JP2892251B2 - Thermal fire detector and its manufacturing method - Google Patents

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to waterproof and non-waterproof thermal fire detectors and a method of manufacturing the same.

[0002]

2. Description of the Related Art In general, a heat detector is mounted as a waterproof type or a non-waterproof type depending on the use, that is, the installation location. In a non-waterproof heat sensor, when the sensor body is attached to a base attached to the ceiling, a fitting is used and the fitting also serves as an electrical connection terminal, The electric circuit in the sensor body is electrically connected to the fire receiver via the fitting.

On the other hand, in the case of the waterproof heat detector, if the fitting also serves as an electrical connection terminal, water enters through the mounting position of the fitting.
As shown in Japanese Patent No. 74, a lead wire is drawn out of the sensor main body, and the position where the lead wire is drawn out is waterproofed. It is also known that a waterproof type heat sensor does not attach the sensor body to a base attached to the ceiling via a fitting, but attaches the sensor body directly to the ceiling by screws or the like. ing.

[0004] The structure of this conventional waterproof heat sensor will be described with reference to FIG. 8. One end of a lead terminal 2 bent into an L shape is connected to the tip of a core wire 1 a of a lead wire 1. . A printer board 5 on which various electronic components 4 for heat detection are mounted is fixed in the housing 3 so as to be horizontal, and an upper portion of the housing 3, that is, a ceiling side is sealed by a horizontal lid 6. The lid 6 is insert-molded so that the other end of the lead terminal 2 faces downward and can be connected to the printer substrate 5 and the lead wire 1 is drawn out along the horizontal lid 6. It is formed so as to be united.

[0005]

However, in such a fire detector, although the function of detecting a fire is the same between the waterproof type and the non-waterproof type, the structure is completely different between the waterproof type and the non-waterproof type. Therefore, there is a problem that the mold manufacturing, molding, and assembly of each part of the sensor are completely different from the stage of designing the structure, and as a result, the manufacturing cost is increased.

In addition, there are an analog type and an on-off type heat sensor. In the analog type, the heat sensor sends a temperature signal and its own identification information (address) to the fire receiver. A DIP switch or the like for setting in advance is required. Therefore, in this case, the circuit configuration of the printed circuit board is of course different, and the portion where the operating knob of the DIP switch mounted on the printed circuit board is exposed to the outside must be made waterproof or non-waterproof. As there are four types of manufacturing methods, the manufacturing cost increases.

SUMMARY OF THE INVENTION In view of the above problems, the present invention provides a method for manufacturing a thermal fire detector capable of manufacturing waterproof and non-waterproof thermal fire detectors at a low cost. It is an object of the present invention to provide waterproof and non-waterproof thermal fire detectors. Another object of the present invention is to provide a method for manufacturing a thermal fire sensor capable of manufacturing a waterproof type, a non-waterproof type, an analog type and an on-off type at a low cost.

[0008]

According to the present invention, in order to achieve the above object, when a sensor body is mounted on a base mounted on a ceiling, a fitting fitting to the base also serves as an electrical connection terminal. In a method for manufacturing a non-waterproof heat fire sensor and a waterproof heat fire sensor mechanically attached to a base by a fitting and electrically connected via a lead wire, the method includes the steps of: In the case of, the fitting is attached to the base and covers the printed circuit board so that the fitting fits through and is mechanically and electrically connected to the internal printed circuit board. The tip of the lead wire and the connection terminal fixed to the tip without penetrating the lid are insert-molded into the mold resin member, and the molding is performed on the lid so that the connection terminal and the printed board can be connected. Characterized by being insert-molded resin member in the vertical direction.

According to the present invention, the main body to which the heat-sensitive element is attached and the cover for covering the main body are commonly configured irrespective of the non-waterproof type and the waterproof type. It is characterized by assembling a lid. The present invention is also characterized in that fitting fittings are attached to the same position of the non-waterproof type and the waterproof type lid.

According to the present invention, an opening for exposing an operation knob of a switch mounted on a printed circuit board to the outside is formed in a lid regardless of whether it is a non-waterproof type or a waterproof type. It is characterized by doing.

[0011]

According to the present invention, in the case of the non-waterproof type, the fitting is also used as an electrical connection terminal to the base, and in the case of the waterproof type, the fitting is mechanically attached to the base and separately connected to the base. And are electrically connected. Therefore, only the lid is manufactured according to the non-waterproof type or the waterproof type, and the other members are manufactured in common regardless of the non-waterproof type or the waterproof type. A sensor can be manufactured.

