JP3047956B2 - Electronic component taping method - Google Patents

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

The present invention relates to relates to taping method that electronic components to transport by housing the electronic components.

[0002]

2. Description of the Related Art A conventional taping structure for an electronic component of this type will be described with reference to FIGS. 5 and 6. The long first tape 1 made of a synthetic resin material is arranged at substantially equal intervals in the longitudinal direction. A box-shaped concave portion 1a having an opening 1b at the upper portion is formed continuously, and in this concave portion 1a, an electronic component 2 having a cylindrical operating portion 2a and an external terminal 2b is housed. ing. When the electronic component 2 is stored in the recess 1a, the bottom of the electronic component 2 is placed on the inner bottom of the recess 1a, and the opening of the operating portion 2a is close to the opening 1b so as not to protrude outside the recess 1a. And a small gap is provided between the electronic component 2 and the inner wall of the recess 1a, thereby facilitating the storage operation of the electronic component 2.

[0003] The flat and long second tape 3 has a concave portion 1a.
Is mounted on the first tape 1 along the longitudinal direction of the first tape 1 by thermocompression bonding or the like so as to cover the opening 1b of the first tape 1 to enclose the electronic component 2 in the concave portion 1a, and The tip of the operation unit 2a of the electronic component 2 is in contact with or close to the tape 3 of the electronic component 2.

An electronic component having such a taping structure is manufactured by winding a reel into a hoop shape.
In this state, it was transported to various places.

Next, a conventional taping method for this kind of electronic component will be described with reference to FIGS. 5 and 6. First, a long first tape 1 provided with a concave portion 1a is sequentially fed. Next, after the electronic component 2 is housed in the recess 1a through the opening 1b using a chuck (not shown) or the like, the first tape 1 is placed on the first tape 1 so as to cover the opening 1b housing the electronic component 2. Send out the second tape 3.

Next, as shown in FIG. 6, when the thermocompression punch 4 having a flat surface 4a slightly larger than the opening 1b and being movable up and down is moved downward, the flat surface 4a is opened. 1b abuts on the second tape 3 at the periphery thereof, and as a result, the second tape 3 located at the periphery
The electronic component 2 is sealed in the concave portion 1a. That is, the concave portion 1 of the first tape 1
After the electronic component 2 is inserted into a, the second tape 3 is thermocompression-bonded to the first tape 1 by the thermocompression bonding punch 4 so as to close the opening 1b, thereby performing a taping method of the electronic component. The tape of the electronic component manufactured in this manner is wound on a reel or the like in a hoop shape.

[0007]

However, the size of the first tape 1 in the recess 1a is limited to the size of the electronic component 2.
Is formed slightly larger than the outer shape of the electronic component 2 so that there is a slight gap between the electronic component 2 stored in the concave portion 1a and the inner wall of the concave portion 1a. Therefore, when an external force acts on the electronic component 2 due to vibration or the like in the transport process, the movement of the electronic component 2 cannot be sufficiently restricted, and the electronic component 2 tilts as shown in FIG.
However, there has been a problem in that the automatic machine cannot bend the electronic component 2 when the electronic component 2 is taken out by the automatic machine at the transfer destination.

[0008] The present invention has been made to solve the above problems, even if an external force is exerted on the electronic component 2, taping method of Ru electronic components to maintain the electronic components 2 in a stable posture It is to provide.

[0009]

SUMMARY OF THE INVENTION According to the present invention, there is provided a table for electronic parts.
The structural feature of the ping method is that the first tape
Electronic components are stored in recesses provided at approximately equal intervals,
Cover the opening of the concave portion with the tape of FIG.
Abutting the tape with a thermocompression punch and thermocompression bonding to the first tape
Taping method of electronic parts to be attached by
The thermo-compression punch is provided with a punch having a protruding portion in the second
Are arranged side by side in the length direction of the tape, and the thermocompression bonding punch is
Abuts the second tape to soften the second tape,
The first and second tapes are fed in the length direction by a predetermined amount and softened.
The second tape is pressed by the punch to
The tape has a protrusion for regulating the movement of the electronic component.
Is Rukoto.

