JP3034355B2 - Laser processing machine - Google Patents

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a laser beam machine for laser-working a workpiece with a laser beam.

[0002]

2. Description of the Related Art In a conventional laser processing machine, for example, a laser processing head is fixed to an upper frame, and a work, for example, in an X direction and a Y direction is fixed below the laser processing head.
There is provided a table device for moving in the direction. A work is set on the upper surface of the table device so as to correspond to the optical axis of the laser processing head at right angles, and the table device is moved while irradiating laser light on the work surface to perform thermal cutting.

In this thermal cutting process, for example, when a square hole is formed at the center and four small holes are formed around the center, the table device is moved to position one corner of the square hole. Thereafter, the table device was moved in one of the X-axis direction and the Y-axis direction to cut the next part. In the following, the outer periphery is cut in accordance with this, and then the positioning is performed four times in the small hole.

[0004]

However, in the above-mentioned conventional laser processing apparatus, the output of the laser beam is constant, and only the processing at the same speed can be performed in the square hole processing and the small hole processing. There is a disadvantage that it takes time.

The present invention has been made in view of the above circumstances, and an object of the present invention is to provide a laser processing machine capable of simultaneously performing a plurality of types of processing and performing processing in a short time.

[0006]

In order to achieve the above-mentioned object, a laser beam machine according to the present invention is provided with a polygonal pyramid-shaped work support so as to be rotatable around an axis. A laser processing device is provided corresponding to each of a plurality of workpiece support surfaces, and the laser processing devices individually process the workpiece.

[0007]

According to the laser processing machine configured as described above, for example, a round hole processing position and a square hole processing position are set corresponding to a plurality of work supporting surfaces, and a laser processing head is provided at each position. A plurality of laser processes are performed while indexing and rotating a work support having a work support surface.

[0008]

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS One embodiment of the present invention will be described below with reference to FIGS.

In FIG. 1 to FIG.
Is a work support base 3 formed in the shape of a polygonal pyramid, a base part 5 having the same shape as the base shape of the work support base 3, and a part of the base part 5 protruding from the work support base. A frame portion 7 formed with the same inclination as the inclined surface formed by the laser beam 3; and a laser processing head movably provided on the frame portion 7 and cutting a work W mounted on the inclined surface of the work support table 3. 9.

The work support 3 is rotatably indexed on the base 5 and a plurality of work clamps (not shown) are provided on each inclined surface of the work support 3 in the vertical direction.
The work W is attached to each of the inclined surfaces of the work support 3 one by one.
It is rotated step by step. At the time of this one-step rotation, processing is performed at the position of the laser processing head 9.

The work support table 3 is a work support surface 11 having one surface formed in an equilateral trapezoidal shape. Each of the work support surfaces 11 is a plane having an equal size area. 11 is composed of a plurality of sheets.

As shown in FIG. 3, when the work support 3 rotates clockwise as shown in FIG. 3, the work support surface 11 is set at a station before the position where the first laser processing head 9 is mounted. ST1, the first laser processing station ST2, the second laser processing station ST3, and the next station are configured as an unloading station ST4.

The work support table 3 is formed in the shape of a truncated pyramid. Although not shown, a rotation shaft is provided at the center, and a motor 13 provided in a base unit 5 described later is It is connected to a rotation transmission mechanism such as a gear, rotated in either clockwise or counterclockwise direction, and is indexed and rotated to correspond to the number of the work support surfaces 11.

A base 5 provided below the work support 3 is a base formed in the same shape as the outer shape of the bottom of the work support 3, and is substantially at the center of the base 5. Has a built-in motor 13 for indexing and rotating the work support 3 and an attached rotation transmitting device. The base portion 5 is provided with a plurality of protrusions 15 having a length that does not come into contact with the work support base 3 even when the work support base 3 rotates. A frame portion 7 is provided which is installed in parallel.

