JP3033777B2 - Low melting point brazing material - Google Patents
Low melting point brazing materialInfo
- Publication number
- JP3033777B2 JP3033777B2 JP2213391A JP21339190A JP3033777B2 JP 3033777 B2 JP3033777 B2 JP 3033777B2 JP 2213391 A JP2213391 A JP 2213391A JP 21339190 A JP21339190 A JP 21339190A JP 3033777 B2 JP3033777 B2 JP 3033777B2
- Authority
- JP
- Japan
- Prior art keywords
- melting point
- brazing material
- brazing
- low melting
- alloy solder
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
Landscapes
- Ceramic Products (AREA)
- Electric Connection Of Electric Components To Printed Circuits (AREA)
Description
【発明の詳細な説明】 （産業上の利用分野） 本発明は、溶融温度が400〜600℃の低融点ろう材に関
するものである。The present invention relates to a low melting point brazing material having a melting temperature of 400 to 600 ° C.
（従来の技術） 電子部品（例えばICパッケージ）の組立てにおいて、
部品の外回りはAgCu系（Ag−Cu28％またはAg−Cu15％）
ろう材が用いられ、半導体の接合にはAu系の合金ソルダ
ーが用いられている。(Prior art) In the assembly of electronic components (for example, IC packages),
AgCu type (Ag-Cu 28% or Ag-Cu 15%)
A brazing material is used, and an Au-based alloy solder is used for joining semiconductors.
（発明が解決しようとする課題） ところで、Au系の合金ソルダーの融点は300〜400℃で
あり、AgCu系ろう材の融点は650〜850℃である為、組立
上中間の溶融温度範囲のろう材が要望されていたが、こ
の温度を満たす材料は加工性が殆んどなく、所望の形状
を得ることができなかった。即ち電子部品用のろう材と
しては、炉中ろう付けができ、有害なガスの発生のない
ものが用いられているが、この系のろう材を低融点化し
たAgCuIn系やAgCuSn系のろう材はInが15％以上、Snが10
％以上入ると、加工性が劣化し、所望の形状が得られな
かった。(Problems to be Solved by the Invention) Meanwhile, the melting point of the Au-based alloy solder is 300 to 400 ° C. and the melting point of the AgCu-based brazing material is 650 to 850 ° C. Although a material was demanded, a material satisfying this temperature had almost no workability, and a desired shape could not be obtained. In other words, brazing materials that can be brazed in a furnace and do not generate harmful gases are used as brazing materials for electronic components. Is 15% or more for In and 10% for Sn
%, The workability deteriorated and the desired shape could not be obtained.
そこで本発明は、400〜600℃の溶融温度範囲にあって
且つ所望形状のろう材を提供しようとするものである。Therefore, the present invention is to provide a brazing material having a desired shape in a melting temperature range of 400 to 600 ° C.
（課題を解決するための手段） 上記課題を解決するための本発明の低融点ろう材は、
Au系の合金ソルダーが所望の形状に加工されて、その表
面にAg、Cu、Pdを単独又は組み合わせた膜が形成されて
溶融温度が400〜600℃となるステップろう付け用低融点
ろう材からなるものである。(Means for Solving the Problems) The low melting point brazing material of the present invention for solving the above problems is:
Au-based alloy solder is processed into a desired shape, Ag, Cu, Pd alone or in combination film is formed on the surface, melting temperature is 400 ~ 600 ℃ from low melting brazing material for step brazing It becomes.
（作用） 上記構成の低融点ろう材を、300〜400℃のろう付け温
度範囲で溶かすと、Au系の合金ソルダーが溶融すると同
時に表面に形成されているAg、Cu、Pdのいずれか膜又は
これらが組み合わされた膜が拡散、溶融し、ろう材自体
の融点があがり、Au系の合金ソルダーとAgCu系ろう材の
中間の400〜600℃の温度範囲の融点となる。(Function) When the low melting point brazing material having the above configuration is melted in a brazing temperature range of 300 to 400 ° C., any one of Ag, Cu, and Pd films formed on the surface at the same time that the Au-based alloy solder is melted or The film in which these are combined diffuses and melts, and the melting point of the brazing material itself rises, and the melting point is in a temperature range of 400 to 600 ° C., which is intermediate between the Au-based alloy solder and the AgCu-based brazing material.
