JP3072514B2 - Liquid crystal display device and method of manufacturing the same - Google Patents

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a liquid crystal display device and a method of manufacturing the same, and more particularly, to a liquid crystal display device having a plurality of liquid crystal layers on one substrate and capable of displaying a bright full-color image and a liquid crystal display device thereof. It relates to a manufacturing method.

[0002]

2. Description of the Related Art As a method of performing color display with a liquid crystal display element, micro color filters of three colors of red, green and blue are provided on three adjacent pixels, and light transmitted through each pixel is controlled by liquid crystal. In general, additive color mixing is performed. For controlling transmitted light, a method in which a twisted nematic liquid crystal and a polarizing plate are combined is most widely used. However, in this method, since the color filter and the polarizing plate absorb light, the light transmittance of the entire liquid crystal display element becomes 10% or less.
When color display is to be performed using reflective liquid crystal using external light, the above-mentioned liquid crystal display element is very dark due to low transmittance, making it difficult to recognize colors.

Therefore, Japanese Patent Application Laid-Open Nos. 61-238024 and 61-238024 disclose a method of performing bright color display with a reflective liquid crystal display device.
As disclosed in JP-A-3-238424, a guest-host mode liquid crystal display device has been proposed. In the guest-host mode, light absorption and transmission are controlled using liquid crystals containing dichroic dyes, and color display is performed by overlapping panels sandwiching liquid crystals containing dichroic dyes of different colors. be able to. Specifically, three liquid crystal panels sandwiching a guest-host liquid crystal containing two dichroic dyes of cyan, magenta, and yellow between two pieces of glass are stacked, and when all layers absorb light, a black display is displayed. When light is transmitted through this layer, white display can be performed. The guest-host mode does not require a color filter or a polarizing plate, and enables very bright and vivid color display, which is effective for a reflective liquid crystal display device. However, in order to perform color display in the guest-host mode, when three liquid crystal panels are stacked as described above, if the pixels become finer, the thickness of the glass becomes relatively large as compared with the pixels, so that parallax is generated and oblique. There is a problem that a color shift occurs when viewed from above.

In order to solve such a problem, a liquid crystal display device as disclosed in Japanese Patent Application Laid-Open No. Hei 6-337643 has been proposed. In this liquid crystal display device, as shown in FIG. 21, a liquid crystal 99 is encapsulated in a polymer 98 in a microcapsule form, solidified while the liquid crystal 99 is dispersed and supported, and liquid crystal layers 95 to 97 are formed. Layer 9
5 to 97 and the drive electrodes 92 to 94 are formed on one glass substrate 9.
1 are stacked. With such a configuration, it is possible to realize a guest-host mode liquid crystal display element having a configuration that does not require glass between the liquid crystal layer and the liquid crystal layer. It is possible to prevent the occurrence of color misregistration caused.

[0005]

However, in the above-mentioned prior art, the ratio of the resist material or the polymer material in the liquid crystal layer in order to disperse and hold the liquid crystal increases, so that the substantial aperture ratio decreases. There was a problem that the contrast ratio could not be increased so much.

Accordingly, the present inventors have already invented a liquid crystal display device for solving the above-mentioned problem, and have filed an application (Japanese Patent Application No. 9-127057) for such an invention. The invention according to Japanese Patent Application No. 9-127057 is an invention on which the present invention is based, in which a liquid crystal layer filled with liquid crystal is formed between a substrate and a sealing film, and the sealing member is supported by a support member. Configuration. In this liquid crystal display device, the ratio of the liquid crystal in the liquid crystal layer can be increased, and the effective aperture ratio can be increased and the contrast ratio can be increased as compared with the conventional example.

However, although the invention according to Japanese Patent Application No. 9-127057 can solve the problems of the conventional example, there is a possibility that the following new problems may occur. Then, the present inventors have completed the present invention by intensive research and development based on the invention according to Japanese Patent Application No. 9-127057 in order to prevent the occurrence of new problems. Therefore, the present invention solves the problems of the conventional example, and furthermore, forms the basis of the invention (Japanese Patent Application No. 9-127).
No. 057) is prevented from occurring.

For reference, the configuration of the invention on which the present invention is based, and the problems to be considered therefor will be described below. The invention underlying the present invention is characterized by the following method (1) or (2) as a method of forming a sealing film on a support member.

(1) A sealing film is formed on the surface of the plate member,
A method of transferring this to a supporting member formed on a substrate, and then releasing the plate member.

(2) After forming a vaporizable solid film on the substrate on which the support member is formed, a sealing film is laminated on the solid film,
Thereafter, the solid film is vaporized to form a gap between the substrate and the sealing film.

However, in the method (1), in the step of releasing the sealing film from the surface of the plate member and transferring the sealing film, there is a case where the releasing is not performed smoothly and the sealing film is not transferred. Thus, the yield may be reduced. This is because the transfer film is transferred onto the support member when the adhesive force between the support member and the transfer film is locally smaller than the peeling force when the transfer film on the plate member is released from the plate member. It is thought to happen because it will not be. In the pixel portion, it is desirable to reduce the area occupied by the support member as much as possible in order to increase the aperture ratio. However, when the area of the support member is reduced,
Since the adhesion area between the support member and the transfer film is also reduced, the force concentrates on a small area at the time of release, and transfer / release may not be performed.

In the method (2), when the solid film is formed on the substrate on which the support member is formed, the solid film may be thinly covered also on the support member. Since the solid film is sandwiched between the sealing film and the sealing film, adhesion is not performed, and the sealing film floats, which causes a reduction in yield.

Also in these examples, if the area occupied by the support member on the pixel plane is increased, the adhesion between the support member and the sealing film may be performed smoothly. As the area increases, the aperture ratio decreases.
The brightness and contrast ratio of the liquid crystal display element are deteriorated, and the display quality is reduced. Therefore, it is desirable that the area occupied by the support member in the pixel is 10% or less of the pixel area. In this case, the sealing film only adheres in a small area on the support member, and the other portions float in the air, so that the adhesion between the support member and the sealing film is not sufficient. As described above, this causes a reduction in yield.

As described above, in the step of bonding the support member on the substrate and the sealing film and forming a gap between the substrate and the sealing film, the sealing film is bonded in a small area on the support member. Since it is necessary to bond them together, it is difficult to bond them.

Thus, it has been found that by using a resin film as the sealing film and directly bonding the resin film to the support member, the above-mentioned problems of the invention underlying the present invention can be prevented.

Incidentally, as a method of bonding the resin film to the substrate, there is a heat bonding (heat sealing). Adhesion by thermal bonding uses a so-called laminator and passes the laminated substrate and resin film between rollers heated at least one side, so that the resin film is bonded to the substrate by the thermoplasticity of the resin film. This is an effective method when the substrate and the resin film are stuck together without any gap. When trying to adhere the support member and the resin film as a sealing film using this method,
It is necessary that the resin film or the support member have thermoplasticity. However, when the roller was heated to a temperature at which the resin film exhibited thermoplasticity, the resin film was softened and deformed along the shapes of the substrate and the support member, and the resin film could not be adhered only on the support member. .
On the other hand, using a thermoplastic material as a support member,
When this was heated to a temperature having thermoplasticity, the softened support member was crushed by the laminator. As described above, when the resin film or the supporting member has thermoplasticity to exhibit thermoplasticity during thermal bonding, a gap for enclosing liquid crystal between the resin film and the substrate cannot be formed, or the gap cannot be formed. Became extremely narrow.

The present invention solves the above-mentioned problems of the prior art and also solves the problems of the invention underlying the present invention, and is applicable to a bright, high-contrast ratio, reflection-type liquid crystal display device. It is an object of the present invention to provide a liquid crystal display element which is possible, has no color shift due to parallax, is simple, and improves the production yield, and a method of manufacturing the same.

[0018]

[0019]

[0020]

[0021]

[MEANS FOR SOLVING THE PROBLEMS] To achieve the above object
The invention of claim 1, wherein the present invention is also the pixel electrode及on the upper surface, a second aspect of the present invention includes a transparent substrate on which the driving elements are formed which are connected to the pixel electrode and the pixel electrodes on the upper surface,
A plurality of resin films arranged above the substrate, a common electrode is formed on the upper surface of the uppermost resin film, and a pixel electrode is formed on the upper surface of the other resin films. It has a plurality of resin films and a plurality of liquid crystal layers formed by sealing liquid crystal in gaps formed by interposing a large number of columnar support members between the substrate and the resin film and between the resin films. On the upper surface of the substrate, driving elements respectively corresponding to the pixel electrodes on each of the resin films are provided, and the three-dimensional wiring provided in relation to the pixel electrodes on the resin film provides a pixel on the resin film. A liquid crystal display element having a structure in which an electrode and a driving element are electrically connected, wherein an adhesive layer is interposed between each of the support members and the resin film, and the adhesive layer has a thermoplastic property. It is made of a material which has a thermoplastic resin in the adhesive layer to obtain a bonding state between the resin film and the supporting member, and a supporting member existing between the substrate and the resin film, and a supporting member existing between the resin films. Are characterized by being substantially at the same position with respect to a plane parallel to the substrate.

A liquid crystal display device having a multilayer structure using a resin film is constructed, and has the following effects. As above
Between the substrate and the resin film, and between the resin films
A liquid crystal layer is formed by filling the gap with liquid crystal.
Liquid crystal display device
And the actual aperture ratio is higher
High contrast ratio and bright display.
it can. In addition, the adhesive layer exhibits thermoplasticity,
Since the material and the resin film are bonded, the resin film
Is deformed along the support member and the gap for enclosing the liquid crystal
Can be prevented beforehand,
The plate and the resin film are held at regular intervals. Therefore,
The thickness of the liquid crystal layer is kept constant, and the display performance is improved.
In addition, the support member exists between the substrate and the resin film, and the support member exists between the resin films,
Since the support members are located at substantially the same position with respect to the plane parallel to the substrate, the support members are arranged in a straight line in a direction perpendicular to the substrate. This makes it possible to reliably support the resin films of the respective layers, and to prevent deformation of the support members due to displacement of the support members between the respective layers and breakage of the liquid crystal layer.

Further, an invention according to claim 2, wherein, in the liquid crystal display device according to claim 1, wherein the resin film, the temperature of expressing thermoplastic than the material or an adhesive layer having no thermoplastic high thermoplastic Wherein the support member is a material having no thermoplasticity or a material having thermoplasticity having a higher temperature at which thermoplasticity is developed than the adhesive layer, or a material to be cured before the bonding treatment. It is characterized by.

By the combination of the resin film and the support member having the above-described structure, a liquid crystal display element in which the resin film and the support member are bonded to each other is formed without deformation of the resin film and the support member.

Further, an invention according to claim 3, wherein, in the liquid crystal display device according to claim 1, wherein the liquid crystal layer and the resin film are each laminate 3 groups, the color liquid crystal differ respectively constituting the three liquid crystal layers A guest-host liquid crystal containing a dichroic dye.

