JP2970969B2 - Epoxy resin composition - Google Patents

Description

DETAILED DESCRIPTION OF THE INVENTION

The present invention relates to an epoxy resin composition. More specifically, the present invention particularly relates to an epoxy resin composition having excellent heat resistance, moisture resistance, toughness, flexibility, and crack resistance. Since the epoxy resin composition of the present invention has such excellent properties as described above, it can be used in various fields, in particular, a resin for multilayer lamination, a conductive paste, an electronic element protective film, an adhesive, a paint, and a sealing material. And in the field of molding materials.

[0002]

2. Description of the Related Art In recent years, miniaturization, high performance, and high performance of electronic devices, electric devices, transportation equipment, and the like have been advanced, and accordingly, materials having excellent heat resistance and moisture resistance have been desired. A polyimide resin is generally known as a heat-resistant resin. However, since it is a dehydration-condensation type, voids are easily generated in a cured product due to condensation water generated by the reaction, and the reliability of the cured product is lowered. On the other hand, polyimide itself is insoluble and infusible, and is difficult to mold.

A bismaleimide resin is known as a polyimide having improved moldability, but molding requires a temperature of 200 ° C. or higher, resulting in poor workability. Further, the bismaleimide resin has poor hydrophobicity, and significantly reduces the reliability of the cured product. In an epoxy resin having good moldability, an acid anhydride, phenol, or the like is usually used as a curing agent, but all cured products are somewhat poor in heat resistance. For example, the glass transition temperature of an epoxy / phenol cured system is typically 140-170C.

[0004]

SUMMARY OF THE INVENTION An object of the present invention is to solve the above-mentioned drawbacks of the prior art, in other words, it can be advantageously used in various fields.
An object of the present invention is to provide an epoxy resin composition having excellent heat resistance, moisture resistance, flexibility, and crack resistance.

[0005]

The epoxy resin composition of the present invention comprises an epoxy resin 100 having a naphthalene skeleton.
Part, and the following formula (I):

[0006]

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[0007] 30 to 120 parts of polyallylphenol having a plurality of structural units of allylphenol represented by the following formula in the repeating unit. Furthermore, the epoxy resin composition of the present invention comprises 100 parts of an epoxy resin having a naphthalene skeleton, the following formula (I):

[0008]

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It comprises 30 to 120 parts of a polyallylphenol having a plurality of structural units of the allylphenol represented by the following formula in the repeating unit, and 5 to 80 parts of a flexibility imparting agent. That is, the object of the present invention is achieved by providing an epoxy resin composition in which a predetermined amount of polyallylphenol is mixed as a curing agent into an epoxy resin having a naphthalene skeleton, or as the third component in the composition. This is achieved by providing an epoxy resin composition containing a predetermined amount of a flexibility-imparting agent.

In the composition of the present invention, the epoxy resin having a naphthalene skeleton used as a base resin is, for example, of the following formula IV:

[0011]

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(Where R ₁ , R ₂ , R ₃ , R ₄ , R ₅ ,
R ₆ may be the same or different and each represents a hydrogen atom, a halogen atom or an alkyl group having 1 to 4 carbon atoms, and n represents 0 to 10. Provided that at least one of R _{1 to} R ₆ is a halogen atom or an alkyl group having 1 to 4 carbon atoms) or the following formula V:

[0013]

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(Wherein n is 2 or 3). These epoxy resins are described in JP-A-61-73719, JP-A-1-268712, and JP-A-1-268715.
It is obtained by reacting epichlorohydrin with dihydroxynaphthalene or trihydroxynaphthalene. As dihydroxynaphthalene, for example, the following formula VI:

[0015]

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Or

[0017]

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(Where R ₁ , R ₂ , R ₃ , R ₄ , R ₅ ,
R ₆ may be the same or different and each represents a hydrogen atom, a halogen atom or an alkyl group having 1 to 4 carbon atoms. However, at least one of R _{1 to} R ₆ is a halogen atom or an alkyl group having 1 to 4 carbon atoms. ). The trihydroxy compound is represented by the following formula VI
I:

[0019]

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Is a compound represented by the formula: The base resin in the present invention has a naphthalene skeleton, so that the heat resistance and the hydrophobicity of the cured product have been widely used in the past. Bisphenol A type epoxy resin, cresol novolak type epoxy resin, and phenol novolak type epoxy resin cured product It can be improved as compared with, for example. Also,
As the structure, any epoxy resin having a naphthalene skeleton can be applied to the composition of the present invention, whether it is a bifunctional type or a polyfunctional type represented by a novolak structure.

