JP3046646B2 - Manufacturing method of radiation image conversion panel - Google Patents

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a method for manufacturing a radiation image conversion panel having a structure in which a stimulable phosphor layer is sealed between a support and a protective layer with a sealing member, and more particularly, to peeling or cracking. The present invention relates to a method for manufacturing a radiation image conversion panel in which generation of a radiation image is prevented.

[0002]

2. Description of the Related Art In the medical field, for example, radiation images such as X-ray images are often used for diagnosing diseases. As a method of forming a radiation image, the radiation transmitted through a subject is absorbed by a phosphor, and then the phosphor is excited by, for example, light or heat energy, so that the radiation energy absorbed and stored in the phosphor is absorbed. Has been proposed as a method for emitting fluorescence as fluorescence and detecting the fluorescence to form an image.

For example, US Pat. No. 3,859,527 and JP-A-55-12144 disclose radiation image conversion using a stimulable phosphor and using visible light or infrared light as stimulating excitation light. The method is shown. This method
A radiation image conversion panel having a stimulable phosphor layer formed on a support is used.A radiation transmitted through a subject is applied to the stimulable phosphor layer of the radiation image conversion panel,
A latent image is formed by accumulating radiation energy corresponding to the radiation transmittance of each part of the object, and then the stimulable phosphor layer is scanned with stimulating excitation light to radiate the radiation energy accumulated in each part. The light is emitted as exhausted light, and an optical signal based on the intensity of the light is photoelectrically converted, for example, and is imaged by an image reproducing device. This final image is reproduced as a hard copy or on a CRT.

A radiation image conversion panel having a stimulable phosphor layer used in such a radiation image conversion method emits stored energy by scanning with stimulating excitation light after accumulating radiation image information. The radiation image can be stored again later, and can be used repeatedly. In such a radiation image conversion panel, usually,
A stimulable phosphor layer is provided between the support and the protective layer, and the stimulable phosphor layer is combined with the support and the protective layer in order to protect the stimulable phosphor layer from external physical or chemical stimuli. Sealing with a sealing member is performed between the two. Conventionally, as a sealing technique using a sealing member, a technique for maintaining the temperature of the support and the protective layer at the time of curing of the sealing member so that the difference from the temperature at the time of using the radiation image conversion panel is within ± 20 ° C. Has been proposed (JP-A-1-316999).

[0005]

However, in the prior art described above, if the temperature at the time of use of the radiation image conversion panel is higher than the curing temperature of the sealing member, the peeling (adhesion interface destruction or the sealing member) occurs. Cohesive failure) and cracks (cohesive failure of the protective layer or the support). Such peeling or cracking reduces the moisture resistance of the radiation image conversion panel. Therefore, an object of the present invention is to provide a method capable of manufacturing a radiation image conversion panel having excellent durability without peeling or cracking.

[0006]

To achieve the above object, according to an aspect of method for producing a radiation image conversion panel of the present invention, the stimulable phosphor layer is provided between the support and the protective layer, the support
And the periphery of the protective layer to the sealing member via a double spacer
In a method for manufacturing a radiation image conversion panel having a structure in which the stimulable phosphor layer is more sealed and sealed between the support and the protective layer, when sealing with the sealing member, The sealing member is cured while the body, the protective layer and the sealing member are kept at a temperature near the upper limit temperature when the radiation image conversion panel is used.

[0007]

When sealing with a sealing member, the sealing member is cured while the support, the protective layer and the sealing member are kept at a temperature near the upper limit temperature when the radiation image conversion panel is used. Accordingly, a radiation image conversion panel that can be used stably for a long time without peeling or cracking can be manufactured.

Hereinafter, the present invention will be described specifically. FIG.
Shows an example of a radiation image conversion panel obtained by the production method of the present invention, in which a stimulable phosphor layer 1 is disposed between a support 2 and a protective layer 3, and the stimulable phosphor layer 1 is In order to protect from external physical or chemical stimuli, the peripheral portions of the support 2 and the protective layer 3 are sealed by a sealing member 4, and the stimulable phosphor layer 1 is sealed.