According to the present invention, an opening for exposing the operation knob of the switch attached to the printed circuit board to the outside is formed in the lid regardless of whether it is a non-waterproof type or a waterproof type. Therefore, it is possible to manufacture a waterproof type, a non-waterproof type, an analog type and an on / off type thermal fire detector at a low cost.

[0013]

Embodiments of the present invention will be described below with reference to the drawings. FIG. 1 shows a heat sensor according to the present invention, and FIG.
1 shows a waterproof heat sensor, and FIG. 1B shows a non-waterproof heat sensor. FIG. 2 is an exploded perspective view of the waterproof heat sensor of FIG. 1A, and FIG. 3 is an exploded perspective view of the non-waterproof heat sensor of FIG. 1B. In these drawings, a base attached to a ceiling is omitted.

In the waterproof and non-waterproof heat sensors of this embodiment, a circular outer cover 21, a body 22 having a thermistor 22a as a heat-sensitive element mounted so as to project downward, and an O-ring 23 are provided. The printed circuit board 24 on which the circuit components are mounted is configured in common. The circuit components mounted on the printed circuit board 24 are different between an analog type and an on / off type.

The cover 25a of the waterproof heat sensor that covers these members 21 to 24 connects the circuit of the printed circuit board 24 and the base side via the lead wire 11 as shown in detail in FIG. In addition, the lid 25b of the non-waterproof heat sensor is configured to be fixed to the base by a fitting 26a, as shown in detail in FIG.
The printed circuit board 24 is formed by the fitting 26b substantially similar to
Is connected to the base side and is fixed to the base.

In this embodiment, the opening 251 has a cover so that an operation knob of a DIP switch (not shown) for presetting its own identification information (address) when used in an analog type is exposed to the outside. 25a and the lid 25b. The DIP switch is mounted on the printed circuit board 24. The opening 251 is sealed by a rubber packing 27, a cover 28 and screws 28a as shown in FIG. 2 in the case of a waterproof type, and a waterproof type or a non-waterproof type is provided on the upper surfaces of the lids 25a and 25b. Regardless, the comprehensive nameplate 29 and the display nameplate 30 are attached.

Next, referring to FIG. 1, the lid 25a, the lid 2
The structure for fixing the base 5b to the base and the electrical connection structure will be described in detail. Waterproof and non-waterproof fittings 26a,
26b is a common L-shaped fitting 261 and insert fittings 26 having different lengths as shown in FIGS.
2, 263. The L-shaped bracket 261 is
It is fixed to the insert fittings 262 and 263 by crimping.

The waterproof type insert fitting 262 is
a is formed relatively short so as not to penetrate through a, and the non-waterproof type insert fitting 263 is formed relatively long so that the tip penetrates through the lid 25b and the printed board 24 and is electrically connected to the printed board 24. These fittings 262, 26
The L-shaped fitting 261 is fixed to the lid 25a and the lid 25b by insert-molding 3 on the lid 25a and the lid 25b, respectively. The L-shaped fitting 261 is fixed to the lid 25a and the lid 25b so as to face outward in the radial direction, and is fixed to the base by fitting to a fitting (not shown) on the base side.

Here, the lid 25 of the fittings 26a, 26b
a, the position with respect to the lid 25b is configured to be the same, and therefore, the fitting position on the base is the same, so that the base can be manufactured with the same structure. The lead-out position of the waterproof heat sensor is determined by the fitting 26a.
Next, the electrical connection structure of the waterproof heat sensor will be described in detail with reference to FIGS. 4 to 6. In FIG. 4, as an example, a single lead wire 11 and a double lead wire 12 are pulled out of the main body, and for example, the lead wire 11 is used as a common, and one of the lead wires 12 is connected to a fire receiver (not shown). And
The other is connected to another sensor.

In this embodiment, first, as shown in FIGS. 4 (a) and 4 (b), the core wires 11a of the respective lead wires 11, 12 are fixed by crimping in the insert fittings 14 for connection terminals. The insert fitting 14 is formed in a substantially cylindrical shape, and its tip 14a has two wire-like (or clip-like) terminals 1 provided substantially parallel to the printed circuit board 24 as described later.
It is formed in a conical shape so that it can be inserted in the vertical direction while contacting inside 7c.

The insert fitting 14 also has a tip 14a.
A circular flange portion 14b serving as a stopper when is vertically inserted, and a flange portion 14c serving as a vertical positioning member when being insert-molded into a mold resin member 15 described later. At the end, an opening 14d into which the core wire 11a of the lead wires 11, 12 is inserted is formed. In addition, each end of the two-core lead wire 12 is commonly inserted into the opening 14d of one insert fitting 14, and the periphery thereof is fixed by crimping.

