JP3078110B2 - Single side polishing method - Google Patents

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

The invention sided Migaku Ken method BACKGROUND OF THE, especially cracks in the end surface such as a glass substrate, cracks, as well as to completely eliminate the occurrence of scratches, adhesion to the workpiece end faces of Migaku Ken material it relates to prevention was one-sided Migaku Ken method.

[0002]

Conventionally generally sided Migaku Ken way <br/> method being carried out, stuck carriers spaced holes workpiece fits to the pressure plate to the workpiece, Migaku Ken such as cerium oxide It has been carried out in a way that timber to be Migaku Ken <br/> processed while applying Migaku Ken liquid suspended in water, if the defect-free as a substrate for LCD large mask, high accuracy is required A method of attaching a soft cloth to the pressure plate side has also been proposed (see Japanese Patent Application No. 3-317539).

[0003] However, when the workpiece is a rectangular substrate made of a brittle material such as glass, there is a disadvantage that the probability of occurrence of defects such as cracks, cracks and scratches on the outer peripheral portion of the substrate is extremely high. , it is also a substrate by there is also disadvantageous in that scratches on the substrate surface caused by wear debris of the glass pieces and carriers generated at this time, which is of varying direction of the force experienced by the substrate during Migaku Ken Is trying to move to a stable position in the carrier.

In the case of single-sided Migaku Ken of the square substrate, the carrier since the rotation as shown in FIG. 3, the direction of the force experienced by the substrate in the carrier is changing as shown in Fig. 4 substantially at a constant angular velocity Therefore, as shown in FIG. 4, the movement of the substrate in the carrier causes the substrate to move in a different direction in the carrier each time the force applied to the substrate changes, thereby causing a collision on the side surface of the carrier. As a result, defects such as cracks occur on the substrate end face, glass fragments are released from the substrate, and carrier wear debris is released.

Further, cracks and breakage about this, even if a defect such as scratches is not generated, since the substrate and the carrier collide with considerable force, Migaku Ken material will be forced into fine irregularities of the substrate end face By the phenomenon,
When cleaning the substrate after Migaku Ken, it takes this tucked was Migaku Ken material is gradually released significant time to clean the substrate, and was a drawback that it is difficult to finish cleaning. For this reason, conventionally, the clearance between the carrier and the substrate is made as small as possible so that the time for which the substrate receives the force is shortened and the impact force when the substrate collides with the carrier is minimized. In order to impart an impact property, the end face of the substrate is processed into a mirror surface.

[0006]

However, even if the clearance between the carrier and the substrate is reduced as much as possible by improving the processing accuracy of the carrier, the generation of surface defects due to cracks, cracks, scratches and carrier abrasion is completely eliminated. it is difficult, not can be prevented from being pushed into the substrate edge portions of Migaku Ken material, which is crack even when the substrate end face in the mirror, cracks, the occurrence of surface defects due to flaws and carriers wear debris that often To the extent that
This cannot be completely suppressed.

Further, this is the method comprising a mirror substrate end face, be used in combination with methods for reducing the clearance between the carrier and the substrate as much as possible, rubbing scratches may occur between the carrier and the substrate, Migaku Ken material on its wound May be pushed in, cracks and cracks may be generated from the scratched part, carrier wear debris can not be eliminated, basic processing,
In particular, in the case of cleaning, a substrate with a mirror-finished end surface is very slippery and poses another danger of danger when handled manually, and it takes a considerable amount of time to make the substrate end surface a mirror-finished surface. However, there is a disadvantage that it is disadvantageous economically.

[0008]

SUMMARY OF THE INVENTION The present invention relates to a single-side polishing method which solves such disadvantages and disadvantages.
This is because in a one-side polishing method in which a cloth is attached to a hole in a carrier attached to a pressure plate and then the workpiece is polished with a workpiece, a certain depth is provided along the carrier surface where the carrier and the workpiece come into contact. The present invention is characterized in that a carrier is used which is provided with a concave portion and which has a nonwoven fabric made of foamed polyurethane adhered from the concave portion to the side surface of the carrier which comes into contact with the workpiece.

That is, the present inventors have conducted various studies to develop a single-side polishing method that eliminates the occurrence of defects such as cracks, cracks, scratches, and surface defects on the end face of the substrate. As a result, the carrier mounted on the pressure plate was developed. with pasting cloth hole portion of the inner, provided a recess of constant depth along the carrier surface from the carrier edge, foamed polyurethane carrier side portion for contacting a workpiece from the recess
The use of a carrier with a nonwoven fabric attached makes it possible to eliminate defects such as cracks and cracks that occur on the end face of the substrate, and that defects are not generated on the substrate surface even when wear debris occurs. the heading, was here to concave body of depth, to promote the study of such clearance between the carrier and the workpiece to the completion of the present invention. This is described in more detail below.