With the above configuration, a liquid crystal display element capable of full color display is formed.

According to a fourth aspect of the present invention, in the liquid crystal display device according to any one of the first to third aspects, the substrate is a transparent substrate, and the support member and the adhesive layer are formed on a substrate surface. A light-shielding film is formed at the supporting member forming position, and the light-shielding film is used as a photomask to form a positive photoresist formed by a photolithography method.

With such a configuration, the positional accuracy of the support member is high, so that the area occupied by the support member can be reduced and the contrast ratio can be easily increased.

In particular, in the case of a multilayer structure, the displacement of the support member between the layers is reduced as much as possible.

According to a fifth aspect of the present invention, in the liquid crystal display device according to any one of the first to third aspects, the substrate is a transparent substrate, and the support member and the adhesive layer are formed on a substrate surface. A light-shielding film is formed in a portion other than the support member forming portion, and the light-shielding film is used as a photomask to form a negative photoresist formed by a photolithography method.

Also in this configuration, the positional accuracy of the support member is improved in the same manner as in the fourth aspect of the present invention.

According to a sixth aspect of the present invention, in the liquid crystal display device according to any one of the first to third aspects, the distance between the support members existing in the pixel region among the plurality of support members is set to be smaller. , 15 μm to 100 μm.

The distance between the support members is regulated by the support.
If the distance between the support members is too large, the distance between the support members
Causes the resin film to sag, and the distance between the substrate and the resin film to
It cannot be maintained at a constant level, causing color unevenness and a decrease in contrast ratio.
It is because it causes. On the other hand, if the interval between the support members is too small, the number of the support members is too large, and the aperture ratio is reduced.

According to a seventh aspect of the present invention, in the liquid crystal display device according to any one of the first to third aspects, the thickness of the resin film is 0.5 μm to 10 μm.

The reason for limiting the thickness of the resin film is as follows. That is, the average of the thickness of the resin film is 0.1.
If the thickness is smaller than 5 μm, wrinkles are easily generated in the resin film. The average thickness of the resin film is 10μ
If it is larger than m, the voltage drop in the resin film becomes too large compared to the voltage applied to the liquid crystal layer.

According to an eighth aspect of the present invention, in the liquid crystal display device according to any one of the first to third aspects, the specific resistance of the resin film is 10 ¹⁰ Ω · cm or less. I do.

The specific resistance of the resin film is specified for the following reasons. That is, when the specific resistance of the resin film is larger than 10 ¹⁰ Ω · cm, the voltage drop in the resin film becomes too large as compared with the voltage applied to the liquid crystal layer.

According to a ninth aspect of the present invention, in the liquid crystal display device according to the first or third aspect , the plurality of resin films are resin films having optical anisotropy. The film is arranged so that the slow axes are all in the same direction.

With the above configuration, light attenuation due to optical anisotropy of the resin film can be suppressed, and a bright display can be realized.

The invention according to claim 10 is the first invention.
4. The liquid crystal display device according to claim 3 ,
The resin film has air permeability, and the common electrode is made of a reflective metal material, and has a shielding film for preventing oxygen and moisture in the outside air from entering the element through the resin film. It is characterized in that it also serves.

According to the above configuration, when the resin film has air permeability, it is possible to prevent a decrease in display performance caused by oxygen and moisture entering the liquid crystal layer from outside air.

[0042] The invention of claim 11, wherein the claim 1
4. The liquid crystal display device according to claim 3 ,
The resin film has air permeability, and a shielding film for preventing oxygen and moisture in the outside air from entering the element through the resin film is formed on the common electrode.

In this configuration, the same operation and effect as those of the tenth aspect are obtained.

The twelfth aspect of the present invention is the first aspect of the present invention.
2. The liquid crystal display element according to 1 , wherein the common electrode is a transparent electrode, and the shielding film is made of a metal material having a reflection characteristic and also serves as a reflection plate.

It is not necessary to separately provide a reflector, and it is possible to prevent a decrease in display performance due to intrusion of oxygen or the like.

Further, the invention of claim 13 provides the invention of claim 1
4. The liquid crystal display device according to claim 3 ,
The common electrode is a transparent electrode, and a transparent resin layer having a large number of fine irregularities on the surface is formed on the common electrode, and a reflective film having an irregular shape according to the surface shape is formed on the resin layer. Is formed.

With the above configuration, the light reflection characteristic of the reflection film becomes diffusive, and it is possible to prevent a decrease in display performance due to reflection of a light source or the like, as compared with the case where the reflection film is specular.

[0048]

[0049]

According to a fourteenth aspect of the present invention, there is provided a substrate on which a pixel electrode and a driving element connected to the pixel electrode are formed on an upper surface, and a plurality of resin films disposed above the substrate. Pixel electrodes are formed on the upper surface of the other resin film other than the resin film at the uppermost position. Such a plurality of resin films, and a large number of columnar support members between the substrate and the resin film and between the resin films, respectively. A plurality of liquid crystal layers formed by enclosing liquid crystal in each of the intervening gaps, and driving elements respectively corresponding to pixel electrodes on each of the resin films are provided on the upper surface of the substrate. A liquid crystal display element having a structure in which a pixel electrode on the resin film and a driving element are electrically connected by three-dimensional wiring provided in relation to the pixel electrode on the resin film. An adhesive layer is interposed between each of the support members and the resin film, and the adhesive layer is made of a material having thermoplasticity, and the adhesive layer expresses thermoplasticity to bond the resin film to the support member. The support member existing between the substrate and the resin film, and the support member existing between the resin films are present at substantially the same position with respect to a plane parallel to the substrate, and the uppermost resin film On the upper surface, a transparent resin layer having a large number of fine irregularities on the surface is formed, and on this resin layer, a reflective film with irregularities according to the surface shape is formed, and this reflective film is common It is characterized in that it also serves as an electrode.

In addition to the function of the invention described in claim 13 , there is no need to provide a separate reflection film, so that the thickness can be reduced and the number of parts can be reduced.

[0052]

[0053]

[0054]

According to a fifteenth aspect of the present invention, there is provided a method for manufacturing a liquid crystal display element, wherein a plurality of support members are formed on a transparent substrate on which a pixel electrode and a driving element connected to the pixel electrode are formed. A supporting member forming step, an adhesive layer forming step of forming an adhesive layer on each of the supporting members, and a resin film laminated on the supporting member via the adhesive layer, and heated in this state, thereby forming a substrate and a resin. A resin film laminating step of laminating the resin film on the support member while maintaining a gap between the film and a step of forming an opening in the resin film, and forming a pixel electrode on the resin film, Electrically connecting a corresponding drive element on the substrate and a pixel electrode on the resin film through the opening, and a region for enclosing liquid crystal on the substrate and the resin film; A laminating step of laminating alternately,
Forming a support member on the resin film bonded to the substrate, forming an adhesive layer on the support member, bonding a resin film on the support member, and forming an opening in the resin film. Forming and forming a pixel electrode on the resin film and electrically connecting a corresponding drive element on the substrate and the pixel electrode on the resin film through the opening are performed at least once. By alternately laminating the liquid crystal enclosing region and the resin film, such a laminating step, and further forming a support member on the resin film finally bonded in the laminating step, an adhesive layer on the support member Forming and bonding the uppermost resin film on the support member, and forming a common electrode on the uppermost resin film upper surface, A step of injecting liquid crystal into a liquid crystal sealing region between the substrate and the resin film and a liquid crystal sealing region between the resin films.

According to the above method, a liquid crystal display device having a multilayer structure having the following effects can be manufactured. That is, the pole
Easily attach a thin resin film to the support member.
Can be. Also, between the substrate and the resin film,
The liquid crystal is sealed in the gap between the films to form the liquid crystal layer.
The ratio of liquid crystal in the liquid crystal display element
Higher aperture, which increases the effective aperture ratio and
Liquid crystal display element that realizes a contrast ratio and bright display.
Can be built. Also, as a sealing film, a resin film
Using this resin film on the support member via an adhesive layer
So that the invention, which is the basis of the present invention,
Low production yield, which can be a problem
It is possible to prevent the underside from occurring.

The invention according to claim 16 is the first invention.
6. The method for manufacturing a liquid crystal display element according to 5 , wherein in the step of forming the opening, the opening is formed in the resin film by reactive ion etching.

According to the above configuration, the opening can be reliably formed in the resin film.

The invention according to claim 17 is the first invention.
6. The method for manufacturing a liquid crystal display element according to 5 , wherein the step of bonding the resin film includes a step of pressing the resin film with a heated roller.

According to the above configuration, the use of the heated roller allows the resin film to be stuck to the support member in a short time and securely.

The invention according to claim 18 is the first invention.
7. The method for producing a liquid crystal display element according to 7 , wherein the temperature at which the adhesive layer exhibits thermoplasticity is selected to be lower than the temperature at which the resin film exhibits thermoplasticity. It is characterized in that the adhesive layer is heated by a heating roller to a temperature higher than the temperature at which the adhesive layer develops plasticity and lower than the temperature at which the resin film develops plasticity.

According to the above configuration, the adhesive layer is plasticized by the heated roller, and the resin film is adhered to the support member via the adhesive layer. At this time, since the support member and the resin film are not plasticized, the resin film is prevented from being deformed along the support member and the support member from being broken. Therefore, it is possible to easily attach the resin film to the support member while maintaining a gap corresponding to the height of the support member.

The invention according to claim 19 is the first invention.
8. The method for manufacturing a liquid crystal display device according to 7 , wherein at least a surface portion of the heated roller is made of a rigid material.

With the above configuration, the thickness of the liquid crystal layer can be made uniform by adhering the resin film to the support member in a smooth state without the resin film being deformed by the support member being entangled by the resin film. Display unevenness and defects can be prevented.

The invention according to claim 20 is the first invention.
8. The method for manufacturing a liquid crystal display element according to 7 , wherein the resin film laminating step includes a step of stretching the resin film to extend wrinkles when the resin film is pressed by a heated roller.

With the above structure, the resin film can be smoothly adhered to the support member without wrinkles, and the display unevenness and defects of the liquid crystal display element can be prevented.

Further, the invention according to claim 21 is based on claim 1
5. The method for manufacturing a liquid crystal display element according to 5 , wherein the supporting member forming step includes forming a light shielding film at a supporting member forming portion on the substrate surface, and covering the light shielding film with a first positive resist on the substrate surface. after coating, the first positive type resist after exposing the light-shielding film as a photo mask from the rear surface side of the substrate is developed with a developer, and curing the first positive type resist, in the step of forming a supporting member on a substrate Yes, support in the lamination process
The member forming step includes the first positive type registration on the resin film surface.
After applying the strike, the light-shielding film is
And then develop the first positive resist with a developer
Then, the first positive resist is hardened, and is cured on the resin film.
Forming a support member on the substrate , wherein the adhesive layer forming step comprises applying a second positive resist on the substrate on which the support member is formed, exposing the light-shielding film as a photomask from the back side of the substrate, and then exposing the second resist. By developing the positive type resist with a developer, a step of forming an adhesive layer on the support member,
The bonding layer forming step in the laminating step forms the support member.
Apply a second positive resist on the formed resin film
Then, the light shielding film is exposed from the back side of the substrate as a photomask.
After that, developing the second positive resist with a developer
This is a step of forming an adhesive layer on the support member .

