JPH0416468A - Reel for packing semiconductor element - Google Patents

Abstract

PURPOSE:To perform packing without damaging a T & R taping work on the feed maker side and preventing the occurrence of a device trouble on the user side by forming a protrusion, engaged with a recessed part formed in the under surface of an emboss tape, in the winding surface of the carrier tape of a reel hub. CONSTITUTION:When an emboss tape 4 is wound around a reel hub 2, winding is effected in a way that a protrusion 8 formed on a reel hub 2 is inserted in a groove 5b nipped by means of a pocket 5a of an emboss tape during the starting of winding. Thus, there is no need for operation to especially fix the terminal end of the emboss tape. When the tape 4 is unreeled from a reel on the user side, the tape 4 is automatically disengaged from the protrusion 8, whereby handling is effected in a state that the terminal end of the tape is substantially not fixed to any object.

Description

DETAILED DESCRIPTION OF THE INVENTION [Field of Industrial Application] The present invention relates to a reel for packaging semiconductor elements used for packaging semiconductors with embossed taping.

[Conventional technology]

In recent years, many users who have started using large quantities of semiconductor devices are using automatic materials for receiving them. Along with this, the shipping packaging format for semiconductor devices has changed from tubes and the like to tape and reel.
l) In particular, embossed taping is becoming more common.

Hereinafter, the shipping form using embossed taping will be referred to as TaR and will be explained.

TaR is one of the shipping forms of semiconductor devices as shown in FIG. The embossed tape 4 is a cover tape in which the carrier tape 5 and the cover tape 6 are integrated. It depends on the size of semiconductor devices to be shipped, but usually 1000 or 15 per reel.
The reel is packed with 00 semiconductor devices and is then shipped.

FIGS. 4 and 5 are perspective views showing the beginning of winding the embossed tape of a conventional TaR. In Fig. 4, the terminal end 4a of the embossed tape 4 is fixed to the reel hub 2 of the reel 1 with an adhesive tape 7 such as trafting tape, and in Fig. 5, the terminal end 4a of the embossed tape 4 is formed into a key shape and is fixed to the reel hub 2 of the reel 1. It is inserted into the groove 3 of 2 and fixed. Both are designed to improve workability at the beginning of winding.

[Problem to be solved by the invention]

The conventional semiconductor device packaging reel is constructed as described above, and in its T&R, the end #A of the embossed tape is
Since the reel 4a is fixed to the reel hub 2, there is a problem in that the following equipment troubles occur when the reel 4a is applied to automatic material accepted by the user.

■ The automatic material pulls the embossed tape 4 with a uniform force, but when it comes to the end of the embossed tape, because the end is fixed, extra strength is applied, causing trouble.

■ After the automatic material has pulled out the embossed tape,
The key shape and adhesive tape 7 formed at the end of the embossed tape cause trouble on the rail of the automatic material.

From the above, from the perspective of the user who uses the automatic material, it is ideal that the terminal end 4a of the embossed tape should not be fixed to anything. In fact, some semiconductor supply manufacturers do not stop the end of the embossed tape at all, even if the workability when winding the T&R becomes a little worse.

This invention was made in order to solve the above-mentioned problems, and it is a semiconductor that can realize T&R packaging that does not impair T&R taping workability on the supplier side and does not cause equipment trouble on the user side. The purpose is to obtain a reel for packaging elements. The purpose is to obtain a method.

[Means for Solving the Problems] A semiconductor device packaging reel according to the present invention is provided with at least one engagement projection that engages with a recess on the lower surface of the embossed tape on the carrier tape winding surface of the reel hub. be.

[Effect]

In this invention, since the tape winding surface is provided with at least one engaging protrusion that engages with the recess on the lower surface of the embossed tape, the recess on the lower surface of the embossed tape is engaged with the engaging protrusion and the embossed tape is wound. It can be easily taped, and the end of the embossed tape can be pulled out without applying unnecessary strength, which prevents problems with automatic materials.

〔Example〕

An embodiment of the present invention will be described below with reference to the drawings.

FIG. 1 is a perspective view showing a reel for packaging semiconductor devices according to an embodiment of the present invention. In the figure, 1 is a reel, 2 is a reel hub, and 8 is provided on the embossed tape winding surface of the reel 1 and the reel hub 2. It is a raised protrusion.

Next, the operation will be explained. FIG. 2 is a view of FIG. 1 from the side of the reel, looking only at the reel hub 2. When winding the embossed tape 4 around the reel hub 2, the protrusion 8 provided on the reel hub 2 is inserted into the groove 5a between the pockets 5b of the embossed tape at the beginning of winding, as shown in FIG. 2(a), and the tape is wound. .

Therefore, there is no need for special operations such as fixing the end of the embossed tape.

FIG. 2(b) shows the embossed tape 4 after it has been wrapped around the reel hub 2 once, but there is no longer any fear of it coming off or spinning idly.

Furthermore, when the user takes out the embossed tape 4 from the reel, the embossed tape 4 automatically comes off the protrusion 8 as shown in Figure 3, so the end of the embossed tape is treated as if nothing is fixed. be able to.

In the above embodiment, only one protrusion 8 is shown on the reel hub 2, but a plurality of protrusions 8 may be provided depending on the pitch of the pocket 5a of the embossed tape 4.

In addition, the shape and length of the protrusion do not have to be wedge-shaped.
Needless to say, the effect is the same even if it is columnar.

Further, in the above embodiment, a protrusion that engages with the groove between the pockets of the embossed tape is provided, but an engagement recess is provided on the lower surface of the embossed tape, and a protrusion that engages with this is provided. The same effect as in the above embodiment can be obtained.

〔Effect of the invention〕

As described above, according to the present invention, the carrier tape winding surface of the reel has a structure in which at least one engagement protrusion that engages with the recess on the lower surface of the embossed tape improves workability during taping. It has the effect of not damaging the material and causing no trouble for the user.

[Brief explanation of drawings]

Fig. 1 is a perspective view showing a reel for packaging semiconductor devices according to an embodiment of the present invention, Fig. 2 is a side view showing how an embossed tape is wound around the reel of this embodiment, and Fig. 3 is an embossed tape from the reel of this embodiment. FIGS. 4 and 5 are a side view showing how the tape is pulled out, and a perspective view showing how the embossed tape is wound in T&H using a conventional reel for packaging semiconductor devices. In the figure, 1 is the reel, 2 is the reel hub, 3 is the groove of the reel hub, 4 is the embossed tape, 4a is the end of the embossed tape, 5a is the pocket of the carrier tape, 5b is the groove between the pockets of the carrier tape, 6 is the cover tape , 7 is an adhesive tape, and 8 is a protrusion formed on the reel hub. Note that the same reference numerals in the figures indicate the same or equivalent parts.

Claims (1)

[Claims] (1) When packaging semiconductor devices in a tape-and-reel format, in a semiconductor device packaging reel around which an embossed tape for semiconductor shipping is wound, the lower surface of the embossed tape is provided on the carrier tape winding surface of the reel hub. A reel for packaging semiconductor devices, comprising at least one engagement protrusion that engages with a recess.