JP3070968U - Inexpensive, high-performance heat dissipation device for chips - Google Patents

Abstract

PROBLEM TO BE SOLVED: To facilitate the assembly of a heat radiating device by providing a heat pipe formed integrally with a substrate and conducting heat generated by a heat generating component to a heat radiating member. Improve heat dissipation efficiency. A first heat radiating member and a second heat radiating member are provided on an upper surface of a substrate so as to be separated from each other, and a heat pipe is fitted in a channel formed in the upper surface of the substrate. The first and second grooves 38, which are rare and whose both ends are provided on the bottom surfaces of the first and second heat radiating members 25, 60,
62 is fitted. The first heat dissipating member 25 is provided with a cavity 27 in which a plurality of heat dissipating fins 33 protrude from the upper surface of the projection 31. The heat generated from the computer chip propagates from the second heat radiating member 60 to the first heat radiating member 25 via the heat pipe 70, and the protrusion 3
The heat is radiated from the radiating fins 33 and is removed from the inside of the cavity 27 to the outside through the open end 28 by the airflow from the fan 40.

Description

[Detailed description of the invention]

[0001]

[Technical field to which the invention belongs]

 The present invention relates to a heat radiating device for a computer, and more particularly to a heat radiating device effective for heat radiation of a computer which can be manufactured at low cost and can be easily assembled.

[0002]

[Prior art]

 As the processing speed of computers increases, the power consumed by computers such as CPUs (Central Processing Units) and chips increases, and as a result, the temperatures of these components increase. The heat generated by these components must be dissipated effectively and in a timely manner, or the computer will fail or malfunction. Traditionally, heat sinks made of a heat conducting material such as aluminum have been used to remove heat generated by heat generating components of a computer. U.S. Pat. No. 5,621,615 and U.S. Pat. No. 5,620,469 discloses a heat reservoir having a plurality of fins extending upwardly from a substrate in a matrix. The base of the heat sink directly contacts the top surface of the heat-generating component, such as a chip, and dissipates heat to the surrounding environment. However, many of the current components are of compact design and are housed in increasingly confined spaces and are very dense, so that the heat dissipation effect of the heat reservoir is inadequate. Thus, most recently developed compact-design computers have overheating problems. In order to solve this problem, a new fan is added and a heat pipe is connected to the heat sink to improve the heat dissipation effect of the heat reservoir. U.S. Pat. No. 5,690,468 disclose a heat reservoir, a plate member fixedly mounted on the heat reservoir, and having a hole at an intermediate portion, a fan device, and a fan assembly including a heat pipe. The heat reservoir has a plurality of rows and multiple rows of fins extending upward from the upper surface thereof so as to define a gap between adjacent fins. A space is defined in the center of the heat reservoir, the fan assembly is mounted on a plate member, and the fan is housed in this space of the heat reservoir. Connected to heat pipe heat reservoir. This design enhances the cooling effect of the computer, but is difficult and time-consuming to assemble. Also, it is not suitable for use in notebook computers, which have high size requirements in the dimensions and configuration of the fan assembly. Another heat dissipation device is a combination of a material substrate, a metal block that contacts the chip, a heat pipe, and a heat reservoir. A part of the substrate is riveted to a metal block, and a heat pipe is pressed into contact with the metal block to absorb heat generated by the chip and propagate the heat to a heat reservoir connected thereto. However, riveting the substrate to the metal block is very labor intensive, time consuming, and does not reliably contact the heat pipe with the metal block. In addition, heat pipes, heat reservoirs, substrates and metal blocks must be manufactured separately, which complicates both the assembly and manufacture of the radiator, and does not meet the current demand for low cost computers. Still another heat dissipating device 10 is shown in FIG. 1, and has a rectangular substrate 11, a heat reservoir 13 attached to the substrate 11, a fan 19 attached to the heat reservoir 13, and a heat reservoir 13 attached to the substrate 11. And a heat pipe 17 attached to the substrate 11 and connecting the metal block 15 to the heat reservoir 13. The metal block 15 has a top plane 14 which abuts a chip (not shown) of the heat source. The heat reservoir 13 and the metal block 15 are provided with central grooves 12 and 16 on the respective bottom surfaces, and the extended portions of the heat pipe 17 are accommodated in the grooves 12 and 16. With such a design, the heat dissipation capability of the computer is sufficiently improved. In this assembly, the heat reservoir 13 is first attached to the substrate 11 with a thermally conductive adhesive, and then the heat pipes 17 are extended into the heat reservoirs 13 and the grooves 12 of the metal blocks 15, respectively. The metal block 15 is attached to the substrate 11. Finally, the fan 19 is attached to the heat reservoir 13 by screws. Such an assembly operation is very tedious and time consuming.