As shown in FIG. 4C, the mold resin member 15 is molded by inserting the insert metal fittings 14 and the distal ends of the lead wires 11 and 12, and as shown in FIG. It is formed so as to be insert-molded in a circular lid 25 a covering the cover 24. More specifically, as shown in FIG. 5, the mold resin member 15 has two insert fittings 14 and tip portions of two lead wires 11 and 12 inserted therein, and a tip portion 14a of the fitting 14 and a flange portion 1 are provided.
4b is formed in such a size and shape that it protrudes, and a flange portion 15a is formed around the flange portion 15a for improving waterproofness and positioning with the lid 25a.

An opening 16a for inserting the mold resin member 15 is previously formed in the lid 25a.
6a with respect to the flange portion 15a of the mold resin member 15.
Are positioned and insert molded. As an example of the material of the lid 25a, polycarbonate is used, and the material of the mold resin member 15 is polybutylene terephthalate (PBT), which has a good flowability with respect to polycarbonate.
Is used.

Next, referring to FIG.
The contact structure will be described. In the substrate 24, the through holes 17 into which the two insert fittings 14 can be inserted respectively.
a is formed, and a land 17b is formed around the through hole 17a on the substrate 17. Two wire-like terminals 17c are soldered to the land 17b, for example, so as to be parallel to each other at an interval smaller than the diameter of the insert fitting 14. Therefore, when the lid 25a is positioned and closed in the circumferential direction, the insert fitting 14 is
a, the two wire-like terminals 17c open and come into contact with each other, and as a result are connected to the land 17b.

Further, as shown in FIG. 1 (b), the non-waterproof type has a similar structure, and the tip of the insert fitting 263 has a
5b and the printed circuit board 24 can be electrically connected to the printed circuit board 24. FIG. 7 shows a printed circuit board 2
4 shows a pair of openings B, B ', C, and C' on the inner side in the radial direction for connecting lead wires for a waterproof heat sensor.
Are formed symmetrically with respect to the center position, and a pair of openings A and D for the insert fitting 263 of the fitting metal fitting 26b for the non-waterproof heat sensor are formed symmetrically with respect to the center position on the outside in the radial direction. The openings A to D are formed on the same line. Further, a pair of through holes 24a for connecting terminals of the thermistor 22a are formed at the center position.

Therefore, the bare board and the mounted parts of the printed circuit board 24 can be configured the same regardless of whether they are waterproof or non-waterproof, and the openings A and D and the openings B, B ',
By forming the lands formed around C and C 'by connecting them in common, it can be used for both waterproof and non-waterproof types. Next, a manufacturing process of the sensor will be described. First, as shown in FIGS. 2 and 3, lids 25a and 25b having different fixing structures to the base and electrical connection structures are prepared according to the waterproof type and the non-waterproof type. Next, the body 22 and the printed circuit board 24 are positioned and assembled so that the terminals of the thermistor 22a are inserted into the through holes 24a of the printed circuit board 24 and soldered, regardless of whether they are waterproof or non-waterproof. 22 and lid 25
a and 25b, the outer cover 21 and the lids 25a and 25b are respectively positioned from both sides of the assembly 22 to 24, and screws 31 are placed on the outer cover 2 from the lids 25a and 25b side.
Assemblies 21 to 25a, 25b by stopping at 1
To manufacture.

Next, in the case of the waterproof type, the opening 2
51 is sealed by the packing 27 and the cover 28, and the total nameplate 29 and the display nameplate 30 are attached to the upper surfaces of the lids 25a and 25b regardless of whether they are waterproof or non-waterproof. Therefore, according to the above embodiment, only the lid 25a and the lid 25b are different depending on the waterproof type and the non-waterproof type, and the other members are the same. Vessels can be manufactured.

The base attached to the ceiling is
In the case of the waterproof type, there is provided a fitting which is only mechanically fitted to the fitting 26a, and a lead wire connected to the lead wire 11 is drawn out. Then, by fitting the fittings 26a and the like, the sensor main bodies 21 to 31 are attached to the base. The fitting fitting of the non-waterproof base is configured to also serve as an electrical connection terminal to the fitting fitting 26b of the sensor main bodies 21 to 31. Therefore, the fitting fitting 26b and the like are fitted. The sensor bodies 21 to 3
1 is attached and electrically connected to the base.