FIG. 2 shows another example of the radiation image conversion panel obtained by the production method of the present invention, in which a stimulable phosphor layer 1 is provided on a support 2 and the stimulable phosphor layer 1 is provided. , The protective layer 3 is disposed via the low refractive index layer 6, and the periphery of the support 2 and the protective layer 3 are sealed by the sealing member 4 via the spacer 5, and the stimulable phosphor layer 1 is sealed.

FIG. 3 shows still another example of the radiation image conversion panel obtained by the manufacturing method of the present invention, wherein the peripheral portions of the support 2 and the protective layer 3 are sealed via double spacers 5A and 5B. It has the same configuration as FIG. 2 except that it is sealed by the attaching member 4. In this configuration, the spacers 5A, 5A
The columnar portion 4A of the sealing member 4 is formed between B, which functions as a buffer against moisture permeation in the sealing member 4, and the infiltration of moisture by moisture permeation is slowed down. There is a merit that it is easy, but on the other hand, when the radiation image conversion panel is used in a high-temperature atmosphere, the effect of the present invention is remarkably exhibited because the columnar portion 4A easily causes peeling and cracking.

In the present invention, the state in which the sealing member 4 is cured means that the support 2 and the protective layer 3 are fixed at the sealing portion, and the relative position is within a range of an external force applied in a normally used state. It is the state that has not changed. When the spacer 5 is provided between the support 2 and the protective layer 3,
The support 2 and the spacer 5 and the spacer 5 and the protective layer 3 are fixed at the sealing portion, and their relative positions do not change. The support 2 and the protective layer 3 are fixed via the spacer 5 and are usually used. The relative position does not change within the range of the external force applied in a given state.

In the manufacturing method of the present invention, the sealing member 4
In the step of sealing the stimulable phosphor layer 1 by the
When curing, the temperature of the support 2 and the protective layer 3 is maintained at a temperature near the upper limit temperature when the radiation image conversion panel is used. Here, the temperature near the upper limit temperature when the radiation image conversion panel is used is defined as Tmax ≦ T ≦ Tmax + 20 ° C., where Tmax ≦ T ≦ Tmax + 20 ° C., and more preferably Tmax ≦ T ≦ Tmax + 10 ° C. Refers to the temperature of the range.

The temperature during use of the radiation image conversion panel is as follows:
Although it depends on the purpose of use and cannot be specified unconditionally, it is usually in the range of -10 to 60C. For example, the temperature during warehouse storage is -10 to 60C, the temperature during transportation is -5 to 30C,
The non-operating temperature at a hospital or the like is -5 to 50C, and the operating temperature at a hospital or the like is 20 to 30C. If the holding temperature is too high or too low, the temperature is likely to be peeled or cracked.

As the sealing member 4, an epoxy-based adhesive is preferable. Particularly, a two-pack type epoxy adhesive is preferable.
As the two-part epoxy adhesive, a conventionally known adhesive mainly containing an epoxy resin is used. As a curing agent,
Polyamine, polyamide, polythiol, modified polyamine, modified polyamide, modified polyamidoamine, aliphatic polyamine, modified aliphatic polyamine, modified aromatic polyamine, modified alicyclic polyamine, imidazole and the like are used.

In the present invention, the term "stimulable phosphor" refers to a stimulus such as optical, thermal, mechanical, chemical or electrical after the first irradiation of light or high-energy radiation. ) Means a phosphor that emits stimulable light corresponding to the dose of the first light or high-energy radiation. From a practical point of view, a phosphor that emits stimulable luminescence by a stimulating light having a wavelength of 500 nm or more. The body is preferred.

The following can be used as the stimulable phosphor constituting the stimulable phosphor layer. (1) BaSO described in JP-A-48-80487
_4: phosphor represented by A _x. Where A is Dy, T
b represents at least one of Tm, and x is 0.001 ≦ x
<1 mol%. (2) SrSO described in JP-A-48-80489
_4: phosphor represented by A _x. Where A is Dy, Tb,
Tm represents at least one kind of Tm, and x is 0.001 ≦ x <
Represents a number that satisfies 1 mol%.

