JPH07183414A - Semiconductor laser device and manufacture thereof - Google Patents

Abstract

PURPOSE:To increase long-term reliability by providing a recessed part or a well-like groove in a frame body and constituting the frame body and optical components of three-dimensional junction plane to increase the airtight quality of a resin package, thereby preventing moisture from entering into the resin package. CONSTITUTION:An ultraviolet-hardened type first bonding agent 21 is applied to the recessed part 20 of a frame body 15, and the positioning of a semiconductor laser chip 13 and optical component 12 are performed by a positioning controller for fitting optical component 12 to the recessed part 20. At that time, accurate positioning can be achieved by the recessed part 20 provided between the optical component 12 and the frame body 15. The periphery of the lower end of the optical component 12 and the recessed part 20 is completely filled up with the bonding agent 21 in the positioning process and bonded for fixation with the radiation of ultraviolet ray. After that, a second bonding agent 22 is filled up throughout the side surface of the optical component 12 to the upper surface of the frame body and hardened. At that time, a hollow part 23 is formed inside the optical component 12 and a resin package 19, and both of them are three-dimensionally bonded in their bonded surface.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a semiconductor laser device used in the fields of optical information processing, optical measurement, optical communication and the like, and a method of manufacturing the same.

[0002]

2. Description of the Related Art In contrast to a conventional video tape system using a magnetic head for recording and reproducing a television signal, an optical head is used to irradiate a converged light beam onto a medium containing information, which is reflected from the medium. Recently, the spread of the optical disk system that detects the light and reproduces the information content of the medium as an image or a sound has become remarkable. As media, compact discs in the audio field and laser discs in the video field are well known, and an optical pickup device using a semiconductor laser device as an optical head is used to read information from the optical disc. The optical recording / reproducing technology using these semiconductor lasers is being developed as a technology that plays a central role in the advanced information society called so-called multimedia, which is applicable to data storage in large computer networks or personal computers.

FIG. 5 shows the structure of an example of the optical pickup device. In the figure, 1 is an optical disk, 2 is an objective lens, 3 is an actuator for moving the objective lens 2, 4 is a reflecting mirror, 5 is a beam splitter, Reference numeral 6 is a three-beam generating grating, 7 is a semiconductor laser, 8 is a light receiving element, 9 is laser emission light, and 10 is signal light which is modulated by the optical disc 1 and reflected back. As described above, in the conventional optical pickup device, the semiconductor laser 7, the three-beam generating grating 6, the beam splitter 5, the light receiving element 8, the reflecting mirror 4 and the objective lens 2 are each composed of separate parts, and the number of parts is large. In addition, there is a problem that the cost becomes high.

In order to solve this problem, the inventors have integrated the above-mentioned separate parts as shown in FIG. 6 and integrated them into a semiconductor laser device and an optical pickup device which are excellent in long-term reliability and mass productivity. Proposed. In FIG. 6, reference numeral 11 denotes a semiconductor laser device in which the semiconductor laser 7, the three-beam generating grating 6, the beam splitter 5, and the light receiving element 8 shown in FIG. 5 are integrally integrated, and which is provided with an optical component 12 such as a hologram element.

FIG. 7 shows a detailed structure of the semiconductor laser device 11 having the optical component 12. In FIG. 7, 13 is a semiconductor laser chip, 14 is a heat dissipation plate made of a silicon substrate, 14a is a light receiving element formed on a part of the heat dissipation plate 14, 15 is a frame, 16 is an external lead, and 17 is a semiconductor laser chip. Laser emission light generated from 13, 18
Is a protective plate, and 19 is a resin package including the protective plate 18 and the frame 15.

In the above structure, the semiconductor laser chip 1
3 is housed in a hollow resin package 19 composed of a frame body 15 and a protective plate 18, and the optical component 1 is placed on the upper opening surface thereof.
2 is fixed by an adhesive 120 to prevent moisture from entering from the outside.

[0007]

However, in the above-mentioned conventional semiconductor laser device, the optical component 12 and the frame body 15 are planarly adhered by the adhesive agent 120 as shown in FIG. The distance was short, and there was a risk that moisture and humidity would enter from the outside. FIG. 8 shows a semiconductor laser device having a conventional structure with a temperature of 60 ° C. and a relative humidity of 9
It shows an example of measuring the elapsed time of the dark current (leakage current) of the light receiving element 14a when stored in an environment of 0%. As shown in FIG. 8, such a conventional structure has a problem that the characteristics of the light receiving element 14a are easily deteriorated.

The present invention is intended to solve the above problems,
An object of the present invention is to provide a semiconductor laser device excellent in long-term reliability and a manufacturing method thereof.

