JP3061141B2 - Epoxy resin composition - Google Patents

Description

Description: TECHNICAL FIELD The present invention relates to an epoxy resin composition. More specifically, the present invention relates to a solvent-free material useful as a sealing material for semiconductor elements and electronic components, particularly HIC for quartz oscillators.
The present invention relates to a liquid epoxy resin composition.

(Prior Art) In recent years, as the functions and integration of semiconductor elements and electronic components have become higher and higher, there has been a strong demand for improvements in the characteristics of sealing materials used in these elements. Is also being promoted.

For example, in the case of HICs for quartz oscillators, their production has grown by more than two orders per year, their application range has expanded for calculation functions, timer functions, etc., and the required level of characteristics for sealing materials used for them has been increasing. It is getting higher.

Until now, as a sealing material used for these crystal oscillator HICs and the like, a solvent-type sealing resin mainly composed of epoxy resin has been used in order to improve sealing workability and reliability. I have.

These sealing resins have low viscosity, and since the solvent evaporates at the time of curing, the filler becomes a sealing material of about 70 to 80%. It was relatively good.

(Problems to be Solved by the Invention) However, in the case of this conventional solvent-type epoxy resin encapsulant, it is inevitable that the filler will settle and change in viscosity, and gas will be generated during curing, which is dangerous. Not only that, there were difficulties in the sealing work that the curing conditions had to be set in multiple stages.

Further, in the case of the conventional sealing material, since the solvent remains in the cured product, a gas is generated due to the solvent, which causes an obstacle such as a frequency fluctuation.

The present invention has been made in view of the above circumstances, improves the disadvantages of conventional solvent-type epoxy resin sealing materials, has a low viscosity, a low expansion coefficient, and has no change in viscosity. It is an object of the present invention to provide a new solvent-free liquid epoxy resin composition which has good workability, has no obstacles due to gas generation, and can realize a sealing material having excellent reliability. .

(Means for Solving the Problems) The present invention provides an epoxy resin composition for encapsulating a hybrid IC for a crystal unit, which solves the above-mentioned problems. <A> Bisphenol F type epoxy resin Ratio is 60 to 10
An epoxy resin occupying 0% by weight, and <B> a plurality of types of spherical silica fillers each having an average particle size in the range of 5 to 50 μm comprise 70% by weight of the total amount of the composition.
A solvent-free liquid epoxy resin composition for hybrid IC encapsulation for quartz oscillators, characterized in that the composition contains about 80% by weight.

In a preferred embodiment of the present invention, a plurality of types of spherical silica having a particle size of 5 to 50 μm and having different particle sizes are blended.

As the bisphenol F type epoxy resin, those known so far can be used, and at least 60% by weight, more preferably 70 to 70% by weight, based on the total amount of the epoxy resin.
Used at 100% by weight. In this case, a conventionally used bisphenol A type epoxy resin or the like can be appropriately compounded within the above range. It is also possible to incorporate a halogenated epoxy resin having flame retardancy.
Instead of the conventional mainstream epoxy resin such as bisphenol A type epoxy resin with a viscosity of about 10,000 cps,
By mainly using bisphenol F type epoxy resin of about 1,000 cps, it is possible to reduce the viscosity and close packing of the filler, and it is possible to reduce the viscosity during storage, suppress the filler sedimentation and change in viscosity .

The addition of a plurality of types of spherical silica fillers having different particle diameters to the bisphenol F type epoxy resin makes the above-mentioned viscosity reduction and suppression of viscosity change more effective.
Yarn breakability is also improved.

In this case, a plurality of types of spherical silica fillers having a spherical shape and different particle diameters are used. Generally, the particle size is preferably selected from 80 μm or less, for example, from the range of about 5 μm to 50 μm. A plurality of silica fillers having a particle diameter in this range, such as two, three, etc., are used. In the case of crushed silica, the desired effect cannot be sufficiently obtained.

Further, these spherical silica fillers are blended so as to be in a range of 70 to 80% by weight based on the total amount of the composition. Other inorganic fillers such as alumina and talc may be blended within the range of 10% by weight or less.

