CN220473960U - Computer server heat sink - Google Patents
Computer server heat sink Download PDFInfo
- Publication number
- CN220473960U CN220473960U CN202322358799.9U CN202322358799U CN220473960U CN 220473960 U CN220473960 U CN 220473960U CN 202322358799 U CN202322358799 U CN 202322358799U CN 220473960 U CN220473960 U CN 220473960U
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- casing
- pipe
- fixed mounting
- computer server
- fan
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- 239000004065 semiconductor Substances 0.000 claims abstract description 18
- 238000005057 refrigeration Methods 0.000 claims abstract description 15
- 238000001816 cooling Methods 0.000 claims abstract description 14
- 239000000428 dust Substances 0.000 claims description 6
- 230000008093 supporting effect Effects 0.000 claims description 6
- 230000017525 heat dissipation Effects 0.000 abstract description 4
- 230000009286 beneficial effect Effects 0.000 abstract description 2
- 230000000694 effects Effects 0.000 description 7
- 238000009434 installation Methods 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- 230000000903 blocking effect Effects 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 238000000034 method Methods 0.000 description 1
- 238000006467 substitution reaction Methods 0.000 description 1
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- Cooling Or The Like Of Electrical Apparatus (AREA)
Abstract
The utility model provides a cooling device of a computer server, and mainly relates to the technical field of computer heat dissipation equipment. The utility model provides a computer server heat sink, includes the casing, one side fixed mounting semiconductor refrigeration fan of casing, the gas outlet fixed mounting blast pipe of semiconductor refrigeration fan, the bottom of the lateral run through casing one side of blast pipe and rather than fixed connection, one side fixed mounting blast pipe of casing inner wall bottom surface, the gas outlet department fixed mounting fan of blast pipe, one side fixed mounting air discharge fan of casing top surface. The utility model has the beneficial effects that: when the device is used, cold air can be directly blown into the shell through the semiconductor refrigeration fan, so that the rapid cooling in the shell is realized.
Description
Technical Field
The utility model mainly relates to the technical field of computer heat dissipation equipment, in particular to a computer server cooling device.
Background
A server, also called a server, is a device that provides computing services. Since the server needs to respond to the service request and process it, the server should generally have the ability to afford the service and secure the service. The server includes a processor, a hard disk, a memory, a system bus, and the like, and is similar to a general-purpose computer architecture, but is required to provide highly reliable services, and thus has high demands in terms of processing capacity, stability, reliability, security, scalability, manageability, and the like. Under the network environment, the service types provided by the servers are different and are divided into file servers, database servers, application program servers, WEB servers and the like.
The heat dissipation mode in the prior art generally increases the heat dissipation efficiency to a certain extent, even causes fire, and has larger potential safety hazards, namely, the heat in the shell of the computer server is pumped outwards by increasing the heat of a fan, and the temperature reduction effect is increased by increasing the fluidity of the air in the shell of the computer server.
Disclosure of Invention
In order to solve the defects in the prior art, the utility model provides a computer server cooling device, which is realized by the following technical scheme:
the utility model provides a computer server heat sink, includes the casing, one side fixed mounting semiconductor refrigeration fan of casing, the gas outlet fixed mounting blast pipe of semiconductor refrigeration fan, the bottom of the lateral run through casing one side of blast pipe and rather than fixed connection, one side fixed mounting blast pipe of casing inner wall bottom surface, the gas outlet department fixed mounting fan of blast pipe, one side fixed mounting air discharge fan of casing top surface.
Further, the first connecting pipe of fixed mounting in the casing, the lateral wall of casing and rather than fixed connection are transversely run through to the one end of first connecting pipe, the periphery fixed mounting of first connecting pipe has a plurality of outer end confined nozzle stubs, the one end of the other end fixed connection second connecting pipe of first connecting pipe, the other end of second connecting pipe and the periphery fixed connection of blast pipe.
Further, a plurality of heat exchange fins are fixedly arranged on the periphery of the short pipe.
Further, the baffle is fixedly installed in the exhaust pipe, the baffle is located between the air outlet of the exhaust pipe and the second connecting pipe, and a gap is reserved between the bottom of the baffle and the bottom of the inner wall of the exhaust pipe.