[0010]

DETAILED DESCRIPTION OF THE INVENTION The present invention relates to single-side polishing method, when it is polished by sticking a cloth hole portion in the carrier attached to the pressure plate,
A concave portion having a constant depth is provided along the carrier surface from the carrier end surface where the carrier and the workpiece come into contact, and from the concave portion to the carrier side surface portion that comes into contact with the workpiece.
The use of a carrier to which a foamed polyurethane non-woven fabric is adhered makes it possible to eliminate the occurrence of defects such as cracks and cracks on the end face of the substrate, and to reduce the surface of the substrate due to wear debris. Has the advantage that the occurrence of defects can be prevented.

[0011] The single-sided Migaku Ken method of the present invention is first stuck a carrier opened a larger hole than the substrate size to the pressure plate in accordance with the proposal earlier, but it is the stick the cloth to the top plate of his career, this cloth since the compression modulus may be of a suede type with foam layer with those of 3 to 80%, it may be assumed to consist of a nonwoven fabric of polyurethane foam, this compound Zhang the hole portion in the carrier Or may be stretched over the workpiece.

Since the carrier used here is not immersed in water, it may be generally made of a vinyl chloride resin, but this carrier has a carrier end face in contact with the carrier and the workpiece. Part, a constant depth along the carrier surface, for example, a depth of 0.5 to 1.5 m
m is provided, and a non-woven fabric made of polyurethane foam is attached from the recessed portion to the side surface of the carrier that comes into contact with the workpiece. As shown in FIG. 1, this recess has a certain width from the side surface of the carrier in contact with the substrate to the outer periphery. If the width is 5 mm or less, the probability of peeling of the cloth during polishing increases, and stable polishing is performed. Therefore, the thickness is preferably 5 mm or more, preferably 10 mm or more.

The carrier is provided with a hole for attaching a cloth, and the size of the hole needs to be such that an appropriate gap is formed when a substrate on which the cloth is attached is inserted. . However, this gap is not that it is 1mm or less substrate end face after completion Migaku Ken is a semi-specular, to effect in the wash is reduced by half, the wear of the fabric of the carrier end surface portion becomes violent when is 4mm or more In an extreme case, the cloth is lost and contact with the carrier occurs, and cracks occur on the end face of the substrate.

Further, although the present invention is the carrier affixed foamed polyurethane <br/> nonwoven fabric toward the carrier side portion for contacting a workpiece from the recessed portion are used, affixed foamed polyurethane nonwoven fabric, This non-woven
If the cloth protrudes from the carrier, the nonwoven fabric tends to peel off during polishing, so that it is preferable not to protrude from the carrier. The nonwoven fabric has a water resistance, you as scratches is not generated on the substrate surface by wear debris. In addition,
The attached polyurethane nonwoven fabric is preferably integrated from the recessed portion to the carrier end body in order to prevent the nonwoven fabric from peeling.

[0015]

Next, examples of the present invention and comparative examples will be described. Example 1 Oscar-type single-sided Migaku Ken apparatus and using the Lapmaster Corp.], a hole of 402mm square in the center of the vinyl chloride resin plate having a diameter of 600mmφ as the carrier, on the periphery of the hole With a 10mm width and 0.6mm depth dent, a cloth NF-20 is placed on the top plate to prevent scratches on the board surface.
0 [Rodelnita Co., Ltd.] was cut into 402 mm and stuck, and then a 0.5 mm-thick urethane foam cloth / 40 film [Rodelnitter Co., Ltd.] was stuck from the recessed portion to the end face of the carrier in contact with the workpiece . I decided to use something.

[0016] then in this one-sided Migaku Ken apparatus, 400mm angle × 6
mm synthetic quartz glass substrate finished with the end face portion of the substrate with free abrasive grains GC # 800 in thickness, with an average particle size Migaku Ken material with cerium oxide Migaku Ken material 1μm suspended 10% in water , the front surface, 30 minutes each on the back alternately, which was repeated 6 times Migaku Ken <br/>.

In this experiment, after treating five substrates under the above conditions, the substrates were cleaned using 10 ultrasonic cleaning tanks. Visual inspection of the surface for defects and stains under an illuminance of 120,000 lux gave the results shown in Table 1 below.