[0003]

[Problems to be solved by the invention]

 The present invention seeks to overcome the above-mentioned problems by providing a heat dissipating device that is inexpensive, easy to assemble, and improves the heat dissipation of the computer. A first object of the present invention is to provide a heat dissipating device that is easy to assemble. A second object of the present invention is to provide an inexpensive heat radiating device. A third object of the present invention is to provide a heat radiating device having an improved heat radiating effect of a computer.

[0004]

[Means to solve the problem]

 To achieve the above object, a heat radiating device for a heat generating component of a computer according to the present invention includes a substrate, a first heat radiating member for removing heat from the heat generating component, and a heat radiating member for contacting the heat generating component. And a heat pipe assembled to the substrate for transmitting heat from the second heat radiating member to the first heat radiating member. The substrate and the first and second heat radiation members are integrally formed by die casting. A channel for receiving the heat pipe is formed in the substrate. Each of the first and second heat radiating members has a groove formed at the bottom thereof, and the groove communicates with a channel of the substrate that engages with the heat pipe. The heat pipe is held in the substrate channel with either an interference fit or a thermally conductive adhesive in the substrate channel. The first heat radiating member has a cavity for removing the heated air, and an open end communicating with the cavity and for removing the heated air. The protrusion integrally formed on the substrate is disposed in the cavity near the opening end. A plurality of radiating fins extend upward from the protruding portion and are substantially flush with the upper surface of the first radiating member. A plurality of guide members are formed on the substrate, and are disposed in the cavity of the first heat radiating member near the protrusion. The guide members are arranged in a vertical pattern to facilitate a smooth air flow. The heat radiating device of the present invention further has a cover attached to the upper surface of the first heat radiating member. A fan is fixed to the bottom surface of the cover and is housed directly above the guide member in the cavity of the first heat dissipation member. Other objects, effects and novel features of the present invention will become apparent from the detailed description of the present invention described in conjunction with the accompanying drawings.

[0005]

[Embodiment of the invention]

 A preferred embodiment of the present invention will be described with reference to the accompanying drawings. Referring to FIGS. 2 and 3, the heat dissipation device 20 of the present invention is formed integrally with the substrate 22, the first heat dissipation member 25 extending integrally from the upper surface 23 of the substrate 22, and the substrate 22. It is composed of a second heat radiation member 60, a cover 50 attached to the first heat radiation member 25, a fan 40 fixed to the cover 50, and a heat pipe 70 attached to the substrate 22. The substrate 22 is made of a heat conductive material such as aluminum. The first heat dissipating member 25 has a rectangular shape and is disposed at one end in the longitudinal direction of the substrate 22. The second heat dissipating member 60 is arranged in parallel with the first heat dissipating member 25, and is in the form of a metal block made of aluminum or the like. The upper surface 61 of the second heat radiation member 60 is in contact with a heat generating component (not shown) such as a computer chip. The substrate 22 and the first and second heat radiating members 25 and 60 are integrally formed by die casting.

A channel 24 having a shape corresponding to the heat pipe 70 is formed in the substrate 22 and houses the heat pipe 70. The first and second heat dissipating members 25 and 60 have first and second grooves 38 and 62 formed at the bottom thereof, respectively. The first and second grooves 38 and 62 communicate with the channel 24 of the substrate 22 to form an extension of the heat pipe 70. The heat pipe 70 is engaged with the first and second grooves 38 and 62 to transmit the heat generated from the chip from the second heat radiating member 60 to the first heat radiating member 25.

