JP3045913B2 - Semiconductor laser device and method of manufacturing the same - Google Patents

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a semiconductor laser device used in fields such as optical information processing, optical measurement and optical communication, and a method of manufacturing the same.

[0002]

2. Description of the Related Art In contrast to a conventional video tape system using a magnetic head for recording and reproducing television signals, an optical head is used to irradiate a converged light beam onto a medium containing information, and the light beam is reflected from the medium. Recently, the use of an optical disk system for detecting information light and reproducing the information content of a medium as video or sound has become remarkable. As a medium, a compact disk is well known in the audio field, and a laser disk is well known in the video field, and an optical pickup device using a semiconductor laser device as an optical head is used to read information from the optical disk. The optical recording / reproducing technology using these semiconductor lasers has been developed as a technology which plays a central role in a so-called multimedia, which is a center of the advanced information society, as being applicable to data storage in a large computer network or a personal computer.

FIG. 5 shows the structure of an example of the optical pickup device. In FIG. 5, 1 is an optical disk, 2 is an objective lens, 3 is an actuator for moving the objective lens 2, 4 is a reflecting mirror, 5 is a beam splitter, Reference numeral 6 denotes a three-beam generating grating, 7 denotes a semiconductor laser, 8 denotes a light receiving element, 9 denotes a laser output light, and 10 denotes a signal light that has been modulated and reflected by the optical disc 1 and returned. As described above, in the conventional optical pickup device, the semiconductor laser 7, the three-beam generating grating 6, the beam splitter 5, the light receiving element 8, the reflecting mirror 4, and the objective lens 2 are each composed of separate components, and the number of components is large. In addition, there is a problem that the cost increases.

In order to solve this problem, the present inventors have integrated the above-mentioned separate components as shown in FIG. 6 and integrated them into a semiconductor laser device and an optical pickup device having excellent long-term reliability and mass productivity. Suggested. In FIG. 6, reference numeral 11 denotes a semiconductor laser device in which the semiconductor laser 7, the three-beam generating grating 6, the beam splitter 5, and the light receiving element 8 in FIG.

Next, FIG. 7 shows a detailed structure of the semiconductor laser device 11 having the optical component 12. As shown in FIG. In FIG. 7, 13 is a semiconductor laser chip, 14 is a radiator plate made of a silicon substrate or the like, 14a is a light receiving element formed on a part of the radiator plate 14, 15 is a frame, 16 is an external lead, and 17 is a semiconductor laser chip. Laser emission light generated from 13, 18
Denotes a protection plate, and 19 denotes a resin package formed by the protection plate 18 and the frame 15.

In the above configuration, the semiconductor laser chip 1
Numeral 3 is housed in a hollow resin package 19 composed of a frame 15 and a protective plate 18, and the optical component 1
2 is fixed by an adhesive 120 to prevent intrusion of moisture from the outside.

[0007]

However, in the above-described conventional semiconductor laser device, since the optical component 12 and the frame 15 are planarly bonded by the adhesive 120 as shown in FIG. Was short, and there was a risk that moisture or moisture might enter from the outside. FIG. 8 shows a semiconductor laser device having a conventional structure at a temperature of 60.degree.
This is an example in which the dark current (leakage current) of the light receiving element 14a over time when stored under an environment of 0% is measured. As shown in FIG. 8, such a conventional structure has a problem that the characteristics of the light receiving element 14a are easily deteriorated.

[0008] The present invention is to solve the above problems,
An object of the present invention is to provide a semiconductor laser device excellent in long-term reliability and a method for manufacturing the same.

[0009]

In order to achieve the above object, a semiconductor laser device according to the present invention comprises a resin package mainly comprising a semiconductor laser chip, a frame housing the semiconductor laser chip therein, and a protective plate. When, a semiconductor laser device composed of an optical component provided on the upper surface of the resin package is provided with a cutout portion having a smaller level difference thickness of the optical component on the upper surface inner circumferential portion of the frame body, small
At least a portion between a side surface of the cutout portion and a side surface of the optical component is bonded with a first adhesive, and a portion from the side surface of the optical component to the upper surface of the frame is bonded with a second adhesive. It is. In addition, a semiconductor laser device of the present invention mainly includes a semiconductor package, a resin package including a semiconductor laser chip, a frame body for housing the semiconductor laser chip therein, and a protective plate, and a convex leg provided on an upper surface of the resin package. A moat-shaped groove provided in an upper peripheral portion of the frame body, wherein the moat-shaped groove is fitted to a convex leg of the optical component, and Groove and said convex
All of the leg-shaped portions are joined with a first adhesive, and a portion from the side surface of the optical component to the upper surface of the frame body is joined with a second adhesive. Further, in the method for manufacturing a semiconductor laser device of the present invention, a semiconductor substrate is provided in a resin package including a frame and a protective plate, a semiconductor laser chip is provided on the semiconductor substrate, and the semiconductor chip and external leads are provided. After performing the wiring process, a notch or a recess provided on the upper surface of the frame body is filled with a first adhesive, and a part of the optical component having a thickness greater than the thickness of the notch. the semiconductor chip to the notch, or a convex leg portion formed on the optical component is fitted in the recess, the clearance provided between the notch or the recess and the optical component After the position of the optical component is adjusted with respect to the optical component, the optical component is cured and adhered, and then a second adhesive is filled from the side surface of the optical component to the upper surface of the frame, and cured and adhered.

