JP2998226B2 - Thick film circuit drawing equipment - Google Patents

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a thick film circuit drawing apparatus for forming a thick film circuit on a substrate constituting an electronic circuit or the like.

[0002]

2. Description of the Related Art A conventional thick film circuit drawing apparatus will be described below.

[0005] As shown in FIG. 5, a substrate setting unit 5 a holds a substrate 6 a, and measures the height of the substrate 6 a by a substrate height measuring unit 2. The substrate setting part 5b also holds the substrate 6b in the same manner, and forms a thick film circuit on the substrate 6b by the drawing nozzle 4. The measuring unit 2 and the drawing nozzle 4 are fixed by the bracket 3, and the measuring unit 2 and the drawing nozzle 4 are fixed to the substrate setting unit 5a.
And 5b are relatively the same respectively.
The application of the thick film circuit on the substrate 6b and the measurement of the substrate height on the substrate 6a are performed simultaneously. The bracket 3 can be moved by a motor 7 in a direction indicated by an arrow a and by the robot 1 in a direction indicated by arrows X and Y.

[0004]

However, when the above-mentioned substrate on the conventional substrate measuring portion for measuring height is transferred to the substrate defining portion for drawing, the substrate is tilted due to the transfer. There was a problem that the height of the substrate on the setting part was different from the value of the height of the substrate measured by the measuring part.

The present invention solves the above-mentioned conventional problems, and corrects a change in substrate height that occurs when a substrate is transferred, thereby maintaining a constant distance between the drawing nozzle and the substrate and stabilizing the distance. The first is to provide a thick film circuit drawing apparatus capable of drawing.
The purpose of.

It is a second object of the present invention to provide a thick film circuit drawing apparatus capable of inspecting whether or not a substrate is correctly regulated and whether or not the substrate itself is damaged or bent.

[0007]

In order to achieve the first object, a thick film circuit drawing apparatus according to the present invention draws a thick film circuit on two or more substrate standardizing portions for holding a mounting substrate. A measuring unit that measures the distance to the board on the drawing nozzle to be mounted and another mounting board, and fixes both to the bracket and moves them relative to each other, and a length measurement sensor that measures the height of each board It has a configuration including a substrate tilt correction calculation unit that corrects the measurement result and feeds it back to the head unit of the drawing nozzle.

In order to achieve the second object, the thick film circuit drawing apparatus of the present invention has a structure in which a substrate state inspection unit is added to a substrate inclination correction operation unit in addition to the structure for achieving the first object. Have.

[0009]

According to this configuration, the fluctuation of the substrate height caused when the substrate is transferred is corrected. In addition, the normal state of the substrate and the state of the substrate itself are inspected.

[0010]

An embodiment of the present invention will be described below with reference to the drawings.

In FIGS. 1 and 3 showing one embodiment of the present invention, the same parts as those of the conventional example are denoted by the same reference numerals and the description thereof will be omitted.

(Embodiment 1) The measuring unit 2 for drawing the substrate height and the drawing nozzle 4 are fixed via a bracket 10, and the measuring unit 2 and the drawing nozzle 4 are relatively positioned with respect to the substrate setting units 5a and 5b, respectively. The application of the thick film circuit on the substrate 6b and the measurement of the substrate height on the substrate 6a are performed at the same time as in the conventional example, except that the drawing nozzle 4 is This configuration allows correction in the height direction. Although not shown, the configuration in which the bracket 10 is moved by a motor and a robot is the same as that of the conventional example.

The substrates 6a and 6 of the substrate setting portions 5a and 5b
The height of the head unit 11 is adjusted by measurement data sent from four length measuring sensors (for example, optical micros manufactured by Anritsu) 8 arranged so that the substrate height at each of the four corners b can be measured by laser light. And a substrate inclination correction calculation unit 9 for performing the correction.

Reference numeral 12 denotes a transport unit for the substrate setting units 5a and 5b. As shown in FIG. 2, the substrate inclination correction calculation unit 9 calculates the difference between the equations of the two planes of the substrate 6a and the substrate 6b, and adds or subtracts the length measurement value of each point drawn by the drawing head at the time of drawing.

In this embodiment, the length measuring sensors 8 are provided at the four corners on the substrate. However, by increasing the length measuring points, the tilt state of the substrate can be measured more accurately. Further, it is not necessary to limit the board setting portions 5a and 5b to each one. In addition, the object to be measured on the substrate setting units 5a and 5b is not limited to the substrates 6a and 6b, and operations other than drawing can be applied to the substrate setting unit 5b.