The use of polyallylphenol as a curing agent further improves the hydrophobicity of the cured product due to the presence of an allyl group, and also contributes to the improvement of toughness by producing flexibility. Further, when an elastomer is usually added to impart flexibility, the moisture resistance of the cured product tends to decrease, but the decrease in moisture resistance can be suppressed by the allyl group in polyallylphenol.

Such a polyallylphenol has the following formula I:

[0023]

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A compound having a plurality of structural units of allylphenol represented by the following formula in the repeating unit. For example, the following formula II:

[0025]

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(N is an integer of 1 to 5) or a compound of the following formula III:

[0027]

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Is a compound represented by the formula: Such polyallyl phenol is contained in the composition in an epoxy resin 100
30 to 120 parts by weight per part. If the amount is less than 30 parts, the effect of addition will not be exhibited, and if the amount exceeds 120 parts, phase separation or the like will occur, and properties such as heat resistance and wetness will deteriorate. In the composition of the present invention, flexibility can be imparted to the cured product by using polyallylphenol as a curing agent as described above, but if it is still insufficient, the following flexibility is imparted as necessary. Agents can also be added. As a flexibility imparting agent, for example, natural rubber, isoprene rubber, styrene-butadiene rubber, butadiene rubber, butyl rubber, ethylene-propylene rubber, chloroprene rubber, acrylonitrile butanediene rubber, hydrogenated nitrile rubber, silicone rubber, acrylic rubber, epichlorohydrin rubber Rubber such as fluorinated rubber, chlorosulfonated polyethylene, chlorinated polyethylene, polyether-based special rubber, styrene-based thermoplastic elastomer having styrene-butadiene-styrene structure, short-chain glycol and diisocyanate A urethane-based thermoplastic elastomer obtained by polyaddition using a long-chain polyol as a soft phase, polybutylene terephthalate as a hard phase and a long-chain polyol or polyester as a soft phase are obtained by polycondensation. Block polymer type thermoplastic elastomers such as ester thermoplastic elastomers, furthermore, olefinic thermoplastic elastomers centered on blends of polypropylene and ethylene-propylene rubber, 1,2-polybutadiene thermoplastic elastomers, and further silicone-modified epoxies Resins. Particularly preferred flexibility-imparting agents are polystyrene / polybutadiene / polystyrene end-block copolymer, ethylene / propylene-based terpolymer, ethylene / α-olefin copolymer, epoxy-containing silicone rubber powder, and silicone-modified epoxy resin. Or butadiene acrylonitrile copolymer.

The butadiene acrylonitrile copolymer is
For example,

[0030]

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[0031] Is a copolymer represented by The above-mentioned flexibility imparting agents can have various structures. In fact, it is commercially available in various forms. For example, polystyrene / polybutadiene / polystyrene end block copolymer is Kraton G-1652 (Shell Chemical), ethylene propylene rubber is JSR 57P (Japan Synthetic Rubber), and ethylene / α-olefin copolymer is Tuffmer PP. −0
280 (Mitsui Petrochemical), a silicone rubber powder containing an epoxy group as a functional group is Trefil E601 (Dow Corning Toray), a silicon-modified epoxy resin is SIN-620 (Dainippon Ink and Chemical), butadiene acrylonitrile. The copolymer is CTBN
1008 (Ube Industries, Ltd.).

In any case, it is desirable to add 5 to 80 parts to 100 parts of the epoxy resin which is the main component in the epoxy resin composition. If the amount is less than 5 parts, the effect of addition does not appear, and if it exceeds 80 parts, the heat resistance decreases. The composition of the present invention may further contain an inorganic filler, for example, to increase the mechanical strength. As the inorganic filler, for example, powdered substances such as fused silica, crystalline silica, alumina, and calcium carbonate are preferably used.
The amount of these additives is preferably in the range of 30 to 95 parts of the whole composition. The reason for this is that if the amount of the inorganic filler is less than 30 parts, the effect of addition is not exhibited. If the amount is more than 95 parts, the flowability is reduced, and the workability may be reduced.