[0009]

In order to achieve the above object, the present invention mainly relates to a semiconductor laser chip, a resin package including a frame for accommodating the semiconductor laser chip and a protective plate, and the resin package. A semiconductor laser device comprising an optical component provided on the upper surface of the frame via an adhesive, wherein a recess having a step smaller than the thickness of the optical component is provided on the inner peripheral surface of the upper surface of the frame, or The trench and the optical component form a three-dimensional joint surface by providing the trench in the peripheral side wall. Further, an adhesive for adhering the frame and the optical component is differently used in steps of a first adhesive for adjusting the position of the optical component and a second adhesive for maintaining airtightness.

[0010]

According to the present invention, therefore, a recess or trench is provided in the frame body, and the recess or trench is first filled with the first adhesive to fit the optical component, and then the recess or trench is formed. Since the position of the optical component with respect to the semiconductor laser chip can be adjusted by the clearance provided in, the extremely accurate position adjustment can be easily performed. The second
By using an airtight adhesive having extremely moisture resistance, water resistance, and a strong adhesive force as the adhesive, it is possible to obtain a semiconductor laser device having excellent long-term reliability.

[0011]

DESCRIPTION OF THE PREFERRED EMBODIMENTS A semiconductor laser device and a method of manufacturing the same according to one embodiment of the present invention will be described below with reference to FIGS. The elements corresponding to those of the apparatus shown in FIGS. 6 and 7 are designated by the same reference numerals.

FIG. 1 shows a first embodiment of the present invention. The structure is different from the conventional example shown in FIG.
As is clear from the above, the frame body 15 forming the resin package 19 is provided with the concave portion 20, the optical component 12 having a thickness larger than the step of the concave portion 20 is inserted into the concave portion 20, and the flat portion and the side wall portion of the concave portion 20 form the frame. This is because the body 15 and the optical component 12 are bonded and fixed.

Further, an optical component 12 and a frame 15 having a hologram pattern (not shown) or the like on one side or both sides thereof.
And 3 are three-dimensionally joined in separate steps by the first adhesive 21 and the second adhesive 22.

Next, an outline of a method of manufacturing the semiconductor laser device 11 of the first embodiment will be described.

Protective plate 1 having external leads and the like formed on its upper surface
8 and the frame body 15 in which the concave portion 20 is formed are the resin package 1
As shown in FIG. 9, a light-radiating plate 14 such as a silicon substrate having a light-receiving element 14a formed at a substantially central portion thereof and having a function of a heat sink is installed at 9 and a semiconductor laser chip 13 is die-bonded on the upper surface thereof. Next, the semiconductor laser chip 13 and the light receiving element 14 for receiving the signal light
After the wiring process between a and the external lead 16 is performed, the frame 1
A small amount of an ultraviolet curable first adhesive 21 made of acrylic resin or the like is applied to the concave portion 20 of the optical disc 5, and the optical component 12 is fitted into the concave portion 20 and the semiconductor laser chip 13 and the optical component 12 are aligned by the position control device. I do. At this time, since the concave portion 20 is provided between the optical component 12 and the frame body 15 so that an appropriate clearance is generated, accurate alignment is possible. In addition, during the alignment process, the periphery of the lower end of the optical component 12 and the concave portion 20 are filled with the first adhesive without any gap, and are cured by being irradiated with ultraviolet rays to be bonded and fixed. Then, a second adhesive 22 made of a thermosetting or room temperature curable epoxy adhesive or the like is filled from the side surface of the optical component 12 to the upper surface of the frame body 15,
By curing, the optical component 12 and the resin package 19 form the airtight hollow portion 23 therein, and the bonding surfaces of the two are three-dimensionally bonded by the two kinds of adhesives. Therefore, the semiconductor laser chip 13 And light receiving element 14a
Can be protected from the external environment such as humidity and moisture.

Next, a second embodiment of the present invention will be described. FIG. 2 shows a semiconductor laser device according to the second embodiment. The difference from the first embodiment is that a recessed groove 20 is provided in the frame body 15 instead of the recess 20 in the first embodiment. The point is that a convex portion 25 is provided around the optical component 12 so as to be fitted into the groove 24 of the frame body 15.

The manufacturing method of the second embodiment is almost the same as that of the first embodiment, but first, a small amount of the first adhesive 21 is filled in the groove 24 of the frame body 15, and then the optical component. The convex portion 25 of 12 is fitted in the groove 24, and the position control device aligns the semiconductor laser chip 13 and the optical component 12 by using the clearance generated therebetween. After that, ultraviolet rays are irradiated to cure the first adhesive 21, and the second adhesive 22 is filled between the peripheral side surface of the optical component 12 and the upper surface of the frame body 15 and cured to cure the optical component 12 and the resin. An airtight hollow portion 23 is formed between the package 19 and the package 19.

In the case of the second embodiment, since the adhesive creepage distance formed by the first adhesive 21 is long and a complicated three-dimensional structure is formed, the airtightness thereof is further increased and the semiconductor laser The chip 13 can be completely protected from the external environment such as humidity and moisture.