(3) Phosphors such as Li ₂ B ₄ O ₇ : Cu and Ag described in JP-A-53-39277. (4) Li ₂ O described in JP-A-54-47883
_{· (B 2 O 2) x} : Cu, Li 2 O · (B 2 O 2) x:
Phosphors such as Cu and Ag. Here, x represents a number satisfying 2 <x ≦ 3. (5) SrS: Ce, Sm, SrS: Eu, Sm, La ₂ O ₂ described in US Pat. No. 3,859,527.
S: a phosphor represented by Eu, Sm, (Zn, Cd) S: Mn, X. Here, X represents halogen.

(6) Phosphors such as ZnS: Cu and Pb described in JP-A-55-12142. (7) BaO.xA described in JP-A-55-12142.
l ₂ O ₃ : Barium aluminate phosphor represented by Eu.
Here, x represents a number satisfying 0.8 ≦ x ≦ 10. (8) M ^II O · xS described in the 55-12142 JP
iO ₂ : an alkaline earth metal silicate-based phosphor represented by A. Where M ^II is Mg, Ca, Sr, Zn, Cd,
A represents Ba, A represents Ce, Tb, Eu, Tm, Pb, T
1, at least one of Bi, Mn, and x is 0.5
Represents a number satisfying ≦ x <2.5.

(9) A phosphor represented by (Ba _1-xy Mg _x C a _y ) FX: eEu ^{2+ described} in JP-A-55-12143. Here, X is at least one of Br and Cl.
X, y, and e represent 0 <x + y ≦ 0.
6, x · y ≠ 0, a number satisfying 10 ⁻⁶ ≦ e ≦ 5 × 10 ⁻² . (10) LnO described in JP-A-55-12144
X: Phosphor represented by xA. Where Ln is La,
Represents at least one of Y, Gd and Lu, and X is Cl,
A represents at least one kind of Br, A represents at least one kind of Ce and Tb, and x represents a number satisfying 0 <x <0.1.

(11) A phosphor represented by (Ba _1-x M ^II _x ) FX: yA described in JP-A-55-12145. Here, M ^II represents at least one of Mg, Ca, Sr, Zn, and Cd, X represents at least one of Cl, Br, and I, and A represents Eu, Tb, Ce, Tm, and D.
It represents at least one of y, Pr, Ho, Nd, Yb, and Er, and x and y represent numbers satisfying 0 ≦ x ≦ 0.6 and 0 ≦ y ≦ 0.2. (12) BaF described in JP-A-55-84389
X: Phosphor represented by xCe, yA. Where X is C
1, at least one of Br, I, and A represents In, T
represents at least one of l, Gd, Sm, and Zr;
Represents a number satisfying 0 <x ≦ 2 × 10 ⁻¹ and 0 <y ≦ 5 × 10 ⁻² .

(13) A rare earth element-activated divalent metal fluorohalide phosphor represented by M ^II FX.xA: yLn described in JP-A-55-160078. Where M
^II represents at least one of Mg, Ca, Ba, Sr, Zn and Cd, and A represents BeO, MgO, CaO, Sr
O, BaO, ZnO, Al ₂ O ₃ , Y ₂ O ₃ , La ₂ O
₃ , In ₂ O ₃ , SiO ₂ , TiO ₂ , ZrO ₂ , Ge
Represents at least one of O ₂ , SnO ₂ , Nb ₂ O ₅ , Ta ₂ O ₅ , and ThO ₂ , and Ln is Eu, Tb, Ce, T
m, Dy, Pr, Ho, Nd, Yb, Er, Sm, Gd
X represents at least one of Cl, Br and I, and x and y represent 5 × 10 ⁻⁵ ≦ x ≦ 0.
5, represents a number satisfying 0 <y ≦ 0.2.

(14) ZnS: A, (Zn, Cd) S: A, CdS: A, described in JP-A-55-160078.
ZnS: A, X, CdS: Phosphor represented by A, X. Here, A represents any of Cu, Ag, Au, and Mn, and X represents halogen.

