JP3024277B2 - Die bonder head device - Google Patents

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a die bonder head device for performing an operation of moving a component such as a semiconductor IC from one predetermined position to another predetermined position.

[0002]

2. Description of the Related Art A conventional die bonder head device will be described below with reference to the drawings.

FIG. 4A is a perspective view showing a main part of a conventional die bonder head device, and FIG. 4B is an enlarged view of the head portion. As shown in the figure, the tip nozzle portion 1 is connected to a shaft 2 that can slide up and down and can rotate in the horizontal direction, and the whole is mounted on the surface of the head 3. The head 3 is an XY robot 4 shown in FIG.
Is mounted on the X-axis robot 4a. The XY robot 4 moves to the position of the component 5 such as an IC, and the head 3 slides down to suck the component 5, moves up again, and then recognizes the component 5 sucked by the tip nozzle unit 1 with the camera 6. And
By rotating the shaft 2 in the direction of the arrow as shown in FIG. 4B, the angle is corrected, the XY robot 4 moves to the bonding position where the substrate 7 is placed, and the head 3 descends. The component 5 is bonded, and then rises again to complete the bonding operation.

[0004]

However, in the above-mentioned conventional die bonder head device, the horizontality θ ₁ (FIG. 4)
It is necessary to suppress the angle seen from the direction A shown in FIG. 4B and the horizontality θ ₂ (the angle seen from the direction B shown in FIG. 4B) to certain constant values. There have been problems in that strict precision is required for dimensions, a thin plate is inserted in order to correct an assembly error, and there is a case where adjustment must be made while processing the part 5 again.

SUMMARY OF THE INVENTION The present invention solves the above-described problems, and provides a die bonder head device capable of accurately positioning components without requiring strict accuracy in the external dimensions of the components and eliminating assembly adjustment. It is intended to provide.

[0006]

In order to achieve the above object, the present invention provides a nozzle tip for sucking a component such as an IC, a slide mechanism for vertically sliding the nozzle tip, and a nozzle tip. The entire surface of the first plate on which the horizontal rotation mechanism and the slide mechanism are rotated in a plane horizontal to the bonding surface of a component such as an IC, in the X direction perpendicular to the bonding surface with the axis inside the surface as the center. And a second vertical rotation mechanism for rotating the entire surface of the second plate, which fixes all of the slide mechanisms, in the Y direction perpendicular to the bonding surface around a support rod inside the second plate. And a first camera and a second camera for recognizing the horizontality of the nozzle tip from the X direction and the Y direction, and two recognition control units for recognizing the nozzle shape.

[0007]

According to the present invention, therefore, it is possible to suppress the horizontality θ ₁ and the horizontality θ ₂ within a certain fixed value without performing assembly adjustment without requiring strict accuracy requirements for parts. Since the adjustment can be performed automatically, it is possible to prevent the parts such as the IC from floating or tilting beforehand, and the adjustment can be performed automatically when the jig is replaced.

[0008]

An embodiment of the present invention will be described below with reference to the drawings.

FIG. 1A is an enlarged perspective view of a head portion in a die bonder head device according to one embodiment of the present invention, and FIG. 1B is a side view of the head portion. In the figure,
8 is the nozzle tip, 9 is the nozzle tip 8 vertically and IC
A shaft for rotating the surface of the component 10 in the horizontal direction; 11, a slide mechanism including a motor 12 for sliding the shaft 9, a belt 13 and a ball screw 14; Reference numeral 1 denotes a plate, 16 denotes an axis, 17 denotes a sliding groove for regulating rotation of the nozzle tip 8 in the direction of horizontality θ ₁ , 18 denotes a pin, and 19 denotes a pin for driving rotation in the direction of horizontality θ ₁ . Motor 20, ball screw 2
1, a first vertical rotation mechanism comprising a spring 22 and a belt 23; 24, a second plate fixing the first plate 15, the first vertical rotation mechanism 19, etc .; 25, the horizontality θ of the nozzle tip 8
A sliding rod for regulating rotation in _two directions, a support rod 26 as an axis of the sliding rod, a _second rod 27 having a motor 28 for driving rotation in the horizontal direction θ2, a ball screw 29 and a belt 30 This is a vertical rotation mechanism. FIG. 2 is a schematic perspective view of the die bonder head device according to the present embodiment. In the drawings, reference numerals 31 and 32 denote the nozzle tip 8 at the origin position (height, XY).
Direction), the first camera and the second camera respectively having the recognition control units 33 and 34, each of which is previously adjusted so that the horizontality θ ₁ and θ ₂ can be maintained at an accuracy of 1/10 of the adjustment completion angle, respectively. Camera.

