JP3060477B2 - Atmospheric pressure vapor deposition equipment - Google Patents

Description

Description: BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an atmospheric pressure vapor phase growth apparatus, and more particularly to an atmospheric pressure vapor phase growth apparatus for reducing particles generated when a wafer is transferred between a carrier and a tray. The present invention relates to a wafer transfer mechanism.

[Conventional technology]

Conventionally, the wafer transfer mechanism of this type of atmospheric pressure CVD equipment, when placing a wafer on a tray, first takes the wafer to the handler standby position with a belt, and the handler grabs the periphery of the semiconductor wafer and transports it to a horizontal tray. ,
He dropped it from a certain height on a tray.

[Problems to be Solved by the Invention] The wafer transfer mechanism of the conventional atmospheric pressure CVD apparatus described above is
When placing a wafer on the tray, the handler grabbed the wafer onto the tray on the tray, transported it, and dropped it onto the tray from a certain height.In this case, the handler holding the wafer was kept horizontal. If not, the handler itself comes into contact with the tray or the wafer falls obliquely onto the tray, so that the film grown on the tray is shaved off and flutters to generate particles.

[Differences of the Invention from the Prior Art]

In contrast to the wafer transfer mechanism of the conventional atmospheric pressure CVD apparatus described above, the present invention uses an auto-handler to transfer the pins between the carrier and the tray, and gently lowers the pins so that the wafer is always kept horizontally in the tray on the tray. It has the difference that it can be loaded, thereby reducing particles during wafer transfer.

[Means for solving the problem]

An atmospheric pressure vapor phase epitaxy apparatus of the present invention is an atmospheric pressure vapor phase epitaxy apparatus comprising a heating mechanism for a wafer support plate, a wafer transport mechanism and a film forming mechanism, wherein the wafer transport mechanism is mounted on the wafer support plate. An embedded wafer push-up mechanism and a wafer transfer mechanism for moving the wafer support plate, wherein the wafer transfer mechanism is a wafer transfer mechanism for moving the wafer support plate from the loader side to the unloader side by a belt, The wafer lifting mechanism includes a plurality of pins projecting from the wafer support plate when setting a semiconductor wafer on the wafer support plate, and the plurality of pins while keeping the semiconductor wafer horizontal with the plurality of pins. Gently set the semiconductor wafer on the wafer support plate so that no particles are generated. A wafer push-up mechanism that was to so that.

Example Next, the present invention will be described with reference to the drawings.

FIG. 1 is a vertical sectional view of a wafer transfer mechanism according to a first embodiment of the present invention in a case where three pins are provided in a tray. Pin 2
Can be put in the tray 3 and is positioned above the surface of the tray 3 by b [mm] only when the semiconductor wafer 1 is actually delivered.

FIG. 2 is a front view of the tray 3 of FIG. 1 and the trays before and after the tray 3 as viewed from the side. The tray of A is not yet horizontal and only the pin 2 is exposed. Also B
The tray 3 is completely horizontal and the wafer 1 has already been transferred onto the pins 2. The tray C has the pins 2 stored in the tray. Next, the operation of the semiconductor wafer transfer mechanism according to the present invention will be described. Conventionally, the semiconductor wafer 1 is transported to the position shown in FIG. 2B by the handler, and when the handler releases the semiconductor wafer 1, the state shown in FIG. 2C is obtained. Therefore, when the handler is not horizontal, the semiconductor wafer 1 falls obliquely onto the tray 3 and generates particles. Therefore, in the wafer transfer mechanism of the present invention, three pins are pulled out from the tray 3 when the tray 3 is in the state shown in FIG. 2A, and when the tray 3 is horizontal as shown in FIG. The back surface is chucked and transported from the carrier onto the pins of the tray 3. The robot handler on which the semiconductor wafer 1 is placed chucks the semiconductor wafer 1 in the next carrier groove, and transports it to the horizontal tray 3 from which the pins 2 come out. The pins 2 in the state shown in FIG. 2B are slowly accommodated in the tray 3, and the semiconductor wafer 1 is set on the tray surface. As a result, there is no shaving of the film due to the falling of the semiconductor wafer, and particles during transportation can be reduced.

FIG. 3 is a view when the tray 3 on the unloader side of the apparatus according to the second embodiment of the present invention is viewed from the side. When the tray 3 approaches the unloader side, the semiconductor wafer 1 on which the film has been grown is removed again from the pins 2 in the tray.
Then, at the position of E, the back surface of the semiconductor wafer is vacuum-chucked by the unloader auto-robot handler and stored in the carrier of the unloader. In this embodiment, when the semiconductor wafer is unloaded, the semiconductor wafer is not directly conveyed and is not conveyed, so that particles during the conveyance of the semiconductor wafer can be reduced.

〔The invention's effect〕

As described above, according to the present invention, when a semiconductor wafer is transferred between a carrier and a tray, the pins in the tray are made to come out so that the transfer of the semiconductor wafer can be easily performed. There is an effect that can be reduced.

[Brief description of the drawings]

FIG. 1 is a longitudinal sectional view of a tray of a semiconductor wafer transfer mechanism according to the present invention, FIG. 2 is a side view of a tray on a loader side, and FIG. 3 is a side view of a tray on an unloader side. 1 ... Semiconductor wafer, 2 ... Pin, 3 ... Tray, 4
…… Tray holder, 5… Rail, 6… Roller,
7 ... Belt mounting part, 8 ... Belt.

Claims (1)

(57) [Claims] 1. An atmospheric pressure vapor deposition apparatus comprising a wafer support plate heating mechanism, a wafer transfer mechanism and a film forming mechanism, wherein the wafer transfer mechanism is embedded in the wafer support plate. A push-up mechanism, and a wafer transfer mechanism that moves the wafer support plate, wherein the wafer transfer mechanism is a wafer transfer mechanism that moves the wafer support plate from the loader side to the unloader side by a belt, and the wafer push-up mechanism Comprises a plurality of pins projecting from the wafer support plate when setting a semiconductor wafer on the wafer support plate, while keeping the semiconductor wafer horizontal with the plurality of pins, gently lower the plurality of pins, The semiconductor wafer is set on the wafer support plate so that particles are not generated. Atmospheric gas phase growth apparatus characterized in that it is a Eha lifting mechanism.