[0010]

Therefore, according to the present invention, a concave or moat-like groove is provided in the frame body, and the concave or moat-like groove is first filled with the first adhesive to fit the optical component into the concave or moat-like groove. Since the position of the optical component with respect to the semiconductor laser chip can be adjusted by the clearance provided in the above, extremely accurate position adjustment can be easily performed. Also the second
By using an airtight adhesive having extremely moisture resistance, water resistance and strong adhesive force as the adhesive of the above, a semiconductor laser device excellent in long-term reliability can be obtained.

[0011]

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS A semiconductor laser device and a method of manufacturing the same according to an embodiment of the present invention will be described below with reference to FIGS. Elements corresponding to those of the apparatus shown in FIGS. 6 and 7 are denoted by the same reference numerals.

FIG. 1 shows a first embodiment of the present invention. The structure of the first embodiment differs from that of the prior art shown in FIG.
As is apparent from FIG. 2, a concave portion 20 is provided in the frame body 15 constituting the resin package 19, the optical component 12 having a thickness greater than the step of the concave portion 20 is inserted into the concave portion 20, and the flat portion and the side wall portion of the concave portion 20 form That is, the body 15 and the optical component 12 are bonded and fixed.

An optical component 12 having a hologram pattern (not shown) or the like on one or both sides thereof and a frame 15
Are three-dimensionally joined in different steps by the first adhesive 21 and the second adhesive 22.

Next, an outline of a method for manufacturing the semiconductor laser device 11 of the first embodiment will be described.

Protective plate 1 having external leads formed on the upper surface
8 and the frame 15 in which the concave portion 20 is formed are the resin package 1
9, a heat sink 14 such as a silicon substrate having a light receiving element 14a formed at a substantially central part thereof and having a heat sink function is provided, and a semiconductor laser chip 13 is die-bonded to the upper surface thereof. Next, a semiconductor laser chip 13 and a light receiving element 14 for receiving signal light
a after the wiring process between the external lead 16 and the frame body 1
A small amount of an ultraviolet-curable first adhesive 21 made of acrylic resin or the like is applied to the concave portion 20 of 5, and the optical component 12 is inserted into the concave portion 20, and the position of the semiconductor laser chip 13 and the optical component 12 is adjusted by a position control device. I do. At this time, since the concave portion 20 is provided between the optical component 12 and the frame body 15 so as to generate an appropriate clearance, accurate positioning can be performed. Also, during the alignment process, the periphery of the lower end of the optical component 12 and the concave portion 20 are filled with the first adhesive without any gap, and are cured, adhered and fixed by irradiating ultraviolet rays. Next, a second adhesive 22 made of a thermosetting or room temperature curable epoxy adhesive or the like is filled from the side surface of the optical component 12 to the upper surface of the frame body 15,
By curing, the optical component 12 and the resin package 19 form an airtight hollow portion 23 therein, and the bonding surfaces of the two are three-dimensionally bonded by two kinds of adhesives. And light receiving element 14a
Can be protected from the external environment such as humidity and moisture.

Next, a second embodiment of the present invention will be described. FIG. 2 shows a semiconductor laser device according to the second embodiment. The difference from the first embodiment is that a moat-like groove 24 is provided in the frame 15 instead of the concave portion 20 in the first embodiment. The point is that a convex portion 25 is provided around the optical component 12 so as to fit into the moat-like groove 24 of the frame body 15.

The manufacturing method of the second embodiment is almost the same as that of the first embodiment. First, a small amount of the first adhesive 21 is filled in the moat-like groove 24 of the frame 15, and then the optical component is formed. Then, the semiconductor laser chip 13 and the optical component 12 are aligned by a position control device using the clearance generated between the protrusions 25 of the semiconductor device 12 and the groove 24. After that, the first adhesive 21 is cured by irradiating ultraviolet rays, and the second adhesive 22 is filled over the peripheral side surface of the optical component 12 and the upper surface of the frame 15, cured, and cured. An air-tight hollow portion 23 is formed between the package and the package 19.

In the case of the second embodiment, since the bonding creepage distance formed by the first adhesive 21 is long and a complicated three-dimensional structure is formed, the airtightness is further improved, and the semiconductor laser The chip 13 can be completely protected from an external environment such as humidity and moisture.

In the present invention, the reason why the ultraviolet curable adhesive such as acrylic resin is used as the first adhesive is that during the position control of the optical component 12 with respect to the semiconductor laser chip 13, heating or viscosity increase of the adhesive occurs. However, this is because curing is rapidly performed by ultraviolet light after the completion of the alignment. If this purpose is achieved, an adhesive other than an acrylic resin can be used. Therefore, the first purpose of the first adhesive 21 is to fix the optical component 12 after the alignment, but it is also important to provide the first adhesive 21 with moisture resistance and airtightness for protecting the semiconductor laser chip 13 from the external environment. It is very important for the second adhesive 22 made of epoxy resin or the like to maintain the airtightness of the hollow portion 23 formed by the resin package 19 and the optical component 12. A second adhesive 22 of a material suitable for the material must be selected.