The following components can be added to the composition of the present invention as needed. (1) A curing accelerator for accelerating a curing reaction between an epoxy resin, a curing agent, and a curing assistant. As the curing accelerator, an imidazole type such as 2-methylimidazole, a phosphine type such as triphenylphosphine, and a DBU (diazabicycloundecene) type such as a phenol salt of DBU are used. (2) When an inorganic filler is added: a coupling agent for improving compatibility with a resin. For example, a silane coupling agent such as 3-aminopropyltriethoxysilane or a titanium coupling agent such as tetraoctylbis (phosphite) titanate is used. The amount of coupling agent added depends on the type, amount,
In the present invention, it is preferably 0.1 to 15 parts, although it depends on the specific surface area and the minimum covering area of the coupling agent. (3) Carnauba wax, stearic acid and its metal salt, montan wax, etc. may be added as a difficult-to-mold agent. (4) Colorants, pigments, flame retardants, flame retardant aids such as titanium dioxide, carbon black, brominated epoxy resins, and antimony trioxide are used.

The resin composition of the present invention can be prepared by heating the above-mentioned components at a temperature of about 60 to 120 ° C. using a means such as a roll, kneader, extruder or the like. In the present invention, after-curing after molding is preferably performed in order to complete the curing reaction of the uncured epoxy resin or the like in the cured product. After-curing after the forming process may be heat-treated for a predetermined time in a constant temperature layer at a temperature substantially equal to the temperature at the time of the forming process.

[0035]

The epoxy resin composition according to the present invention uses an epoxy resin containing a naphthalene skeleton as a base resin,
A polyallylphenol is added as a curing agent, and a polystyrene / polybutadiene / polystyrene end block copolymer, an ethylene / propylene-based rubber, an ethylene / α-olefin copolymer, and a functional group containing an epoxy group are used as a flexibility-imparting agent. The addition of silicone rubber powder, a specific silicone-modified epoxy resin, and butadiene acrylonitrile copolymer, which effectively improves the heat resistance, moisture resistance, toughness, flexibility, and crack resistance of the cured product can do. Further, by adding the inorganic filler, the mechanical strength is also improved.

Hereinafter, the present invention will be further described with reference to Examples and Comparative Examples, but it goes without saying that the present invention is not limited to these Examples.

[0037]

EXAMPLES Examples 1 to 5 and Comparative Examples 1 to 3 In this example, the following raw materials were used. (1) Epoxy resin having a naphthalene skeleton EPICLON EXA-4300 (an epoxy resin obtained by co-shrinking cresol and β-naphthol at a ratio of 1: 1) Dainippon Ink Co., Ltd. (2) Polyallylphenol (polyallylphenol of the above formula II, n = 1 to 4) (Hereinafter, this polyallylphenol is used in all Examples) (3) Epoxy resin Cresol novolak type epoxy resin Nippon Kayaku EO
The compositions shown in the CN-1025 Examples and Comparative Examples were prepared by kneading the raw materials together in a pressure kneader. The preparation of the test piece was performed as follows.

First, the composition obtained by kneading was converted into a powder having an 8-mesh pass, and the powder was transferred to a press mold and compression-molded at 200 ° C. and 80 kg / cm ^{2 for} 20 minutes. After-cure under the following conditions. The properties of the composition thus obtained were evaluated as follows. Glass transition temperature Thermomechanical analyzer (Vacuum Science and Technology)
Flexural strength according to JIS K6911 Bending elasticity according to JIS K6911 Water absorption According to JIS K6911 Table 1 shows the results.

[0039]

[Table 1]

By using an epoxy resin having a naphthalene skeleton as the base resin and polyallylphenol as the curing agent, it is possible to obtain a resin composition having excellent heat resistance, moisture resistance and toughness, as is clear from Table 1. it can. The amount of polyallylphenol added was 10
It is understood that 30 to 120 parts by weight is better than 0 part by weight. Examples 6 to 10 and Comparative Examples 4 and 5 In this example, the following raw materials were used.

