JP2967795B2 - Semiconductor manufacturing equipment - Google Patents

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a semiconductor device having an air-conditioning airflow separation rectifying plate used for separating an air-conditioning airflow of a semiconductor manufacturing apparatus including a chemical processing apparatus from a chemical spray atmosphere.
It relates to a manufacturing device .

[0002]

2. Description of the Related Art A conventional semiconductor manufacturing apparatus will be described with reference to FIG.

[0003] 1 is an air-conditioning airflow separation plate, 2 is a chemical solution treatment device,
3 is an air conditioner with a device, 4 is a chemical treatment tank, and 5 is an exhaust port.

The operation of the semiconductor manufacturing apparatus configured as described above will be described below.

[0005] First, the inside of the chemical treatment device 2 separated from the external air-conditioning airflow by the air-conditioning airflow separation plate 1 is exposed to the chemical spraying atmosphere generated by the chemical treatment tank 4 wound up by the airflow of the air conditioner 3 with the device. It has become.

By discharging the chemical spray atmosphere from the exhaust port 5 to the outside of the chemical processing apparatus 2, the concentration of the chemical spray atmosphere is reduced.

[0007]

However, in the above-mentioned conventional configuration, the exhaust amount is adjusted with the air conditioner with the device in a state where the front surface of the device is closed by the air-conditioning airflow separating plate. The air flow inside the chemical treatment device may be disturbed at the time of transfer of the chemical treatment product between the tanks, which may cause a worker to inhale the chemical spray atmosphere. And had problems such as corrosion.

The present invention solves the above-mentioned conventional problems, and always separates the air-conditioning airflow from the chemical spraying atmosphere, so that the inside of the chemical processing apparatus can be taken in and out of the chemical processing product and when the chemical processing product moves between tanks. Semiconductor manufacturing equipment that solves the danger of workers sucking in a chemical spray atmosphere without disturbing the airflow of the semiconductor , and the drawbacks such as the mechanism for automatic movement of chemical processing products between tanks being attacked and corroded by the chemical spray atmosphere. The purpose is to provide.

[0009]

SUMMARY OF THE INVENTION In order to solve the above-mentioned problems, the present invention is directed to a chemical solution processing apparatus, in which a top surface of a chemical liquid processing apparatus is moved from a top plate to an upper part thereof.
And a chemical treatment tank provided with an opening.
Is provided above and descends with respect to the chemical processing apparatus.
An air conditioner for providing an air flow;
To discharge the chemical spray generated from the chemical processing tank.
Air vent, and provided so as to protrude upward with respect to the device top plate.
The air flow from the air conditioner and the chemical from the chemical treatment tank.
Semiconductor consisting of air-conditioning airflow separation rectifying plate that separates from spray
The manufacturing apparatus, wherein the air-conditioning airflow separation rectifying plate includes the chemical liquid.
In order to surround the open upper part of the processing tank,
An open side of the chemical solution treatment tank, which is provided on the top plate of the device
The semiconductor manufacturing apparatus is provided at an angle .

[0010]

According to the above construction, the air-conditioning airflow of the semiconductor manufacturing apparatus including the chemical processing apparatus can be separated from the chemical spraying atmosphere without closing the apparatus at the front of the apparatus. In addition, there is no risk of disturbing the air flow inside the chemical solution treatment equipment when taking in and out the chemical solution and moving the chemical solution between tanks. Can be solved by the mechanism for automatic movement between tanks being attacked by the chemical spray atmosphere and corroded.

[0011]

FIG. 1 shows an embodiment of the present invention.

FIGS. 1A and 1B are a side view and a perspective view, respectively, showing an air-conditioning / airflow separation / rectification device of a semiconductor manufacturing apparatus according to the present invention.

In FIG. 1, reference numeral 2 denotes a chemical processing apparatus, 3 denotes an air conditioner, 4 denotes a chemical processing tank, 5 denotes an exhaust port, and 6 denotes an air-conditioning airflow separation rectifying plate.

First, the airflow of the air conditioner 3 on the chemical processing unit 2 flows down uniformly into the chemical processing tank 4.