Next, the first embodiment of the present invention and the second embodiment
The temperature of the semiconductor laser device of the embodiment is 60 ° C. and the relative humidity is 9
Light-receiving element 14a when stored under 0% environment
FIG. 3 and FIG. 4 show an example of the result of measuring the passage of time of the dark current (leakage current) of FIG. Compared with the reliability test results of the conventional semiconductor laser device shown in FIG. 8, no increase in the leakage current of the light receiving element 14a was observed in any case, indicating that the long-term reliability was greatly improved.

As described above, according to the above embodiment, the concave portion 20 or the moat-shaped groove 24 is provided in the frame 15 constituting the resin package 19, and the optical component 12 is attached to the first adhesive 21 and the second adhesive 21.
Of the hollow portion 2
3, the airtightness of the semiconductor laser chip 13 and the reliability of the characteristics of the semiconductor laser chip 13 and the light receiving element 14a can be greatly improved.

[0022]

According to the present invention, there is provided a resin package mainly comprising a semiconductor laser chip, a frame for accommodating the semiconductor laser chip therein, and a protective plate, and an optical element provided on the upper surface of the resin package via an adhesive. A semiconductor laser device comprising components, wherein the frame and the optical component form a three-dimensional joint surface by providing a concave portion or a moat-shaped groove in the frame, and a semiconductor with excellent long-term reliability. A laser device can be provided.

[Brief description of the drawings]

FIG. 1 is a sectional view of a semiconductor laser device according to a first embodiment of the present invention.

FIG. 2 is a sectional view of the semiconductor laser device according to the second embodiment.

FIG. 3 is a characteristic diagram obtained by measuring the reliability of the semiconductor laser device according to the first embodiment.

FIG. 4 is a characteristic diagram obtained by measuring the reliability of the semiconductor laser device according to the second embodiment.

FIG. 5 is a schematic configuration diagram of a conventional optical pickup device.

FIG. 6 is a schematic configuration diagram of an improved conventional optical pickup device.

FIG. 7 is a sectional view of a conventional semiconductor laser device.

FIG. 8 is a characteristic diagram obtained by measuring the reliability of a conventional semiconductor laser device.

[Explanation of symbols]

 DESCRIPTION OF SYMBOLS 12 Optical component 13 Semiconductor laser chip 15 Frame 18 Protective plate 19 Resin package 20 Depression 21 First adhesive 22 Second adhesive

──────────────────────────────────────────────────続 き Continuing on the front page (72) Inventor Akio Yoshikawa 1-1, Kochi-cho, Takatsuki-shi, Osaka Prefecture Inside Matsushita Electronics Corporation (72) Inventor Kazunari Ota 1-1, Kochi-cho, Takatsuki-shi, Osaka Matsushita (56) References JP-A-3-48446 (JP, A) JP-A-63-153539 (JP, U) JP-A-62-37935 (JP, U) JP-A-61-199052 (JP, U) Japanese Utility Model 63-185240 (JP, U) (58) Fields investigated (Int. Cl. ⁷ , DB name) H01L 23/02

Claims (3)

(57) [Claims] 1. A semiconductor laser device mainly comprising a semiconductor laser chip, a resin package including a frame housing the semiconductor laser chip therein and a protective plate, and an optical component provided on an upper surface of the resin package. A notch having a step smaller than the thickness of the optical component is provided in an inner peripheral portion of the upper surface of the frame, and at least the notch is provided.
Between side face side and the optical components of joined at the first adhesive, it is over the upper surface of the frame from the side surface of the optical component semiconductor laser, characterized by being bonded with the second adhesive apparatus. 2. A resin package mainly comprising a semiconductor laser chip, a frame housing the semiconductor laser chip therein and a protective plate, and an optical component having a convex leg provided on an upper surface of the resin package. A moat-shaped groove is provided on a peripheral upper surface of the frame, and the moat-shaped groove and the convex leg of the optical component are fitted to each other. A semiconductor laser device, wherein all of the legs are joined with a first adhesive, and the side surface of the optical component and the upper surface of the frame are joined with a second adhesive. 3. After a semiconductor substrate is set in a resin package including a frame and a protection plate, a semiconductor laser chip is provided on the semiconductor substrate, and wiring processing between the semiconductor chip and external leads is performed. A notch or a concave portion provided on the upper surface of the frame is filled with a first adhesive, and a part of the optical component having a thickness larger than the thickness of the notch is provided in the notch, or and a convex leg portion formed on the optical component is fitted in the recess, the notch or the recess
After adjusting the position of the optical component with respect to the semiconductor chip by the clearance provided between the optical component and the optical component, the optical component is cured and bonded, and then a second adhesive is applied from the side surface of the optical component to the upper surface of the frame. Manufacturing method of a semiconductor laser device which is filled and cured by bonding.