Epoxy resin having a naphthalene skeleton EPICLON EXA-4300 Dainippon Ink Co., Ltd. Polyallylphenol polystyrene / polybutadiene / polystyrene end block copolymer Kraton G-1652 (manufactured by Shell Chemical) Compositions shown in Examples and Comparative Examples The material was prepared by kneading the raw materials together in a pressure kneader. The preparation of the test piece was performed as follows.

First, the composition obtained by kneading was converted into a powder having an 8-mesh pass, the powder was transferred to a press mold, and compression-molded at 200 ° C. and 80 kg / cm ^{2 for} 20 minutes. After-cure under the following conditions. The properties of the composition thus obtained were evaluated as follows. Glass transition temperature Measured by thermomechanical analyzer (Vacuum Science and Technology) Bending strength According to JIS K6911.

Bending elasticity According to JIS K6911. Water absorption According to JIS K6911. Moisture resistance (pressure cooker test) (PCT) (125
(° C./2.3 atm). (Measure the resistance between the aluminum electrodes in the device).

In FIG. 1, reference numeral 1 denotes a whole line, 2 denotes a lead,
Is an aluminum electrode. Circuit width / circuit interval 10 μm / 10
μm. Package crack 84-pin QFP is molded and 121
C./100% RH / 24 h After moisture absorption treatment, the occurrence of cracks when immersed in solder at 260.degree. C. is examined.

The results are shown in Table 2 and FIG.

[0046]

[Table 2]

As is clear from Table 2, polystyrene /
By adding the butadiene / polystyrene end block copolymer, the flexibility of the cured product is improved, and the amount added is 5%.
2 to 80 parts. As is apparent from FIG. 2, by using polyallylphenol as a curing agent, a resin composition having excellent hydrophobicity can be obtained. In addition, an epoxy resin composition having good curability can be obtained by adding polyphenol.

In FIG. 2, the defect rate is a parameter of 10
Of the 0 elements, an element having at least one defective circuit is regarded as defective,
This is the occurrence rate (%) of the defective element (hereinafter the same). Examples 11 to 15 and Comparative Examples 6 and 7 In this example, the following raw materials were used. Epoxy resin having a naphthalene skeleton EPICLON EXA-4300 Dainippon Ink Co., Ltd. Polyallylphenol ethylene / propylene-based ternary copolymer JSR 57P (manufactured by Nippon Synthetic Rubber Co., Ltd.) It was prepared by kneading together with a pressure kneader. The preparation of the test piece was performed as follows.

First, the composition obtained by kneading was converted into a powder having an 8-mesh pass, the powder was transferred to a press die, and compression-molded at 200 ° C. and 80 kg / cm ^{2 for} 20 minutes. After-cure under the following conditions. The properties of the composition thus obtained were evaluated as follows. Glass transition temperature Measured by thermomechanical analyzer (Vacuum Science and Technology) Bending strength According to JIS K6911.

Flexural elasticity According to JIS K6911. Water absorption According to JIS K6911. Moisture resistance PC using aluminum wiring simulation element
Failure after T (125 ° C./2.3 atm) treatment was evaluated. Package crack 84-pin QFP is molded and 121
After the moisture absorption treatment at 24 ° C. for 24 hours, the occurrence of cracks when immersed in solder at 260 ° C. is examined.

The results are shown in Table 3 and FIG.

[0052]

[Table 3]

As apparent from Table 3, the addition of the ethylene / propylene ternary copolymer improves the flexibility of the cured product, and the addition amount is preferably 5 to 80 parts. As described above, by using polyallylphenol as a curing agent, a resin composition having excellent hydrophobicity can be obtained. In addition, an epoxy resin composition having good curability can be obtained by adding polyphenol. Examples 16 to 21 and Comparative Examples 8 to 9 In this example, the following raw materials were used.