According to the above configuration, the adhesive layer can be easily formed on the support member without the necessity of aligning the mask between the support member and the adhesive layer, and the manufacturing process can be simplified.

The invention according to claim 22 is the first invention.
5. The method for manufacturing a liquid crystal display element according to 5 , wherein the resin layer forming step and the resin film bonding step prepare a resin film having one surface coated with an adhesive layer in advance, and the resin film is bonded to the adhesive layer. A step of laminating the resin film on the support member by heating the support member in such a state that the surface coated with the resin film faces the support member.

With the above configuration, the step of forming an adhesive layer on the support member is not required, and the manufacturing process can be simplified.

The invention according to claim 23 is the first invention.
6. The method for manufacturing a liquid crystal display element according to 5 , wherein in the supporting member forming step, a supporting member existing in a pixel region among the plurality of supporting members is formed to have a width equal to or greater than a height. .

With the above configuration, for example, in order to bond the resin film to the support member, it is possible to prevent the support member from being broken by the pressure of the roller when passing through the laminator while the resin film is overlaid on the support member. And the production yield can be increased.

The invention according to claim 24 is the first invention.
6. The method for manufacturing a liquid crystal display element according to 5 , wherein the thickness of the resin film is 0.5 μm to 10 μm.

The thickness of the resin film is regulated for the following reasons. That is, the average of the thickness of the resin film is 0.1.
If the thickness is smaller than 5 μm, wrinkles are easily generated in the resin film. The average thickness of the resin film is 10μ
If it is larger than m, the voltage drop in the resin film becomes too large compared to the voltage applied to the liquid crystal layer.

The invention according to claim 25 is the first invention.
6. The method for manufacturing a liquid crystal display element according to 5 , wherein a main component of the resin film is a polyester resin.

According to the above configuration, the resin film has a necessary strength, the resin film hardly breaks during production, and the production yield can be improved.
Further, since the polyester resin is transparent and the attenuation of light in a visible light wavelength range is small, a bright display can be realized as a liquid crystal display element.

[0077]

[0078]

The invention according to claim 26 is based on claim 1
5. The method for manufacturing a liquid crystal display element according to 5 , wherein a vent is formed for ventilating the gap between the substrate and the resin film and the outside during the step of bonding the support member on the substrate and the resin film. During the process of bonding the support member on the resin film to the resin film, a vent is formed for ventilating the gap between the resin films and the outside.

With the above structure, in a step involving heating or evacuation, it is possible to prevent breakage of the resin film caused by expansion of gas in the gap between the substrate and the resin film or in the gap between the resin films due to the ventilation through the ventilation hole. And a decrease in yield can be suppressed.

[0081]

[0082]

The invention according to claim 27 is based on claim 2
6. The method for manufacturing a liquid crystal display element according to 6, wherein the resin film and the resin film are bonded to each other around a display portion on the substrate except for a portion that is not bonded, so that the non-bonded portion is ventilated. It is characterized by being provided as a mouth.

With the above configuration, the ventilation port can be easily formed, and the manufacturing process can be simplified.

The invention according to claim 28 is based on claim 2
8. The method for manufacturing a liquid crystal display element according to 7 , wherein a treatment for reducing surface tension is performed on the inner wall of the vent.

According to the above configuration, it is not necessary to repeat the opening and closing of the vent when the step of heating or evacuation and the step of immersing in a solution are alternately performed, so that the manufacturing process can be simplified.

[0087]

[0088]

The invention according to claim 29 is based on claim 2
6. The method for manufacturing a liquid crystal display element according to 6 , wherein the substrate and the resin film and the resin films are adhered to each other around the display portion on the substrate to fill the liquid crystal between the substrate and the resin film and between the resin films. After the region is once closed, a through hole is formed in a portion other than the display portion of the resin film to form a vent.

With the above configuration, the ventilation port can be easily formed, and the manufacturing process can be simplified.

The invention described in claim 30 is the same as the claim 2
7. The method for manufacturing a liquid crystal display device according to item 6, wherein the method includes a step of closing the vent.

According to the above configuration, in the step involving immersion in the solution, it is possible to prevent the solution from entering through the vent hole, and it is possible to increase the yield.

[0093]

[0094]

According to a thirty- first aspect of the present invention, there is provided a method of manufacturing a liquid crystal display element, comprising forming a plurality of columnar support members on a transparent substrate on which a pixel electrode and a driving element connected to the pixel electrode are formed. By forming a supporting member forming step, an adhesive layer forming step of forming an adhesive layer on each of the supporting members, and stacking a resin film on the supporting member via the adhesive layer, and heating in this state, the substrate and A bonding step of bonding the resin film on the support member while maintaining a gap between the resin film and a step of forming an opening in the resin film, and forming a pixel electrode on the resin film, Electrically connecting the corresponding drive element on the substrate and the pixel electrode on the resin film through the opening; and alternately enclosing the liquid crystal sealing region and the resin film on the substrate. A step of forming a support member on a resin film bonded to a substrate, a step of forming an adhesive layer on the support member, and a step of bonding a resin film on the support member Forming an opening in the resin film; forming a pixel electrode on the resin film; and electrically connecting a corresponding drive element on the substrate and a pixel electrode on the resin film through the opening. Performing the step of performing at least once to alternately laminate the liquid crystal enclosing area and the resin film. Such a laminating step, and further forming a support member on the resin film finally bonded in the laminating step. Forming a bonding layer on the support member and bonding the uppermost resin film on the support member;
Applying a photoresist on the upper surface of the uppermost resin film, performing mask exposure and development, and then baking to form a resin layer having a large number of fine irregularities on the surface; and Forming a reflective film also serving as a common electrode, and injecting liquid crystal into a liquid crystal sealing region between the substrate and the resin film, and a liquid crystal sealing region between the resin films. .

With the above configuration, a reflective film having diffusivity can be easily formed on the liquid crystal layer.

[0097]

(Embodiment 1) Embodiment 1 of the present invention will be described below with reference to FIGS. FIG. 1 is a cross-sectional view of one pixel portion at the center of the liquid crystal display device of the present invention, FIG. 2 is a plan view of one pixel portion of the central portion of the liquid crystal display device of the present invention, and FIG. 4 and 5 are partially enlarged sectional views of FIG. 1, FIG.
13 to 13 are views for explaining a manufacturing process of the liquid crystal display element. FIG. 1 is a sectional view taken along the line AA of FIG.
1 to 13 do not show all components of the entire liquid crystal display element, and some parts are omitted. In addition, the drawings are schematically shown, and there are portions different from the actual ones, such as the scale and the number of each part.

As shown in FIG. 1, this liquid crystal display element
The substrate 1 is provided with three liquid crystal layers 6, 7, and 8 filled with cyan, magenta, and yellow guest host liquid crystals 21, 22, and 23, respectively. Substrate 1
Are made of borosilicate glass, and thin film transistors (hereinafter, referred to as TFT elements) 2, 3, and 4 made of amorphous silicon are formed on the substrate 1 as drive elements. On the substrate 1, as shown in FIG. 3, a first pixel electrode M1, a plurality of source lines SL, a plurality of gate lines GL, and a pixel display area are arranged in a matrix in the pixel display area 45. Peripheral part 46 of area 45
And a driving circuit 81 that applies a driving voltage to the source line SL and that applies a driving voltage to the gate line GL, which is provided in the peripheral portion 46 of the pixel display area 45, respectively.

Of these TFT elements 2, 3, and 4, the TFT
The elements 3, 4 are provided with drain terminals 3a, 4a made of a transparent conductive film of indium tin oxide (ITO). On the other hand, the drain terminal 2a of the TFT element 2 is electrically connected to the first pixel electrode M1 made of a transparent conductive film. Pixels on the substrate 1 are dotted with a square light-shielding film 5 having a side of 5 μm. The pitch between these light shielding films 5 is set to 30 μm. Further, on the light shielding film 5,
As clearly shown in FIG. 4, a support member 18 is formed. As clearly shown in FIG. 5, a light-shielding film 5 is formed on the TFT elements 3 and 4, and a three-dimensional wiring pad 40 is formed on the light-shielding film 5. The three-dimensional wiring pad 40 also has a function as a support member. Here, the light shielding film 5 is made of a resist containing black carbon particles. The support member 18 and the three-dimensional wiring pad 40 are made of a positive resist having a height of 5 μm. An adhesive layer 31 made of a positive resist is formed on each of the support members 18 and the three-dimensional wiring pads 40, whereby the resin film 11 is formed on the support members 18 and the three-dimensional wiring pads 40.
Are glued. The resin film 11 is a 1.2 μm-thick resin film containing polyethylene terephthalate (PET), which is a kind of polyester resin, as a main component. The resin film 11 is supported by the support member 18 and the substrate 1
5 μm for enclosing liquid crystal between the resin film 11
Are formed. Substrate 1 and resin film 1
In the gap 1, a guest-host liquid crystal 21 in which a cyan dichroic dye is dissolved in a fluorine-based nematic liquid crystal is sealed to form a first liquid crystal layer 6.

The drain terminals 3a, 4a of the TFT elements 3, 4
Above a, openings 24 and 25 are provided in the three-dimensional wiring pad 40 and the resin film 11. In a pixel portion on the resin film 11, a second pixel electrode M2 made of a transparent conductive film of ITO is formed. This second pixel electrode M
The two ends extend to the drain terminal 3a of the TFT element 3 through the opening 24, as clearly shown in FIG. 5, and the second pixel electrode M2 and the terminal 3a of the TFT element are electrically connected. ing. By conducting the second pixel electrode M2 on the resin film 11 and the terminal 3a of the TFT element 3 on the substrate 1 through the opening 24 in this manner, the potential of the second pixel electrode M2 on the resin film 11 is TFT
It can be controlled by the element 3.

Above the first liquid crystal layer 6, the second liquid crystal layer 7,
The third liquid crystal layer 8 and the resin films 12 and 13 are alternately laminated, whereby the three liquid crystal layers 6, 7, and 8 and the three resin films 11, 12, and 13 are alternately laminated on the substrate 1. Structure. The second liquid crystal layer 7 and the third liquid crystal layer 8 have basically the same configuration as the first liquid crystal layer 6, and the support member 19 and the three-dimensional wiring pad 41 are associated with the second liquid crystal layer 7. And an adhesive layer 32, and the third liquid crystal layer 8
The support member 20, the pad 42 for three-dimensional wiring, and the adhesive layer 33 are provided in relation to. The support members 19, 20, and 18 are made of the same material and have the same shape. The support members 19 and 20 are located on an extension of the support member 18. As a result, as described in Japanese Patent Application No. 10-70069, filed by the present inventors, the support member can reliably support the resin film, and the displacement of the support member is caused. Deformation of the support member, destruction of the liquid crystal layer, and the like are prevented.

