JP3007244U - Flexible wiring board connection structure - Google Patents

Flexible wiring board connection structure

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Publication number
JP3007244U
JP3007244U JP1994009176U JP917694U JP3007244U JP 3007244 U JP3007244 U JP 3007244U JP 1994009176 U JP1994009176 U JP 1994009176U JP 917694 U JP917694 U JP 917694U JP 3007244 U JP3007244 U JP 3007244U
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JP
Japan
Prior art keywords
electrode
flexible wiring
wiring board
connection structure
positioning
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
JP1994009176U
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Japanese (ja)
Inventor
一 道家
浩一 山崎
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Shin Etsu Polymer Co Ltd
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Shin Etsu Polymer Co Ltd
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Priority to JP1994009176U priority Critical patent/JP3007244U/en
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Publication of JP3007244U publication Critical patent/JP3007244U/en
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Abstract

(57)【要約】 (修正有) 【目的】半田付けに伴う高度の技術や異方導電膜の熱接
着を必要とせず、組み替えや組み直しによる二次的不良
を起こさず、しかも機器の小型化、薄型化が行えるフレ
キシブル配線基板の接続構造を提供する。 【構成】このフレキシブル配線基板の接続構造は、位置
決め用の穴10を有する電気接続部材4を介して、フレキ
シブル配線基板3の電極7と別の基板5の電極6とを、
位置決め用ピン13により圧縮固定してなるものである。
(57) [Summary] (Modified) [Purpose] Does not require advanced technology associated with soldering or thermal bonding of anisotropic conductive films, does not cause secondary defects due to reassembly or reassembly, and is compact Provided is a flexible wiring board connection structure capable of being thinned. [Structure] This flexible wiring board connecting structure connects an electrode 7 of a flexible wiring board 3 and an electrode 6 of another board 5 via an electric connecting member 4 having a hole 10 for positioning.
It is fixed by compression with the positioning pin 13.

Description

【考案の詳細な説明】[Detailed description of the device]

【0001】[0001]

【産業上の利用分野】[Industrial applications]

本考案は、例えば、携帯電話、電卓、ポケットベルなどの液晶モジュールや大 型計算機のマルチチップモジュール等において、フレキシブル配線基板と別の基 板等とを電気的に接続するのに有用な、フレキシブル配線基板の接続構造に関す る。 INDUSTRIAL APPLICABILITY The present invention is useful for electrically connecting a flexible wiring board to another board in a liquid crystal module such as a mobile phone, a calculator, a pager, or a multi-chip module of a large-scale computer. This relates to the connection structure of the wiring board.

【0002】[0002]

【従来の技術】[Prior art]

従来、上記利用分野等において、フレキシブル配線基板と別の基板等とを電気 的に接続するには、それぞれの接続端子を半田付けするか、接着性異方導電膜を 用いて熱接着するか、あるいはフラットケーブル用コネクタにより機械的に接続 する構造が採られていた。 Conventionally, in the above-mentioned field of use, etc., in order to electrically connect a flexible wiring board to another board or the like, either soldering the respective connection terminals or thermally bonding them using an adhesive anisotropic conductive film, Alternatively, a structure for mechanically connecting with a flat cable connector was adopted.

【0003】[0003]

【考案が解決しようとする課題】[Problems to be solved by the device]

