JP3061301U - Board connection structure - Google Patents

Abstract

(57) [Summary] [PROBLEMS] To provide a substrate connection structure capable of improving the working efficiency and reducing the size. SOLUTION: In a state where a liquid crystal module 4 is attached to an attachment portion 3a of a holder 3, positioning pins 2 of a substrate 2 are provided.
b, 2c are aligned and fitted into the through holes 1b, 1c. As a result, the electrode 1a of the flexible wiring board 1
Is located on substantially the same plane as the electrode 2 a of the substrate 2.
Are positioned at predetermined intervals. When the tips of the positioning pins 2b, 2c fit into the positioning recesses 3b, 3c of the holder 3, and the notches 2d, 2e, 2f, 2g fit into the lock pins 3d, 3e, 3f, 3g, the substrate 2
The holder 3 is positioned at a predetermined upper position. As a result, the elastic force of the insulating rubber sheet 30a causes the electrode 1
The conductive thin wire 30b comes into pressure contact with the electrode a and the electrode 2b, and the electrode 1a and the electrode 2b are electrically connected.

Description

[Detailed description of the invention]

[0001]

[Technical field to which the invention belongs]

 The present invention relates to a connection structure of a board for electrically connecting an electrode of a flexible wiring board or the like and an electrode of another board arranged on substantially the same plane by a connector.

[0002]

[Prior art]

 Conventionally, when electrically connecting a flexible wiring board to another board, each electrode is soldered, thermally bonded using an adhesive anisotropic conductive film, or mechanically connected with a flat cable connector. Was connected to.

[0003]

[Problems to be solved by the invention]

 However, the connection structure by soldering the electrodes or the thermal bonding of the adhesive anisotropic conductive film required a high level of technology, and the work efficiency was poor. Also, once these connections are made, it is difficult to reassemble or reassemble the LCD module or the board if there is a problem.If the reassembly is performed, the adhesive pattern of the board will peel off. Such a secondary failure may be caused. Furthermore, the connection structure using a flat cable has a limitation in miniaturization and thinning of the equipment, and it is difficult to reduce the pitch of the electrodes of the connector compared to the pitch of the electrodes of the flexible wiring board. there were.

[0004] An object of the present invention is to provide a substrate connection structure that can improve the working efficiency and can be made compact.

[0005]

[Means for Solving the Problems]

 The present invention solves the above problem by the following means. That is, according to the first aspect of the present invention, the electrode of the first substrate is electrically connected to the electrode of the second substrate which is arranged on substantially the same plane as the electrode of the first substrate by the connector. In the board connection structure, the connector has an insulating elastic body, and a plurality of connectors are arranged on the surface of the insulating elastic body at a distance from each other, and the electrodes of the first board and the electrodes of the second board are arranged. And a conductive thin wire that is detachably pressurized and electrically connected to the substrate, thereby providing a substrate connection structure.

According to a second aspect of the present invention, in the connection structure for a board according to the first aspect, the back surface of the insulating elastic body of the connector is attached to a plate-like holder. Structure.

According to a third aspect of the present invention, in the substrate connection structure according to the second aspect, the first substrate has a positioning through hole for positioning with the second substrate, and The second substrate is provided with positioning pins that fit into the through holes and position the electrodes of the first substrate at predetermined intervals in substantially the same plane as the electrodes of the second substrate. In addition, the holder has a positioning concave portion that fits with a positioning pin of the second substrate to position the holder at a predetermined position on the second substrate. A lock pin is provided at an end of the substrate for locking, and when locked, the insulating elastic body is pressed to connect the conductive thin wires to the electrodes of the first substrate and the second substrate. It is a connection structure of a substrate characterized by doing.

[0008]

[Embodiment of the invention]

 (1st Embodiment) Hereinafter, 1st Embodiment of this invention is described with reference to drawings. FIG. 1 is a development view of a connection structure of a substrate according to the first embodiment of the present invention, FIG. 2 is a cross-sectional view of a connection structure of the substrate according to the first embodiment of the present invention, and FIG. FIG. 3 is an enlarged cross-sectional view illustrating a portion III in FIG. 2. In FIG. 2, the positioning claws 3d, 3e, the notches 2d, 2e into which the positioning claws 3d, 3e fit, and the positioning pin 1b, and the through-hole 1b into which the positioning pin 1b fits. The positioning holes 3b are shown in parentheses.