The three-dimensional wiring pad 41 is disposed immediately above the three-dimensional wiring pad 40, and the three-dimensional wiring pad 42 is disposed immediately above the three-dimensional wiring pad 41. The resin films 12 and 13 have the same material and the same thickness as the resin film 11.

The liquid crystal 2 forming the second liquid crystal layer 7
Reference numeral 2 denotes a guest-host liquid crystal in which the color of the dichroic dye is magenta. Liquid crystal 23 forming the third liquid crystal layer 8 is a guest-host liquid crystal in which the color of the dichroic dye is yellow. With respect to both the first and second liquid crystal layers 7 and 8,
This is the same as the liquid crystal layer 6.

The three-dimensional wiring pad 41 and the resin film 1 provided above the drain terminal 4a of the TFT element 4
An opening 25 is provided in 2. Further, a third pixel electrode M3 made of a transparent conductive film is formed in a pixel portion on the resin film 12. The third pixel electrode M3 is connected to the TFT 25 through the opening 25 as clearly shown in FIG.
The element 4 is electrically connected to the drain terminal 4a.
With such a configuration, similarly to the above-described second pixel electrode M2, the potential of the third pixel electrode M3 on the resin film 12 can be controlled by the TFT element 4 on the substrate 1.

On the resin film 13 above the third liquid crystal layer 8, a common electrode 16 also serving as a reflection film is provided.
The common electrode 16 is made of aluminum. On the common electrode 16, a protective film 17 for protecting the liquid crystal layer from external pressure or the like is formed. The protection film 17 is an acrylic resin. The liquid crystals 21, 22, and 23 of each liquid crystal layer are filled with liquid crystals having appropriately adjusted densities of cyan, magenta, and yellow dichroic dyes in consideration of color balance.

Further, in the present embodiment, the aperture ratio in the pixel portion (the area of the pixel excluding the supporting member portion with respect to the entire area of the pixel) is as high as 97% or more, and a bright display is realized.

The operation of the liquid crystal display device of the present invention will be described. The liquid crystal display element of the present invention is a reflection type color liquid crystal, does not have a backlight, and reflects external light to obtain a color display. Light incident from the opposite side of the substrate 1 from the liquid crystal layer passes through the liquid crystal layers in the order of the liquid crystal layers 6, 7, and 8,
The light is reflected by the common electrode 16 also serving as a reflective film,
The display is shown to the observer who passes again in the order of 7 and 6 and is viewed from the side opposite to the liquid crystal layer of the substrate 1. Here, each liquid crystal layer 6,
Guest host liquid crystals containing dichroic dyes of cyan, magenta, and yellow are sealed in 7 and 8 as described above, and when no voltage is applied between pixel electrodes sandwiching each liquid crystal layer, out of incident light, Light in the absorption wavelength range of each color is absorbed, and light is transmitted when a voltage is applied. By controlling the voltage applied to each liquid crystal layer in this manner, light absorption and transmission can be controlled, and a full-color display can be obtained.

Next, a specific driving method of the liquid crystal display element in the present embodiment will be described below. Third pixel electrode M
3, a voltage V3 corresponding to an image signal to the third liquid crystal layer 8 is applied with reference to the potential of the common electrode 16, and the second pixel electrode M2 is applied with reference to the potential of the third pixel electrode M3. A voltage V2 corresponding to an image signal to the second liquid crystal layer 7 is applied, and a voltage corresponding to the image signal to the first liquid crystal layer 6 is applied to the first pixel electrode M1 with reference to the potential of the second pixel electrode M2. Apply V1. That is, when the potential of the common electrode 16 is used as a reference, V3, V3 + V are applied to each of the pixel electrodes M3 to M1.
2, and V3 + V2 + V1. Thereby, an independent voltage can be applied to each of the guest-host liquid crystals 23, 22, and 21.

The guest-host liquid crystals 23, 22, 21
When the AC drive is performed to prevent the deterioration of
3 as positive, (± V3), (± V3) + (± V2),
And (± V3) + (± V2) + (± V1). Further, in order to reduce the absolute value of the applied voltage to keep the output voltage of the drive circuit or the like low, the polarity of the applied voltage is inverted between the third to first liquid crystal layers 8, 7, and 6 adjacent to each other. Voltages of (± V3), (± V3)-(± V2), and (± V3)-(± V2) + (± V1) may be applied.

Since color image display is performed by subtractive color mixture, when an image signal is given as RGB (red, green, blue) image data, a complement operation is performed to perform CMY.
(Cyan, magenta, and yellow) image data, and a voltage corresponding thereto may be applied. In particular,
For example, in the case of 8-color display, if the given RGB data is (1, 0, 0), a voltage corresponding to its complement (0, 1, 1) may be applied.

Further, in the liquid crystal display device of the present invention,
As described above, openings were formed in the resin film and the on-element support member, and the pixel electrodes on the resin film were electrically connected to the terminals of the TFT elements on the substrate through the openings. In this manner, the voltage applied to each pixel electrode is
Since it can be controlled by the above TFT element, T
There is no need to sandwich a glass substrate having an FT element, and a bright reflective color liquid crystal display element without parallax can be realized. In this embodiment, a TFT element is used as a pixel switching element, but the present invention is not limited to this, and a thin film diode or the like may be used.

In the first embodiment, the resin film 1
The thickness of each of 1, 12, and 13 was 1.2 μm.
Since the thinner the resin film, the smaller the voltage drop in the resin film and the lower the applied voltage,
desirable. However, when the thickness of the resin film is smaller than 0.5 μm, the resin film is apt to wrinkle, and is more likely to be torn, so that handling becomes difficult and the yield is deteriorated. Therefore, it is appropriate that the thickness of the resin film is 0.5 μm or more. Further, when the thickness of the resin film is larger than 10 μm, the voltage required for operating the liquid crystal layer becomes extremely large because the voltage drop in the resin film exceeds twice the voltage applied to the liquid crystal layer. Therefore, it is desirable that the thickness of the resin film is at least 10 μm or less. As described above, the thickness of the resin film is 0.5 to 10 μm.
It is good to set in the range of m.

It is also desirable to reduce the specific resistance of the resin film, because the voltage drop in the resin film can be reduced. The relative permittivity of the liquid crystal differs depending on the orientation direction. In a general liquid crystal having a positive dielectric anisotropy, when a voltage is applied between the electrodes, the molecules are oriented perpendicular to the electrodes, and the relative permittivity increases. In particular, in the case of a liquid crystal material having a small operating voltage, the relative dielectric constant is about ε⊥ = 4, while ε // = 11
And this difference tends to increase. Since the relative permittivity of the polyester resin constituting the resin film is approximately 3, when the relative permittivity of the liquid crystal is increased by applying a voltage, more voltage is divided into the resin film having a smaller permittivity than the liquid crystal, There is a possibility that the problem that the voltage applied to the liquid crystal becomes small may occur. Therefore, when the specific resistance of the resin film is reduced, it is possible to reduce a voltage drop particularly in the resin film when a voltage is applied. The polyester resin that is the material of the resin film is usually 10
^It has a specific resistance of ¹⁴ to 10 ¹⁶ . If lowering the specific resistance, the specific until resistivity of about 10 ¹² is only the partial pressure ratio of change in the resin film, the effect due to the reduced specific resistance is small, in approximately 10 ¹⁰ smaller ranges, resin The partial pressure ratio of the film becomes smaller. By setting the specific resistance to 10 ¹⁰ or less, when the thickness of the resin film is 0.5 to 10 μm, the voltage drop in the resin film can be reduced to about half or less of the voltage applied between the electrodes. For this reason, the specific resistance of the resin film is preferably 10 ¹⁰ or less.

As a method for reducing the specific resistance of the resin film, for example, a substance that slightly increases conductivity, such as zirconium oxide or an organic conductor, may be mixed or doped into the resin film.

In the first embodiment, the resin film 1
By making PET (polyethylene terephthalate), which is a kind of polyester resin, the material of 1, 12, and 13, the thickness of the resin film is 0.5 to 10 μm as described above.
Even when m, the required strength can be imparted to the resin film. In the laminating step described later, when the sheet is passed through a laminator, breakage due to the pressure of the roller hardly occurs, and the production yield can be improved. In addition, PET hardly undergoes plasticization at a heating temperature (150 ° C.) in a bonding step described later. For this reason, the resin film can be smoothly adhered without deforming the resin film along the supporting member and narrowing the gap for enclosing the liquid crystal as in the related art. Further, since the polyester resin is transparent and the attenuation of light in a visible light wavelength range is small, a bright display can be realized as a liquid crystal display element. Embodiment 1 includes polyester resin.
There are other types such as polyethylene naphthalate (PEN) other than PET used in the above, and these may be used.

In the first embodiment, support members having a rectangular cross section are distributed in the pixel portion. The smaller the area occupied by the support member in the pixel range, the higher the aperture ratio of the liquid crystal display element, and a brighter display can be realized. Therefore, in terms of display, it is desirable that the width of the support member, that is, the length of one side of the rectangular shape of the support member be as small as possible, and that the distance between the support member and the adjacent support member be as long as possible. However, if the width of the supporting member is small, the supporting member is crushed and broken in a step of bonding a resin film on the substrate as described below,
The gap between the liquid crystal layers becomes small, so that liquid crystal cannot be injected, which causes a reduction in manufacturing yield. When the positive resist of the support member is sufficiently cured, by making the width of the support member larger than the height of the support member,
Destruction of the support member as described above can be avoided.
In the first embodiment, since the height of the support member is set to 5 μm, by setting the width of the support member to 5 μm or more, the support member is not broken and a decrease in yield can be suppressed.

In the first embodiment, the interval between the support members existing in the range of the pixel portion is set to 25 μm (the side of the support member is 5 μm, the pitch is 30 μm). Here, if the distance between the support members is large, the resin film sags between the support members and the distance between the substrate and the resin film, or the distance between the resin films cannot be maintained, causing color unevenness and a decrease in contrast ratio. . Therefore, by setting the distance between the support members to 100 μm or less, the sag of the resin film is small, and the gap between the substrate and the resin film can be maintained. By doing so, the thickness of the liquid crystal layer is maintained,
It is possible to prevent color contrast and a decrease in contrast ratio due to insufficient gap.