Epoxy resin having a naphthalene skeleton EPICLON EXA-4300 Dainippon Ink Co., Ltd. Polyallylphenol ethylene / α-olefin copolymer Tuffmer P P-0280 (manufactured by Mitsui Petrochemical) Compositions shown in Examples and Comparative Examples The material was prepared by kneading the raw materials together in a pressure kneader. The preparation of the test piece was performed as follows.

First, the composition obtained by kneading was converted into an 8-mesh pass powder, this powder was transferred to a press mold, and compression-molded at 200 ° C. and 80 kg / cm ^{2 for} 20 minutes. After-cure under the following conditions. The properties of the composition thus obtained were evaluated as follows. Glass transition temperature Measured by thermomechanical analyzer (Vacuum Science and Technology) Bending strength Flexural elasticity according to JIS K6911 Water absorption rate according to JIS K6911 Moisture resistance according to JIS K6911 PC using aluminum wiring simulated element
Failure after T (125 ° C./2.3 atm) treatment was evaluated.

Package Crack An 84-pin QFP was molded, subjected to a moisture absorption treatment at 121 ° C./24 h, and then examined for cracks when immersed in solder at 260 ° C. The results are shown in Table 4 and FIG.

[0057]

[Table 4]

As is clear from Table 4, ethylene / α-
By adding the olefin copolymer, the flexibility of the cured product is improved, and the addition amount is preferably from 5 to 80 parts. As is apparent from FIG. 4, by using polyallylphenol as a curing agent, it becomes hydrophobic. An excellent resin composition can be obtained. Examples 21 to 25 and Comparative Examples 10 to 11 In this example, the following raw materials were used.

Epoxy resin having a naphthalene skeleton EPICLON EXA-4300 Dainippon Ink Co., Ltd. Polyallylphenol Epoxy group-containing silicone powder Trefil E-601 (Toray Dow Corning) The compositions shown in the Examples and Comparative Examples are obtained by using raw materials. It was prepared by kneading together with a pressure kneader. The preparation of the test piece was performed as follows.

First, the composition obtained by kneading was converted into an 8-mesh pass powder. The powder was transferred to a press mold, and compression-molded at 200 ° C. and 80 kg / cm ^{2 for} 20 minutes. After-cure under the following conditions. The properties of the composition thus obtained were evaluated as follows. Glass transition temperature Measured by thermomechanical analyzer (Vacuum Science and Technology) Bending strength Flexural elasticity according to JIS K6911 Water absorption rate according to JIS K6911 Moisture resistance according to JIS K6911 PC using aluminum wiring simulated element
Evaluation of defects after T (125 ° C./2.3 atm) treatment Package crack Formed 84-pin QFP, 121
After the moisture absorption treatment at 24 ° C. for 24 hours, the occurrence of cracks when immersed in solder at 260 ° C. is examined.

The results are shown in Table 5 and FIG.

[0062]

[Table 5]

As is clear from Table 5, the addition of the epoxy group-containing silicone powder improves the flexibility of the cured product, and the addition amount is preferably 5 to 80 parts. As is clear from FIG. By using polyallylphenol as the above, a resin composition having excellent hydrophobicity can be obtained. In addition, an epoxy resin composition having good curability can be obtained by adding polyphenol. Examples 26 to 30, Comparative Examples 12 to 13 In this example, the following raw materials were used.

Epoxy resin having a naphthalene skeleton EPICLON EXA-4300 Dainippon Ink Co., Ltd. Polyallylphenol silicon-modified epoxy resin SIN-260 Dainippon Ink and Chemicals Co., Ltd. It was prepared by kneading together with a pressure kneader. The preparation of the test piece was performed as follows.

First, the composition obtained by kneading was converted into a powder having an 8-mesh pass, and the powder was transferred to a press mold and subjected to compression molding at 200 ° C. and 80 kg / cm ^{2 for} 20 minutes. After-cure under the following conditions. The properties of the composition thus obtained were evaluated as follows. Glass transition temperature Measured by thermomechanical analyzer (Vacuum Science and Technology) Bending strength Flexural elasticity according to JIS K6911 Water absorption rate according to JIS K6911 Moisture resistance according to JIS K6911 PC using aluminum wiring simulated element
Failure after T (125 ° C./2.3 atm) treatment was evaluated.