Example 2 A substrate obtained by processing in the same manner as in Example 1 except that the size of the hole of the carrier in Example 1 was 405 mm was inspected, and the result as shown in Table 1 below was obtained. Obtained.

Example 3 Inspection was performed on substrates obtained in the same manner as in Example 1 except that the number of ultrasonic cleaning tanks in Example 1 was changed from 10 to 5, and the results are shown in Table 1 below. The following results were obtained.

COMPARATIVE EXAMPLE 1 An inspection was performed on a substrate obtained in the same manner as in Example 1 except that a soft cloth was not attached to the carrier. The results were as shown in Table 1 below. Was done.

COMPARATIVE EXAMPLE 2 An inspection was performed on a substrate obtained in the same manner as in Comparative Example 1 except that the end face portion of the substrate in Comparative Example 1 was mirror-finished. The results are shown in Table 1 below. The following results were obtained.

COMPARATIVE EXAMPLE 3 The end face of the substrate in Example 1 was mirror-finished, the hole size of the carrier was 400.5 mm, and a soft cloth was not attached to the carrier. When the substrate obtained by treating the substrate in the same manner as in the example was inspected, the results as shown in Table 1 described later were obtained.

Comparative Examples 4 to 5 The same procedure as in Example 1 was carried out except that the hole size of the carrier in Example 1 was set to 406 mm (Comparative Example 4) or 401.5 mm (Comparative Example 5). When the substrate was inspected, the results as shown in Table 1 below were obtained.

Comparative Examples 6 and 7 The same as Example 1 except that the width of the dent of the carrier in Example 1 was set to 5 mm (Comparative Example 6) or the depth of the dent was set to 0.30 mm (Comparative Example 7). When the processed substrate was inspected, the results as shown in Table 1 below were obtained.

An inspection was performed on a substrate obtained in the same manner as in Example 1 except that the soft cloth used in Example 1 was a normal woven cloth (cotton), and the results are shown in Table 1 below. The following results were obtained.

[0026]

[Table 1]

[0027]

The present invention relates to a single-side polishing method, in which a cloth is stuck to a hole portion in a carrier attached to a pressure plate as described above, and then a workpiece is polished by polishing. In the polishing method, a recess having a constant depth is provided along the carrier surface from the carrier end surface where the carrier and the workpiece contact, and the recess is applied to the side surface of the carrier that contacts the workpiece.
It is characterized by using a carrier to which a foamed polyurethane non-woven fabric is stuck, which eliminates the occurrence of cracks, cracks, scratches, etc. on the end face of the object to be processed, it had been able to prevent sticking to the object edge advantages are given.

[Brief description of the drawings]

BRIEF DESCRIPTION OF THE DRAWINGS FIG. 1 is a view showing a form of forming a dent provided on the surface of a carrier used in the present invention, wherein (a) is a plan view thereof, and (b) is a partial sectional view thereof.

FIGS. 2A and 2B are schematic diagrams of a carrier used in Example 1 of the present invention, wherein FIG. 2A is a plan view and FIG. 2B is a partial cross section of a recess.

[3] shows a plan view of a variation of the angular velocity due to the rotation of the top plate in the known single-sided Migaku Ken.

4 is a plan view showing the movement within the rectangular substrate carrier in the known single-sided Migaku Ken.

Continuation of the front page (72) Inventor Masatoshi Takita 28, Nishifukushima, Nishifukushima, Nakakushiro-gun, Niigata Pref. Shin-Etsu Chemical Co., Ltd. Synthetic Technology Research Laboratory (56) References Kaihei 2-117857 (JP, U) (58) Field surveyed (Int. Cl. ⁷ , DB name) B24B 37/04

Claims (4)

(57) [Claims] 1. A single-side polishing method in which a cloth is attached to a hole portion in a carrier attached to a pressure plate and then a workpiece is polished by inserting the workpiece into the hole. A recess having a constant depth is provided along the side surface of the carrier, and the recessed portion is applied to the side surface of the carrier that comes into contact with the workpiece.
A single-side polishing method characterized by using a carrier to which a non-woven fabric is attached. 2. The single-side polishing method according to claim 1, wherein the workpiece is glass . 3. The nonwoven fabric made of foamed polyurethane having a depth of the recess.
The single-side polishing method according to claim 1, wherein the single-side polishing method is larger than the thickness . 4. The clearance between the carrier and the workpiece is 1
The single-side polishing method according to claim 1, wherein the thickness is not less than 4 mm and not more than 4 mm .