JP2982578B2 - Coverlay film punching blade type - Google Patents

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a coverlay film punching blade die for forming a through hole functioning as a terminal outlet in a coverlay film used for manufacturing a flexible circuit board.

[0002]

2. Description of the Related Art Conventionally, a flexible circuit board [Flexible Pri.
nted Circuit: FPC] is manufactured as follows. That is, first, as shown in FIG. 4, a metal foil C functioning as a circuit pattern is formed on a base film B by using a pattern forming method such as etching or die stamping. And FIG.
A coverlay film D having a predetermined pattern of through-holes d formed thereon and a thermosetting or thermoplastic adhesive applied thereto is prepared, and is superimposed on the base film B on which the metal foil C is formed. Combined and pressed by a hot press P (FIG. 6). Finally, as shown in FIG. 7, a predetermined flexible circuit board A is completed by cutting a predetermined position.

In the flexible circuit board A manufactured as described above, a through hole d is formed in a part of the coverlay film D.
Is formed, and a part of the metal foil C is exposed through the through hole d. That is, the through hole d of the cover lay film D functions as a terminal outlet.

In view of the above, conventionally, a press method using a flat blade mold 50 in which a punching blade 52 having a shape corresponding to the shape of the through hole d is projected on a flat base 51 as shown in FIG. 9, a rotary blade mold 60 having a cylindrical shaft 61 provided with a punching blade 62.
The punching process of the through-hole d into the coverlay film D by the roll-to-roll method using the method is performed.

[0005]

By the way, when the through hole d is punched by using the blade dies 50 and 60 as described above,
Punched chips having a shape corresponding to the through holes d are formed. However, if static electricity or the like is generated in the cover lay film D, the punched chips may adhere to the cover lay film D. Further, the punching process may not be performed completely due to wear of the punching blades 52 and 62, play, etc., and punching waste may remain on the coverlay film D.

[0006] When the coverlay film D from which the punching waste is not completely removed is used for manufacturing the flexible circuit board A, the flexible circuit board A cannot be manufactured stably. A defect occurs in which no mouth is formed and electrical connection with a circuit cannot be obtained.

[0007] Further, the punched waste remaining on the cover lay film D is scattered around the cover lay film manufacturing apparatus.
This causes problems such as the need for cleaning.

Accordingly, an object of the present invention is to provide a cover lay film capable of reliably removing and collecting punched chips generated when forming a through-hole in a cover lay film without scattering it to the surroundings. It is to provide a punching blade mold.

[0009]

In order to solve the above-mentioned problems, this coverlay film punching blade die is anvillo type.
Coverlay film between the cover
For forming through holes in the lay film.
In addition, a suction port for sucking air inside is formed at an end of the hollow blade-shaped main body, and a cover is provided around the outer periphery of the blade-shaped main body.
-A substantially annular punch for forming through holes in lay film
A cutting blade is formed so as to protrude and is inside the punching blade of the blade mold body.
A is the even suction hole for sucking the chippings in the cutting die body is <br/> formed.

[0010]

In the cover lay film punching blade die configured as described above, when the air in the blade die body is suctioned from the suction port when the through-hole is formed in the cover lay film, the punching blade can cover the cover lay film. The punching waste generated when punching the lay film is sucked and removed from the suction hole into the blade body, and is not scattered around.

[0011]

Embodiments will be described below with reference to the drawings. As shown in FIG. 3, the cover lay film manufacturing apparatus generally has a film supply unit 10, a hole forming unit 20, and a film collection unit 30 arranged in this order along the transport path of the cover lay film D. .

In the film supply unit 10, the coverlay film D which has not been subjected to the punching process is wound up in a roll shape, and is sent out toward the hole forming unit 20 along the transport path. I have.

The hole forming section 20 is composed of a rotary type coverlay film punching blade die 21 and an anvil roll 21a opposed to the coverlay film punching blade die 21. The cover lay film D sent out of the cover lay is sandwiched between them, so that a through hole of a predetermined pattern is punched in the cover lay film D.

Then, the cover lay film D, from which the through-holes have been punched out, is wound into a roll at the film collecting section 30 and collected, and then used for manufacturing a flexible circuit board.