しかし、接続端子の半田付けや接着性異方導電膜の熱接着による接続構造は、 高度の技術を必要とし、作業効率が悪く、しかも一度接続してしまうと、液晶モ ジュールやマルチチップモジュール、さらにはPCB等に不具合があった場合に 組み替え、組み直しの作業が困難なほか、PCBの接続パターンが剥離するとい うような二次的不良を引き起こすおそれがあった。 また、フラットケーブル用コネクタを用いる接続構造は、機器の小型化、薄型 化に限度があり、フレキシブル配線基板の接続端子の低ピッチ化に対してコネク タの端子の低ピッチ化が困難という問題があった。 したがって、本考案の目的は半田付けに伴う高度の技術や異方導電膜の熱接着 を必要とせず、また組み替えや組み直しによる二次的不良を起こさず、しかも機 器の小型化、薄型化が行えるフレキシブル配線基板の接続構造を提供するもので ある。 However, the connection structure by soldering the connection terminals and heat-bonding the adhesive anisotropic conductive film requires high technology, is not efficient in working, and once connected, the liquid crystal module, multi-chip module, Furthermore, if there is a problem with the PCB, it is difficult to reassemble and reassemble, and there is a risk of secondary defects such as peeling of the PCB connection pattern. In addition, the connection structure that uses a connector for a flat cable has a limit to downsizing and thinning of the device, and it is difficult to reduce the pitch of the terminals of the connector as compared with the reduction of the pitch of the connecting terminals of the flexible wiring board. there were. Therefore, the purpose of the present invention is to eliminate the need for advanced technology associated with soldering and thermal bonding of anisotropic conductive films, to prevent secondary defects due to reassembly and reassembly, and to reduce the size and thickness of equipment. A flexible wiring board connection structure that can be performed is provided.

【0004】[0004]

【課題を解決するための手段】 本考案によるフレキシブル配線基板の接続構造(以下、単に接続構造とする) は、位置決め用の穴を有する電気接続部材を介して、フレキシブル配線基板の電 極と別の基板の電極とを、位置決め用ピンにより圧縮固定してなることを特徴と するか、あるいは絶縁性エラスチック部材の厚み方向に、多数の導電部材が、と くには位置決め用の穴の周縁部を除いて、接続する電極の位置に対応して埋設さ れ、その片面または両面に接着剤層が設けられた、位置決め用の穴を有する電気 接続部材を介して、フレキシブル配線基板の電極と別の基板の電極とを、位置決 め用ピンにより圧縮固定してなることを特徴とするものである。A flexible wiring board connection structure (hereinafter, simply referred to as a connection structure) according to the present invention is separated from an electrode of a flexible wiring board through an electric connection member having a positioning hole. Characterized in that the electrodes of the substrate are compressed and fixed by positioning pins, or in the thickness direction of the insulating elastic member, a large number of conductive members, especially the peripheral portion of the positioning hole, are formed. Except for the electrodes of the flexible wiring board, they are embedded via the electrical connection member that has a positioning hole that is embedded corresponding to the position of the electrode to be connected and has an adhesive layer on one or both sides. It is characterized in that the electrodes of the substrate are compressed and fixed by the positioning pins.

【0005】 次に、本考案の接続構造を例示した図1〜図4に基づいて説明する。 なお、図1は接続構造の縦断面図、図2はその斜視図、図3は図2の反対方向 からの斜視図、図4(a)、(b)はそれぞれ接続構造に用いられる電気接続部 材の異なる実施態様についての平面図である。 これらの図において、1は液晶モジュール2の固定具、3はフレキシブル配線 基板、4は電気接続部材、5はPCBなどの基板、6はその電極、7はフレキシ ブル配線基板3の電極である。電気接続部材4は絶縁性エラスチック部材8、導 電部材9、位置決め用の穴10、接着剤層11からなっている。 12、13はそれぞれ固定具1に設けられた固定用ツメおよび位置決め用ピン、14 、15はそれぞれ基板5の位置決め用の穴および固定用ツメ12の挿通用の穴である 。Next, the connection structure of the present invention will be described with reference to FIGS. 1 is a longitudinal sectional view of the connection structure, FIG. 2 is a perspective view thereof, FIG. 3 is a perspective view from the opposite direction of FIG. 2, and FIGS. 4 (a) and 4 (b) are electrical connections used in the connection structure. It is a top view about the embodiment from which a part differs. In these figures, 1 is a fixture for the liquid crystal module 2, 3 is a flexible wiring board, 4 is an electrical connection member, 5 is a board such as PCB, 6 is an electrode thereof, and 7 is an electrode of the flexible wiring board 3. The electrical connection member 4 comprises an insulating elastic member 8, a conductive member 9, a positioning hole 10 and an adhesive layer 11. Reference numerals 12 and 13 denote fixing claws and positioning pins provided on the fixture 1, and 14 and 15 denote positioning holes of the substrate 5 and insertion holes of the fixing claws 12, respectively.

