JP2992647B2 - Method for producing electroformed product having through-hole - Google Patents

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a method for producing an electroformed product having a through hole.

[0002]

2. Description of the Related Art Examples of this type of electroformed product include various meshes such as a mesh for precision screen printing, an electric razor blade, and other various nozzles. These electroformed products, especially relatively thick (for example, 15
In the production of an electroformed product having a through hole having a diameter of 0 to 200 μm, in many cases, for example, as shown in FIG. A negative type photoresist 4 is superposed in a plurality of layers on the surface of the casting mold 3, and a film 5 having a pattern (network pattern) corresponding to the through-holes of the electroformed product is brought into close contact with the photoresist 4. By baking and developing, a photoresist film 6 is formed as shown in FIG. Then, as shown in FIG. 5C, a metal 7 is electrodeposited on the surface of the electroformed mold 3 which is not covered with the photoresist film 6, and thereafter,
As shown in FIG. 5D, the electrodeposited metal 7 is
Then, the photoresist film 6 is removed to obtain an electroformed product having the through holes 2.

[0003] The cross-sectional shape of the through hole 2 thus obtained tends to be inverted trapezoidal. This is because light rays (ultraviolet rays) are absorbed exponentially by stacking the photoresist film 6 with two or three layers, and as a result, almost no light rays reach the position of the electroformed mold 3. Probable cause. Such a tendency of inverted trapezoid becomes more remarkable as a photoresist having a smaller light transmittance is used.

[0004]

However, the through-hole 2 having an inverted trapezoidal cross section is provided with a uniform flow of the ink in a uniform flow with high accuracy with respect to the object to be ejected, such as a nozzle for an ink jet printer. Not suitable for objects that need to be erupted.

SUMMARY OF THE INVENTION Accordingly, an object of the present invention is to provide a manufacturing method capable of obtaining an electroformed product having a through-hole having an optimum sectional shape for a nozzle for an ink jet printer and the like.

[0006]

According to the present invention, as illustrated in FIG. 1, a photoresist film 6 having a pattern (pattern) corresponding to a through hole of an electroformed product is formed on the surface of an electroformed mold 3. Forming a metal layer 7 on the surface of the electroforming mold 3 that is not covered with the photoresist film 6 to a thickness of the photoresist film 6
A step of electrodeposition up to, and the surface remains in conductive Chakukinzoku 7 in a state in which with a photoresist film 6 electroforming mother die 3 is etched, high current near the photoresist film 6 of electrodeposited metal 7
A step of Ru is locally corroded concentrated density portion, after etching, the electrodeposition metal 7 was peeled off from the electroformed mold 3, after the step of removing the photoresist film 6, the cross-sectional shape is included funnel derivative This is to obtain an electroformed product having a through hole 2 formed so as to communicate with a thin pipe-like outlet portion 2b on the narrow diameter outlet side of the portion 2a.

[0007]

By depositing the metal 7 on the surface of the electroformed mold 3 not covered with the photoresist film 6, the pipe-shaped outlet 2b can be formed at a position corresponding to the photoresist film 6. . At this time, as shown in FIG.
Is performed in a straight line as shown in FIG.
In addition to the straight electrodeposition, the electrodeposition is also performed by wrapping around the surface of the photoresist film 6 as shown by an arrow n in FIG. 7a (dendritic growth phenomenon) occurs.

The high current density portion on the surface of the electrodeposited metal 7 is liable to be corroded intensively by etching in the next step. It can be formed in communication with the conduit outlet 2b. At the time of this etching, an etching photoresist is not required.

[0009]

According to the present invention, it is possible to obtain a cross-sectional shape of the through hole 2 of the electroformed product in which the duct-like outlet portion 2b communicates with the narrow-diameter outlet side of the funnel-like guiding portion 2a. Since the fluid such as ink drawn in by the funnel-like drawing part 2a can be jetted out in a uniform flow in the area of the pipe-like outlet part 2b, the cross-section reverse without the pipe-like outlet part 2a. Compared to conventional electroformed products with trapezoidal through-holes, nozzles, especially those that need to jet ink, etc., uniformly and precisely to the jetting target, such as nozzles for ink jet printers, or Advantageously, it is possible to easily manufacture an electroformed product suitable for a material similar to, for example, a CRT shadow mask.

[0010]

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS One embodiment of a method for manufacturing an electroformed product according to the present invention will be described with reference to FIGS. FIG. 2 shows a nozzle for an ink jet printer which is an example of the electroformed product, and has a rectangular thin flat nozzle body 1 (80 μm).
(Thickness). As shown in FIG. 3, the cross-sectional shape of the through-hole 2 is composed of a funnel-shaped guiding portion 2a and a thin channel-like outlet portion 2b formed in communication with the small-diameter outlet side of the funnel-shaped guiding portion 2a. have.

An electroformed product having the through-hole 2 having such a sectional shape is manufactured through the following steps. First, as shown in FIG. 1A, a plurality of (four in the illustrated example) negative-type film-shaped photoresists 4 are superposed on the surface of an electroformed mother mold 3 made of stainless steel. Form a uniform thick film. As the photoresist 4, it is preferable to use a photoresist having a large light transmittance, for example, Nichigo ALPHO-321Y50 (trade name, manufactured by Nippon Synthetic Chemical Industry Co., Ltd.).

Next, as shown in FIG. 1B, a film 5 having a pattern (pattern) corresponding to the through hole of the electroformed product is brought into close contact with the photoresist 4 and baked by irradiating an ultraviolet lamp. After performing development and drying processes, FIG.
As shown in (C) of FIG.
Thickness). Since the photoresist film 6 uses the photoresist 4 having a high light transmittance, the photoresist film 6 can be formed almost vertically, and has excellent adhesion to the surface of the electroformed mold 3.