As shown in FIGS. 1 to 3, the substrate connection structure according to the first embodiment of the present invention is arranged on the same plane as the electrode 1a of the flexible wiring substrate 1 and the electrode 1a. This is a structure in which an electrode 2 a of the substrate 2 is electrically connected by a connector 30.

The flexible wiring board 1 is a flexible, bendable first board. The flexible wiring board 1 has an electrode 1a and positioning through-holes 1b and 1c. The flexible wiring board 1 is connected to the liquid crystal module 4, the electrode 1 a side is folded back, and inserted between the surface of the substrate 2 and the back surface of the holder 3.

The board 2 is a second board that is electrically connected to the flexible wiring board 1. An electrode 2a and positioning pins 2b and 2c are formed on the surface of the substrate 2. The positioning pins 2b and 2c fit into the through holes 1b and 1c and are substantially the same as the electrode 2a. The electrode 1a is positioned on the plane at a predetermined distance from the electrode 2a. Notches 2d, 2e, 2f, and 2g are formed at both edges of the substrate 2. The electrodes 1a and 2a include, for example, a gold-plated electrode, a solder-plated electrode, and a carbon electrode. In this case, a gold-plated electrode or a solder-plated electrode is preferable.

The holder 3 is a plate-like member that is detachable on the substrate 2 and holds the liquid crystal module 4 and the connector 30. A mounting portion 3a for mounting the liquid crystal module 4 is formed on the surface of the holder 3, and the positioning recesses 3b and 3c and the lock pin 3d are formed on the back surface (the surface facing the substrate 2) of the holder 3. , 3e, 3f, 3g and an attachment portion 3h.

The positioning recesses 3 b, 3 c are for positioning the holder 3 at a predetermined position on the substrate 2, into which the tips of the positioning pins 2 b, 2 c are fitted. The lock pins 3d, 3e, 3f, and 3g are fitted into the cutouts 2d, 2e, 2f, and 2g, respectively, and the distal end for compressing the connector 30 and fixing it on the substrate 2 has a claw shape. It is a pin. Further, the mounting portion 3h is a concave portion for mounting the holder 30, and two rows of projections 3i and 3j are formed on the bottom surface thereof. In FIG. 2, the through hole 1b, the positioning pin 2b, the notches 2d and 2e, the positioning recess 3b and the lock pins 3d and 3e are shown in parentheses.

The liquid crystal module 4 is obtained by assembling and wiring a liquid crystal display and the like. The liquid crystal module 4 performs liquid crystal display of, for example, a mobile phone, a calculator, a pager, and the like.

FIG. 4 is a perspective view of the connector having the board connection structure according to the first embodiment of the present invention. The connector 30 is a member that presses and contacts the electrodes 1a and 2a shown in FIGS. 1 and 2 to electrically connect them, and includes an insulating rubber sheet 30a, a conductive thin wire 30b, and a mounting recess. 30c and 30d. The mounting recesses 30c and 30d are used to position the connector 30 with respect to the electrodes 1a and 2b. The mounting recesses 30c and 30d have protrusions 3i of the holder 3 as shown in FIG. , 3j fit into each other. In the first embodiment of the present invention, if the amount of compression of the connector 30 is 0.1 mm or less, the step between the electrode 1a and the electrode 2a cannot be absorbed and stable connection cannot be achieved. If the amount of compression of the connector 30 is 0.5 mm or more, the conductive thin wire 30b may be bent. For this reason, too much load is applied to the flexible wiring board 1, the board 2 and the holder 3, and they are warped or cracked, and the pattern on the flexible wiring board 1 and the board 2 is peeled off. May occur. As a result, when the connector 30 is compressed and fixed, the amount of compression of the connector 30 is preferably about 0.1 to 0.5 mm, particularly preferably about 0.2 to 0.4 mm.

The insulating rubber sheet 30a is an insulating elastic material, for example, a butadiene-based copolymer such as butadiene-styrene, butadiene-acrylonitrile, butadiene-isobutylene, a chloroprene polymer, a vinyl chloride-vinyl acetate copolymer. It is selected from various insulating elastomer materials such as polymer, polyurethane, and silicone rubber. The insulating rubber sheet 30a is particularly preferably a non-toxic silicone rubber which is excellent in heat resistance, cold resistance, weather resistance, and electrical insulation.