[0029]

As described above, according to the present invention, when the sensor main body is attached to a base attached to a ceiling, a non-waterproof heat fire in which a fitting fitting to the base also serves as an electrical connection terminal. In a method of manufacturing a waterproof thermal fire detector that is mechanically attached to a base with a fitting and is electrically connected to a base via a lead wire, a non-waterproof type is used for a base. The lid is attached and covers the printed circuit board, and the fitting is configured to penetrate through the lid mechanically and electrically to the internal printed board, and the fitting does not penetrate the lid in the case of the waterproof type. The tip of the lead wire and the connection terminal fixed to the tip are insert-molded into the mold resin member, and the mold resin member is perpendicular to the lid so that the connection terminal and the printed circuit board can be connected. Since insert molding, it is produced in accordance with only the lid unsealed or waterproof, therefore,
Since the other members are commonly manufactured regardless of whether they are non-waterproof or waterproof, it is possible to manufacture waterproof and non-waterproof thermal fire detectors at low cost.

According to the present invention, an opening for exposing the operation knob of the switch attached to the printed circuit board to the outside is formed in the lid regardless of whether it is a non-waterproof type or a waterproof type. Therefore, it is possible to manufacture a waterproof type, a non-waterproof type, an analog type and an on / off type thermal fire detector at a low cost.

[Brief description of the drawings]

FIG. 1 is a side sectional view showing a waterproof heat sensor and a non-waterproof heat sensor according to the present invention.

FIG. 2 is an exploded perspective view showing the waterproof heat detector of FIG.

FIG. 3 is an exploded perspective view showing the non-waterproof heat sensor of FIG. 1 (b).

FIG. 4 is a manufacturing process diagram showing a waterproof structure of the waterproof thermal fire detector of FIGS. 1 (a) and 2;

FIG. 5 is a diagram showing the mold resin member of FIG. 4 in detail;

FIG. 6 is a perspective view showing a contact structure of a printed circuit board.

FIG. 7 is a plan view showing a bare board of a printed circuit board;

FIG. 8 is a side sectional view showing a conventional waterproof heat sensor.

[Explanation of symbols]

 11, 12: Lead wire 11a: Core wire 14: Insert fitting 14a: Tip 14a, 14b: Flange portion 14d, 251, A to D: Opening 15: Mold resin member 17a, 24: Through hole 17b: Land 17c: Wire terminal 21: Outer cover 22: Main body 22a: Thermistor 23: O-ring 24: Printed circuit board 24a: Through hole 25a, 25b: Lid 26a, 26b: Fitting 27: Packing 28: Cover 28a, 31: Screw 29: General nameplate 30 : Display name plate 261: L-shaped bracket 262, 263: Insert bracket

Claims (6)

(57) [Claims] When a sensor main body is attached to a base attached to a ceiling, a fitting fitting to the base is fitted to a non-waterproof thermal fire sensor also serving as an electrical connection terminal, and to the base. In a method for manufacturing a waterproof thermal fire detector which is mechanically attached by an alloy tool and electrically connected via a lead wire, in a case of a non-waterproof type, a lid which is attached to a base and covers a printed circuit board is provided. The fitting is configured to penetrate and mechanically and electrically connect to an internal printed circuit board. In the case of a waterproof type, the fitting does not penetrate the lid and the tip of the lead wire and the tip thereof The connection terminal fixed to the mold resin member is insert-molded into a mold resin member, and the mold resin member is vertically inserted into the lid so that the connection terminal can be connected to the printed circuit board. A method for manufacturing a thermal fire detector, characterized by being molded. 2. A method for manufacturing a thermal fire detector according to claim 1, wherein the main body to which the heat-sensitive element is mounted and the cover covering the main body are configured in common regardless of whether they are a non-waterproof type or a waterproof type. And assembling the non-waterproof or waterproof lid with respect to the method. 3. The method for manufacturing a thermal fire detector according to claim 1, wherein said fittings are attached to the same position of said non-waterproof type and said waterproof type lid. Production method. 4. A method for manufacturing a thermal fire detector according to claim 1, wherein an opening for exposing an operation knob of a switch attached to said printed circuit board to the outside is waterproof and waterproof. A method for manufacturing a thermal fire detector, wherein the opening is sealed in the case of a waterproof type formed on the lid regardless of the type. 5. A non-waterproof thermal fire detector manufactured by the method for manufacturing a thermal fire detector according to claim 1. 6. A waterproof thermal fire detector manufactured by the method for manufacturing a thermal fire detector according to claim 1.