Further, an air inlet pipe is fixedly arranged at the air inlet of the semiconductor refrigeration fan, and a dust screen is arranged in the air inlet pipe.
Further, supporting feet are fixedly arranged at four corners of the bottom surface of the shell.
Compared with the prior art, the utility model has the beneficial effects that:
when the device is used, cold air can be directly blown into the shell through the semiconductor refrigeration fan, so that the quick cooling in the shell is realized, and meanwhile, the exhaust fan can timely exhaust the hot air in the shell outwards, so that the cooling effect of the device on the inside of the shell is further improved.
Drawings
FIG. 1 is a schematic diagram of the structure of the present utility model;
FIG. 2 is an enlarged view of part of I of FIG. 1;
fig. 3 is an enlarged view of part ii of fig. 1.
The reference numbers shown in the drawings: 1. a housing; 2. a semiconductor refrigeration fan; 3. an exhaust pipe; 4. a fan; 5. an exhaust fan; 6. a first connection pipe; 7. a short pipe; 8. a second connection pipe; 9. a heat exchange fin; 10. a baffle; 11. an air inlet pipe; 12. and supporting the feet.
Detailed Description
The utility model will be further described with reference to the accompanying drawings and specific embodiments. It is to be understood that these examples are illustrative of the present utility model and are not intended to limit the scope of the present utility model. Further, it will be understood that various changes or modifications may be made by those skilled in the art after reading the teachings of the utility model, and such equivalents are intended to fall within the scope of the utility model as defined herein.
Examples: computer server heat sink
As shown in fig. 1-3, a cooling device for a computer server comprises the following specific structures:
the semiconductor refrigerating fan 2 is fixedly arranged on one side of the casing 1, the semiconductor refrigerating fan 2 is electrically connected with a power supply, the exhaust pipe 3 is fixedly arranged at the air outlet of the semiconductor refrigerating fan 2, the exhaust pipe 3 transversely penetrates through the bottom of one side of the casing 1 and is fixedly connected with the bottom, the exhaust pipe 3 extends into the casing 1, the exhaust pipe 3 is fixedly arranged on one side of the bottom surface of the inner wall of the casing 1, the fan 4 is fixedly arranged at the air outlet of the exhaust pipe 3, the exhaust fan 5 is fixedly arranged on one side of the top surface of the casing 1, and the exhaust fan 5 is communicated with the inside of the casing 1.
The casing 1 is internally and fixedly provided with a first connecting pipe 6, one end of the first connecting pipe 6 transversely penetrates through the side wall of the casing 1 and is fixedly connected with the side wall, the periphery of the first connecting pipe 6 is fixedly provided with a plurality of short pipes 7 with closed outer ends, the short pipes 7 are communicated with the inside of the first connecting pipe 6, the other end of the first connecting pipe 6 is fixedly connected with one end of a second connecting pipe 8, the other end of the second connecting pipe 8 is fixedly connected with the periphery of the exhaust pipe 3, and the second connecting pipe 8 is communicated with the inside of the exhaust pipe 3. When the device is used, cold air in the exhaust pipe 3 can enter the corresponding short pipe 7 through the second connecting pipe 8 and the first connecting pipe 6 which are communicated with the cold air, the short pipe 7 further cools the interior of the shell 1 by radiating hot air on the upper portion in the shell 1, so that the hot air is prevented from gathering in the shell 1, and the cooling effect of the device is improved.
And a plurality of heat exchange fins 9 are fixedly arranged on the periphery of the short pipe 7. The heat exchange efficiency of the short pipe 7 and the air in the shell 1 can be further improved through the heat radiating fins 9, and the heat exchange effect of the device is further improved.
The baffle 10 is fixedly installed in the exhaust pipe 3, the baffle 10 is positioned between the air outlet of the exhaust pipe 3 and the second connecting pipe 8, and a gap is reserved between the bottom of the baffle 10 and the bottom of the inner wall of the exhaust pipe 3. When the structure is used, the baffle plate 10 can play a corresponding role in blocking the air in the exhaust pipe 3, so that the air pressure in the exhaust pipe 3 is improved, and cold air in the exhaust pipe 3 can smoothly enter the second connecting pipe 8.