The results are shown in Table 6 and FIG.

[0067]

[Table 6]

As is clear from Table 6, the addition of the silicon-modified epoxy resin improves the toughness and flexibility of the cured product. The addition amount is preferably 5 to 80 parts, and as shown in FIG. By using polyallylphenol as the agent, a resin composition having excellent hydrophobicity can be obtained. Examples 31 to 35 and Comparative Examples 14 to 15 In this example, the following raw materials were used.

Epoxy resin having a naphthalene skeleton EPICLON EXA-4300 Dainippon Ink Co., Ltd. Polyallylphenol butadiene acrylonitrile copolymer CTBN 1008 Ube Industries, Ltd. The compositions shown in Examples and Comparative Examples are obtained by mixing raw materials together. It is prepared by kneading with a pressure kneader. The preparation of the test piece was performed as follows.

First, the composition obtained by kneading was converted into a powder having an 8-mesh pass, and the powder was transferred to a press mold and compression-molded at 200 ° C. and 80 kg / cm ^{2 for} 20 minutes. After-cure under the following conditions. The properties of the composition thus obtained were evaluated as follows. Glass transition temperature Measured by thermomechanical analyzer (Vacuum Science and Technology) Bending strength Flexural elasticity according to JIS K6911 Water absorption rate according to JIS K6911 Moisture resistance according to JIS K6911 PC using aluminum wiring simulated element
Failure after T (125 ° C./2.3 atm) treatment was evaluated.

The results are shown in Table 7 and FIG.

[0072]

[Table 7]

As is clear from Table 7, the addition of the butadiene acrylonitrile copolymer improves the flexibility of the cured product. The addition amount is preferably from 5 to 80 parts, and as is clear from FIG. By using polyallylphenol as the above, a resin composition having excellent hydrophobicity can be obtained. Examples 36 to 40 and Comparative Examples 16 to 17 In this example, the following raw materials were used.

Epoxy resin having a naphthalene skeleton EPICLON EXA-4300 Dainippon Ink Co., Ltd. Polyallyl phenol Inorganic filler (silica) RD-8 (manufactured by Tatsumori) The compositions shown in Examples and Comparative Examples are based on raw materials. It was prepared by kneading together with a pressure kneader. The preparation of the test piece was performed as follows.

First, the composition obtained by kneading was converted into a powder having an 8-mesh pass, and the powder was transferred to a press mold and compression-molded at 200 ° C. and 80 kg / cm ^{2 for} 20 minutes. After-cure under the following conditions. The properties of the composition thus obtained were evaluated as follows. Glass transition temperature Measured by thermomechanical analyzer (Vacuum Science and Technology) Bending strength Bending elasticity according to JIS K6911 Water absorption according to JIS K6911 Moisture resistance Moisture resistance according to JIS K6911 PCT (125 ° C / 2. (3 atm) Evaluate defects after processing Package crack 84-pin QFP is molded and 121
After the moisture absorption treatment at 24 ° C. for 24 hours, the occurrence of cracks when immersed in solder at 260 ° C. is examined.

Viscosity The results obtained by the flow tester method are shown in Table 8 and FIG.

[0077]

[Table 8]

As is evident from Table 8, the mechanical strength of the cured product was improved by adding an inorganic filler, and the added amount was preferably 20 to 85%. As is clear from FIG. By using allylphenol, a resin composition having excellent hydrophobicity can be obtained.

[0079]

As described above, the present invention is constituted by adding an epoxy resin containing a naphthalene skeleton as a base resin, a specific polyallylphenol as a curing agent, and further adding a specific flexibility imparting agent. Therefore, it has an effect of obtaining a resin composition having excellent heat resistance, moisture resistance, toughness, flexibility, and crack resistance. Further, by adding an inorganic filler, a resin composition having excellent mechanical strength can be obtained.

[Brief description of the drawings]

FIG. 1 is a structural diagram of an aluminum wiring simulating device used for evaluating the wettability of the composition of the present invention.

FIG. 2 is a graph showing a relationship between a PCT time (h) and a defect rate (%).