(15) xM ₃ (PO ₄ ) ₂ .NX ₂ : yA, M ₃ (PO) described in JP-A-59-38278.
₄ ) Phosphor represented by ₂ · yA. Here, M and N each represent at least one of Mg, Ca, Sr, Ba, Zn, and Cd, X represents at least one of F, Cl, Br, and I, and A represents Eu, Tb. , Ce, Tm, Dy,
Pr, Ho, Nd, Yb, Er, Sb, Tl, Mn, S
n and at least one of x and y is 0 <x ≦ 6, 0
Represents a number satisfying ≦ y ≦ 1. (16) A phosphor represented by nReX ₃ .mAX ′ ₂ : xEu nReX ₃ .mAX ′ ₂ : xEu, ySm described in JP-A-59-155487. However, Re is La, Gd, Y,
Represents at least one kind of Lu, and A represents Ba, Sr, Ca
X, X 'represents at least one alkaline earth metal of
Represents at least one of F, Cl, and Br, and x, y
Is 1 × 10 ⁻⁴ <x <3 × 10 ⁻¹ , 1 × 10 ⁻⁴ <y <1
Represents a number satisfying × 10 ⁻¹ and n / m is 1 × 10 ⁻³ <n
/ M <7 × 10 ⁻¹ .

[0024] (17) M ^I X · aM described in JP 61-72087 JP _{^{II X '2 · bM III X}} ''3: alkali halide phosphor represented by cA. Where M ^I is
Li, Na, K, Rb and Cs represent at least one alkali metal, and M ^II is Be, Mg, Ca, Sr, B
a, Zn, Cd, Cu, and Ni represent at least one divalent metal, and M ^III represents Sc, Y, La, Ce, Pr,
Nd, Pm, Sm, Eu, Gd, Tb, Dy, Ho, E
r, Tm, Yb, Lu, Al, Ga, In represents at least one trivalent metal, and X, X ′, X ″ are F, C
1, at least one halogen of Br, I, A
Are Eu, Tb, Ce, Tm, Dy, Pr, Ho, N
d, Yb, Er, Gd, Lu, Sm, Y, Tl, Na,
Represents at least one metal of Ag, Cu, and Mg;
b and c are 0 ≦ a <0.5, 0 ≦ b <0.5, 0 <c ≦
Represents a number satisfying 0.2. (18) In formula described in JP 60-84381 JP _{^{M II X 2 · aM II X}} '2 · xEu divalent europium activated alkaline earth represented by ²⁺ metal halide phosphor. (However, M ^II is Ba, Sr, Ca
X and X ′ are at least one halogen of Cl, Br, I and X ≠ X ′, and a, x is 0.1 ≦ a ≦
10.0, a number satisfying 0 <x ≦ 0.2. (19) A divalent europium-activated alkaline earth metal halide phosphor represented by the general formula MX ₂ · aMX ' ₂ · bEu ²⁺ described in JP-A-63-27588. (Where M is at least one alkaline earth metal of Ca, Sr, Ba, X and X ′ are at least one halogen of Cl, Br, I, and X ≠ X ′) A, b is 0.5 ≦ a ≦
It represents a number that satisfies 1.8, 10 ⁻⁴ ≦ b ≦ 10 ⁻² . (20) Divalent Europium-Activated Halogenation Represented by General Formula BaX ₂ : Eu (X is Halogen) Described in the Proceedings of the 51st Annual Meeting of the Japan Society of Applied Physics (Autumn 1990), p. 1086 Barium phosphor.

Of the above, alkali halide phosphors are particularly preferred in that it is easy to form a stimulable phosphor layer by a vacuum deposition method, a sputtering method, or the like. However, in the present invention, the phosphor is not limited to the above, other phosphor may be used as long as it is a phosphor that shows stimulated emission when irradiated with radiation and then irradiated with stimulated excitation light. . The radiation image conversion panel obtained by the production method of the present invention is a stimulable phosphor layer group consisting of one or more stimulable phosphor layers containing at least one kind of the stimulable phosphor described above. There may be. Also, the stimulable phosphor contained in each stimulable phosphor layer may be the same or different.