The first heat radiating member 25 has a cavity 27 that is exposed upward and an open end 28 that communicates with the cavity 27 and removes heated air from the cavity. This is clearly explained below. The plurality of screw holes 37 are formed on the upper surface of the first heat dissipation member 25. The projection 31 is formed near the opening end 28 in the cavity 27. A plurality of radiating fins 33 extend upward from the protrusion 31. Each fin 33 has a cylindrical shape and is flush with the upper surface 26 of the first heat radiation member 25. A plurality of airflow guide members 35 are formed on the upper surface 23 of the substrate 22 in the cavity 27 and adjacent to the protrusion 31. The guide members 35 are arc-shaped, and are arranged in a vertical pattern so that air can flow easily and smoothly.

The cover 50 has an opening 53 that penetrates the cover 50 at a position corresponding to the guide member 35 of the first heat radiation member 25. A plurality of holes 59 are formed around opening 53 in alignment with corresponding engagement holes 44 in frame 42 of fan 40. A plurality of bolts (not shown) sequentially pass through the through holes 57 of the cover 50 and the corresponding screw holes 37 of the first heat radiating member 25, whereby the fan 40 is fixed to the bottom of the cover 50. A plurality of through holes 57 are formed in alignment with the corresponding screw holes 37 of the first heat radiating member 25. A plurality of bolts (not shown) are sequentially passed through the through holes 57 of the cover 50 and the screw holes 57 of the first heat radiating member 25, thereby fixing the cover 50 to the upper surface 50 of the first heat radiating member 25. The fan 40 fixed to the bottom 55 of the cover 50 is housed in the cavity 27 of the first heat dissipation member 25 immediately above the guide member 35.

The heat pipe 70 has a curved cylindrical shape and a diameter substantially equal to the width of the channel 24 of the substrate 22. The heat pipe 70 is tightly fitted into the channel 24 from the bottom surface 21 of the substrate 22 or assembled by using a heat conductive adhesive such as an epoxy resin. The heat pipe 70 is engaged with the first and second grooves 38 and 62 of the first and second members 25 and 60 and is flush with the bottom surface of the substrate 22.

At the time of assembly, the heat pipe 70 is assembled to the channel 24 by either an interference fit or a thermally conductive adhesive in the channel 24 of the substrate 22. The cover 50 in which the fan 40 is fixed to the bottom surface 55 is attached to the upper surface 26 of the first heat dissipation member 25. Thus, the assembly of the heat radiator 20 becomes very easy as compared with the conventional heat radiator.

[0011]

[Effect of the invention]

 The heat generated from the chip is transmitted to the second heat radiating member 60 via the upper flat surface 61 with which the chip is in contact. This heat is then transmitted from the second heat dissipating member 60 to the first heat dissipating member 25 via the heat pipe 70. During operation, the fan 40 is operated to generate an air flow, which flows into the cavity 27 of the first heat radiating member 25 through the opening 53, and removes heat radiated from the fin 33 through the opening end 28. Since the guide member 35 is provided, the air flowing into the cavity 27 is directed in a direction so as to sufficiently pass through the fins 33 and efficiently removes heat from these fins. Therefore, the heat generated from the chip is removed by the fan 40 via the second heat radiating member 60, the heat pipe 70 and the first heat radiating member 25, whereby the chip can be operated at a specified temperature or lower, and the computer can normally operate. Becomes With this configuration, the heat radiation effect of the computer is improved. In the above-described design, the first and second heat radiating portions 25, 60 and the substrate 22 are integrally formed by die casting, so that the heat radiating device 20 can be easily assembled and its cost can be reduced. Further, by improving the design of the first heat radiation member 25, the heat radiation effect of the computer is improved. Although the detailed structure and function of the present invention have been described in detail and a number of features and effects have been described, the above disclosure is merely exemplary, and may be changed or modified in detail. Matters relating to the shape, size, and configuration of typical parts should be construed in a generic and broad definition in the sense set forth in the claim.

[Brief description of the drawings]

FIG. 1 is a perspective view showing a conventional heat dissipation device.