【0006】 本考案の接続構造は液晶モジュール等のフレキシブル配線基板3の電極7とP CBなどの基板5の電極6とを、電気接続部材4を介して圧縮接続した構造のも のであるが、この電気接続部材4は基材としての絶縁性エラスチック部材8の厚 み方向に、金属細線等の多数の導電部材9が複数列、とくには位置決め用の穴10 の周縁部16を除いて、接続する電極の位置に対応して埋設され、その片面または 両面には接着剤層11が設けられた構造をしている。 これらの圧縮接続に際しては、まず液晶モジュール2の固定具1と基板5との 間にフレキシブル配線基板3と電気接続部材4とを配置した後、基板5に電気接 続部材4を位置合わせしてその接着剤層11で接着し、フレキシブル配線基板3を 固定具1の下側に回し込んで、その先端の電極7を固定具1の下面に設けた2個 の位置決め用ピン13の間に置き、位置決め用ピン13に電気接続部材4および基板 5を、それぞれに設けた穴10および14において位置合わせしながら装着して、電 極7を電気接続部材4により固定具1に押し付けると共に、固定用ツメ12を基板 5の穴15に通して基板5の下面に引っ掛けるか、また基板5および固定具1にス ペース的余裕があれば、固定具7と基板5とを互いにリベットまたはねじ止めす ることにより行われる。 その際、フレキシブル配線基板3の電極7と基板5の電極6とを安定かつ確実 に接続させるための電気接続部材4の圧縮量は、 0.2〜 0.4mm程度であることが 好ましく、これが 0.2mm未満では安定した接続が得られず、また 0.5mm以上では 電気接続部材4の金属細線などの導電部材9が折れ曲がるおそれがある。 なお、導電部材9を45°前後傾斜させておくと、上記よりも低い圧縮量で確実 に接続させることができる。The connection structure of the present invention is a structure in which the electrode 7 of the flexible wiring substrate 3 such as a liquid crystal module and the electrode 6 of the substrate 5 such as PCB are compression-connected via the electric connection member 4. This electric connecting member 4 is connected in the thickness direction of the insulating elastic member 8 as a base material, except for a plurality of rows of a large number of conductive members 9 such as thin metal wires, especially except for the peripheral portion 16 of the positioning hole 10. The electrode is embedded corresponding to the position of the electrode, and the adhesive layer 11 is provided on one or both surfaces of the electrode. In these compression connections, first, the flexible wiring board 3 and the electric connection member 4 are arranged between the fixture 1 of the liquid crystal module 2 and the board 5, and then the electric connection member 4 is aligned with the board 5. The adhesive layer 11 is used for adhesion, the flexible wiring board 3 is wound under the fixture 1, and the electrode 7 at the tip thereof is placed between the two positioning pins 13 provided on the lower surface of the fixture 1. , The electric connecting member 4 and the substrate 5 are mounted on the positioning pin 13 while aligning the holes in the holes 10 and 14, respectively, and the electric electrode 7 is pressed against the fixture 1 by the electric connecting member 4 and fixed. The tab 12 is passed through the hole 15 of the board 5 and hooked on the lower surface of the board 5, or if the board 5 and the fixture 1 have a space, the fixture 7 and the substrate 5 are riveted or screwed to each other. Done by . At that time, the compression amount of the electrical connecting member 4 for connecting the electrode 7 of the flexible wiring board 3 and the electrode 6 of the substrate 5 stably and reliably is preferably about 0.2 to 0.4 mm, which is less than 0.2 mm. In that case, a stable connection cannot be obtained, and in the case of 0.5 mm or more, the conductive member 9 such as the thin metal wire of the electric connecting member 4 may be bent. If the conductive member 9 is tilted at about 45 °, the connection can be surely made with a lower compression amount than the above.