In the first embodiment, the resin film 11
The directions of the optical anisotropy of 〜13, that is, the directions of the slow axis of the resin film are all matched. Since the optical anisotropy of the resin film appears along the slow axis of each resin film, that is, along the stretching direction when manufacturing the resin film, if the direction of the slow axis of a plurality of resin films laminated on the substrate is different. In this case, light is absorbed by the resin film, and the brightness of the liquid crystal display element may be reduced. Therefore, by making the directions of the slow axes of the resin films all the same, a bright display can be realized without light attenuation due to the optical anisotropy of the resin films.

Next, a method for manufacturing the liquid crystal display device will be described with reference to FIGS. The following steps are:
This is performed in a room (yellow room) illuminated with long-wavelength light to which a photosensitive material such as a positive resist is not exposed.

(1) First, as shown in FIG.
After a transparent conductive film of ITO is formed on the substrate 1 on which the FT elements 2, 3, and 4 are formed by sputtering, the drain terminals 3a and 4a of the TFT elements 3 and 4 and the first pixel electrode M1 are formed by photolithography and etching. Perform patterning. At the same time, a source line and a gate line around the pixel are formed by the transparent conductive film.

Next, a step of forming the light shielding film 5 was performed. A negative resist containing carbon is applied on the substrate 1, and mask exposure and development are performed so that the resist remains only at the position where the support member 18 and the three-dimensional wiring pad 40 are provided, as shown in FIG. 6B. The light shielding film 5 is formed.
Note that the light-shielding film 5 may be formed by forming a metal thin film such as aluminum, and performing photolithography and etching.

(2) Next, a step of forming the support member 18 is performed. First, on the substrate 1 on which the light shielding film 5 is formed, a first
Is applied by spin coating and prebaked. Next, by exposing the substrate 1 to ultraviolet rays, the light-shielding film 5 is used as a photomask to expose portions other than those where the support members 18 and the three-dimensional wiring pads 40 are to be formed. After the exposure, the support member 18 and the three-dimensional wiring pad 40 can be formed on the light-shielding film 5 as shown in FIG. 7A by developing with a developer of a positive resist and hardening by post-baking. .

(3) Next, a step of forming an adhesive layer on the support member 18 is performed. As shown in FIG.
A second positive resist serving as the adhesive layer 31 is applied by spin coating on the substrate 1 on which the substrate 8 is formed, and prebaked. Next, as in the step (2), the substrate 1 is exposed to ultraviolet light using the light-shielding film 5 as a photomask, and is developed with a second positive resist developer, thereby supporting the substrate as shown in FIG. 7B. An adhesive layer 31 of about 1 μm is formed on the member 18 and the three-dimensional wiring pad 40. By exposing the light-shielding film 5 on the substrate 1 as a photomask from the back surface of the substrate as in the steps (2) and (3), the adhesive layer 31 can be easily formed only on the support member 18 and the three-dimensional wiring pads 40. Can be formed. Here, in the case of forming the adhesive layer only on the support member by a normal mask exposure process, a process of aligning the support member on the substrate and the photomask of the adhesive layer is required,
On a support member in which one side of a planar shape is small as in the present invention, a displacement of several μm causes a small bonding area on the support member, so that extremely high precision is required for mask positioning, and a decrease in yield due to the displacement is caused. Caused.
By exposing from the back surface of the substrate using the light-shielding film as a photomask as in the process (3), the adhesive layer 31 can be formed on the support member 18 accurately and easily without such a problem.

The second positive resist used for the adhesive layer 31 is subjected to a heating step after development (post-baking step).
In this case, a material having a property of hardening after expressing thermoplasticity is used. In this example, the adhesive layer 31 (the adhesive layers 32 and 3) is used.
3) is higher than the temperature at which the support member 18 (same for the support members 19 and 20) and the resin film 11 (same for the resin films 12 and 13) exhibit thermoplasticity. Use lower 150 ° C. material. Further, the support member 18 (the same applies to the support members 19 and 20) has already been cured, and does not exhibit thermoplasticity when heated again. By doing so, in the bonding step described later, only the adhesive layers 31, 32, 33 exhibit thermoplasticity, and the support members 18, 19, 20 and the resin film 1 are bonded together.
1, 12, 13 can be adhered, and the problem that the resin film bends and the gap between the substrates becomes narrow as described in the section of the prior art can be improved, and the support members 18, 19, 2 can be improved.
The resin films 11, 12, and 13 can be smoothly bonded on the “0”.

Incidentally, the resin film and the support member in the present invention are not limited to the above examples. That is, the resin film may be any of a non-thermoplastic material and a thermoplastic material having a higher temperature at which thermoplasticity is exhibited than the adhesive layer. Also, the support member is
Any material may be used, as long as it is a non-thermoplastic material or a thermoplastic material having a higher temperature to exhibit thermoplasticity than the adhesive layer, or a material which is cured before the adhesive treatment.
With such a combination of the resin film and the support member, and since the adhesive layer has thermoplasticity, the support member and the resin film can be formed without deforming the resin film along the support member or breaking the support member. Can be adhered.

In a normal liquid crystal display device, a sealing material is applied around the display portion to seal the gap in order to prevent liquid crystal from flowing out of the gap. In the present invention, in the step (3) of forming the adhesive layer 31 instead of applying the sealing material, as shown in FIG. 12, not only on the support member 18 but also on the display area where the support member 18 is not provided. The adhesive layer 31 is also formed on the substrate 1 in the peripheral portion 46 (outside the broken line 44 in FIG. 12). By doing so, the substrate 1 and the resin film 11 can be adhered to the display area peripheral portion 46 without a gap in a later bonding step. The adhesive layer 31 of the display area peripheral portion 46 is provided with a photomask that shields the display area peripheral portion 46 on the substrate side at the time of the exposure in the step (3). The layer 31 remains without being removed. This step eliminates the need for another step for sealing, such as application of a sealant, and can simplify the step.

Here, when the adhesive layer 31 is formed on the entire periphery of the display area peripheral portion 46, the gap between the substrate 1 and the resin film 11 is sealed in a step involving heating or vacuuming after the resin film 11 is bonded. The blown air expands and the resin film 11 ruptures.
There is a possibility that a problem that the adhesion with the first member comes off may occur. Therefore, it is necessary to provide a vent for letting the air in the gap ventilate to the outside. In the first embodiment, in order to provide a ventilation hole, in the step (3) of forming the adhesive layer, exposure is performed using a photomask that does not shield part of the display area peripheral part 46 but shields the other part. Thus, a portion 34 ′ (see FIGS. 12 and 14) in which the adhesive layer 31 is not formed is provided in the display area peripheral portion 46. In a later bonding step, this portion 34 ′ can be used as the vent 34 because the substrate 1 and the resin film 11 are not bonded. As shown in FIG. 12, the vent 34 has a first passage 34a opened to the outside, and a second passage 34 communicating with the first passage 34a and having a passage cross section larger than the first passage 34a.
b. In this way, problems such as rupture of the resin film 11 can be prevented beforehand, and a step of forming the vent 34 is included in a step of forming the adhesive layer 31, so that an extra step is unnecessary. The vent 34 can be easily formed.

(4) Next, a step of bonding the resin film 11 to the substrate 1 on which the support member 18 is formed is performed. This is shown in FIG. As shown in FIG. 8, the resin film 11 mainly composed of PET is superposed on the side of the substrate 1 on which the support member 18 and the adhesive layer 31 are formed, and is passed between the rollers 26 and 27 of the laminator. At this time, at least one of the rollers 26 and 27 of the laminator, desirably, the surface of the roller 26 in contact with the resin film is set to 150 ° C. at which the adhesive layer 31 exhibits thermoplasticity. The rollers sandwich the rollers 26 and 27 so that a pressing force of 10 MPa is uniformly applied to the substrate 1 and rotate the rollers at a peripheral speed of 10 mm / sec. In this way, the substrate 1 on which the support member 18 and the adhesive layer 31 are provided and the resin film 11 are overlaid, and the laminator rollers 26, 2
The adhesive layer 31 is thermally bonded to the resin film 11 by passing through the gap between the support members 7, and the support member 18 and the resin film 11 are bonded to each other. At the roller temperature at this time, the supporting member 18
Since the resin film 11 is not plasticized, the resin film does not deform along the support member or the support member is broken, and as shown in FIG.
While maintaining a gap corresponding to the height of the resin film 11
Can be easily bonded together. Next, the substrate 1 on which the resin film 11 is bonded is baked to cure the adhesive layer 31, and the support member 18 and the resin film 11 are firmly bonded. The firing temperature needs to be at least higher than the temperature at which the adhesive layer 31 is cured, but by setting the temperature at which the resin film 11 causes slight thermal contraction, the slack of the resin film between the support members is reduced. By reducing the size, the resin film can be bonded in a flatter state. In the case of a PET resin film having a thickness of 1.2 μm used in the present embodiment, 200 ° C. to 220 ° C. is a preferable firing temperature.

According to the above steps, the resin film 11 can be firmly adhered on the support member 18 while maintaining the gap between the substrate 1 and the resin film 11, and the production yield can be increased. Further, a step of releasing the resin film and a step of vaporizing the solid film as in the conventional example are not required, and the resin film can be bonded more easily and easily than in the past.

Here, in the bonding step (4),
Since the substrate 1 and the resin film 11 pass between the rollers 26 and 27 of the laminator, if the resin film is folded or wrinkled at this time, the resin film 11 cannot be smoothly adhered onto the substrate 1 and unevenness of display is caused. And the problem of causing defects. In particular, the present invention relates to a resin film 1
1 was thin and easily wrinkled, which reduced the yield. Therefore, the resin film 11 is passed between the rollers 26 and 27 while uniformly pulling the resin film 11 in the direction of arrow B in FIG. By doing so, the resin film 11 can be bonded to the substrate 1 in a smooth state.

Further, the roller of the laminator is generally made of an elastic material (rubber or the like). In the process of the present invention, when an elastic material is used as the roller 26 on the resin film side, (4) When the substrate 1 and the resin film 11 are passed through in the step of
, The support member 18 bites into the roller 26,
There is a possibility that the resin film 11 is plastically deformed toward the substrate 1 and bends, and a problem that a gap is not maintained occurs. Therefore, the roller 26 is formed of a rigid body having a hardness such that the bite when pressed is smaller than the elastic deformation of the resin film.
For example, by using a stainless steel or the like, the resin film is not deformed due to the support member 18 digging in, the resin film is adhered to the support member in a smooth state, and the thickness of the gap for enclosing the liquid crystal is made uniform. can do.

In the step (4), the display area peripheral portion 46 is formed.
Where the adhesive layer 31 was not formed in the resin film 1
1 are attached to each other, as shown in FIG.
4 are provided. As a result, problems such as rupture of the resin film in the step involving heating or evacuation as described above can be prevented beforehand. However, in the step of immersing the substrate in a resist developer when forming a support member on the resin film, or in the step of immersing the substrate in an etchant for patterning the transparent conductive film on the resin film, the solution enters the gap through the vent. There is a possibility that a new problem of infiltration into the vehicle may occur. When the solution intrudes into the gap through the vent hole 34, the gap is so narrow that it becomes difficult to remove the infiltrated solution or the components in the solution remain in the gap, and the liquid crystal is injected into the gap. It became the cause that became impossible.