The conductive thin wires 30b are thin wires arranged on the surface of the insulating rubber sheet 30a at a distance from each other. The conductive thin wire 30b is, for example, a metal thin wire made of gold, gold alloy, platinum, copper, aluminum, aluminum-silicon alloy, brass, nickel silver, phosphor bronze, beryllium copper, nickel, molybdenum, tungsten, stainless steel, or the like. For these, fine wires plated with gold, a gold alloy, rhodium, or the like having excellent conductivity and environmental resistance can be used. The conductive fine wire 30b is particularly preferably a metal wire or a gold-plated metal fine wire having excellent conductivity, environmental resistance and low contact characteristics.

If the diameter of the conductive thin wire 30b is too large, a thin conductive array cannot be obtained, and if the wire diameter is too small, the wire is easily broken. For this purpose, the wire diameter is in the range of 7 to 500 μm, preferably 10 to 100 μm, more preferably 15 to 50 μm, and the conductive fine wire 30 b is 30 to 80%, preferably 40 to 60% of the wire diameter. Is preferably embedded in the unvulcanized rubber sheet 30a. The arrangement of the conductive wires 30b is appropriately selected according to the pitch, width, position, and the like of the electrode 1a or the electrode 2a. For example, when the pitch of the electrode 1a or the electrode 2a is narrow, such as 0.2 mm or 0.3 mm and the width is 0.1 mm or 0.15 mm, the conductive thin wire 30b is 0.5 to 1.0 mm. They are arranged in parallel at a pitch. In order to stably connect the conductive thin wires 30b, it is preferable that one to ten conductive thin wires 30b are arranged in accordance with the width of the electrode 1a or the electrode 2a, and it is particularly preferable to arrange four to six conductive thin wires 30b. I like it.

Next, a method of assembling the substrate connection structure according to the first embodiment of the present invention will be described. As shown in FIG. 1, in a state where the liquid crystal module 4 is mounted on the mounting portion 3a, the positioning pins 2b and 2c are aligned and fitted into the through holes 1b and 1c so that the electrodes 1a face upward. As a result, the electrode 1a is positioned on the substantially same plane as the electrode 2a at a predetermined interval from the electrode 2a. As shown in FIG. 2, the connector 30 is mounted on the holder 3 such that the projections 3i and 3j are fitted into the mounting recesses 30c and 30d, and the surface on which the conductive wires 30b are arranged is on the front side. Attached. Next, the tips of the positioning pins 2b, 2c fit into the positioning recesses 3b, 3c, and the notches 2d, 2e, 2f, 2g fit into the lock pins 3d, 3e, 3f, 3g, respectively. The holder 3 is positioned at a predetermined position on the substrate 2. As a result, the conductive thin wire 30b is brought into pressure contact with the electrode 1a and the electrode 2a by the elastic force of the insulating rubber sheet 30b, and the electrode 1a and the electrode 2a are electrically connected.

The connection structure of the substrate according to the first embodiment of the present invention has the following effects. (1) In the first embodiment of the present invention, the connector 30 comes into pressure contact with the electrode 1a and the electrode 2a so that the connector 30 can be attached and detached, and these are electrically connected. Therefore, the electrodes 1a and 2a can be electrically connected to each other only by compressing and fixing the electrodes 1a and 2a with the connector 30 via the holder 30.

(2) In the first embodiment of the present invention, the lock pin 3d, 3e, 3f, 3g is simply removed from the notch 2d, 2e, 2f, 2g, and the electrode 1a is detached from the electrode 2a. 4 and the substrate 2 can be separated. This eliminates the need for advanced soldering work and thermocompression bonding with an adhesive anisotropic conductive film, greatly reducing the number of assembly steps and improving work efficiency and quality. . Further, since a flat cable connector or the like is not used to connect the electrode 1a and the electrode 2a, the space inside the device can be saved, and the size and thickness of the device itself can be reduced. Further, the rearrangement and reassembly of the liquid crystal module 4 and the substrate 2 are facilitated, and secondary defects such as peeling of the connection pattern between the flexible wiring substrate 1 and the substrate 2 can be prevented.

[0022]

EXAMPLES The connector 30 in the board connection structure according to the first embodiment of the present invention was manufactured by the following procedure. A silicone rubber compound KE-153U (trade name, manufactured by Shin-Etsu Chemical Co., Ltd.) was sheeted on a long sheet of a non-stretchable base material made of a PET sheet having a thickness of 50 μm and a width of 350 mm by a calendar roll (not shown). An insulating rubber sheet having a thickness of 0.9 mm and a width of 300 mm was formed. Next, this insulating rubber sheet was cut into a length of 600 mm, and conductive thin wires made of a gold-plated brass wire having a diameter of 30 μm were arranged in parallel on the insulating rubber sheet at a pitch of 50 μm. This conductive thin wire was pressed with a flat plate to obtain a sheet in which the conductive thin wire was embedded 50%. After heating the sheet in an oven at 120 ° C for 30 minutes to perform primary vulcanization, the base sheet is peeled off and removed, and further heated in an oven at 195 ° C for 4 hours to perform secondary vulcanization. The vulcanized core material sheet was obtained. After cutting this core material sheet in a direction crossing the conductive thin wire, it is cut in a direction parallel to the conductive thin wire, and has a width of 5.0 mm, a length of 20.0 mm, and a thickness of 1. A 0 mm connector was obtained.