The thickness of the stimulable phosphor layer varies depending on the intended sensitivity of the radiation image conversion panel to radiation, the kind of the stimulable phosphor, and the like. 1000 μm is preferred, especially 20 to 800
μm is preferred, and 20 to 10 when a binder is contained.
00 μm is preferable, and particularly preferably 50 to 500 μm. Such a stimulable phosphor layer is formed on the support using a coating method, a vapor deposition method, or the like. After forming the stimulable phosphor layer on the protective layer, the stimulable phosphor layer is laminated on the support. May be. As the vapor deposition method, for example, a vapor deposition method, a sputtering method, C
VD method and the like.

When the stimulable phosphor layer formed by the vapor deposition method is subjected to a heat treatment, the sensitivity to X-rays is improved. Further, after forming a stimulable phosphor base layer containing no activator on the support or the protective layer, by doping the activator into the stimulable phosphor base layer by a method such as a thermal diffusion method. It may be a predetermined stimulable phosphor layer.

As the material of the support, various polymer materials,
Glass, ceramics, metals and the like are used. As a polymer material, a cellulose acetate film, a polyester film, a polyethylene terephthalate film,
Examples thereof include a polyamide film, a polyimide film, a triacetate film, and a polycarbonate film. Examples of the metal include a metal sheet or metal plate of aluminum, iron, copper, chromium, or the like, or a metal sheet or metal plate having a metal oxide coating layer. Examples of the glass include chemically strengthened glass and crystallized glass. Examples of the ceramic include a sintered plate of alumina and zirconia.

The thickness of the support varies depending on the material and the like, but is generally 80 μm to 5000 μm, and particularly preferably 200 μm to 2000 μm from the viewpoint of convenience in handling. The support preferably has a low moisture permeability from the viewpoint of moisture resistance, and the moisture permeability is preferably 10 g / m ² · 24 hr or less, particularly preferably 1 g / m ² · 24 hr or less. Glass, ceramics, metal, and the like having excellent moisture permeability of substantially 0 are particularly preferable.

When the stimulable phosphor layer is subjected to the heat treatment as described above, the support is required to have heat resistance.
It is preferable that no cracking or deformation occurs even in continuous use at 00 ° C. or higher. Further, it is preferable that during the heat treatment, it does not react with the stimulable phosphor to affect the performance such as X-ray sensitivity. Examples of the support having excellent heat resistance and poor reactivity with the stimulable phosphor layer include a crystallized glass plate, a quartz plate, and an alumina-silica sintered plate.

Crystallized glass is also referred to as glass-ceramic. After melt-molding glass having the following special composition, it is reheated under well-controlled conditions, and is maintained in its original form, while maintaining its original shape. It has been converted into an aggregate of crystals. The main composition systems of crystallized glass currently in practical use include, for example, silicate glass such as Li ₂ O—SiO ₂ , Na ₂ O—CaO—MgO.
—SiO ₂ , Li ₂ O—Al as aluminosilicate type
₂ O ₃ —SiO ₂ , Na ₂ O—Al ₂ O ₃ —SiO ₂ —
_{MgO-Al 2 O 3 -SiO 2} , PbO-ZnO-B 2 O 3 as borate _{glasses, ZnO-B 2 O 3 -SiO} 2 and the like as a borosilicate glass.

The surface of the support may be a smooth surface or a matte surface for the purpose of improving the adhesion to the stimulable phosphor layer. The surface of the support may be an uneven surface, or may have a surface structure in which minute tile plates independent of each other are densely arranged. Further, on the support, an undercoat layer may be provided on the surface on which the stimulable phosphor layer is provided for the purpose of improving the adhesiveness with the stimulable phosphor layer, and light reflection may be performed as necessary. A layer, a light absorbing layer, or the like may be provided.

The protective layer is provided for physically or chemically protecting the stimulable phosphor layer, and has good translucency and can be formed into a sheet. The protective layer desirably has a high transmittance in a wide wavelength range in order to efficiently transmit stimulated excitation light and / or stimulated emission, and the light transmittance is 80% or more in a wavelength range of 400 to 800 nm. Preferably, especially 90% or more,
In the wavelength range of 360 to 400 nm, 60% or more is preferable, and 80% or more is particularly preferable.