As shown in FIG. 1, the cover lay film punching blade die 21 is formed by using a bolt 27 to connect disk members 24a and 24b having shafts 26a and hollow shafts 26b at both ends of a hollow cylindrical body 23, respectively. It comprises an attached blade-type main body 22 and a punching blade 28 protruding from the outer peripheral surface of the tubular body 23.

The blade-shaped main body 22 is rotatable about a rotation axis extending through the shaft 26a and the hollow shaft 26b, and is rotated by a driving source connected to the shaft 26a. In addition, the disk member 2
4b has a hole (suction) corresponding to the inner diameter of the hollow shaft 26b.
A suction port 25b is formed, and the inside of the cylindrical body 23 is made to have a negative pressure by a suction unit such as a vacuum pump connected to the hollow shaft 26b.

The punching blade 28 is a substantially annular blade for punching a through hole as a terminal outlet in the cover lay film D. The punching blade 28 is formed to project by shaving the outer periphery of the cylindrical body 23 by milling or the like. ing.

Further, the cylindrical body 23 is formed with a suction hole 29 opened along the inner surface of the punching blade 28, and punching dust generated when the coverlay film D is punched by the punching blade 28 is formed. Is drawn through the suction hole 29 into the cylindrical body 23 at a negative pressure, and is sucked and collected by the suction unit via the hollow shaft 26b.

Therefore, the punching waste generated in the hole forming section 20 is reliably removed, and the scattering of the punching waste around the apparatus can be prevented.

In the above embodiment, the rotary type coverlay film punching blade type was described.
The present invention is not limited to this. For a flat type coverlay film punching blade type, the same effect can be obtained by forming a suction port by hollowing the blade type body and forming a suction hole for punching debris inside the punching blade. Can be obtained.

[0021]

As described above, in the cover lay film punching blade die of the present invention, the blade die body is hollow and the suction port is provided, and the punching blade suction hole is formed inside the punching blade. When the suction unit is connected to the blade mold body to suction air, the cutting waste generated when the punching blade punches the coverlay film is removed by suction into the blade mold body. Punching waste can be reliably removed and collected without scattering.

Further, since the punching die is provided with a punching dust collecting function as described above, there is no need to provide a separate punching dust removing section in the coverlay film manufacturing apparatus, and the manufacturing cost of the apparatus itself can be reduced. In addition, when the design is changed, it is only necessary to recreate only the blade dies, so that the manufacturing cost of the FPC or the like can be reduced.

[Brief description of the drawings]

FIG. 1 is an exploded perspective view showing an embodiment according to the present invention.

FIG. 2 is a sectional view taken along the line X-X 'of FIG.

FIG. 3 is a schematic diagram of a cover lay film manufacturing apparatus using the same cover lay film punching blade.

FIG. 4 is a view showing a method of manufacturing a flexible circuit board as a background of the present invention.

FIG. 5 is a perspective view showing a coverlay film on which a through hole functioning as a terminal outlet is formed.

FIG. 6 is a view showing a method of manufacturing a flexible circuit board as a background of the present invention.

FIG. 7 is a diagram showing a method of manufacturing a flexible circuit board as a background of the present invention.

FIG. 8 is a perspective view showing a flat blade mold.

FIG. 9 is a perspective view showing a rotary blade mold.

[Explanation of symbols]

 DESCRIPTION OF SYMBOLS 10 Film supply part 20 Hole formation part 21 Cover lay film punching blade type 22 Blade type main body 23 Cylindrical body 24a, 24b Disk member 26a Shaft 26b Hollow shaft 28 Punching blade 29 Suction hole 30 Film collection part

Claims (1)

(57) [Claims] 1. A cover lay fiber between an anvil roll.
A through hole in the coverlay film
And a suction opening for sucking the internal air is formed at an end of a hollow blade-type main body, and a cover layer is formed on an outer periphery of the blade-type main body.
Substantially annular punching blade for forming through holes in film
There are protruded, the inside of the punching blade of the blade-type body, a cover lay film punching blade type suction holes are formed for sucking the punched debris in the blade-type body.