FIG. 3 is a graph showing a relationship between a PCT time (h) and a defect rate (%).

FIG. 4 is a graph showing a relationship between a PCT time (h) and a defect rate (%).

FIG. 5 is a graph showing a relationship between a PCT time (h) and a defect rate (%).

FIG. 6 is a graph showing a relationship between a PCT time (h) and a defect rate (%).

FIG. 7 is a graph showing a relationship between a PCT time (h) and a defect rate (%).

FIG. 8 is a graph showing a relationship between a PCT time (h) and a defect rate (%).

[Explanation of symbols]

 1: full wire 2: lead 3: aluminum electrode

 ──────────────────────────────────────────────────続 き Continued on the front page (72) Inventor Shigeaki Yagi 1015 Uedanaka, Nakahara-ku, Kawasaki City, Kanagawa Prefecture Inside Fujitsu Limited (72) Inventor Norio Saruwatari 1015 Kamikodanaka, Nakahara-ku, Kawasaki City, Kanagawa Prefecture Fujitsu Limited ( 56) References JP-A-4-23824 (JP, A) JP-A-61-73719 (JP, A) JP-A-1-268712 (JP, A) JP-A-1-268715 (JP, A) JP-A-4-50223 (JP, A) JP-A-4-96929 (JP, A)

Claims (9)

(57) [Claims] 1. An epoxy resin 1 having a naphthalene skeleton
00 parts, and the following formula I: A polyallylphenol having a plurality of structural units of an allylphenol represented by the following formula in a repeating unit:
An epoxy resin composition comprising a part. 2. The polyallylphenol has the following formula II: Wherein n is an integer of 1 to 5 or a polyallylphenol represented by the following formula III: The epoxy resin composition according to claim 1, which is a polyallylphenol represented by the following formula: 3. An epoxy resin having a naphthalene skeleton is represented by the following formula IV: (Wherein, R ₁ , R ₂ , R ₃ , R ₄ , R ₅ , and R ₆ may be the same or different and each represent a hydrogen atom, a halogen atom, or an alkyl group having 1 to 4 carbon atoms; Is 0
Represents 10. However, at least one of R _{1 to} R ₆ is a halogen atom or an alkyl group having 1 to 4 carbon atoms. Or an epoxy resin represented by the following formula V: The epoxy resin composition according to claim 1, which is an epoxy resin represented by the formula: wherein n is 2 or 3. 4. The epoxy resin composition according to claim 1, further comprising an inorganic filler in an amount of 30 to 85% by weight of the whole epoxy resin composition. 5. An epoxy resin 1 having a naphthalene skeleton
00 parts, the following formula (I): A polyallylphenol having a plurality of structural units of an allylphenol represented by the following formula in a repeating unit:
The epoxy resin composition according to claim 1, which comprises 5 parts to 80 parts of a flexibility imparting agent. 6. The polyallylphenol having the following formula II: Wherein n is an integer from 1 to 5, or a polyallylphenol represented by the following formula III: The epoxy resin composition according to claim 5, which is a polyallylphenol represented by the following formula: 7. An epoxy resin having a naphthalene skeleton is represented by the following formula IV: (Wherein, R ₁ , R ₂ , R ₃ , R ₄ , R ₅ , and R ₆ may be the same or different and each represent a hydrogen atom, a halogen atom, or an alkyl group having 1 to 4 carbon atoms; Is 0
Represents 10. However, at least one of R _{1 to} R ₆ is a halogen atom or an alkyl group having 1 to 4 carbon atoms. Or an epoxy resin represented by the following formula V: The epoxy resin composition according to claim 1, which is an epoxy resin represented by the formula: wherein n is 2 or 3. 8. The epoxy resin composition according to claim 5, further comprising an inorganic filler in an amount of 30 to 85% by weight of the entire epoxy resin composition. 9. The flexibility-imparting agent is a polystyrene / polybutadiene / polystyrene end-block copolymer, an ethylene / propylene-based ternary copolymer, an ethylene / α-olefin copolymer, an epoxy group-containing silicone rubber powder, or silicone. The epoxy resin composition according to claim 5, which is a modified epoxy resin or a butadiene acrylonitrile copolymer.