JP2988038B2 - Electronic component mounting method - Google Patents

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a method for mounting an electronic component having lead wires into an insertion hole of a substrate automatically.

[0002]

2. Description of the Related Art A conventional electronic component mounting method will be described below. As shown in FIG. 2, the lead wire 2 of the electronic component 1 inserted into the insertion hole 4 of the substrate 3 is cut and formed by a cutter blade 5 and a cutter blade 6 which are rocked by a lever 7 of the electronic component fixing device. . At this time, as shown in FIG. 3, the lead wire 2 is detected by the insertion detecting device 9 provided in the electronic component fixing device.
It is determined whether or not the insertion operation has been normally performed based on a signal detected by the sensor 8 when a reaction force generated at the time of cutting or forming is performed.

Recently, in order to shorten the insertion cycle time, the process of supplying the electronic component 1 and the process of inserting the electronic component 1 are operated in parallel, and as shown in FIG. When the electronic component 1 is mounted in the first insertion hole 4, only the supply operation of the electronic component 1 is performed, and the insertion operation of the electronic component 1 and the fixing operation of the electronic component 1 are idle operations without the electronic component 1. The device 9 considers that the lead wire 2 has been cut and formed, and the electronic component fixing device performs the mounting operation of the next electronic component 1.

[0004]

However, according to the above-mentioned conventional method, even when a foreign substance is caught in the electronic component fixing device or an adjustment error of the electronic component fixing device occurs, the insertion detecting device 9 always operates. There has been a problem that it is determined that cutting and molding have been performed, and that the insertion operation is erroneously determined to be successful even though the insertion operation has failed.

SUMMARY OF THE INVENTION The present invention solves the above-mentioned conventional problems. An electronic component mounting method capable of confirming that the electronic component fixing device and the insertion detecting device are operating normally and performing a highly reliable insertion operation is provided. The purpose is to provide.

[0006]

To SUMMARY OF THE INVENTION To achieve this object, the electronic component mounting method of the present invention, a supplying step of supplying an electronic component having a lead wire to a predetermined position, said supplied to the predetermined position an insertion step of inserting the lead wire of the electronic part into the insertion hole of the board, inserted cutting the lead wire to the substrate, forming to consist attaching step of fixing the electronic component on the substrate, in the insertion step Of electronic components
With no insert a lead wire insertion hole of the substrate, activating the insertion detection device for determining the cutting of the lead wire provided in the mounting process, whether the molding is performed by one sensor
And the insertion detection device is
That the insertion detector operates normally
And determines that said supplying step, the inserting step and
This is a method of repeating the mounting step.

[0007]

According to this method, it is confirmed that the electronic component fixing device and the insertion detecting device are operating normally.

[0008]

An embodiment of the present invention will be described below with reference to the drawings.

The electronic component fixing apparatus of the electronic component mounting method according to one embodiment of the present invention is the same as the electronic component fixing apparatus of the conventional electronic component mounting method described with reference to FIG.

As shown in FIG. 1, since the insertion cycle is shortened and the electronic component supply step and the insertion step are performed in parallel, the first insertion operation when the insertion into the substrate 3 is started is actually an electronic operation. Insert the lead wire 2 of the component 1 into the insertion hole 4
This is an idle operation that is not inserted into Since the sensor 8 does not generate a normal insertion signal due to the idle operation, the insertion inspection device 9 determines that the electronic component 1 has not been inserted. If a normal insertion signal is generated from the sensor 8 regardless of the idle operation, or if the insertion inspection device 9 determines that the insertion has been performed, the insertion operation is stopped. This is to prevent erroneous determination that the insertion operation is normal even when the subsequent insertion operation fails.

When there is no normal insertion signal from the sensor 8 at the time of the first idle operation, and the insertion inspection device 9 determines that there is no insertion, the operation proceeds to the next insertion operation and the insertion operation of the electronic component 1 is actually repeated. It will be.

As described above, according to the present embodiment, the cutting and shaping of the lead wire 2 provided in the mounting step of fixing the lead wire 2 of the electronic component 1 to the board 3 in the insertion hole 4 of the board 3 are performed. The insertion inspection device 9 for judging whether or not the board 3 has been operated properly is checked while the supply step, the insertion step, and the mounting step are repeated.
Since the insertion process is performed for each insertion hole 4 while confirming whether the insertion detection device 9 is operating normally, it is erroneously determined that the insertion operation was successful despite the failure of the insertion operation. Therefore, the occurrence of a defective board can be prevented, and a highly reliable mounting method can be achieved.

In this embodiment, an example in which the supply operation and the insertion operation of the electronic component 1 are operated in parallel has been described. However, when the electronic component 1 is operated only by the electronic component fixing device without inserting the electronic component 1, the sensor is operated. The insertion detection device 9 may be configured so as to be able to confirm the determination that the insertion has not been performed while the signal of the normal insertion is not output from the signal 8.

In one embodiment of the present invention, one substrate 3
Although an example of one confirmation operation has been described above, the electronic component fixing device may be operated without inserting the electronic component 1 and the confirmation operation may be performed for each of the insertion holes 4.

[0015]

As is apparent from the above description of the embodiment, the present invention provides a supply step of supplying an electronic component having a lead wire to a predetermined position, and a method of supplying the electronic component lead wire supplied to the predetermined position to a substrate. And a mounting step of cutting and shaping the lead wire inserted into the board and fixing the electronic component to the board. The lead wire provided in the mounting step is cut and shaped. The electronic component fixing device and the insertion detection device are operating normally by a method of repeating the supply process, the insertion process, and the mounting process while confirming whether the insertion detection device that determines whether or not the operation is normal is performed. Thus, it is possible to realize an excellent electronic component mounting method capable of performing a reliable insertion operation.

[Brief description of the drawings]

FIG. 1 is a flowchart of an electronic component mounting method according to an embodiment of the present invention.

FIG. 2 is a side view of a main part of an electronic component fixing device according to one embodiment of the present invention and a conventional example and an electronic component inserted into a substrate.

FIG. 3 is a flowchart of a conventional electronic component mounting method.

FIG. 4 is a flowchart of another conventional electronic component mounting method.

[Explanation of symbols]

 DESCRIPTION OF SYMBOLS 1 Electronic component 2 Lead wire 4 Insertion hole 8 Sensor 9 Insertion detection device

──────────────────────────────────────────────────続 き Continued on the front page (72) Inventor Toshio Yano 1006 Kazuma Kadoma, Kadoma, Osaka Prefecture Matsushita Electric Industrial Co., Ltd. (56) References JP-A-2-268499 (JP, A) JP-A-63- 224400 (JP, A) Japanese Utility Model 2-57035 (JP, U) (58) Field surveyed (Int. Cl. ⁶ , DB name) H05K 13/00-13/04 H05K 13/08

Claims (1)

(57) [Claims] 1. A supply step of supplying an electronic component having a lead wire to a predetermined position, an insertion step of inserting a lead wire of the electronic component supplied to the predetermined position into an insertion hole of a substrate, and inserting the electronic component into the substrate. by cutting the lead wire, it from the mounting step of fixing the electronic component on the substrate by molding
In the inserting step, the lead wire of the electronic component is
In a state where the lead wire is not inserted into the insertion hole, it is determined whether or not the cutting and molding of the lead wire provided in the mounting process have been performed .
Activate the insertion detection device that determines with the sensor, and
Check that the lead wire is not inserted correctly
To determine that the insertion detection device is operating normally
And an electronic component mounting method in which the supplying step, the inserting step, and the mounting step are repeated.