JP3035335B2 - Busbar mounted on printed wiring board - Google Patents

Description

Description: BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a plate-shaped bus bar mounted on a printed wiring board for supplying a considerable current to the printed wiring board.

[Conventional technology]

Conventionally, when handling circuits that require power, printed wiring boards
When a wiring pattern for flowing an electric current cannot be secured on the wiring 31 or the wiring pattern is insufficient, a bus bar 33 having a plurality of support pins 32 attached to a lower part of a metal plate such as iron is used. That is, the through hole of the printed wiring board 31
By inserting the support pin 32 of the bus bar 33 into 34,
The bus bar 33 is supported on the printed wiring board 31 and a current is applied to the bus bar 33 to cope with the problem.

[Problems to be solved by the invention]

However, the above-mentioned conventional bus bar 33 is a printed wiring board.
The exposed metal on the base 31 poses a danger, and it is expensive because it is made of phosphor bronze with solder plating. there were.

Accordingly, an object of the present invention is to provide a bus bar that is mounted on a printed wiring board that can be manufactured at low cost while improving safety without preventing metal from being exposed on the printed wiring board.

[Means for solving the problem]

In order to achieve the above object, in the present invention, a plate-shaped bus bar that is attached to a through hole of a printed wiring board and supplies a desired current is provided. Printed circuit board formed on the inner layer of the printed circuit board, supplying current to the conductive part via through holes, forming outer layer patterns on both sides of the printed circuit board, and grounding both outer layer patterns The gist is the bus bar attached to the.

[Action]

According to the above configuration, in the present invention, the bus bar is covered with an insulating material, a conductive portion for supplying current is formed in an inner layer of the printed circuit board, and the current is supplied to the conductive portion through a through hole, and the printed portion is printed. An outer layer pattern is formed on both sides of the substrate, and both outer layer patterns are grounded.

〔Example〕

(First Embodiment) An embodiment of the present invention will be described below with reference to FIGS.

As shown in FIG. 2, the bus bar 1 of the present embodiment includes a main body 2 formed of a plate-shaped printed circuit board and four pins 3 attached to one side (the lower part of the figure). Have been. The bus bar 1 in the present invention is a plate-shaped member that is mounted on a printed wiring board and allows a considerable amount of current to flow when a predetermined current cannot be ensured by a wiring pattern on the printed wiring board. As shown in FIG. 1, an inner layer pattern 4 as a conductive portion formed by a solid pattern is provided inside the main body 2, and the inner layer pattern 4 is connected to a pad 6 on the through hole 5 through the through hole 5. It is connected to the.

An outer layer pattern 7 formed by a solid pattern is provided on both outer layer sides of the main body 2. The outer layer patterns 7 are connected to each other through through holes 8, and are connected to one outer layer pattern 7. It is connected to the pad 10 (the lower left part in FIG. 1) on the through hole 9 via the hole 9.

As shown in FIGS. 1 and 2, the four pins 3 are composed of two power pins 3a and two ground pins 3b. The upper end of the power pin 3a is fixed to the pad 6 by soldering, and the upper end of the grounding pin 3b is fixed to the pad 10 by soldering. The inner layer pattern 4 includes the power pins 3a to the pads 6,
A current flows through the through hole 5. It is to be noted that, when it is desired to flow a considerably large amount of current, the inner layer pattern 4 can be dealt with by making the inner layer pattern 4 into one layer.

As shown in FIG. 3, these four pins 3 are attached to the lower part of both sides of the main body 2 in a staggered manner. Of these, two are connected to the pad 10 connected to the outer layer pattern 7 and two are connected to the pad 6 connected to the inner layer pattern 4 as described above.

The operation and effect of the bus bar 1 mounted on the printed wiring board configured as described above will be described.

As shown in FIG. 4, the power pin 3a at one end of the main body 2 of the bus bar 1 is inserted into a through hole 13 connected to the wiring pattern 12 of the power circuit of the printed wiring board 11. At the same time, the grounding pin 3b is inserted into the through hole 15 connected to the wiring pattern 14 of the grounding circuit. Similarly, the power pin 3a and the ground pin on the other end of the main body 2
The bus bar 1 is supported and fixed to the printed wiring board 11 by inserting 3b into the through holes 13 and 15 of the printed wiring board 11.

