JP3067338B2 - Semiconductor heat detector - Google Patents

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a semiconductor type heat sensor provided with a temperature detecting element such as a thermistor whose impedance changes with a change in temperature.

[0002]

2. Description of the Related Art Conventionally, for example, a semiconductor heat sensor of this type is known as shown in FIG. In FIG. 6, 1
Denotes a sensor main body, and a back cover 2 is mounted inside the sensor main body 1 following the printed circuit board 16. Printed circuit board 1
6, a circuit pattern 4 is formed, the circuit component 6 is mounted, and a lead wire of the temperature detecting element 5 is connected. The temperature detecting element 5 is protruded below the sensor main body 1 through the lead hole 7. The lead wire 7 is held and sealed with an adhesive or the like. An outer cover 8 is attached to the lower side of the sensor body 1 to protect the temperature detecting element 5 held in a protruding state.

The printed circuit board 16 is fixed to the sensor main body 1 by screws 17 together with the back cover 2. At the same time, the L-shaped fitting 10 is fixed to the back cover 2, and the L-shaped fitting is fixed by the screws 17. The electrical connection between the circuit pattern 10 and the circuit pattern 5 is made.

[0004]

However, in a conventional semiconductor heat sensor having such a structure,
Since the printed circuit board 16 and the back cover 2 are mounted in the sensor main body 1, the number of components is large, the dimension in the height direction is increased, and the L-shaped fitting 10, the back cover 2, and the print are increased by screws 17. Since the substrate 16 is integrally attached to the sensor main body 1, there is a problem that the assembling work is complicated and the cost is increased.

The present invention has been made in view of such conventional problems, and has as its object to provide a semiconductor heat sensor whose structure is simplified to reduce the size and cost. .

[0006]

In order to achieve this object, the present invention is configured as follows. The reference numerals in the drawings of the embodiments are also shown. The present invention is directed to a semiconductor-type heat sensor having a temperature detecting element 5 whose impedance changes with a change in temperature, and is fitted on a cover member mounted on the sensor body 1 on the back side. An alloy tool is insert- molded and fixed, and a circuit pattern 4 is formed on the inner surface of the lid member so as to be electrically connected to the fitting at a predetermined position. The component 6 is mounted.

More specifically, the cover member is a back cover 2 for closing the back side of the sensor body 1, and a temperature detection element 5 having a lead terminal connected to a circuit pattern 4 formed on the inner surface of the back cover 2 is used as a sensor. It is held outside the main body 1 in a protruding state. As another specific example, the cover member is a front cover 20 that closes the front side of the sensor main body 1, and the temperature detection element 5 is directly mounted on the circuit pattern 4 formed on the inner surface of the front cover 20.

[0008]

According to the semiconductor heat detector of the present invention having such a configuration, since the fitting is integrally formed with the cover member by insert molding, it is not necessary to assemble the fitting with screws or the like. become. In addition, since a circuit pattern is formed directly on the lid member, a printed circuit board is not required, the cost can be significantly reduced by reducing the number of components, and the size and height can be reduced by reducing the dimension in the height direction.

[0009]

FIG. 1 is a structural view showing an embodiment of a semiconductor heat sensor of the present invention having a structure in which a back cover is attached to a sensor body. In FIG. 1, 1 is a sensor main body,
A back cover 2 is mounted inside the sensor body 1. A pair of column-type fittings 3 are integrally fixed to the back cover 2 by insert molding. That is, the column-type fitting 3 can be assembled and fixed integrally with the back cover 2 by insert molding in which resin is injected in a state where the column-type fitting 3 is set in the mold. The column-type fitting 3 has a fitting recess 3a at the top.
, And the lower end is exposed on the inner surface side.

[0010] A circuit pattern 4 of the sensor circuit is formed on the inner surface side of the back cover 2. The circuit pattern 4 is formed so as to be electrically connected at an exposed position on the inner surface side of the column-type fitting 3. Circuit pattern 4 formed on the inner surface of back cover 2
A circuit component 6 composed of a chip component or the like is mounted thereon, and a lead terminal of the temperature detecting element 5 using a thermistor or the like is connected by solder or the like.

The temperature detecting element 5 projects out of the drawer hole 7 with the back cover 2 incorporated in the sensor main body 1 as shown in the figure, and the drawer hole 7 is sealed by filling it with an adhesive or the like. ing. Further, an outer cover 8 having an opening 9 is attached so as to cover the protruding portion of the temperature detecting element 5 to protect the temperature detecting element 5. According to the structure of the semiconductor heat detector of the present invention shown in FIG. 1, the pole-type fitting 3 is fixed to the back cover 2 by insert molding. Can be unnecessary. In addition, since the circuit pattern 4 is formed on the inner surface of the back cover 2, a printed circuit board conventionally used can be omitted.

Further, a circuit pattern 4 is formed on an exposed portion of the inside of the pole-type fitting 3 which is insert-molded on the back cover 2 to make an electrical connection, so that the pole-type fitting 3 is formed.
It is not necessary to use a screw or the like to make an electrical connection between the circuit pattern 4 and the circuit. As a result, the only part to be incorporated into the sensor main body 1 is the back cover 2, and the size in the height direction can be reduced to make the sensor smaller and thinner. Also, the assembling operation itself becomes extremely simple. Significant cost reduction can be achieved.

In the above embodiment, the back cover 2 and the pole-type fitting 3 are insert-molded. However, the pole-type fitting 3 may be inserted and fixed by, for example, ultrasonic welding. FIG. 2 is a structural diagram showing another embodiment of the present invention in which a back cover is attached to the sensor body.