【0007】 このように本考案の接続構造では、金属細線などの導電部材9が絶縁性エラス チック部材8に埋設されている電気接続部材4を圧縮して接続させるものである ため、基板5の電極6およびフレキシブル配線基板3の電極7には、例えば金メ ッキ電極、半田メッキ電極、カーボン電極などが用いられるが、これらの内では 金メッキ電極か半田メッキ電極が好ましい。 この電気接続部材4の導電部材9としての金属細線には、例えば金線、銅線、 真ちゅう線、りん青銅線、ニッケル線、ステンレス線等が使用できるが、良好な 導電性を有し比較的安価な真ちゅう線またはりん青銅線が好ましく、とくに低抵 抗を必要とするような場合には、真ちゅう線またはりん青銅線に金メッキを施し てもよく、線径としてはφ30〜50μm がよい。 導電部材9の配列は接続する電極の位置に対応して、フレキシブル配線基板3 の電極7あるいは基板5の電極6の幅、ピッチ等により適宜選択すればよい。 例えば、電極ピッチが 0.2mmあるいは 0.3mm、電極幅が 0.1mmあるいは0.15mmの ように低ピッチの場合には、図4(a)のように導電部材9を0.05〜 0.1mmピッ チに電極数分配列し、安定した接続をさせるために、電極の大きさに合わせてこ れを3〜5列程度とするか、または電極ピッチが 0.4mm以上、電極幅が 0.2mm以 上のように比較的粗いピッチの場合は、図4(b)のように導電部材9を電極ピ ッチに合わせて 0.1〜 0.4mm程度の間隔で1電極当たり4〜10本程度配置し、電 極数だけ設けるようにすればよい。As described above, in the connection structure of the present invention, the conductive member 9 such as a thin metal wire compresses and connects the electric connection member 4 embedded in the insulating elastic member 8. As the electrode 6 and the electrode 7 of the flexible wiring board 3, for example, a gold plating electrode, a solder plating electrode, a carbon electrode or the like is used, and among these, a gold plating electrode or a solder plating electrode is preferable. As the metal thin wire as the conductive member 9 of the electrical connecting member 4, for example, a gold wire, a copper wire, a brass wire, a phosphor bronze wire, a nickel wire, a stainless wire, etc. can be used, but they have good conductivity and are relatively good. Inexpensive brass wire or phosphor bronze wire is preferable, and particularly when low resistance is required, the brass wire or phosphor bronze wire may be plated with gold, and the wire diameter is preferably 30 to 50 μm. The arrangement of the conductive members 9 may be appropriately selected depending on the width, pitch, etc. of the electrodes 7 of the flexible wiring board 3 or the electrodes 6 of the board 5 in accordance with the positions of the electrodes to be connected. For example, if the electrode pitch is as low as 0.2 mm or 0.3 mm and the electrode width is as low as 0.1 mm or 0.15 mm, the number of electrodes should be 0.05 to 0.1 mm as shown in Fig. 4 (a). In order to make a stable connection, the number of rows should be 3-5 rows depending on the size of the electrodes, or the electrode pitch should be 0.4 mm or more and the electrode width should be 0.2 mm or more. In the case of a coarse pitch, as shown in Fig. 4 (b), the conductive members 9 should be arranged at an interval of about 0.1 to 0.4 mm at an interval of about 0.1 to 0.4 mm, and about 4 to 10 per electrode should be arranged, and the number of electrodes should be set. You can do this.