In the present invention, an ultraviolet curable adhesive such as an acrylic resin is used as the first adhesive because it is heated or the viscosity of the adhesive increases during the position control of the optical component 12 with respect to the semiconductor laser chip 13. However, this is because it is not preferable because it is rapidly cured by ultraviolet rays after completion of the alignment, and an adhesive other than the acrylic resin can be used if this purpose is achieved. Therefore, the first adhesive 21 is mainly fixed after the optical component 12 is aligned, but it is also important to have moisture resistance and airtightness for protecting the semiconductor laser chip 13 from the external environment. Regarding the second adhesive 22 made of epoxy resin or the like, it is extremely important to maintain the airtightness of the hollow portion 23 formed by the resin package 19 and the optical component 12, and the configuration of the resin package 19 and the optical component 12 is very important. A second adhesive 22 having a material suitable for the material should be selected.

Next, the first and second embodiments of the present invention will be described.
The semiconductor laser device of the embodiment of
Light receiving element 14a when stored under 0% environment
An example of the result obtained by measuring the passage of time of the dark current (leakage current) is shown in FIGS. 3 and 4, respectively. As compared with the reliability test results of the conventional semiconductor laser device shown in FIG. 8, no increase in the leak current of the light receiving element 14a is seen in any of them, and it is understood that the long-term reliability is significantly improved.

As described above, according to the above-described embodiment, the concave portion 20 or the trench groove 24 is provided in the frame body 15 constituting the resin package 19, and the optical component 12 is provided with the first adhesive 21 and the second adhesive 21.
Since it is bonded by the adhesive 22 of
3 is highly airtight, and the reliability of the characteristics of the semiconductor laser chip 13 and the light receiving element 14a can be greatly improved.

[0022]

According to the present invention, a resin package mainly composed of a semiconductor laser chip, a frame for accommodating the semiconductor laser chip and a protective plate, and an optical device provided on the upper surface of the resin package via an adhesive agent are provided. A semiconductor laser device composed of parts, wherein the frame body and the optical component form a three-dimensional joint surface by providing a recess or a trench in the frame body, and a semiconductor having an extremely long-term reliability. A laser device can be provided.

[Brief description of drawings]

FIG. 1 is a sectional view of a semiconductor laser device according to a first embodiment of the present invention.

FIG. 2 is a sectional view of a semiconductor laser device according to the second embodiment.

FIG. 3 is a characteristic diagram in which the reliability of the semiconductor laser device of the first embodiment is measured.

FIG. 4 is a characteristic diagram in which the reliability of the semiconductor laser device of the second embodiment is measured.

FIG. 5 is a schematic configuration diagram of a conventional optical pickup device.

FIG. 6 is a schematic configuration diagram of an improved conventional optical pickup device.

FIG. 7 is a sectional view of a conventional semiconductor laser device.

FIG. 8 is a characteristic diagram in which the reliability of a conventional semiconductor laser device is measured.

[Explanation of symbols]

 12 Optical Components 13 Semiconductor Laser Chip 15 Frame 18 Protective Plate 19 Resin Package 20 Recess 21 First Adhesive 22 Second Adhesive

 ─────────────────────────────────────────────────── ─── Continuation of the front page (72) Inventor Akio Yoshikawa 1-1 Sachimachi, Takatsuki City, Osaka Prefecture Matsushita Electronics Industrial Co., Ltd. (72) Issei Ota 1-1 Sachimachi, Takatsuki City, Osaka Matsushita Electronics Industry Co., Ltd.

Claims (4)

[Claims] 1. A resin package mainly composed of a semiconductor laser chip, a frame for accommodating the semiconductor laser chip and a protective plate, and an optical component provided on the upper surface of the resin package via an adhesive. A semiconductor laser device comprising a frame and an optical component forming a three-dimensional joint surface by providing a recess having a step smaller than the thickness of the optical component on the inner peripheral surface of the upper surface of the frame. apparatus. 2. A resin package mainly composed of a semiconductor laser chip, a frame for accommodating the semiconductor laser chip and a protective plate, and an optical component provided on the upper surface of the resin package via an adhesive. In the semiconductor laser device, the groove and the groove are provided in the peripheral side wall of the frame, and the frame and the optical component form a three-dimensional joint surface by fitting with the convex leg of the optical component. The constituent semiconductor laser device. 3. An adhesive is stepwise by a first adhesive for adjusting the position of the optical component, and a second adhesive filled for maintaining the airtightness of the optical component after adjusting the position of the optical component. The semiconductor laser device according to claim 1 or 2, wherein the adhesives are different kinds of adhesives used for. 4. A semiconductor substrate having a light receiving element partially formed in a resin package including a frame and a protective plate,
A semiconductor laser chip is bonded onto the semiconductor substrate, wiring processing is performed on external leads, and then a first adhesive is filled in the notch or recess provided in the frame to fit an optical component. Then, the position of the optical component is adjusted with respect to the semiconductor chip by the clearance provided in the cutout portion or the concave portion, and then cured and adhered, and then the second adhesive is applied to the joint portion between the frame body and the resin package. Filled in
A method for manufacturing a semiconductor laser device in which curing and adhesion are performed.