As described above, according to this embodiment, by providing the means for maintaining the distance between the nozzle and the substrate at a constant value, the fluctuation of the substrate height which occurs when the substrate is transferred is corrected and drawn. The condition is stable, the variation in line width and film thickness is small,
A precise and fine circuit pattern can be formed,
The quality of the electronic circuit can be greatly improved.

(Embodiment 2) Hereinafter, a second embodiment of the present invention will be described with reference to the drawings.

As shown in FIG. 3, the configuration of the first embodiment differs from that of FIG. 1 in that the board state inspection section 1 which performs the board state inspection function before performing the correction operation by the board inclination correction operation section 9.
3 is added. FIG. 4 shows an example of a specific calculation / inspection algorithm for the board state inspection unit 13. In the present embodiment, the example in the board setting unit 5 is shown, but the present invention can be applied to other setting units and stages. Further, if the number of measurement points other than the measurement points A, B, C, and D is increased, the number of plane equations increases, and more accurate inspection can be performed. In addition, numerical values such as 5 (μm) and 3 (the third time) of the criterion in FIG. 4 can be freely set according to the purpose of use.

According to this embodiment, before correcting the height of the substrate, it can be inspected whether the substrate is correctly set and whether the substrate itself is damaged or bent, and so on. It is possible to reduce the number of failures that cannot be performed.

[0020]

As described above, according to the present invention, there are provided two or more board defining portions for holding a mounting board, a drawing nozzle for drawing a thick film circuit on the mounting board, and a distance between the mounting board and another mounting board. A measurement unit that measures the height of the substrate is fixed, and both are fixed to the bracket and moved relative to each other.The measurement result of the length measurement sensor that measures the height of each substrate is corrected and fed back to the head of the drawing nozzle. With the configuration provided with a board tilt correction calculation unit, or the configuration in which a board state inspection unit is added to the board correction calculation unit, the fluctuation of the board height that occurs when the board is transferred is corrected to draw the drawing nozzle and the mounting board. Realizes an excellent thick film circuit drawing device that can maintain stable spacing by keeping the distance between the substrate and the substrate constant, and can check whether the substrate is correctly regulated and whether the substrate itself is damaged or bent. You can do it.

[Brief description of the drawings]

FIG. 1 is a schematic perspective view showing the concept of the configuration of a thick film circuit drawing apparatus according to a first embodiment of the present invention.

FIG. 2 is a calculation algorithm according to the first embodiment;

FIG. 3 is a schematic perspective view showing the concept of the configuration of a thick film circuit drawing apparatus according to a second embodiment of the present invention.

FIG. 4 is a calculation and inspection algorithm according to a second embodiment;

FIG. 5 is a schematic perspective view showing the concept of the configuration of a conventional thick film circuit drawing apparatus.

[Explanation of symbols]

 2 Measuring unit 4 Drawing nozzle 5a, 5b Board setting unit 6a, 6b Mounting board 8 Length measuring sensor 9 Board tilt correction calculation unit 10 Bracket 11 Head unit 13 Board state inspection unit

──────────────────────────────────────────────────の Continued on the front page (72) Inventor Satoshi Shida 1006 Kazuma Kadoma, Kadoma City, Osaka Prefecture Inside Matsushita Electric Industrial Co., Ltd. In-company (56) References JP-A 64-2391 (JP, A) JP-A-1-308093 (JP, A) JP-A 63-87867 (JP, U) (58) Fields investigated (Int. . ^7, DB name) H05K 3/10 B41F 17/36

Claims (2)

(57) [Claims] 1. A method according to claim 1, further comprising: two or more board setting sections for holding the mounting board; a drawing nozzle for drawing a thick film circuit on the mounting board; and a measuring section for measuring a distance to the mounting board on another mounting board. Arranged, a device that fixes the drawing nozzle and the measurement unit to the bracket and relatively moves together, and corrects and calculates the measurement result of the length measurement sensor that measures the height of each mounting board,
A thick film circuit drawing apparatus comprising a substrate tilt correction operation unit that feeds back to a head unit of the drawing nozzle. 2. The thick film circuit drawing apparatus according to claim 1, wherein a substrate state inspection unit is added to the substrate inclination correction operation unit.