Next, the operation of the above configuration will be described.
When the nozzle tip 8 moves to the origin, the first camera 31
Then, it enters the center of the field of view of the second camera 32, recognizes the nozzle shape which is a characteristic of the nozzle tip 8, and adjusts the horizontality of the nozzle tip 8 according to the flowchart shown in FIG. That is, first, the shape of the nozzle tip 8 is captured by the first camera 31 and the second camera 32,
The respective recognition control units 33 and 34 compare the horizontal positions in the θ ₁ and θ ₂ directions stored in advance, respectively, and calculate the shift amount. And correcting the amount of deviation, each comprising a horizontal angle by FIGS. 1 (a) of the horizontal degree theta ₁ direction shown in the first vertical rotation mechanism 19 and the horizontal degree theta ₂ direction second vertical rotating mechanism 27
The horizontal movements θ ₁ and θ ₂ can be suppressed to a certain constant value. Nozzle tip 8 after adjustment
Are the same as those in the above-described conventional example, and a detailed description thereof will be omitted.

In FIG. 1A, reference numeral 35 denotes a horizontal rotation mechanism for rotating the nozzle tip 8 composed of a motor 36 and a belt 37 in a horizontal plane.

As described above, according to this embodiment, the slide mechanism 11, the first vertical rotation mechanism 19, and the second vertical rotation mechanism 27 are provided.
And the horizontal rotation mechanism 35, the first camera 31, the second camera 32, and the recognition controllers 33 and 34, so that the horizontality θ ₁ and θ ₂ of the nozzle tip 8 are automatically adjusted. It is possible to accurately position the component 10 without requiring strict accuracy in the external dimensions of the component 10 and without performing assembly adjustment.

[0013]

As is clear from the above embodiment, according to the present invention, even if a strict outer dimensional accuracy of a part is not required,
Also, the horizontality θ ₁ , θ ₂ at the nozzle tip can be automatically adjusted without adjusting the error due to the accumulation of the assembly.
This has the effect that components such as ICs can be accurately positioned.

[Brief description of the drawings]

FIG. 1A is an enlarged perspective view of a head portion of a die bonder head device according to an embodiment of the present invention. FIG. 1B is a side view of the head portion.

FIG. 2 is a schematic perspective view of a die bonder head device according to one embodiment of the present invention.

FIG. 3 is a flowchart of a recognition control process in the die bonder head device.

FIG. 4A is a schematic perspective view of a conventional die bonder head device. FIG. 4B is an enlarged perspective view of a head portion of the die bonder head device.

[Explanation of symbols]

 Reference Signs List 8 Nozzle tip 10 Parts 11 Slide mechanism 15 First plate 16 Axis 19 First vertical rotation mechanism 24 Second plate 26 Support rod 27 Second vertical rotation mechanism 31 First camera 32 Second camera 33, 34 Recognition control unit 35 Horizontal rotation mechanism

──────────────────────────────────────────────────続 き Continuation of the front page (56) References JP-A-2-113600 (JP, A) JP-A-3-141700 (JP, A) JP-A-3-203399 (JP, A) JP-A-4- 45598 (JP, A) JP-A-4-97600 (JP, A) JP-A-4-275835 (JP, A) (58) Fields investigated (Int. Cl. ⁷ , DB name) H05K 13/04

Claims (1)

(57) [Claims] 1. A nozzle tip for adsorbing a component such as an IC, a slide mechanism for sliding the nozzle tip up and down, and the nozzle tip in a plane horizontal to a bonding surface of the component such as an IC. And a horizontal rotating mechanism for rotating the first plate to which the slide mechanism is fixed.
A first vertical rotation mechanism for rotating in a direction (one direction) and a whole surface of a second plate, which fixes all the slide mechanisms, with respect to a bonding surface centered on a support rod inside the surface.
A second vertical rotation mechanism for rotating in a direction (a direction orthogonal to the vertical X direction), a first camera and a second camera for recognizing the horizontality of the nozzle tip from the X direction and the Y direction, and a nozzle shape Die bonder head device having two recognition control units for recognizing a mark.