The embodiment of FIG. 2 is characterized in that an L-shaped fitting 10 is used as the fitting, and the back cover 2 is formed by insert-molding the L-shaped fitting 10. I have. Further, a shield plate 12 is insert-molded in the back cover 2 to electrostatically shield a detector circuit including the circuit components 6 mounted on the circuit pattern 4 formed inside the back cover 2 from the outside. .

In this embodiment, the back cover 2 is screwed and fixed to the mounting column 11 standing inside the sensor main body 1 with screws 13 but may be fixed with an adhesive or the like. Even in the semiconductor heat sensor of the present invention using the L-shaped fitting 10 of FIG. 2, since only the back cover 2 is incorporated in the sensor main body 1, it is small and thin. A significant cost reduction can be achieved by reducing the number of parts, the number of parts and the assembly work.

FIG. 3 shows another embodiment of the insert molding of the L-shaped fitting 10 to the back cover 2 in the embodiment of FIG. That is, in the embodiment of FIG.
3 is inserted into the end of the back cover 2, but in the embodiment of FIG. 3, the base of the L-shaped bracket 10 is partially embedded with an embedded portion 14 at the end of the back cover 2. Insert molding is performed so as to be embedded, and L
The mounting strength of the character-shaped fitting 10 can be improved. Further, the shield effect is enhanced by connecting the shield plate 12 to the ground of the circuit pattern 4.

FIG. 4 is a structural view showing an embodiment of the present invention having a structure in which a front cover is attached to a sensor main body. In FIG. 4, the sensor main body is a cylindrical member that is opened up and down, and forms a receiving portion 1b having an opening 1a on the lower side. Front cover 2 for receiving portion 1b inside sensor body 1
0 is incorporated. The front cover 20 is formed by insert-molding the L-shaped fitting 10 and has a circuit pattern 4 of a sensor circuit formed on the inner surface of the front cover 20. The circuit pattern 4 is formed so as to be electrically connected to the L-shaped fitting 10 at a predetermined position.

Circuit pattern 4 formed on the inner surface of front cover 20
At the center is mounted a thermal IC 15 having a built-in temperature detecting element, and at another pattern position, a circuit component 6 using a chip component or the like constituting a sensor circuit is mounted.
Here, the front cover 20 functions as a printed circuit board by forming the circuit pattern 4 on the inner surface, and at the same time, the heat sensitive I
Since C15 is mounted, it also functions as a heat receiving plate.

In the embodiment shown in FIG.
It is only necessary to incorporate only the front cover 20 into the inside of the device, and it is possible to achieve a significant cost reduction by reducing the size and thickness, reducing the number of parts and assembling work. In the embodiment of FIG. 4, the back side of the sensor body 1 is open, but a back cover may be provided if necessary.

FIG. 5 shows a thermal IC 1 in the embodiment of FIG.
FIG. 8 is an explanatory view showing another embodiment of the heat-sensitive structure of the front lid 20 with respect to FIG. In the embodiment of FIG. 4, the thermal IC 15 is directly mounted on the circuit pattern 4 on the back side of the front lid 20, but in the embodiment of FIG. In order to perform the process efficiently, the heat receiving metal fitting 18 is insert-molded at the center together with the L-shaped fitting metal fitting 10, and the upper end of the heat receiving metal fitting 18 is mounted on the circuit pattern 4 by the thermal IC 15
So that you can contact them. The contact between the heat receiving bracket 18 and the heat-sensitive IC 15 may be made directly, or indirectly by applying grease or the like between them.

[0021]

As described above, according to the present invention, the number of components incorporated in the sensor body can be reduced, so that the sensor can be reduced in size and thickness, and the fitting fitting and the printed circuit board can be assembled. Since it becomes unnecessary, the number of assembling steps can be reduced, and as a result, a significant cost reduction can be achieved.

[Brief description of the drawings]

FIG. 1 is a configuration diagram showing an embodiment of the present invention having a back cover.

FIG. 2 is a configuration diagram showing another embodiment of the present invention having a back cover.

FIG. 3 is an explanatory view showing another insert molding structure of the fitting in the embodiment of FIG. 2;

FIG. 4 is a structural view showing another embodiment of the present invention having a front cover.

FIG. 5 is an explanatory view showing a heat-sensitive structure used for the front cover of FIG. 4;

FIG. 6 is an explanatory view showing a conventional sensor structure.

[Explanation of symbols]

 1: Sensor body 2: Back cover 3: Pole-type fitting 4: Circuit pattern 5: Temperature detection element 6: Circuit component 7: Lead-out hole 8: Outer cover 9: Opening 10: L-shaped fitting 11 : Mounting column 12: Shield plate 13: Screw 14: Producing part 15: Thermal IC 18: Heat receiving bracket 20: Front cover

Claims (3)

(57) [Claims] 1. A semiconductor heat sensor provided with a temperature detecting element whose impedance changes with a change in temperature, wherein a fitting fitting standing upright on a back side is provided on a lid member mounted on the sensor body. Insert molding and fixing, forming a circuit pattern on the inner surface of the lid member so as to be electrically connected to the fitting at a predetermined position, and mounting the temperature detecting element and the circuit component on the circuit pattern. A semiconductor type heat sensor characterized by the above-mentioned. 2. The semiconductor heat sensor according to claim 1, wherein said cover member is a back cover for closing a back side of the sensor body, and a lead terminal is provided on a circuit pattern formed on an inner surface of said back cover. A semiconductor heat sensor, wherein the connected temperature detecting element is held in a protruding state outside the main body. 3. A semiconductor heat sensor according to claim 1, wherein said cover member is a front cover for closing a front side of a sensor main body, and said temperature detection is performed by a circuit pattern formed on an inner surface of said front cover. A semiconductor heat detector characterized by directly mounting elements.