(5) As a method for solving this, the substrate 1 and the resin film 11 near the first passage 34a of the vent 34
And a step of reducing the surface tension of the gap between them. As a process for reducing the surface tension, the surface of the substrate 1 or the resin film 11 near the first passage 34a of the vent 34 is coated with a fluorine-based coating agent 90 (see FIG. 14). Without surface treatment, the contact angle of water on the PET surface is about 7
Although it is 0 degrees, the solution such as water infiltrates the gap, but by setting the contact angle to 90 degrees or more by the above processing, the solution does not infiltrate into the gap as shown in FIG. it can. Further, according to this method, when repeating the step of heating or evacuation and the step of dipping in the solution, it is not necessary to repeat the opening and closing of the vent, so that the manufacturing process can be simplified.

(6) Next, a step of forming openings 24 and 25 in the resin film 11 bonded to the substrate 1 was performed. The openings 24 and 25 are openings for electrically connecting the pixel electrodes on the resin film and the drain terminals of the TFT elements on the substrate as described above. A third positive resist 28 was applied to the outside of the resin film 11 shown in FIG. 9A by spin coating, and prebaked. Next, mask exposure is performed using a photomask that irradiates light only to the portions where the openings 24 and 25 are to be formed, and development is performed with a developing solution. , 25 are removed and the resin film 1 is removed.
A 3 μm resist film 28 was formed on 1. Next, portions of the resin film 11 where openings were to be formed were removed by reactive ion etching (RIE), and openings 24 and 25 were formed in the resin film 11 as shown in FIG. RIE is a method in which oxygen ions are accelerated in one direction and collide with the resin film surface to decompose and vaporize resin molecules of the resin film to perform etching.
The main component of the resin film 11 is 0.1% by RIE.
Decomposed and removed at a rate of 3 μm / min. On the other hand, the main component of the resist film 28 is an acrylic resin, which is decomposed and removed at a speed of 0.3 μm / min similarly to the resin film.
In this example, the openings 24, 2
While the resin film 11 in the portion 5 was removed, the resist film 28 remained without removing the thickness of 1.5 μm, and the resist film 28 protected the resin film 11 in portions other than the openings 24 and 25. Thereafter, the resist film 2
8 is peeled off, and as shown in FIG.
Openings 24 and 25 were formed. Thus, the opening can be formed by reactive ion etching,
An opening can be formed in a resin film resistant to an organic solvent such as PET or an acid.

As a method of forming an opening in the resin film, a plasma asher (plasma asher) may be used instead of reactive ion etching.

(7) Next, a step of forming a pixel electrode on the resin film 11 is performed. This situation is shown in FIG.
Shown in The second pixel electrode M2 is formed by sputtering ITO, which is a transparent conductive film, to have a thickness of about 0.1 μm. At this time, the openings 24 and 25 provided in the resin film 11 also
O is formed, and the drain terminals 3 a and 4 a of the TFT elements 3 and 4 on the substrate 1 and the second pixel electrode M on the resin film 11 are formed.
2 can be electrically connected. Next, the pixel portion and the opening portion are covered with a resist, the other ITO is removed by etching, and then the resist is peeled off.
The ITO is patterned into the shape of the pixel electrode M2. Thereby, the potential of the second pixel electrode M2 can be controlled by the TFT element 3 on the substrate 1.

(8) Next, the second liquid crystal layer 7 is formed. The step of forming the second liquid crystal layer 7 is formed by repeating the steps (2) to (7). First, by the step (2),
After forming the support member 19 on the resin film 11,
In the step (3), the adhesive layer 32 is formed on the support member 19. (2) Similarly to (3), by exposing from the substrate 1 side using the light-shielding film 5 formed in the step (1) as a photomask, the same as the support member 18 and the adhesive layer 31 of the first liquid crystal layer 6 are obtained. The support member 19 of the second liquid crystal layer 7 and the adhesive layer 32 can be easily formed at positions. Next, the supporting member 1 is formed by the process (4).
9 and the resin film 12 are bonded to form a gap between the resin film 11 and the resin film 12 for sealing liquid crystal. At this time, the direction of the slow axis of the resin film 12 is set to be the same as the slow axis of the resin film 11. Further, the first passage 35a of the vent 35 (see FIGS. 13 and 16) communicating with the gap of the second liquid crystal layer 7 in the step (5).
A process for reducing the surface tension in the vicinity is performed. The vent 3
As shown in FIG. 13, reference numeral 5 denotes a configuration similar to that of the ventilation port 34, and includes a first passage 35a opened to the outside and a first passage 35
a and a second passage 35b having a passage cross section larger than the first passage 35a.

Next, in the step (6), an opening 25 is formed in the resin film 12 above the drain terminal 4a of the TFT element 4 on the substrate, and then in the step (7), the third pixel electrode M3 is formed. The third pixel electrode M3 is made conductive with the drain terminal 4a. Thus, as shown in FIG.
Gap for forming the second liquid crystal layer 7, resin film 1
2. A third pixel electrode M3 was formed.

(9) Next, the third liquid crystal layer 8 is formed. The step of forming the third liquid crystal layer 8 is performed by repeating the steps (2) to (5). First, by the steps (2) and (3), the support member 19 of the second liquid crystal layer on the resin film 12 is formed.
The support member 20 and the adhesive layer 33 were provided at the same positions as in FIG. Next, the support member 20 and the resin film 13 are formed by the process (4).
Are bonded to form a gap between the resin films 12 and 13 for enclosing the liquid crystal. The direction of the slow axis of the resin film 13 is the same as the direction of the resin films 11 and 12.
Next, in the step (5), a process for reducing the surface tension near the first passage 36a of the vent 36 (see FIGS. 13 and 17) communicating with the gap of the third liquid crystal layer 8 is performed. As shown in FIG. 13, the ventilation port 36 has the same configuration as the ventilation port 34, and has a first passage 36a opened to the outside and a passage cross-section that communicates with the first passage 36a and is larger than the first passage 36a. And a large second passage 36b. In addition, the vents 34 to
The positions 36 are formed at different positions as shown in FIG.

(10) Next, a step of forming the common electrode 16 on the resin film 13 is performed. The common electrode also serves as a reflector, and is 0.1 μm
m to form a film.

(11) A protective film 17 made of acrylic resin is further formed on the resin film 13 on which the common electrode 16 is formed.
Is carried out.

(12) Next, a step of injecting liquid crystal in vacuum is performed. First, the substrate 1 and the resin films 11, 1
By cutting 2 and 13 along the line CC in FIG.
First passages 34a and 35, which are portions where the surface tension is reduced.
a, 36a are removed, and the second passages 34b, 35b, 36 are removed.
b functions as a liquid crystal injection port. Next, the structure obtained by laminating the resin film on the above-mentioned substrate is placed in a vacuum injector together with three liquid crystal reservoirs containing guest-host liquid crystals in which dichroic dyes of cyan, magenta and yellow are dissolved. Put in. Then, after evacuating, the second passage 34 of each liquid crystal layer is formed.
By bringing b, 35b, and 36b into contact with the liquid crystal liquid surface of each liquid crystal reservoir, guest-host liquid crystals corresponding to each color are vacuum-injected into gaps between the three liquid crystal layers. After all the liquid crystal has been injected into each gap, the substrate is taken out of the vacuum injector, and the three second passages 34b, 35b, 36b are sealed using an ultraviolet curable resin. As described above, the liquid crystals 21 to 23 can be sealed in the gaps between the first to third liquid crystal layers 6 to 8.

Through the above steps, the liquid crystal display device shown in FIG. 1 can be manufactured. As a result, an extremely thin resin film can be easily adhered to the supporting member, and liquid crystal is sealed in a gap between the substrate and the resin film to form a liquid crystal display element. The aperture ratio was increased, and a high contrast ratio and a bright display were realized. Further, since the thickness of the resin film is small, the liquid crystal display element can be driven at a low voltage, and a glass substrate is not required, so that a bright display without parallax can be realized. In the first embodiment, a positive photoresist is used as the support member and the adhesive layer. However, the support member and the adhesive layer may be formed using a negative resist. In this case, instead of providing a light-shielding film between the substrate and the support member, a reflection film is provided in a portion where the support member is not provided, and the support member and the adhesive layer are formed using the reflection film as a mask.
In addition, since a reflective film is formed on a substrate, a transparent conductive film is formed as a common electrode on the uppermost resin film.

(Embodiment 2) In Embodiment 1, the adhesive layer forming step of forming the adhesive layer only on the support member was performed. However, as the adhesive layer forming step, the resin film is coated with the adhesive layer in advance. By performing the step, this can be used as an adhesive layer. In this case, the adhesive layer can be formed during the production of the resin film, and the step of forming the adhesive layer on the support member is not required, so that the production process can be simplified. In the bonding step, the substrate and the resin film are bonded to each other with the surface of the resin film provided with the adhesive layer in contact with the support member on the substrate. The adhesive layers may be provided on both sides of the resin film.

The adhesive layer on the resin film is formed by thinly coating a resin mainly composed of a polyethylene resin, a polyurethane resin or the like having thermoplasticity at a temperature lower than that of the polyester resin on a resin film made of a polyester resin. Form. Here, the thickness of the adhesive layer was 1/5 to 1/10 the thickness of the resin film. By thus reducing the thickness of the adhesive layer, a voltage drop in the adhesive layer can be suppressed.

The method for forming such a thin adhesive layer is as follows. A resin film having a thickness of about several μm is thinned by stretching. Before stretching, a resin forming an adhesive layer is applied to the resin film, and then stretched. By doing so, the resin film and the adhesive layer are thinned at the same ratio as the thickness of the resin film and the adhesive layer before stretching, so that a very thin and uniform adhesive layer can be formed.

(Embodiment 3) In Embodiment 1, vents 34 to 36 are provided around the display portion for venting the gas in the gap between the resin film and the substrate and the outside, and the vents 34 to 36 are provided. First passages 34a to 36a
By lowering the surface tension in the vicinity, the possibility of intrusion of the solution from the vent was prevented beforehand. Instead of such a method, the periphery of the display portion may be sealed and the vent hole may be closed to prevent the intrusion of the solution. In this case, in a step involving heating or evacuation, the gas in the gap may expand and the resin film may be broken.Before this step, a part of the sealed display portion is penetrated to open the vent. Provide. After the step involving heating and evacuation, the vent is closed before the step of dipping in the solution. The location where the vent is provided is a portion other than the pixels around the display portion, and the vent is formed by using a laser beam to form a hole having a diameter of 50 μm in the resin film. The vent is closed by pressing an iron tip heated to about 200 ° C. into the vent and thermally bonding the resin film.