When a circuit requiring electric power is handled, a wiring pattern on the printed wiring board 11 cannot cope with it, but by using the bus bar 1, a sufficient current can flow. The bus bar 1 is formed on a printed circuit board as described above, and a pattern to which a current is supplied is formed on the inner layer pattern 4 and the outer layer side is covered with an insulating material. Is not exposed, thus improving safety. In addition, since the outer layer pattern 7 is formed in a solid pattern and is configured to cover the inner layer pattern 4 and these outer layer patterns 7 are grounded, a circuit that handles high frequency such as a switching power supply that performs switching at several hundred KHz in particular. In this case, noise generated in the inner layer pattern 4 can be reliably shielded. This electromagnetic wave shield can be reduced in size as compared with a method using a normal case.

Further, the bus bar 1 of this embodiment is different from the conventional bus bar 33.
Since the thickness is as thin as 40 to 50 μm compared to the thickness of 0.5 to 2 mm, the effect of the skin effect, that is, the phenomenon that radio waves can only flow to the outer periphery of the conductor when the frequency increases, can be reduced. Heat generation can be suppressed. In addition, compared to the case where expensive metal such as conventional phosphor bronze is used, since it is formed on a printed circuit board that is mass-produced, it can be manufactured at low cost.

The bus bar 1 mounted on the printed wiring board 11
The weight of the main body 2 is supported by four pins 3 fixed to the lower portions on both sides of the main body 2 and the four pins 3 are arranged in a staggered manner. Is further improved.

The present invention is not limited to the above embodiment, and may be configured as follows without departing from the spirit of the present invention.

(1) As shown in FIG. 5, V-grooves 18 are formed in the bus bar 1 constituting the main body 2 at opposing positions on both side surfaces thereof.
The bus bar 1 having a predetermined size can be obtained by bending the portion from the V-groove 18.

(2) As shown in FIG. 6, when it is desired to form the bus bar 1 in a bent state, the bus bar 1 of the first embodiment is replaced by two.
This can be performed by preparing a plurality of sheets, providing pads 19 at the ends of the main body 2, arranging the bus bars 1 at predetermined intervals, and connecting the bus bars 1 to the pads 19 of both main bodies 2 with a flexible substrate 20. .

(3) Since the bus bar 1 of the present invention is formed of a printed circuit board, as shown in FIG. It can be connected to pattern 4.

〔The invention's effect〕

The bus bar mounted on the printed wiring board of the present invention has no risk that metal is exposed on the printed wiring board, so that the safety is greatly improved, and the bus bar can be manufactured at a lower cost than before, and in particular, handles high frequencies. There is an effect that noise generated by the circuit can be significantly suppressed.

[Brief description of the drawings]

1 to 4 are views showing an embodiment of the present invention. FIG. 1 is a sectional view showing a bus bar, FIG. 2 is a perspective view showing a bus bar, FIG. 3 is a plan view showing a bus bar, and FIG. 5 is a partial perspective view showing a state in which a bus bar is attached to a printed wiring board. FIGS. 5 to 8 are views showing another example of the present invention, and FIG.
FIG. 6 is a plan view showing a bus bar having grooves, FIG. 6 is a plan view showing a state in which a flexible board is attached to ends of two bus bars, and FIG. 7 is a partial perspective view showing a state in which a chip capacitor is attached to the bus bar. FIG. 8 is a perspective view showing a state in which a conventional bus bar is attached to a printed wiring board. 1 ... busbar, 2 ... body consisting of printed circuit board, 4
...... Inner layer pattern as conductive part, 5 ... Through hole, 7 ... Outer layer pattern, 11 ... Printed wiring board, 13,1
5 ... Through hole.

Claims (1)

(57) [Claims] A through-hole (1) in a printed wiring board (11).
A plate-shaped bus bar (1) attached to the printed circuit board (2) for supplying a desired current, the conductive portion (4) being coated with an insulating material and supplying a current; And a current is supplied to the conductive portion (4) through the through hole (5), and an outer layer pattern (7) is formed on both sides of the printed circuit board (2). A busbar mounted on a printed wiring board, wherein the busbar is configured to be grounded.