Further , the thermo-compression punch and the punch are
Prepared together.

[0011]

[0012]

[0013]

The taping of the electronic component constructed as described above is performed.
According to the method, the second step is performed by using a punch having a protrusion.
By pressing the tape, the second tape is
Easy provision of protrusions that regulate the movement of electronic components
Can be. In addition, the second tape is attached to the first tape.
The thermocompression punch is attached by thermocompression.
By installing, the second tape is attached to the first tape.
Attaching a protrusion to the second tape.
Can be performed simultaneously. Also, the heat pressure
If the wearing punch and the punch are provided separately,
There is no restriction in designing the structure of the ping device,
Also, to improve the degree of freedom in designing the manufacturing process
Can be.

Further , the thermocompression bonding punch and the punch are
By being provided integrally, the crimping punch and the punch
And the relative position with respect to the first tape does not change.
Attaching the second tape and attaching the second tape to the second tape;
The projection can be formed without displacement.

[0015]

[0016]

[0017]

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS One embodiment of the present invention will be described below with reference to FIGS. 1 to 4. Here, the same parts as those of the prior art are denoted by the same reference numerals, and detailed description will be omitted.

The taping structure of an electronic component according to one embodiment of the present invention will be described with reference to FIGS. 1 to 4. The second tape 3 is provided with valleys continuously at substantially equal intervals in the longitudinal direction. A mountain-shaped protruding portion 3a having 3b is formed. The valley portion 3b is formed in such a size that the tip of the operation portion 2a of the electronic component 2 can be sunk into the valley portion 3b. When the second tape 3 is mounted on the first tape 1, the mountain-shaped protrusion 3a is led out of the opening 1b into the recess 1a, and the electronic component is placed in the valley 3b. In this state, the tip of the second operation unit 2a is positioned.
Thus, the movement of the electronic component 2 is regulated.

The projecting portion 3a of the second tape 3 formed around the operation portion 2a has a shape surrounding the entire periphery of the operation portion 2a as shown in FIG. As shown in FIG. 4, a plurality of projecting portions 3a are provided around the operation portion 2a at intervals smaller than the diameter of the operation portion 2a.
There is one in which four protrusions 3a are provided in a square shape around the operation unit 2a with an interval smaller than the diameter of the operation unit 2a.

Next, a method of taping an electronic component according to an embodiment of the present invention will be described with reference to FIG.
c that can be inserted into the opening 1b provided with the opening c.
And a punch 5 of irregular shape having a flat surface 5a slightly larger than the opening 1b integrally with the thermocompression bonding punch 4 shown in the conventional example, which is installed in a taping device (not shown) so as to be vertically movable. I have. Then, first, the first tape 1 containing the electronic component 2 and the second tape 3 superimposed on the first tape 1 are sent below the thermocompression punch 4, and in this state, the thermocompression punch 4 When the punch 5 is moved downward, the flat surface 4a abuts on the opening 1b and the second tape 3 in the periphery thereof, and as a result, the second tape 3 located in the periphery becomes the first tape. 1, and the first electronic component 2 is sealed in the recess 1a. Next, after the thermo-compression punch 4 and the punch 5 are once moved upward, the first and second tapes 1 and 3 are fed by a fixed amount, and the operation unit 2 of the enclosed first electronic component 2 is moved.
a is positioned below the valley 5c of the punch 5, and the second electronic component 2 housed in the recess 1a is positioned below the thermocompression punch 4, and then the thermocompression punch 4 and When the punch 5 having the irregular shape is moved downward again, the flat surface 5a of the punch 5 comes into contact with the second tape 3 on the first electronic component 2, and this second tape 3 is heated. Since it is in a state of being softened by the pressure bonding punch 4, it is pressed by the mountain-shaped projection 5b, so that the mountain-shaped projection 3a projecting inward of the concave portion 1a is formed on the second tape 3. At the same time that the tip of the operation unit 2a of the electronic component 2 is located in the valley 3b, the second tape 3 is thermocompression-bonded to the first tape 1 by the thermocompression punch 4, and the second tape 3 is inserted into the recess 1a. The second electronic component 2 is sealed. That is, after the electronic component 2 is inserted into the concave portion 1a of the first tape 1, the second tape 3 is attached to the first tape 1 by thermocompression using a thermocompression punch 4 so as to sequentially cover the opening 1b. By controlling the movement of the electronic component 2 by forming a mountain-shaped protrusion 3a on the second tape 3 with the odd-shaped punch 5, a taping method of the electronic component is performed, and the electronic component is manufactured in this manner. The tape of the electronic component is wound on a reel or the like in a hoop shape.