An air inlet pipe 11 is fixedly arranged at the air inlet of the semiconductor refrigeration fan 2, and a dust screen is arranged in the air inlet pipe 11. The dust screen can play the effect of dust fall, reduces the dust and gets into in the casing 1 through intake pipe 11.
Supporting feet 12 are fixedly arranged at four corners of the bottom surface of the machine shell 1. The supporting feet 12 can have a corresponding supporting effect on the machine shell 1, so that the machine shell 1 is separated from the ground, and the machine shell 1 is prevented from being affected with damp.
The technical effects are as follows:
when the device is used, the power supply of the semiconductor refrigeration fan 2 is connected, and when the semiconductor refrigeration fan 2 is electrified to work, cold air can be directly blown into the shell 1 through the exhaust pipe 3 connected with the semiconductor refrigeration fan, so that the cold air is neutralized with hot air in the shell 1, the temperature in the shell 1 is quickly reduced, the uniformity of the cold air blown out of the exhaust pipe 3 can be improved by the fan 4, the temperature of the shell 1 can be quickly reduced, and hot air in the shell 1 is timely discharged outwards through the exhaust fan 5, so that heat is prevented from accumulating in the shell 1, and the radiating effect of the device is further improved.
In the explanation of the present utility model, it should be noted that the term "azimuth" is merely for convenience of description and understanding, and does not limit the installation position of specific technical features uniquely, but does not exclude other installation manners that can be implemented.
Finally, it should be noted that: the above embodiments are only for illustrating the technical solution of the present utility model, and are not limiting; although the utility model has been described in detail with reference to the foregoing embodiments, it will be understood by those of ordinary skill in the art that: the technical scheme described in the foregoing embodiments can be modified or some technical features thereof can be replaced by equivalents; such modifications and substitutions do not depart from the spirit and scope of the technical solutions of the embodiments of the present utility model.
Claims (6)
1. A computer server cooling device, comprising a casing (1), characterized in that: one side fixed mounting semiconductor refrigeration fan (2) of casing (1), the gas outlet fixed mounting blast pipe (3) of semiconductor refrigeration fan (2), the bottom of casing (1) one side is transversely run through to blast pipe (3) and rather than fixed connection, one side fixed mounting blast pipe (3) of casing (1) inner wall bottom surface, the gas outlet department fixed mounting fan (4) of blast pipe (3), one side fixed mounting air discharge fan (5) of casing (1) top surface.
2. A computer server cooling device according to claim 1, wherein: the utility model discloses a casing, including casing (1), casing, first connecting pipe (6) of fixed mounting in casing (1), the lateral wall of casing (1) is transversely run through to the one end of first connecting pipe (6) and rather than fixed connection, the periphery fixed mounting of first connecting pipe (6) has a plurality of outer end confined nozzle stub (7), the one end of the other end fixed connection second connecting pipe (8) of first connecting pipe (6), the other end of second connecting pipe (8) and the periphery fixed connection of blast pipe (3).
3. A computer server cooling device according to claim 2, wherein: and a plurality of heat exchange fins (9) are fixedly arranged on the periphery of the short pipe (7).
4. A computer server cooling device according to claim 2, wherein: the baffle (10) is fixedly installed in the exhaust pipe (3), the baffle (10) is positioned between the air outlet of the exhaust pipe (3) and the second connecting pipe (8), and a gap is reserved between the bottom of the baffle (10) and the bottom of the inner wall of the exhaust pipe (3).
5. A computer server cooling device according to claim 1, wherein: an air inlet pipe (11) is fixedly arranged at the air inlet of the semiconductor refrigeration fan (2), and a dust screen is arranged in the air inlet pipe (11).
6. A computer server cooling device according to claim 1, wherein: supporting feet (12) are fixedly arranged at four corners of the bottom surface of the shell (1).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202322358799.9U CN220473960U (en) | 2023-08-31 | 2023-08-31 | Computer server heat sink |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202322358799.9U CN220473960U (en) | 2023-08-31 | 2023-08-31 | Computer server heat sink |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN220473960U true CN220473960U (en) | 2024-02-09 |
Family
ID=89804333
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202322358799.9U Active CN220473960U (en) | 2023-08-31 | 2023-08-31 | Computer server heat sink |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN220473960U (en) |
-
2023
- 2023-08-31 CN CN202322358799.9U patent/CN220473960U/en active Active
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