【0008】 電気接続部材4の片面または両面には、フレキシブル配線基板3の電極7と基 板5の電極6との位置決めがし易いように、シリコーン系、エポキシ系等の接着 剤を、スクリーン印刷、スプレー塗布などにより設けておくのが好ましい。 しかし、PCBなどの基板5に接着する接着作業性を考慮すると、片面にのみ 接着剤を設けた方がよい。また電気接続部材4には位置決め用の穴10または切り 欠き(図示せず)を設けておくのが好ましい。さらにはこの位置決め用の穴10ま たは切り欠きの周縁部16には金属細線等の導電部材9を埋設しないようにしてお くと、圧縮して接続した際に導電部材9の端部が折れ曲がってリークを生ずるこ とがないのでより好ましい。 さらに、電気接続部材4は圧縮して使用されるため、金属細線等の導電部材9 が埋設される絶縁性エラスチック部材8としては、天然ゴム、シリコーンゴム、 イソプレンゴム、スチレンゴム、ブタジエンゴム、ブチルゴム、ニトリルゴム、 エチレン・プロピレン・ジエンゴム、アクリルゴム、ウレタンゴム、フッ素ゴム 等が例示されるが、これらのうちでは耐熱性、耐環境特性、機械的特性に優れて いるシリコーンゴムが最も好ましい。A silicone-based or epoxy-based adhesive is screen-printed on one surface or both surfaces of the electrical connection member 4 so that the electrodes 7 of the flexible wiring board 3 and the electrodes 6 of the substrate 5 can be easily positioned. It is preferably provided by spray coating or the like. However, considering the workability of adhering to the substrate 5 such as PCB, it is better to provide the adhesive only on one side. Further, it is preferable that the electric connection member 4 is provided with a positioning hole 10 or a notch (not shown). Furthermore, if the conductive member 9 such as a thin metal wire is not embedded in the positioning hole 10 or the peripheral portion 16 of the cutout, the end portion of the conductive member 9 will be compressed and connected. It is more preferable because it does not bend to cause a leak. Further, since the electric connecting member 4 is used after being compressed, the insulating elastic member 8 in which the conductive member 9 such as a thin metal wire is embedded is natural rubber, silicone rubber, isoprene rubber, styrene rubber, butadiene rubber, butyl rubber. Examples thereof include nitrile rubber, ethylene / propylene / diene rubber, acrylic rubber, urethane rubber, and fluororubber. Among these, silicone rubber, which has excellent heat resistance, environmental resistance and mechanical properties, is most preferable.

【0009】[0009]

【実施例】【Example】

以下、本考案の具体的態様を実施例を挙げて説明する。 液晶モジュール2のフレキシブル配線基板3には、電極ピッチ 1.0mm、電極幅 0.5mm、電極長さ 2.0mm、電極数20の金メッキ処理がなされ、位置決め用の穴φ 2mmのものが2個設けられている。またポリプロピレン製の固定具1の中央部に は電気接続部材4の位置決め用ピン13(φ 1.8mm、長さ 1.2mm)が25mmの間隔で 2個設けてある。さらに固定具1の四隅には電気接続部材4を圧縮しPCB等の 基板5を固定するための固定用ツメ12がついているが、この固定用ツメ12の長さ は圧縮量が 0.3mmとなるように 1.1mmに寸法設計されている。 PCB等の基板5面上にはフレキシブル配線基板3の電極7と同ピッチの電極 6(半田メッキ処理)等の基板があり、この電極6上に片側接着剤付き電気接続 部材4を載せて位置合わせを行い、PCBと接着する。その際、基板5上に位置 決め用の印等を印刷しておくと組み込み易くなる。接着剤はシリコーン接着剤KR -120(信越化学工業社製、商品名)を厚さ20μm にスクリーン印刷して施した。 Hereinafter, specific embodiments of the present invention will be described with reference to examples. The flexible wiring board 3 of the liquid crystal module 2 is gold-plated with an electrode pitch of 1.0 mm, an electrode width of 0.5 mm, an electrode length of 2.0 mm, and the number of electrodes is 20, and two positioning holes φ 2 mm are provided. There is. Further, two positioning pins 13 (φ 1.8 mm, length 1.2 mm) for the electrical connecting member 4 are provided at the center of the polypropylene fixture 1 at intervals of 25 mm. Further, there are fixing tabs 12 at the four corners of the fixing tool 1 for compressing the electrical connection member 4 and fixing the substrate 5 such as PCB. The length of the fixing tabs 12 is 0.3 mm in compression amount. Dimensioned as 1.1mm. There is a substrate such as an electrode 6 (solder plating treatment) having the same pitch as the electrodes 7 of the flexible wiring substrate 3 on the surface of the substrate 5 such as a PCB, and the electric connection member 4 with an adhesive on one side is placed on the electrode 6 and positioned. Align and bond with PCB. At that time, if a mark for positioning or the like is printed on the substrate 5, it can be easily incorporated. As the adhesive, a silicone adhesive KR-120 (trade name, manufactured by Shin-Etsu Chemical Co., Ltd.) was applied by screen printing to a thickness of 20 μm.

