according to the present invention comprises a compression device 26, a condensing device 28, an evaporating device 30, and a pipe member 32 connecting the devices so as to form a circulation. Having a housing. Cooling fan 284 and fins 282 are mounted near condenser 28. With such an arrangement, the heat from the condenser is directed out of casing 20 by a cooling fan. An air outlet 22 and an air inlet 24 (shown in FIGS. 2 and 3) are formed on the upper surface of the casing 20 for communicating with the inside of the computer chassis 10. Further, the cooling device of the present invention includes a fan 34 disposed below the air outlet 22 so that the cool air is directed to the computer chassis 10 through the air passage 23 by the fan 34, an inner surface of the housing 20, and a plate member. 36 and an air passage 23 formed by

When the cooling device is operating, the compression device 26 sends the coolant inside the compression device 26 to the evaporator 30 and the condenser 28 by a pipe member 32 for forming a circulation. The suction from the fan 34 draws the heated air inside the computer chassis 10 downward and through the air inlet 24 into the housing 20. As the heated air inside the computer chassis flows over the evaporator 30, heat is removed from the air. The cooled air is then flowed by fan 34 through air passage 23 and into computer chassis 10, which cools the components inside the computer chassis and maintains the components in a stable working condition. By using the cooling device according to the present invention, all components that generate heat can be cooled to maintain the operation mode of the computer.

According to the above description, the present invention has the advantage of cooling down the temperature efficiently and the existing computer chassis does not require any modification.

While the embodiments of the present invention have been described, it will be apparent to those having skill in the art that changes in detail, particularly in matters of shape, size and arrangement of parts, are possible. .

[Brief description of the drawings]

FIG. 1 is a perspective view of a cooling device according to the present invention used in a computer chassis.

FIG. 2 is a side view of the cooling device and the computer chassis of FIG. 1 taken along line 2-2.

FIG. 3 is a schematic front view of the cooling device of FIG. 1 taken along line 3-3, showing the airflow through the cooling device; a computer chassis is imagined for understanding the internal structure of the cooling device of the present invention; Shown by lines.

[Explanation of symbols]

 DESCRIPTION OF SYMBOLS 10 Computer chassis 20 Housing 22 Air outlet 23 Air passage 24 Air inlet 26 Compressor 28 Condenser 30 Evaporator 32 Pipe member 34 Fan 36 Plate material

Claims (3)

[Utility model registration claims] 1. A housing communicating with a chassis, the housing comprising:
A housing having a compressor, a condenser, an evaporator, and a tube connecting the compressor, the condenser and the evaporator to form a circulation, and an interior of the housing to allow air to flow into the chassis. A cooling device for the computer chassis, including a fan arranged in the computer chassis. 2. The housing has an air outlet and an air inlet formed to communicate with the inside of the chassis,
The apparatus of claim 1, wherein air flowed by the fan flows from the housing into the chassis, and air inside the chassis can flow into the housing via the air inlet. 3. The apparatus of claim 2, wherein an air passage is formed by an inner surface of the housing and a plate, and air is directed to the chassis via the air passage above the fan.