Next, the electroforming mold 3 is transferred to an electroforming tank such as a nickel sulfamate bath and electroformed with nickel or a nickel-cobalt alloy, as shown in FIG. Metal 7 is electrodeposited on the surface of the mold 3 not covered with the photoresist film 6 to a thickness of the photoresist film 6. At this time, in the vicinity of the photoresist film 6 on the surface of the electrodeposited metal 7, in addition to the straight electrodeposition indicated by the arrow m,
Electrodeposition is also performed by wrapping around the surface of the photoresist film 6 as shown by the arrow n, so that a dendritic growth phenomenon occurs at the location, and a thickened portion 7a having a high current density is generated.

Next, as shown in FIG. 1E, the surfaces of the electrodeposited metal 7 and the photoresist film 6 are polished to a uniform thickness (150 μm). This polishing step can be omitted.

Next, the whole was immersed or spray-etched in a corrosive solution such as ferric chloride to obtain a solution shown in FIG.
(F), the surface of the electrodeposited metal 7 is chemically corroded. At this time, in the high current density portion near the photoresist film 6 on the surface of the electrodeposited metal 7, the portion concentrates and locally corrodes to form a funnel. The etching depth and diameter are adjusted by the etching time.

After the etching, the electrodeposited metal 7 and the photoresist film 6 are peeled off from the electroforming mold 3 and immersed in a sodium hydroxide peeling bath or the like to remove the photoresist film 6 (FIG. 1). G) and an electroformed product 9 having a through hole 2 having a funnel-shaped guiding portion 2a and a narrow conduit-like outlet portion 2b as shown in FIG.

In the above embodiment, a film-like resist is used as the photoresist 4 formed on the surface of the electroformed mold 3, but instead, a liquid photoresist is sequentially applied to a plurality of layers and dried. A thick photoresist film 6 can also be formed.

FIG. 4 is a process explanatory view of a manufacturing process showing another embodiment. In this embodiment, the cross-sectional shape of the through hole 2 is different from that of the above embodiment, and the pipe-like outlet portion 2b is formed in parallel in the above embodiment, whereas in this embodiment, it is shown in FIG. The difference is that they are tapered. The through-hole 2 having such a cross-sectional shape is manufactured as follows. First, on the surface of the electroformed mold 3, a plurality of layers of a photoresist 4 having a small light transmittance, for example, Nippon Synthetic Chemical Industry Co., Ltd. product name: Nichigo ALPHO-1150MY or Nichigo ALPHO-111Y50. Next, as shown in FIG. 1B of the above embodiment, a film 5 having a pattern corresponding to the through-hole of the electroformed product is brought into close contact with the photoresist 4 of the uppermost layer, baked by ultraviolet irradiation, and developed. Are performed to form a photoresist film 6 as shown in FIG. Since the photoresist film 6 uses only the photoresist 4 having a small light transmittance, it is difficult for light rays to reach the surface of the electroformed mold 3, and as a result, the cross-sectional shape of the photoresist film 6 is formed into an inverted trapezoid. be able to. After the photoresist film 6 having the inverted trapezoidal cross section is formed in this manner, the metal 7 is electrodeposited on the surface of the electroformed mold 3 not covered with the photoresist film 6 as in the above embodiment ( Next, the surfaces of the electrodeposited metal 7 and the photoresist film 6 are polished (FIG. 4B).
(C)), and then the surface of the electrodeposited metal 7 is etched (FIG. 4D). Finally, the electrodeposited metal 7 is peeled from the electroformed mold 3 and the photoresist film 6 is removed. Thus, as shown in FIG. 4 (E), it is possible to obtain an electroformed product 9 having the through-hole 2 which forms the tapered pipe-like outlet 2b in communication with the funnel-like inlet 2a.

[Brief description of the drawings]

FIG. 1 is a process explanatory view of a manufacturing process.

FIG. 2 is a perspective view of an electroformed product.

FIG. 3 is an enlarged sectional view of a through-hole portion of an electroformed product.

FIG. 4 is a process explanatory view of a manufacturing process showing another embodiment.

FIG. 5 is an explanatory diagram of a process in a process of manufacturing a conventional electroformed product.

[Explanation of symbols]

 DESCRIPTION OF SYMBOLS 2 Through-hole 2a Funnel-shaped guiding part 2b Pipe-shaped outlet part 3 Electroforming mold 4 Photoresist 6 Photoresist film 7 Electrodeposited metal 9 Electroforming product

Continuation of the front page (72) Inventor Yoshihiro Kobayashi 4680 Ikata, Fukuoka, Tagawa-gun, Fukuoka Prefecture Kyushu Hitachi Maxell Co., Ltd. (Int.Cl. ⁶ , DB name) C25D 1/00-7/12

Claims (1)

(57) [Claims] 1. A step of forming a photoresist film 6 having a pattern corresponding to a through hole of an electroformed product on the surface of an electroformed mold 3; a step of electrodepositing until the metal 7 to about the thickness of the photoresist film 6 on the free surface, the surface remains in conductive Chakukinzoku 7 in a state in which with a photoresist film 6 electroforming mother die 3 is etched, electrostatic Of the metal 7
High current density near the photoresist film 6
A step of Ru corrode, after etching, the electrodeposition metal 7 was peeled off from the electroformed mold 3, characterized in that it consists of a step of removing the photoresist film 6, the production of electroforming products having a through hole Method.