（実施例） 本発明の低融点ろう材の一実施例と従来例について説
明する。(Example) An example of the low melting point brazing material of the present invention and a conventional example will be described.
先ず一実施例について説明すると、Au系の合金ソルダ
ーとしてAu−Ge9％を用い、厚さ40μｍ、幅2mmのテープ
を作り、その表面にCuを９μｍスパッター法により製膜
した。このろう材の融点を測定した処、液相586℃、固
相370℃であった。First, an example will be described. A tape having a thickness of 40 μm and a width of 2 mm was prepared using Au—Ge 9% as an Au-based alloy solder, and Cu was formed on the surface by a 9 μm sputtering method. The melting point of the brazing material was measured to be 586 ° C. in the liquid phase and 370 ° C. in the solid phase.
然してこのろう材を用い、コバールどうしを620℃で
ろう付けした結果、良好なろう付け状態が得られた。However, as a result of brazing Kovar at 620 ° C. using this brazing material, a good brazing condition was obtained.
次に従来例について説明すると、Ag37％、Cu33％、In
30％の成分組成で液相690℃、固相640℃のろう材を作
り、圧延加工して所望のテープ状のろう材を得ようとし
たが、材料が加工途中で破壊し、テープ状のものが得ら
れなかった。Next, a conventional example will be described. Ag37%, Cu33%, In
A brazing filler metal with a liquid phase of 690 ° C and a solid phase of 640 ° C with a composition of 30% was prepared and rolled to obtain the desired tape-shaped brazing filler metal. I didn't get anything.
またAu81％、Ge9％、Cu10％の成分組成でろう材を作
り、圧延加工を試みたが、加工途中で破壊した。In addition, a brazing material was made with a composition of 81% Au, 9% Ge, and 10% Cu, and rolling was attempted, but was broken during processing.
尚、Au系の合金ソルダーの融点は、低融点ろう材（40
0〜600℃）を得る目的から300〜400℃が好ましい。The melting point of Au-based alloy solder is low melting point brazing material (40
(0 to 600 ° C) is preferably 300 to 400 ° C.
（発明の効果） 以上の通り本発明の低融点ろう材は、Au系の合金ソル
ダーとAgCu系ろう材の中間の400〜600℃の温度範囲の融
点を有するので、該融点でのろう付けは勿論のこと、Ag
Cu系ろう材、本発明の低融点ろう材、Au系の合金ソルダ
ーの３段階の温度範囲でステップろう付けが可能とな
る。従って、高度な電気部品の組立てが容易となる。(Effect of the Invention) As described above, the low melting point brazing material of the present invention has a melting point in the temperature range of 400 to 600 ° C, which is intermediate between the Au alloy solder and the AgCu brazing material. Ag, of course
Step brazing can be performed in three temperature ranges of the Cu brazing material, the low-melting brazing material of the present invention, and the Au-based alloy solder. Therefore, it is easy to assemble advanced electric components.
またAlNのような比較的低温でのろう付けが望ましい
もののろう付けも可能である。Although brazing at a relatively low temperature such as AlN is desirable, brazing is also possible.
Claims (1)
れて、その表面にAg、Cu、Pdを単独又は組み合わせた膜
が形成されて溶融温度が400〜600℃と低融点ステップろ
う付け用低融点ろう材。1. An Au-based alloy solder is processed into a desired shape, and a film of Ag, Cu, or Pd alone or in combination is formed on the surface thereof, and has a melting point of 400 to 600 ° C. and a low melting point brazing. For low melting brazing material.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2213391A JP3033777B2 (en) | 1990-08-10 | 1990-08-10 | Low melting point brazing material |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2213391A JP3033777B2 (en) | 1990-08-10 | 1990-08-10 | Low melting point brazing material |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH0494888A JPH0494888A (en) | 1992-03-26 |
| JP3033777B2 true JP3033777B2 (en) | 2000-04-17 |
Family
ID=16638428
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2213391A Expired - Fee Related JP3033777B2 (en) | 1990-08-10 | 1990-08-10 | Low melting point brazing material |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP3033777B2 (en) |
-
1990
- 1990-08-10 JP JP2213391A patent/JP3033777B2/en not_active Expired - Fee Related
Also Published As
| Publication number | Publication date |
|---|---|
| JPH0494888A (en) | 1992-03-26 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
| LAPS | Cancellation because of no payment of annual fees |