FIG. 2 is an exploded development view showing the heat dissipation device according to the present invention.

FIG. 3 is a transverse sectional view taken along the line III-III in FIG. 2;

[Explanation of symbols]

 20. Heat dissipating device Substrate 23. Top surface 24. Channel 25. First heat radiation member 26. Top surface 27. Cavity 28. Open end 31. Projection 33. Heat radiation fins 35. Guide member 37. Screw hole 38. First groove 40. Fan 42. frame 44. hole 50. Fan 53. Opening 55. Bottom 57. Through hole 59. Hole 60. Second heat radiation member 61. Upper plane 62. Second groove 70. heat pipe

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[Procedure amendment]

[Submission date] March 30, 2000 (2003.3.3)
0)

[Procedure amendment 1]

[Document name to be amended] Statement

[Correction target item name] Claims for utility model registration

[Correction method] Change

[Correction contents]

[Utility model registration claims]

 ──────────────────────────────────────────────────の Continuing on the front page (72) Inventor Chun-Fusinl Taiwan, Taipei Fussian, Tsu-Chen, Chun-Shang Road, Number 66-1 (72) Inventor Nian-Cheng Cheng Taiwan, Taipei Fussian, Tu-Chen, Chun-Shang Road, Number 66-1

Claims (12)

[Utility model registration claims] 1. A heat radiating device for a heat generating component of a computer, comprising: a substrate; a first heat radiating member formed integrally with the substrate to remove heat generated by the heat generating component; And separated from the first heat dissipation member.
A second heat dissipating member that contacts the heat generating component; and a second heat dissipating member that is disposed between the first and second heat dissipating members.
A heat pipe configured to conduct heat from the heat radiating member to the first heat radiating member. 2. The heat radiating device according to claim 1, wherein said substrate and said first and second heat radiating members are integrally formed by die casting. 3. The heat dissipation device according to claim 1, wherein the substrate defines a channel for accommodating the heat pipe, and each of the first and second heat dissipation members has a groove in a bottom surface thereof. A heat dissipation device, wherein the groove is in communication with a channel of the substrate for extending the heat pipe. 4. The heat radiating device according to claim 3, wherein said heat pipe is assembled to said channel of said substrate by interference fit. 5. The heat radiating device according to claim 3, wherein the heat pipe is assembled to the channel of the substrate with a heat conductive adhesive. 6. The heat radiating device according to claim 3, wherein the heat pipe is assembled to the channel of the substrate from its bottom surface, and is flush with the bottom surface. 7. The heat radiating device according to claim 1, wherein the first heat radiating member has a cavity exposed upward and an open end communicating with the cavity. 8. The heat radiating device according to claim 7, further comprising: a cover attached to an upper surface of the first heat radiating member; and a fan fixed to a bottom of the cover. 9. The heat dissipating device according to claim 8, wherein the first heat dissipating member has a projection integrally protruding from the substrate and disposed in the cavity near the opening end thereof. A heat dissipation device, wherein a plurality of heat dissipation fins extend upward from the projections, and the fins are substantially as high as the upper surface of the first heat dissipation member. 10. The heat dissipation device according to claim 9,
The heat dissipating member includes a plurality of arcuate guide members extending upward in the cavity in proximity to the protrusion, the guide members being arranged in a vertical pattern to facilitate a smooth air flow, The heat dissipating device, wherein the fan is received in the cavity above the guide member and blows air toward the guide member. 11. The heat dissipation device according to claim 1,
The heat dissipation device wherein the first and second heat dissipation members are integrally formed on a top surface of the substrate. 12. A method of assembling a heat radiating device, comprising: providing a first and a second heat radiating member, each having a groove formed near a bottom portion, on a substrate so as to be integral with the substrate; Forming a channel communicating with the corresponding groove so as to extend through the bottom so as to be exposed to the outside through the bottom of the substrate; and forming a heat pipe in the channel upward from the bottom of the substrate. Inserting and attaching the heat pipe, wherein both ends of the heat pipe are housed in the corresponding grooves and are in reliable contact with the corresponding heat radiating members.