The frame portion 7 is provided on the work support surface 11.
The frame structure is formed by two inclined members 17 erected in parallel with the above, and two connecting members 19 connecting the inclined members 17. The upper part is fixed to a rectangular frame 21 provided on the upper part of the work support table 3. A slightly projecting guide member 23 is provided on the outer end surface of the inclined member 17.
A movable table 25 for movably mounting the laser processing head 9 is movably engaged with the guide member 23.

The movable table 25 is a frame formed so as to be longer than the width of the left and right inclined members 17, and has a groove for engaging with the guide member 23 at both ends in the longitudinal direction. It is movably engaged. A rectangular opening 27 is provided inside the movable base 25, and a guide rail 29 is provided on an inner end surface of the opening 27 in the longitudinal direction. The laser processing head 9 is movably engaged with the guide rail 29, and the laser processing head 9 is moved in the longitudinal direction (X-axis direction) of the movable base 25. The workpiece support surface 11 is moved in the longitudinal direction (Y-axis direction).
Is moved in the X-axis-Y-axis direction.

The movement of the laser processing head 9 in the X-Y direction is not shown, but a pulse motor or the like is attached to a part of the movable table 25 and the housing of the laser processing head 9, respectively. It is positioned at a predetermined position by a signal from the provided control device. The laser oscillator 31 is housed in the protruding portion 15 of the base 5, and a laser beam is sent to the laser processing head 9 by an optical fiber (not shown). Alternatively, although the mechanism is complicated, it is also possible to provide a bent mirror at a plurality of locations and to send it.

The laser processing heads 9 configured as described above are provided at a plurality of locations corresponding to the work support surfaces 11 of the work support table 3, and stations having different time constants of the laser processing heads 9 are provided. Thus, for example, a round hole processing with a large number of positioning times and a square hole processing with a small number of positioning times can be simultaneously processed at different stations.

In the laser processing machine 1 having the above configuration, the first station ST1 on the front side of the station provided with the laser processing head 9 is fixed as a loading station to the work W by a work clamp. The laser beam is sent to the first laser processing station ST2 provided with the laser processing head 9 and, for example, a high-speed round hole processing is performed. At this time, the next work W is fixed by the work clamp in the loading station ST1.

After the completion of the high-speed round hole machining, the work support 3 is rotated by one step, and the low-speed square hole machining is performed at the second laser processing station ST3.
Then, in the first laser processing station ST2, round hole processing is performed at the same time, and in the loading station ST1, the work W is loaded.

In this way, the work W having been subjected to the round hole processing and the square hole processing is transferred to the unloading station ST.
4 and unloaded. In this way,
The processing of the work W that has completed one round of the work support table 3 is completed. Note that this unloading station ST4
May be at the same position as the loading station ST1 from the processing step.

The laser processing machine 1 is generally used with the base 5 placed on a horizontal plane, but it is also possible to operate the laser processing machine 1 by fixing the bottom of the base 5 on a vertical plane. Also, the same operation and effect can be obtained by forming the work support 3 in a polygonal column shape and irradiating each side (work support surface) of the polygonal column with a laser beam from the vertical direction.

The present invention is not limited to the above-described embodiment, but can be implemented in other modes by making appropriate changes.

[0024]

As described above, according to the present invention,
Since the configuration is as described in the claims,
There is an advantage that a function as a laser processing machine capable of performing a plurality of types of processing simultaneously and performing processing in a short time can be provided.

[Brief description of the drawings]

FIG. 1 is a side view of a laser processing machine according to one embodiment of the present invention.

FIG. 2 is a view taken in the direction of the arrow II in FIG.

FIG. 3 is a plan view of FIG. 1;

[Explanation of symbols]

 DESCRIPTION OF SYMBOLS 1 Laser processing machine 3 Work support base 9 Laser processing head 11 Work support surface

Claims (1)

(57) [Claims] 1. A polygonal pyramid-shaped work support is rotatably indexed around an axis, and laser processing devices are provided corresponding to a plurality of work support surfaces of the work support, respectively. A laser processing machine characterized in that a workpiece is individually processed by an apparatus.