【0010】 フレキシブル配線基板3を液晶モジュール2の固定具1の下面側に回し込み、 その先を2個の位置決め用ピン13間に挿入し、さらに電気接続部材4の位置決め 用の穴10と基板5の位置決め用の穴14に位置決め用ピン13を嵌挿させて、これら によりフレキシブル配線基板3の電極7を固定具1側に押さえ付けると共に、固 定用ツメ12を基板5の下面に引っ掛けることにより、接着剤付き電気接続部材4 を 0.3mm圧縮させて、フレキシブル配線基板3の電極7と基板5の電極6とを接 続した。 この電気接続部材4はフレキシブル配線基板3と基板5の両電極7、6のピッ チおよび電極幅が比較的大きいことから、導電部材9としてφ40μm の金メッキ 真ちゅう線を、絶縁性エラスチック部材8としての絶縁性シリコーンゴム内に、 電極ピッチと同じピッチ 1.0mmで電極長さ方向に 0.1mmピッチで1電極当たり10 本配列したものを用いた。また、この絶縁性シリコーンゴムにはゴム硬度20°H のシリコーンゴムKE-1978A/B(信越化学工業社製、商品名)を用いた。 本実施例の電気接続部材4は幅 3.0mm、長さ26.0mm(位置決め用穴10の周縁部 16を除いた導電部材9の配列部分:10.0mm)、厚さ 1.0mmで、位置決め用穴10は φ2mmを2個設けた形状であった。このように接続することにより、電極が安定 かつ確実に接続され、しかも機器を薄く小型にでき、部品数も減り、組み替え、 補修が可能な利点が得られた。The flexible wiring board 3 is turned to the lower surface side of the fixture 1 of the liquid crystal module 2, the tip is inserted between the two positioning pins 13, and the positioning hole 10 for the electrical connection member 4 and the board Insert the positioning pin 13 into the positioning hole 14 of the connector 5, press the electrode 7 of the flexible wiring board 3 toward the fixture 1 side by these, and hook the fixing tab 12 on the lower surface of the board 5. Thus, the electrical connection member 4 with the adhesive was compressed by 0.3 mm to connect the electrode 7 of the flexible wiring substrate 3 and the electrode 6 of the substrate 5 to each other. Since the electrical connection member 4 has a relatively large pitch and the electrode width of both electrodes 7 and 6 of the flexible wiring board 3 and the board 5, a gold plated brass wire of φ40 μm is used as the conductive member 9 and an insulating elastic member 8 is used. In the insulating silicone rubber, the same pitch as the electrode pitch was 1.0 mm, and 10 electrodes were arranged at 0.1 mm pitch in the electrode length direction per electrode. As the insulating silicone rubber, silicone rubber KE-1978A / B (trade name, manufactured by Shin-Etsu Chemical Co., Ltd.) having a rubber hardness of 20 ° H was used. The electrical connection member 4 of this embodiment has a width of 3.0 mm, a length of 26.0 mm (arrangement of the conductive members 9 excluding the peripheral portion 16 of the positioning hole 10: 10.0 mm), a thickness of 1.0 mm, and a positioning hole 10. Had a shape with two φ2 mm. By connecting in this way, the electrodes can be connected stably and securely, the device can be made thin and small, the number of parts is reduced, and the advantages of reassembly and repair are obtained.