Examples of such a material include plate glass such as quartz, borosilicate glass, chemically strengthened glass, polyethylene terephthalate (PET), drawn polypropylene, and the like.
Organic polymer compounds such as polyvinyl chloride are exemplified. Borosilicate glass shows a light transmittance of 80% or more in a wavelength range of 330 nm to 2.6 μm, and quartz glass shows a high light transmittance even at a shorter wavelength. Further, it is preferable to provide an anti-reflection layer such as MgF _{2 on} the surface of the protective layer, because it has the effects of efficiently transmitting the stimulating light and the stimulating light and reducing the decrease in sharpness.

The thickness of the protective layer is, for example, 25 μm to 5 mm.
In order to obtain good moisture resistance and impact resistance, 10
0 μm to 3 mm is preferred. The moisture permeability of the protective layer is preferably low from the viewpoint of the moisture resistance of the radiation image conversion panel, and is preferably, for example, 10 [g / m ² · 24 hr] or less, and particularly preferably 1 [g / m ² · 24 hr] or less. Glass that is excellent in airtightness, has a water vapor transmission rate of substantially 0, and has good light transmissivity is particularly preferable.

The protective layer may be a single layer or may be composed of two or more layers. For example, glass may be used as the first protective layer (outside), and the organic polymer layer may be used as the second protective layer (inside). When a second hygroscopic organic polymer layer such as polyvinyl alcohol or an ethylene-vinyl alcohol copolymer is used as the second protective layer and provided on the stimulable phosphor layer side of the first protective layer The water adsorbed on the stimulable phosphor layer at the time of sealing is now adsorbed and removed by the second protective layer, so that the stimulable phosphor layer is more effectively prevented from being deteriorated by moisture,
The initial performance of the radiation image conversion panel is further improved.

The stimulable phosphor layer may be in contact with both the support and the protective layer, but it is preferable to provide a low refractive index layer between the stimulable phosphor layer and the protective layer. The low-refractive-index layer exists in a state where the low-refractive-index layer is shielded from the external atmosphere, and the presence of the low-refractive-index layer substantially increases the thickness of the protective layer without lowering sharpness. It is possible to further improve the moisture resistance and the durability. Examples of such a low refractive index layer include a layer made of an inert gas such as air, nitrogen, and argon, a layer having a refractive index of substantially 1, such as a vacuum layer, methyl alcohol (refractive index of 1.33), Ethyl alcohol (refractive index 1.3
6) a layer composed of a liquid such as CaF ₂ (refractive index 1.23 to
1.26), Na ₃ AlF ₆ (refractive index: 1.35), Mg
F ₂ (refractive index 1.38), SiO ₂ (refractive index 1.46)
And the like. Among these,
In particular, a low-refractive-index layer composed of a gas layer or a vacuum layer is preferable because it has a high effect of preventing a decrease in sharpness. Usually, the practical thickness of the low refractive index layer is 0.05 μm to 3 mm.

When the protective layer is disposed at a distance from the stimulable phosphor layer, a spacer surrounding the stimulable phosphor layer is provided between the support and the protective layer. The spacer is not particularly limited as long as it can hold the stimulable phosphor layer in a state of being shielded from the external atmosphere.
Glass, ceramics, metals, plastics and the like can be mentioned.

FIG. 4 schematically shows a radiation image conversion apparatus constituted by using a radiation image conversion panel manufactured by the method of the present invention, wherein 10 is a radiation generator, 11 is a subject, 12 is a radiation image conversion panel, 13 is a photostimulated excitation light source, 14 is a photoelectric conversion device for detecting photostimulated emission emitted from the radiation image conversion panel 12, and 15 is a photoelectric conversion device 1.
A reproducing device for reproducing the signal detected in 4 as an image, 1
Reference numeral 6 denotes a display device for displaying an image reproduced by the reproducing device 15, and reference numeral 17 denotes a filter that separates stimulated excitation light and stimulated emission and transmits only stimulated emission.