In this embodiment, the thermo-compression punch 4 and the punch 5 having a different shape have been described as being integrated. However, they may be provided separately. In this case, in designing the structure of the taping device, There is no restriction, and by providing the thermo-compression punch 4 and the punch 5 of irregular shape at a distance, the degree of freedom in designing the manufacturing process can be improved. In this case, the second tape 3 is attached to the first tape 1 by thermocompression bonding using a thermocompression punch 4, and then a mountain-shaped projection 3a is formed on the second tape 3 using the odd-shaped punch 5. When the second tape 3 is hardened by the time, the protrusion 5b of the punch 5 is heated to allow the second tape 3 to be softened. The mold protrusion 3a can be formed.

[0022]

As described above, the electronic component of the present invention
According to the taping method, a punch with a projection is used.
And pressing the second tape, the second tape
Easy to project on the tape to regulate the movement of the electronic components
Can be provided. In addition, the first tape
In front of the thermocompression punch to attach the second tape by thermocompression
By arranging in parallel with the punch, the first tape
Attaching a second tape, the second tape;
The formation of the protrusions can be performed simultaneously. Ma
Further, when the thermocompression bonding punch and the punch are separately provided,
If so, regulate the structure of the taping device
And there is more freedom in designing the manufacturing process.
Can be up.

Further, the thermocompression bonding punch and the punch are
By being provided integrally, the crimping punch and the punch
And the relative position with respect to the first tape does not change.
Attaching the second tape and attaching the second tape to the second tape;
The projection can be formed without displacement.

[0024]

[0025]

[Brief description of the drawings]

FIG. 1 is a sectional view of an essential part for explaining a taping structure of an electronic component and a taping method of the electronic component according to an embodiment of the present invention.

FIG. 2 is a plan view of a main part for explaining a protrusion formed on a second tape according to the embodiment of the present invention.

FIG. 3 is a plan view of a main part for explaining a protrusion formed on a second tape according to the embodiment of the present invention.

FIG. 4 is a plan view of an essential part for explaining a protrusion formed on a second tape according to an embodiment of the present invention.

FIG. 5 is a plan view of an essential part for explaining a taping structure of an electronic component and a taping method of the electronic component according to a conventional example.

FIG. 6 is a sectional view of an essential part for explaining a taping structure of an electronic component and a taping method of the electronic component according to a conventional example.

FIG. 7 is a cross-sectional view of a main part showing a state where an electronic component shown in a conventional example is inclined.

[Explanation of symbols]

 REFERENCE SIGNS LIST 1 first tape 1a recess 1b opening 2 electronic component 2a operation unit 2b external terminal 3 second tape 3a protrusion 3b valley 4 thermocompression punch 4a flat surface 5 punch 5a flat surface 5b protrusion 5c valley

Claims (2)

(57) [Claims] A first tape provided at substantially equal intervals on the first tape;
The electronic component is housed in the recess, and the second tape is used to store the electronic component.
Cover the opening and abut the second tape with a thermocompression punch
Electronic part attached to the first tape by thermocompression bonding
A tapping method of the thermocompression bonding punch.
Punches having raised portions are aligned in the length direction of the second tape.
And pressing the thermocompression bonding punch against the second tape,
Softening a second tape, said first and second tapes
In the longitudinal direction by a predetermined amount, and the softened second tape is
Pressing with the punch, the second tape to the electronic part
Electronic device characterized by providing a protrusion for regulating the movement of a product
Taping method of parts. 2. The thermocompression bonding punch and the punch are integrated.
2. The electronic component tag according to claim 1, wherein:
Grouping method.