【0011】[0011]

【考案の効果】[Effect of device]

本考案のフレキシブル配線基板の接続構造によれば、 フレキシブル配線基板の電極とPCBなどの基板の電極とを、電気接続部材を 介して圧縮固定するだけで電気的接続が得られるため、従来の接続で必要とされ た半田付け作業や異方導電膜の熱圧着による接着が不要となり、組み込み作業の 工数が大幅に短縮し、作業効率と品質が向上する。 また、液晶モジュールの固定具を基板から取り外すだけで、液晶モジュールと 基板とを分離でき、液晶モジュールや基板の組み替え、変更が容易になる。 しかも、フレキシブル配線基板の電極と基板の電極との接続にフラットケーブ ル用コネクタなどを使用しないため、機器内部の省スペース化、機器の小型化と 薄型化ができる利点もある。 According to the flexible wiring board connection structure of the present invention, the electrical connection can be obtained by simply compressing and fixing the electrode of the flexible wiring board and the electrode of the substrate such as the PCB via the electrical connection member, and thus the conventional connection is achieved. Since the soldering work and the adhesion of anisotropic conductive film by thermocompression bonding, which are required in 2., are not required, the man-hours for assembling work are greatly reduced, and the work efficiency and quality are improved. In addition, the liquid crystal module and the substrate can be separated by simply removing the fixture of the liquid crystal module from the substrate, and the liquid crystal module and the substrate can be easily reassembled and changed. Moreover, since a flat cable connector or the like is not used to connect the electrodes of the flexible wiring board to the electrodes of the board, there is an advantage that the space inside the device can be saved and the device can be made smaller and thinner.

【図面の簡単な説明】[Brief description of drawings]

【図1】本考案のフレキシブル配線基板の接続構造の一
例を示す縦断面正面図である。
FIG. 1 is a vertical sectional front view showing an example of a flexible wiring board connection structure of the present invention.

【図2】図1に示したフレキシブル配線基板の接続構造
の斜視図である。
FIG. 2 is a perspective view of a connection structure of the flexible wiring board shown in FIG.

【図3】図2の反対方向からの斜視図である。FIG. 3 is a perspective view from the opposite direction of FIG.

【図4】(a)、(b)はそれぞれ本考案のフレキシブ
ル配線基板の接続構造に使用される電気接続部材の異な
る実施態様についての平面図である。
4 (a) and 4 (b) are plan views of different embodiments of the electrical connection member used in the flexible wiring board connection structure of the present invention.

【符号の説明】[Explanation of symbols]

1…(液晶モジュールの)固定具、 2…液晶モ
ジュール、3…フレキシブル配線基板、
4…電気接続部材、5…基板、
6…(基板の)電極、7…(フレキシブル配線
基板の)電極、 8…絶縁性エラスチック部材、9…
導電部材、10…(絶縁性エラスチック部材の)位置決め
用の穴、11…接着剤層、 12
…(固定具の)固定用ツメ、13…位置決め用ピン、
14…(基板の)位置決め用の穴、15…
固定用ツメの挿通用の穴、16…(絶縁性エラスチック部
材の位置決め用の穴)の周縁部。
1 ... Fixing tool (of liquid crystal module), 2 ... Liquid crystal module, 3 ... Flexible wiring board,
4 ... Electrical connection member, 5 ... Substrate,
6 ... (substrate) electrode, 7 ... (flexible wiring substrate) electrode, 8 ... Insulating elastic member, 9 ...
Conductive member, 10 ... Hole for positioning (of insulating elastic member), 11 ... Adhesive layer, 12
… Fixing tabs (of the fixture), 13… positioning pins,
14… Positioning holes (on board), 15…
Holes for inserting fixing claws, 16 ... (peripheral hole for positioning the insulating elastic member).