An electrode having a pitch of 1.0 mm, an electrode width of 0.5 mm, an electrode length of 2.0 mm, and a number of electrodes of a gold-plated liquid crystal module having 15 electrodes, and a gold plating process having the same pitch as the electrodes The electrode of the other substrate was connected by a connector with a compression amount of 0.3 mm. The length of the lock pin is set such that the amount of compression of the connector is 0. The dimensions were designed to be 1.1 mm so as to be 3 to 0.4 mm. As a result, these electrodes could be connected stably and reliably.

(Other Embodiments) The present invention is not limited to the above-described embodiments, and various modifications or changes can be made as described below, and these are also within the scope of the present invention. It is. (1) In the embodiment of the present invention, the conductive thin wire 30b has been described as an example. However, the present invention is not limited to this. For example, a metal slit foil may be used. In this case, use a metal slit foil made of iron, stainless steel, copper, copper-titanium alloy, etc., or a metal slit foil plated with a material having excellent conductivity and cold pole resistance such as gold, gold alloy, rhodium, etc. can do. In particular, metal wires or gold-plated metal slit foils having excellent conductivity, environmental resistance and low contact characteristics are preferable. For example, a metal slit foil having a thickness of 20 μm, a pitch of 70 μm, and a width of a metal conductor portion of 30 μm can be used.

(2) In the embodiment of the present invention, the liquid crystal module 4 has been described as an example. However, the present invention can be applied to a multi-chip module of a large-sized computer.

[0026]

[Effect of the invention]

 As described above, according to the present invention, the electrodes of the first substrate and the electrodes of the second substrate are detachably pressurized and brought into contact with each other, and are electrically connected to each other. This eliminates the need for advanced technology and thermal bonding with an adhesive anisotropic conductive film, does not cause secondary defects due to rearrangement or reassembly, and can reduce the size and thickness of equipment.

[Brief description of the drawings]

FIG. 1 is a development view of a substrate connection structure according to a first embodiment of the present invention.

FIG. 2 is a cross-sectional view of the substrate connection structure according to the first embodiment of the present invention.

FIG. 3 is an enlarged sectional view showing a portion III in FIG. 2;

FIG. 4 is a perspective view of the connector having the board connection structure according to the first embodiment of the present invention;

[Explanation of symbols]

 DESCRIPTION OF SYMBOLS 1 Flexible wiring board 1a Electrode 1b, 1c Through-hole 2 Substrate 2a Electrode 2b, 2c Positioning pin 2d, 2e, 2f, 2g Notch 3 Holder 3b, 3c Positioning recess 3d, 3e, 3f, 3g Lock pin 30 Connector 30a Insulation Rubber sheet 30b conductive thin wire

Claims (3)

[Utility model registration claims] 1. A substrate connection structure for electrically connecting an electrode of a first substrate and an electrode of a second substrate disposed substantially on the same plane as the electrode of the first substrate by a connector. The connector has an insulating elastic body, and a plurality of the connectors are arranged on the surface of the insulating elastic body at a distance from each other, and are detachably attached to the electrodes of the first substrate and the electrodes of the second substrate. And a conductive thin wire for pressure-contacting and electrically connecting them. 2. The board connection structure according to claim 1, wherein the back surface of the insulating elastic body of the connector is attached to a plate-like holder. 3. The substrate connection structure according to claim 2, wherein the first substrate has a positioning through-hole for positioning with the second substrate, and the second substrate is A positioning pin that fits into the through-hole and positions the electrode of the first substrate at a predetermined interval in substantially the same plane as the electrode of the second substrate. A lock pin that is fitted to a positioning pin of the second substrate to position the holder at a predetermined position on the second substrate, and that is locked at both ends to an end of the second substrate. Wherein the insulating elastic body is pressed to lock the conductive thin wires to connect the electrodes of the first substrate and the second substrate when locked.