The exhaust port 5 adjusts the exhaust amount with the front surface of the apparatus open. The air-conditioning airflow separation and rectification plate 6 is installed on the chemical processing unit 2 so as to surround the chemical processing tank 4, and separates the airflow of the air conditioner 3 into the front side of the chemical processing unit 2 and the exhaust port 5 side.

The chemical spray generated from the chemical treatment tank 4 is wound up by the airflow of the air conditioner 3, but is interrupted by the air conditioning airflow separation rectifying plate 6 in the airflow of the air conditioner 3 separated to the front side of the chemical treatment apparatus 2. Further, the air is separated from the air conditioner 3 by the air-conditioning air flow separating and rectifying plate 6 and exhausted by the air flow of the air conditioner 3.

As described above, according to the present embodiment, the air-conditioning air flow and the chemical spray are always provided by installing the air-conditioning air flow separating and rectifying plate 6 of the semiconductor manufacturing apparatus on the chemical processing apparatus 2 so as to surround the chemical processing tank 4. It is possible to separate the atmosphere from the atmosphere to prevent the risk of the worker inhaling the chemical spray atmosphere without disturbing the air flow inside the chemical processing equipment during the loading / unloading operation of the chemical processing product or the movement of the chemical processing product between tanks. The mechanism for automatic movement between tanks is attacked by a chemical spray atmosphere and corrodes.

In the embodiment, the air-conditioning airflow separating and rectifying plate 6 of the semiconductor manufacturing apparatus is installed on the chemical processing unit 2 so as to surround the chemical processing tank 4. If it has an angle that separates it from the atmosphere,
It goes without saying that the shape, size and position may be changed.

[0019]

As described above, according to the present invention, the air-conditioning air flow of the semiconductor manufacturing apparatus and the chemical spraying atmosphere are closed at the front of the apparatus by installing the air-conditioning air flow separating and rectifying plate in the semiconductor manufacturing apparatus including the chemical liquid processing apparatus. It is possible to separate the air-conditioning system without the need for air-conditioning, and even if the exhaust volume is adjusted with the air conditioner equipped with the device, the air flow in the chemical solution treatment device may be disturbed when taking in and out the chemical product and moving the chemical product between tanks. In addition, it is possible to solve the problem that the operator may inhale the chemical spraying atmosphere and the mechanism for automatic movement of the chemical processing material between tanks is corroded and corroded by the chemical spraying atmosphere.

[Brief description of the drawings]

FIG. 1 is a configuration diagram of a semiconductor manufacturing apparatus according to an embodiment of the present invention.

FIG. 2 is a configuration diagram of a conventional semiconductor manufacturing apparatus .

[Explanation of symbols]

 DESCRIPTION OF SYMBOLS 1 Air-conditioning air flow separation plate 2 Chemical processing unit 3 Air conditioner 4 Chemical processing tank 5 Exhaust port 6 Air-conditioning air flow separation rectification plate

──────────────────────────────────────────────────続 き Continued on the front page (58) Field surveyed (Int. Cl. ⁶ , DB name) H01L 21/02 F24F 9/00 B01L 1/00

Claims (1)

(57) [Claims] 1. An apparatus top plate on an upper surface of a chemical solution processing apparatus.
A chemical treatment tank provided with an open top, and the chemical treatment
Provided above the device and lowered with respect to the chemical processing device
An air conditioner for providing a flowing air flow, and an air conditioner provided in the chemical processing apparatus.
Exhausting the chemical spray generated from the chemical treatment tank
An exhaust port, which is provided to protrude upward with respect to the device top plate;
The air flow from the air conditioner and the chemical from the chemical treatment tank.
Semiconductor consisting of air-conditioning airflow separation rectifying plate that separates from spray
The manufacturing apparatus, wherein the air-conditioning airflow separation rectifying plate includes the chemical liquid.
In order to surround the open upper part of the processing tank,
An open side of the chemical solution treatment tank, which is provided on the top plate of the device
Semiconductor manufacturing characterized by being provided at an angle
apparatus.