In order to form three liquid crystal layers,
Since it is necessary to repeat the process of opening and closing the vent a plurality of times, the vent was provided by changing the place where the vent was formed once.
By doing so, a liquid crystal display element can be formed as in the first embodiment. Further, as a method of closing the vent, an adhesive tape may be used. In this case, the same effect as in the first embodiment can be obtained by attaching and detaching the tape each time the process of closing and opening the vent is repeated. As the tape for closing, a tape having a resistance to a solution in which the substrate is immersed is used, and a tape having relatively low adhesiveness is preferable.

(Embodiment 4) In the first and third embodiments, the gas in the gap and the outside are ventilated by providing the vent. Instead of such a method, in the fourth embodiment, resin films 11 to 13 having air permeability were used. This allows air in the gap to enter and exit through the resin film even in a process involving heating and evacuation, thereby preventing problems such as breakage of the resin film due to expansion of gas generated when the gas does not have air permeability. In the step of immersion in the solution, it is possible to prevent the solution from entering the gap. Therefore, the step of providing a vent as in the first and third embodiments can be omitted. In addition, by taking measures against both the use of the air-permeable resin film and the formation of the air vents of the first and third embodiments, the air in the gap can be smoothly ventilated, and the resin film can be broken. The effect of prevention increases. When a resin film having air permeability and moisture permeability is used, oxygen or moisture in the air enters the gap through the resin film after manufacturing the liquid crystal display element,
The display performance may be deteriorated by lowering the retention rate of the liquid crystal. Here, if aluminum is vapor-deposited as a common electrode on the uppermost resin film as in Embodiment 1, the common electrode can serve as a shielding film to prevent intrusion of oxygen or moisture. There is no need to provide them, and the process can be simplified. When there is a portion where the resin film is exposed on the surface of the liquid crystal display element, a shielding film having no air permeability and no moisture permeability is placed on the uppermost resin film 13 in order to prevent a decrease in display performance. Must be formed.

Embodiment 5 In Embodiment 1, the reflection plate is formed by forming the reflection film 16 also serving as a common electrode on the uppermost resin film 13. In this method, since the reflection film is formed on the flat resin film, the light reflection characteristics have a specular property. When the reflective film has a mirror surface, the light source is reflected on the reflective film, making it difficult to see the display, and there is a problem that the display is dark when the display element is viewed from an angle without the reflection. For this reason, a liquid crystal display device having a reflective film whose reflective property is made diffusive by providing fine irregularities on the surface of the reflective film has been conventionally proposed (Japanese Patent Laid-Open No. Hei.
243226). In this method, a resin layer having fine irregularities is provided on a substrate, and a reflective film is formed on the resin layer so as to have a diffusive property. Here, in the configuration of Embodiment 1 of the present invention, when a reflective film having an uneven shape is provided on a substrate similarly to the related art, (1) the gap between the reflective film and the resin film due to the unevenness on the substrate; (2) When back exposure is performed to form a support member and an adhesive layer, light is shielded by a reflective film, so that a positive photoresist is used as in the first embodiment. There is a possibility that a new problem may occur that the support member and the adhesive layer cannot be provided at the same position.

Therefore, the fifth embodiment of the present invention will be described with reference to FIG.
As described above, on the outermost liquid crystal layer of the laminated liquid crystal layers, that is, on the uppermost resin film 13, a resin layer 50 having a large number of fine irregularities on the surface is provided. The reflection film 51 was formed. Here, the resin layer 50 was formed of a transparent positive photoresist, and the reflection film 51 was formed by aluminum evaporation. With this configuration, a reflective film having a diffusivity can be formed on the liquid crystal layer, so that the display can be easily viewed and the above problem can be solved. The present invention is different from the prior art in that the surface of the reflective film having the uneven shape on the resin layer side is used as the reflective surface. If the light absorption by the resin layer is large, the display becomes dark. Therefore, the resin layer 50 needs to be a transparent material as described above.

In the fifth embodiment, the reflection film also serves as a common electrode. However, when a voltage is applied between the electrodes, the voltage drops in the resin layer and the voltage applied to the liquid crystal layer decreases. In order to avoid this, the resin film 13 and the resin layer 5
A configuration may be such that a transparent common electrode is provided between 0 and 0.
Note that in this case, light may be absorbed by the common electrode and the brightness of the display may be slightly darkened.

Next, the manufacturing process of this embodiment will be described.
Parts overlapping with the first embodiment are omitted, and only different parts will be described. Of the items described in the description of the steps of the manufacturing method of the first embodiment, (1) to (9) are similarly performed,
Only the step (10) of forming a reflection film is changed as follows. A positive photoresist is applied on the resin film 13 to a thickness of 1 μm. Next, using a photomask 53 having a large number of minute circular holes 52 as shown in FIG. 19, mask exposure and development are performed to perform patterning. After that, the entire surface is exposed to make the resist transparent. Next, the substrate is fired in a 200 ° C. oven. By using a material that causes thermal sag during baking as the photoresist, the protrusions on the surface of the resin layer are deformed from the solid line 54 to the imaginary line 55 in FIG. 20 to form minute uneven surfaces. Next, a reflective film 51 of 0.1 μm is formed on the surface of the resin layer by aluminum evaporation. Next, liquid crystal was injected in the same process as (12) of the manufacturing process of the first embodiment, and the liquid crystal display device of FIG. 18 was completed. Note that the step (11) may be performed in the same manner as in the first embodiment, and a protective film may be formed on the reflective film.

As described above, a reflective film having diffusivity can be formed on the liquid crystal layer, and the display can be easily viewed.

[0155]

As described above, according to the present invention, a gap for enclosing liquid crystal is formed between the resin film and the substrate or between the resin films, and the liquid crystal is encapsulated in the gap. By forming the element, a bright, high-contrast liquid crystal display element can be realized without color shift due to parallax caused by stacking liquid crystal layers.

In addition, since a resin film is used as the sealing film and the resin film is bonded to the supporting member via the adhesive layer, the manufacturing process can be simplified and the manufacturing yield can be increased.

[Brief description of the drawings]

FIG. 1 is a cross-sectional view of one pixel portion in a central portion of a liquid crystal display element according to a first embodiment.

FIG. 2 is a plan view of one pixel portion in a central portion of the liquid crystal display element according to the first embodiment.

FIG. 3 is an overall configuration diagram of the liquid crystal display element according to the first embodiment.

FIG. 4 is a partially enlarged sectional view of FIG. 1;

FIG. 5 is a partially enlarged sectional view of FIG. 1;

FIG. 6 is an explanatory diagram illustrating a manufacturing process of the liquid crystal display element of the first embodiment.

FIG. 7 is an explanatory diagram illustrating a manufacturing process of the liquid crystal display element of the first embodiment.

FIG. 8 is an explanatory diagram illustrating a manufacturing process of the liquid crystal display element of the first embodiment.

FIG. 9 is an explanatory diagram illustrating a manufacturing process of the liquid crystal display element of the first embodiment.

FIG. 10 is an explanatory diagram illustrating a manufacturing process of the liquid crystal display element of the first embodiment.

FIG. 11 is an explanatory diagram illustrating a manufacturing process of the liquid crystal display element of the first embodiment.

FIG. 12 is an explanatory diagram illustrating a manufacturing process of the liquid crystal display element of the first embodiment.

FIG. 13 is an explanatory diagram illustrating a manufacturing step of the liquid crystal display element of the first embodiment.

FIG. 14 is a cross-sectional view of the vicinity of a vent 34.

FIG. 15 is a diagram showing a state in which the infiltration of a solution is prevented by a surface tension lowering process performed on a vent.

FIG. 16 is a cross-sectional view of the vicinity of a vent 35;

FIG. 17 is a cross-sectional view of the vicinity of a vent 36.

FIG. 18 is a cross-sectional view of one pixel portion in the center of the liquid crystal display element according to the fifth embodiment.

FIG. 19 is a partial plan view of a mask 53.

FIG. 20 is a diagram showing a surface change of a resin layer 50.

FIG. 21 is an explanatory diagram of a conventional liquid crystal display element.

[Explanation of symbols]

 1: substrate 2, 3, 4: TFT element 2a: drain terminal of TFT element 2 3a: drain terminal of TFT element 4 4a: drain terminal of TFT element 4 5: light shielding film 6: first liquid crystal layer 7: second liquid crystal Layer 8: Third liquid crystal layer 11, 12, 13: Resin film 16: Common electrode 18, 19, 20: Support member 21, 22, 23: Liquid crystal 24, 25: Opening 26, 27: Roller 28: Resist film 31, 32, 33: adhesive layers 34, 35, 36: vents 40, 41, 42: three-dimensional wiring pads M1: first pixel electrode M2: second pixel electrode M3: third pixel electrode 50: resin layer 51: reflective film

──────────────────────────────────────────────────の Continued on the front page (72) Inventor Takeshi Karasawa 1006 Kadoma Kadoma, Osaka Prefecture Matsushita Electric Industrial Co., Ltd. (72) Inventor Hiroshi Yamazoe 1006 Odaka Kadoma Kadoma City, Osaka Matsushita Electric Industrial Co., Ltd. (56) References JP-A-55-53316 (JP, A) JP-A-8-313939 (JP, A) JP-A-8-328031 (JP, A) JP-A-5-81829 (JP, U) (58) Field surveyed (Int.Cl. ⁷ , DB name) G02F 1/1333 G02F 1/1335 G02F 1/1339 G02F 1/1347

Claims (31)