Claims (4)

【実用新案登録請求の範囲】[Scope of utility model registration request] 【請求項1】位置決め用の穴を有する電気接続部材を介
して、フレキシブル配線基板の電極と別の基板の電極と
を、位置決め用ピンにより圧縮固定してなることを特徴
とするフレキシブル配線基板の接続構造。
1. A flexible wiring board, characterized in that an electrode of a flexible wiring board and an electrode of another board are compressed and fixed by a positioning pin through an electric connecting member having a positioning hole. Connection structure.
【請求項2】絶縁性エラスチック部材の厚み方向に多数
の導電部材が接続する電極の位置に対応して埋設され、
その片面または両面に接着剤層が設けられた、位置決め
用の穴を有する電気接続部材を介して、フレキシブル配
線基板の電極と別の基板の電極とを、位置決め用ピンに
より圧縮固定してなることを特徴とするフレキシブル配
線基板の接続構造。
2. The insulating elastic member is embedded in the thickness direction of the insulating elastic member at a position corresponding to an electrode to which the conductive member is connected,
An electrode of a flexible wiring board and an electrode of another board are compressed and fixed by a positioning pin through an electric connection member having an adhesive layer provided on one or both sides thereof for positioning. Flexible wiring board connection structure characterized by:
【請求項3】導電部材が、位置決め用の穴の周縁部を除
いて絶縁性エラスチック部材に埋設されてなる、請求項
2記載のフレキシブル配線基板の接続構造。
3. The flexible wiring board connection structure according to claim 2, wherein the conductive member is embedded in the insulating elastic member except for the peripheral portion of the positioning hole.
【請求項4】位置決め用ピンが、電気接続部材および基
板の電極のそれぞれに設けられた位置決め用穴で相互に
位置決めされた後、これらの位置決め用穴に挿着されて
なる、請求項1または2記載のフレキシブル配線基板の
接続構造。
4. The positioning pins are mutually positioned by positioning holes provided in each of the electrical connection member and the electrode of the substrate, and then inserted into these positioning holes. 2. The flexible wiring board connection structure according to 2.
JP1994009176U 1994-07-28 1994-07-28 Flexible wiring board connection structure Expired - Lifetime JP3007244U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1994009176U JP3007244U (en) 1994-07-28 1994-07-28 Flexible wiring board connection structure

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1994009176U JP3007244U (en) 1994-07-28 1994-07-28 Flexible wiring board connection structure

Publications (1)

Publication Number Publication Date
JP3007244U true JP3007244U (en) 1995-02-14

Family

ID=43143094

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1994009176U Expired - Lifetime JP3007244U (en) 1994-07-28 1994-07-28 Flexible wiring board connection structure

Country Status (1)

Country Link
JP (1) JP3007244U (en)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2000036647A (en) * 1998-07-21 2000-02-02 Hitachi Chem Co Ltd Printed wiring board, its manufacture and manufacture of assembled body using the same
US8144482B2 (en) 2006-05-31 2012-03-27 Nec Corporation Circuit board device, wiring board interconnection method, and circuit board module device

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2000036647A (en) * 1998-07-21 2000-02-02 Hitachi Chem Co Ltd Printed wiring board, its manufacture and manufacture of assembled body using the same
US8144482B2 (en) 2006-05-31 2012-03-27 Nec Corporation Circuit board device, wiring board interconnection method, and circuit board module device

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