In this radiation image conversion apparatus, the radiation from the radiation generation apparatus 10 enters the radiation image conversion panel 12 through the subject 11. The incident radiation is absorbed by the stimulable phosphor layer of the radiation image conversion panel 12 and its energy is accumulated, thereby forming an accumulated radiation transmission image. Next, this accumulated image is excited by stimulating light from the stimulating light source 13 and emitted as stimulating light.
Since the intensity of the emitted stimulating luminescence is proportional to the amount of accumulated radiation energy, this optical signal is photoelectrically converted by a photoelectric conversion device 14 such as a photomultiplier tube, and reproduced as an image by a reproduction device 15, By displaying the image on the display device 16, a radiation transmission image of the subject 11 can be observed.

[0041]

EXAMPLES Hereinafter, more specific examples will be described, but the present invention is not limited to these examples. Example 1 A support made of crystallized glass having a thickness of 1.1 mm (400 m
m × 500 mm) was placed in a vapor deposition apparatus employing an electron beam method (EB method). Next, a press-molded alkali halide (RbBr) as an evaporation source was placed in a water-cooled crucible. Subsequently, the inside of the vapor deposition apparatus was evacuated, and 5 ×
The degree of vacuum was set to 10 ⁻⁶ Torr. Next, the support is 40 ~
While maintaining the temperature at 45 ° C., power is supplied to the EB gun so that R
bBr was evaporated. In order to obtain a target RbBr layer, the deposition rate was controlled by a film thickness monitor so as to be 10 ⁵ ° / min. The EB scanned the surface of the evaporation source of the crucible in a raster shape.

When the thickness of the RbBr layer reached 300 μm, the vapor deposition was terminated to obtain a vapor-deposited panel. This vapor-deposited panel is activated by a doping agent powder (RbBr: 10 ^-4 Tl).
Was placed in a quartz crucible, covered, and heated at 600 ° C. for 1 hour, thereby doping Tl into the RbBr layer of the vapor deposition panel to obtain a stimulable phosphor layer. On this stimulable phosphor layer, a 1.1 mm thick linear thermal expansion coefficient was 32.5 × 1.
Protective layer made of borosilicate glass of 0 ^-7 / ° C (grain-treated at the upper part of the spacer, 400 mm × 50
0 mm). Next, the peripheral portion of the stimulable phosphor layer is sealed with a two-component epoxy adhesive (AW-13).
6 and HY994, manufactured by Nippon Ciba Geigy Co., Ltd.). The radiation image conversion panel was placed in a thermostat until the adhesive was cured and the radiation image conversion panel was sealed, and the temperature of the support and the protective layer was maintained at 40 ° C. for 12 hours. Thus, a radiation image conversion panel having the structure shown in FIG. 1 was manufactured. Thereafter, the radiation image conversion panel was used at 40 ° C., and changes in the radiation image conversion panel were examined. The results are shown in Table 1 below.

Example 2 A radiation image conversion panel was manufactured in the same manner as in Example 1 except that the conditions shown in Table 1 below were used, and evaluation was performed in the same manner.

Example 3 An RbBr vapor-deposited panel was prepared in the same manner as in Example 1.
After doping with Tl, as shown in FIG. 2, a spacer made of crystallized glass surrounding the stimulable phosphor layer on the support and having a thickness of 1.1 mm and a linear thermal expansion coefficient of 10 × 10 ⁻⁷ / ° C. And a protective layer made of borosilicate glass having a thickness of 1.1 mm and a coefficient of linear thermal expansion of 32.5 × 10 ⁻⁷ / ° C. through a gap (grain-treated at a portion corresponding to the upper portion of the spacer) , 400 mm × 500 mm). A two-component epoxy adhesive (AW-136 and HY99) as a sealing member is provided between the protective layer and the spacer, and between the support and the spacer.
4, Nippon Ciba Geigy Co., Ltd.). Until the adhesive was cured and the radiation image conversion panel was sealed, the radiation image conversion panel was placed in a thermostat and the temperature of the support and the protective layer was kept at 40 ° C. for 12 hours. Thus, a radiation image conversion panel having the structure shown in FIG. 2 was manufactured. Thereafter, the radiation image conversion panel was used at 0 ° C., and changes in the radiation image conversion panel were examined. The results are shown in Table 1 below.