(57) [Claims] 1. A transparent substrate having an upper surface on which a pixel electrode and a driving element connected to the pixel electrode are formed, and a plurality of resin films disposed above the substrate, wherein A common electrode is formed on the upper surface, and a pixel electrode is formed on the upper surface of the other resin film.
Such a plurality of resin films, and a plurality of liquid crystal layers configured by sealing liquid crystal in each gap formed by interposing a large number of columnar support members between the substrate and the resin film and between the resin films. And a drive element corresponding to each of the pixel electrodes on each of the resin films is provided on the upper surface of the substrate, and the three-dimensional wiring provided in relation to the pixel electrodes on the resin film makes the resin film A liquid crystal display element having a structure in which an upper pixel electrode and a driving element are electrically connected, wherein an adhesive layer is interposed between each of the support members and the resin film, and the adhesive layer has a thermoplastic property. It has a bonding state between the resin film and the substrate, between the substrate and the resin film and between the resin films. That the support member is a liquid crystal display element characterized by being present in substantially the same position with respect to a plane parallel to the substrate. 2. The resin film is a non-thermoplastic material or a thermoplastic material exhibiting a higher thermoplasticity temperature than the adhesive layer, and the support member is a non-thermoplastic material. 2. The liquid crystal display device according to claim 1 , wherein the liquid crystal display element is a material having thermoplasticity exhibiting a higher thermoplasticity than the adhesive layer, or a material which is cured before the adhesive treatment. 3. The liquid crystal layer and the resin film are each 3
2. The liquid crystal display device according to claim 1 , wherein the liquid crystals forming the three liquid crystal layers in a set are stacked are guest-host liquid crystals containing dichroic dyes of different colors. 4. The substrate is a transparent substrate, and the support member and the adhesive layer form a light-shielding film at a support member-forming portion on the surface of the substrate, and are formed by photolithography using the light-shielding film as a photomask. 3. A photoresist according to claim 1, wherein said photoresist is a shaped photoresist.
3. The liquid crystal display device according to any one of items 3 . 5. The substrate is a transparent substrate, and the support member and the adhesive layer are formed by forming a light-shielding film on a portion of the substrate surface other than where the support member is formed, and using the light-shielding film as a photomask by a photolithography method. 2. The method of claim 1, wherein the negative photoresist is coated.
A liquid crystal display device according to claim 3 . 6. A distance between supporting members existing in a pixel region among the plurality of supporting members is 15 μm to 10 μm.
The liquid crystal display device according to any one of claims 1 to 3, characterized in that in the range of 0 .mu.m. 7. The resin film having a thickness of 0.5 μm or less.
Claim, characterized in that a 10 [mu] m 1 through claim 3
The liquid crystal display device according to any one of the above. 8. The resin film having a specific resistance of 10 ¹⁰ Ω ·
claim, characterized in that cm or less 1 to claim 3
The liquid crystal display device according to any one of the above. 9. The method according to claim 1, wherein the plurality of resin films are resin films having optical anisotropy, and are arranged such that the slow axes of the resin films are all in the same direction. The liquid crystal display device according to claim 1 or 3 . 10. The resin film has air permeability, and the common electrode is made of a reflective metal material, and prevents oxygen and moisture in outside air from entering the element through the resin film. the liquid crystal display device according to any one of claims 1 to 3, characterized in that also serves as a shielding film for. 11. The shielding film for preventing the oxygen and moisture in the outside air from entering the device through the resin film is formed on the common electrode, wherein the resin film has air permeability. the liquid crystal display device according to any one of claims 1 to 3, characterized in. 12. The liquid crystal display device according to claim 11 , wherein said common electrode is a transparent electrode, and said shielding film is made of a metal material having a reflection characteristic and also serves as a reflection plate. 13. The common electrode is a transparent electrode, on which a transparent resin layer having a large number of fine irregularities is formed on the surface of the common electrode. the liquid crystal display device according to any one of claims 1 to 3, characterized in that the reflection film of the concavo-convex shape is formed. 14. A substrate having an upper surface on which a pixel electrode and a driving element connected to the pixel electrode are formed, and a plurality of resin films disposed above the substrate, other than the uppermost resin film. Pixel electrodes are formed on the upper surface of the resin film of such a plurality of resin films,
Having a plurality of liquid crystal layers configured by enclosing liquid crystal in each gap formed by interposing a large number of columnar support members between the substrate and the resin film and between the resin films,
Driving elements respectively corresponding to the pixel electrodes on each of the resin films are provided on the upper surface of the substrate, and the pixel electrodes on the resin film are provided by three-dimensional wiring provided in relation to the pixel electrodes on the resin film. And a driving element are electrically connected to each other, wherein an adhesive layer is interposed between each of the support members and the resin film, and the adhesive layer is made of a material having thermoplasticity. The adhesive layer develops thermoplasticity to obtain an adhesion state between the resin film and the support member.The support member existing between the substrate and the resin film, and the support member existing between the resin films, A transparent resin layer having a large number of fine irregularities on the surface is formed on the upper surface of the resin film at the uppermost position. A liquid crystal display device, wherein a reflective film having an uneven shape corresponding to the surface shape of the liquid crystal is formed, and the reflective film also serves as a common electrode. 15. A supporting member forming step of forming a plurality of supporting members on a transparent substrate on which a pixel electrode and a driving element connected to the pixel electrode are formed, and forming an adhesive layer on each of the supporting members. An adhesive layer forming step, a resin film is laminated on the support member via the adhesive layer,
By heating in this state, a resin film laminating step of laminating the resin film on the support member while maintaining a gap between the substrate and the resin film, and a step of forming an opening in the resin film, Forming a pixel electrode on the resin film and electrically connecting a corresponding drive element on the substrate to the pixel electrode on the resin film through the opening; A laminating step of alternately laminating a film, a step of forming a support member on a resin film bonded to a substrate, a step of forming an adhesive layer on the support member, and a step of forming a resin on the support member. Bonding a film; forming an opening in the resin film; forming a pixel electrode on the resin film; The step of electrically connecting the pixel electrodes on the resin film and the drive device corresponding on the substrate by performing at least once Te,
Such a laminating step of alternately laminating the liquid crystal enclosing region and the resin film, and further forming a support member on the resin film that is finally bonded in the laminating step, and forming an adhesive layer on the support member. Bonding the uppermost resin film on the support member by using a conventional method, forming a common electrode on the uppermost resin film, forming a liquid crystal sealing region between the substrate and the resin film, and liquid crystal between the resin films. A method of injecting a liquid crystal into the sealing region. 16. The method for manufacturing a liquid crystal display element according to claim 15 , wherein, in the step of forming the opening, the opening is formed in the resin film by reactive ion etching. Method. 17. The method for manufacturing a liquid crystal display device according to claim 15 , wherein the step of bonding the resin film includes a step of pressing the resin film with a heated roller. Production method. 18. The method for manufacturing a liquid crystal display device according to claim 17 , wherein the temperature at which the adhesive layer exhibits thermoplasticity is lower than the temperature at which the resin film exhibits thermoplasticity. Wherein the heating roller heats the adhesive layer to a temperature at which the adhesive layer develops plasticity and a temperature at which the resin film develops plasticity. 19. The method for manufacturing a liquid crystal display device according to claim 17 , wherein at least a surface portion of the heated roller is made of a rigid material. 20. The method for manufacturing a liquid crystal display element according to claim 17 , wherein the step of bonding the resin film includes the step of pulling the resin film to extend wrinkles when the resin film is pressed by a heated roller. A method for manufacturing a liquid crystal display element, comprising: 21. The method for manufacturing a liquid crystal display element according to claim 15 , wherein the supporting member forming step includes forming a light shielding film at a supporting member forming portion on the substrate surface, and covering the light shielding film on the substrate surface. First
After applying the positive resist of the above, the light-shielding film is exposed from the back side of the substrate using a photomask, and then the first positive resist is developed with a developing solution, the first positive resist is cured, and the supporting member is provided on the substrate. A supporting member forming step in the laminating step , wherein a resin film is formed.
After applying the first positive resist on the surface of the
After exposing the light shielding film as a photomask, the first positive
The first positive resist is developed with a developing solution.
In the process of curing and forming the support member on the resin film
In the adhesive layer forming step, after applying a second positive resist on the substrate on which the support member is formed, exposing the second positive resist with a developing solution after exposing from the back surface of the substrate using the light-shielding film as a photomask. The step of forming an adhesive layer on the support member by developing is performed. In the step of forming the adhesive layer in the laminating step, the support member is formed.
Apply a second positive resist on the formed resin film
Then, the light shielding film is exposed from the back side of the substrate as a photomask.
After that, developing the second positive resist with a developer
A method of forming an adhesive layer on a supporting member . 22. The method for manufacturing a liquid crystal display element according to claim 15 , wherein the resin layer forming step and the resin film laminating step prepare a resin film having one surface coated with an adhesive layer in advance. This resin film is overlaid on the support member such that the surface covered with the adhesive layer faces the support member,
A step of bonding the resin film on the support member by heating in this state. 23. The method for manufacturing a liquid crystal display element according to claim 15 , wherein, in the supporting member forming step, a supporting member existing in a pixel region among the plurality of supporting members has a width equal to or greater than a height. Forming a liquid crystal display element. 24. The method according to claim 15 , wherein the resin film has a thickness of 0.5 μm to 10 μm. 25. The method according to claim 15 , wherein a main component of the resin film is a polyester resin. 26. The method for manufacturing a liquid crystal display element according to claim 15 , wherein, during the step of bonding the support member on the substrate and the resin film, the gap between the substrate and the resin film and the outside are ventilated. Forming a ventilation hole for bonding, and, during the step of bonding the support member on the resin film and the resin film, forming a ventilation hole for ventilation between a gap between the resin films and the outside. A method for manufacturing a liquid crystal display element. 27. The method for manufacturing a liquid crystal display element according to claim 26, wherein the resin film and the resin film are bonded to each other around a display portion on the substrate except for a portion not to be bonded. A method for manufacturing a liquid crystal display element, wherein a portion not bonded is provided as a vent. 28. The method for manufacturing a liquid crystal display element according to claim 27 , wherein a process for reducing surface tension is performed on the inner wall of the vent. 29. The method for manufacturing a liquid crystal display element according to claim 26 , wherein the substrate and the resin film and the resin film are adhered to each other around the display portion on the substrate, and between the substrate and the resin film and between the resin film A method for manufacturing a liquid crystal display element, wherein each liquid crystal enclosing region between them is once sealed, and then a through hole is formed in a portion other than the display portion of the resin film to form a vent. 30. The method for manufacturing a liquid crystal display element according to claim 26 , comprising a step of closing the vent. 31. A supporting member forming step of forming a plurality of columnar supporting members on a transparent substrate on which a pixel electrode and a driving element connected to the pixel electrode are formed, and forming an adhesive layer on each of the supporting members. An adhesive layer forming step to be performed, a resin film is overlaid on the support member via the adhesive layer,
By heating in this state, a bonding step of bonding the resin film on the support member while maintaining a gap between the substrate and the resin film, a step of forming an opening in the resin film, Forming a pixel electrode thereon and electrically connecting a corresponding drive element on the substrate and a pixel electrode on the resin film through the opening; and a region for enclosing liquid crystal on the substrate and the resin film. A laminating step of alternately laminating, a step of forming a support member on a resin film bonded to a substrate, a step of forming an adhesive layer on the support member, and a resin film on the support member Laminating, forming an opening in the resin film, forming a pixel electrode on the resin film, and forming the substrate through the opening. Of the step of electrically connecting the corresponding drive elements and pixel electrodes on the resin film, by performing at least once,
Such a laminating step of alternately laminating the liquid crystal enclosing region and the resin film, and further forming a support member on the resin film that is finally bonded in the laminating step, and forming an adhesive layer on the support member. Bonding a resin film at the uppermost position on the support member, applying a photoresist on the upper surface of the resin film at the uppermost position, performing mask exposure and development, and then baking the surface to form a large number of fine particles on the surface. A step of forming a resin layer having an uneven shape; a step of forming a reflective film also serving as a common electrode on the resin layer; a liquid crystal sealing area between the substrate and the resin film; and a liquid crystal sealing area between the resin films. And a step of injecting a liquid crystal.