No solvents or diluents are used in the composition of the present invention. For this reason, there is no danger of gas generation, no obstacles such as frequency fluctuations occur, and the resin does not become porous at the time of curing, so that the PCT moisture resistance reliability is also improved.

 Of course, the sealing workability is further improved.

In addition to the bisphenol F-type epoxy resin and the spherical silica filler, a curing agent, a curing assistant, and other additives can be appropriately added to the composition of the present invention.

As a curing agent, an acid anhydride can be exemplified as a preferable one. For example, methyl hexahydrophthalic anhydride, 5- (2,5-dioxotetrahydro-3-furanyl) -3-methyl-3-cyclohexene-1,2-dicarboxylic anhydride and the like are exemplified.

As a curing assistant, 2,4-diamino-6 [2'-methylimidazolyl- (1) '] ethyl-s-triazine.
Isocyanuric anhydride and the like are exemplified.

The liquid epoxy resin composition of the present invention can be produced, for example, by mixing the above components and kneading with a roll, a disper, an ajihomo mixer, a planetary mixer, a kneader, a grinder, or the like. it can. At this time, if the viscosity is too high, it may be heated to about 50 ° C. It is preferable that bubbles contained in the resin composition be degassed under reduced pressure during and after kneading.

Examples 1 to 5 Epoxy resin compositions mainly containing bisphenol F glycidyl ether (epoxy equivalent 150, viscosity 1000 cps) as a bisphenol F type epoxy resin were prepared at the mixing ratios shown in Table 1.

As spherical silica filler, average particle size 50μm, 20μm
And 5 μm were used in combination.

This epoxy resin composition was evaluated for its physical properties, workability, and reliability. Table 2 shows the results.

As is clear from comparison with Comparative Examples described below, in the case of the compositions of the present invention of Examples 1 to 5, the coefficient of linear expansion is low, the physical properties are good, and the dispenser dischargeability and thread breakability are good. A sealing material having excellent workability and excellent reliability can be obtained.

Comparative Examples 1 to 4 For comparison, epoxy resin compositions having the formulations shown in Table 1 were prepared.

As the bisphenol A type epoxy resin, bisphenol A glycidyl ether (epoxy equivalent 210, viscosity 1
000 cps), phenylglycidyl ether was used as the reactive diluent, and methyl ethyl ketone was used as the solvent.

 The crushed silica used had an average particle size of 50 μm.

The properties, workability, and reliability were evaluated in the same manner as in Examples 1 to 5, but as shown in Table 2, the results were all inferior to Examples 1 to 5.

(Effects of the Invention) As described in detail above, according to the present invention, there is no need to worry about the sedimentation and viscosity change of the filler during storage, and there is no need for multi-stage curing during curing. A good sealing material is realized.

There is no danger of gas generation. Since it does not become porous, the PCT moisture resistance reliability is also good.

Furthermore, since there is no solvent remaining in the cured product, frequency fluctuation due to gas generation is suppressed even in a high-humidity storage test.

Continuation of front page (56) References JP-A-61-19620 (JP, A) JP-A-62-10132 (JP, A) JP-A-62-10159 (JP, A) JP-A-63-178121 (JP) JP-A-1-294765 (JP, A) JP-A-1-263131 (JP, A) JP-A-1-266152 (JP, A) JP-A-2-99514 (JP, A) 2-166152 (JP, A) Masaki Shinbo, Epoxy Resin Handbook, First Edition, December 25, 1987, First Edition, Published by Nikkan Kogyo Shimbun, pages 29-30 and 48-54 (58) Survey Field (Int.Cl. ⁷ , DB name) C08G 59/20 C08L 63/00 C08K 3/36 H01L 23/30

Claims (1)

(57) [Claims] 1. An epoxy resin composition for encapsulating a hybrid IC for a crystal unit, comprising: <A> a bisphenol F type epoxy resin having a ratio of 60 to 10;
An epoxy resin occupying 0% by weight, and <B> a plurality of types of spherical silica fillers each having an average particle diameter in the range of 5 to 50 μm are contained in an amount of 70 to 50% based on the total amount of the composition.
A solvent-free liquid epoxy resin composition for hybrid IC sealing for quartz oscillators, characterized in that 80% by weight is blended.