Examples 4 and 5 A radiation image conversion panel was manufactured and evaluated in the same manner as in Example 3, except that the conditions shown in Table 1 were used.

Example 6 An RbBr vapor-deposited panel was prepared in the same manner as in Example 1.
After doping with Tl, as shown in FIG. 3, the support is made of a crystallized glass having a thickness of 1.1 mm and a linear thermal expansion coefficient of 10 × 10 ⁻⁷ / ° C. surrounding the stimulable phosphor layer on the support. A protective layer made of borosilicate glass having a thickness of 1.1 mm and a linear thermal expansion coefficient of 32.5 × 10 ⁻⁷ / ° C. (a part corresponding to the upper part of the spacer is subjected to a graining treatment through an air gap) (400 mm × 500 mm). A two-component epoxy adhesive (AW-136 and HY99) as a sealing member is provided between the protective layer and the spacer and between the support and the spacer.
4, Nippon Ciba Geigy Co., Ltd.). Until the adhesive was cured and the radiation image conversion panel was sealed, the radiation image conversion panel was placed in a thermostat and the temperature of the support and the protective layer was kept at 40 ° C. for 12 hours. Thus, a radiation image conversion panel having the structure shown in FIG. 3 was manufactured. Thereafter, the radiation image conversion panel was used at 40 ° C., and changes in the radiation image conversion panel were examined. The results are shown in Table 1 below.

Example 7 A radiation image conversion panel was manufactured and evaluated in the same manner as in Example 6, except that the conditions shown in Table 1 below were used.

Comparative Example 1 A radiation image conversion panel was manufactured in the same manner as in Example 1 except that the conditions shown in Table 1 below were used, and evaluation was performed in the same manner.

Comparative Example 2 A radiation image conversion panel was manufactured in the same manner as in Example 3 except that the conditions shown in Table 1 below were used, and evaluation was performed in the same manner.

Comparative Example 3 A radiation image conversion panel was manufactured in the same manner as in Example 6 except that the conditions shown in Table 1 below were used, and evaluation was performed in the same manner.

[0051]

[Table 1]

[0052]

As described in detail above, according to the manufacturing method of the present invention, a radiation image conversion panel free from peeling or cracking can be manufactured. That is, assuming that the use temperature range is 0 to 60 ° C., when the sealing member is cured while maintaining the temperature at 60 ° C., a radiation image conversion panel that does not cause peeling or cracking can be manufactured.

[Brief description of the drawings]

FIG. 1 is a cross-sectional view illustrating an example of a radiation image conversion panel manufactured by a manufacturing method of the present invention.

FIG. 2 is a sectional view showing another example of the radiation image conversion panel manufactured by the manufacturing method of the present invention.

FIG. 3 is a sectional view showing still another example of the radiation image conversion panel manufactured by the manufacturing method of the present invention.

FIG. 4 is an explanatory view schematically showing a radiation image conversion apparatus configured using a radiation image conversion panel obtained by the manufacturing method of the present invention.

[Explanation of symbols]

REFERENCE SIGNS LIST 1 photostimulable phosphor layer 2 support 3 protective layer 4 sealing member 5 spacer 5A spacer 5B spacer 6 low refractive index layer 10 radiation generator 11 subject 12 radiation image conversion panel 13 photostimulation excitation light source 14 photoelectric conversion device 15 reproduction Device 16 Display device 17 Filter

Claims (1)

(57) [Claims] A stimulable phosphor layer is provided between a support and a protective layer, and a peripheral portion of the support and the protective layer is a double spacer.
In a method for manufacturing a radiation image conversion panel having a structure in which the stimulable phosphor layer is sealed between a support and a protective layer by being sealed by a sealing member via a sealing member, In this case, the sealing member is cured while the support, the protective layer, and the sealing member are kept at a temperature near the upper limit temperature when the radiation image conversion panel is used. Panel manufacturing method.