JP2956761B2 - Capillary contact state detection device - Google Patents
Capillary contact state detection deviceInfo
- Publication number
- JP2956761B2 JP2956761B2 JP9285519A JP28551997A JP2956761B2 JP 2956761 B2 JP2956761 B2 JP 2956761B2 JP 9285519 A JP9285519 A JP 9285519A JP 28551997 A JP28551997 A JP 28551997A JP 2956761 B2 JP2956761 B2 JP 2956761B2
- Authority
- JP
- Japan
- Prior art keywords
- contact
- capillary
- terminal
- bidirectional switch
- movable
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies
- H01L24/78—Apparatus for connecting with wire connectors
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/44—Structure, shape, material or disposition of the wire connectors prior to the connecting process
- H01L2224/45—Structure, shape, material or disposition of the wire connectors prior to the connecting process of an individual wire connector
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/44—Structure, shape, material or disposition of the wire connectors prior to the connecting process
- H01L2224/45—Structure, shape, material or disposition of the wire connectors prior to the connecting process of an individual wire connector
- H01L2224/45001—Core members of the connector
- H01L2224/45099—Material
- H01L2224/451—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof
- H01L2224/45138—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof the principal constituent melting at a temperature of greater than or equal to 950°C and less than 1550°C
- H01L2224/45144—Gold (Au) as principal constituent
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
- H01L2224/78—Apparatus for connecting with wire connectors
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
- H01L2224/78—Apparatus for connecting with wire connectors
- H01L2224/7825—Means for applying energy, e.g. heating means
- H01L2224/783—Means for applying energy, e.g. heating means by means of pressure
- H01L2224/78301—Capillary
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01004—Beryllium [Be]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01005—Boron [B]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01013—Aluminum [Al]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01033—Arsenic [As]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01079—Gold [Au]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01082—Lead [Pb]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/19—Details of hybrid assemblies other than the semiconductor or other solid state devices to be connected
- H01L2924/1901—Structure
- H01L2924/1904—Component type
- H01L2924/19043—Component type being a resistor
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Wire Bonding (AREA)
Description
【０００１】[0001]
【発明の属する技術分野】本発明は、ワイヤボンディン
グ装置、特にワイヤボンディングの際に、キャピラリが
被接続部に当接したことを検出する接点の接触状態を監
視するキャピラリ接触状態検出装置に関連する。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a wire bonding apparatus and, more particularly, to a capillary contact state detecting apparatus for monitoring a contact state of a contact for detecting that a capillary has contacted a connected portion during wire bonding. .
【０００２】[0002]
【従来の技術】金（Ａｕ）又はアルミニウム（Ａｌ）等
の金属細線によって半導体素子上に形成された電極とリ
ード端子とを接続するとき、周知のワイヤボンディング
方法が利用されている。ワイヤボンディング方法は、例
えば図２に示すワイヤボンディング装置を使用して実施
される。図２に示すように、ワイヤボンディング装置
は、固定接点（７）を備えたホーン支持部（１）と、一
端に可動接点（８）を備えたホーン（３）とを備えてい
る。ホーン（３）の一端にはキャピラリ（４）が取り付
けられ、ホーン（３）の他端に設けられたホーン固定部
（２）は、スプリング（６）を介してホーン支持部
（１）に連結される。ホーン（３）に取り付けられた可
動接点（８）は、ホーン支持部（１）に取り付けられた
固定接点（７）に対向して配置され、導電性金属から成
る固定接点（７）及び可動接点（８）は接触検出装置
（９）に電気的に接続される。2. Description of the Related Art When an electrode formed on a semiconductor element is connected to a lead terminal by a thin metal wire such as gold (Au) or aluminum (Al), a well-known wire bonding method is used. The wire bonding method is performed using, for example, a wire bonding apparatus shown in FIG. As shown in FIG. 2, the wire bonding apparatus includes a horn support (1) having a fixed contact (7) and a horn (3) having a movable contact (8) at one end. A capillary (4) is attached to one end of the horn (3), and a horn fixing portion (2) provided at the other end of the horn (3) is connected to the horn support portion (1) via a spring (6). Is done. The movable contact (8) attached to the horn (3) is arranged to face the fixed contact (7) attached to the horn support (1), and includes a fixed contact (7) made of a conductive metal and a movable contact. (8) is electrically connected to the contact detection device (9).
【０００３】ホーン支持部（１）はシャフト（９０）に
回転可能に支持されかつ駆動装置（５）のプランジャ
（５ａ）に接続される。駆動装置（５）のプランジャ
（５ａ）を伸縮することにより、ホーン支持部（１）は
矢印ＡＢで示すように、垂直方向に揺動運動を行い、ホ
ーン支持部（１）は上昇位置と下降位置との間で垂直方
向に移動可能に設けられる。スプリング（６）を介して
ホーン支持部（１）に連結されるホーン固定部（２）
は、ホーン支持部（１）の揺動運動に伴って同様に垂直
方向に揺動する。従って、キャピラリ（４）が被接続部
（１０）に対し微小間隔だけ接近又は離間する方向に進
退するように、ホーン（３）は垂直方向に揺動運動が可
能にホーン支持部（１）に取り付けられる。The horn support (1) is rotatably supported on a shaft (90) and is connected to a plunger (5a) of a driving device (5). By expanding and contracting the plunger (5a) of the driving device (5), the horn support (1) performs a swinging motion in the vertical direction as shown by an arrow AB, and the horn support (1) moves up and down. It is provided movably in the vertical direction between the position. Horn fixing part (2) connected to horn support part (1) via spring (6)
Swings vertically in the same manner as the horn support (1) swings. Accordingly, the horn (3) is capable of swinging in the vertical direction so that the capillary (4) moves back and forth in a direction approaching or moving away from the connected portion (10) by a small distance. It is attached.
【０００４】図２のワイヤボンディング装置を使用し
て、被接続部（１０）に金属細線を接続するとき、キャ
ピラリ（４）の先端から金属細線（１１）を繰り出した
状態で、金属細線（１１）の端部を加熱によりボール状
に溶融させた後、ホーン支持部（１）を下側（矢印Ｂ）
に移動する。キャピラリ（４）を更に下降させて被接続
部（１０）に当接させ、キャピラリ（４）の先端で金属
細線（１１）の端部を押し潰して被接続部（１０）に接
続する。When a thin metal wire is connected to the portion to be connected (10) using the wire bonding apparatus shown in FIG. 2, the thin metal wire (11) is pulled out from the tip of the capillary (4). ) Is melted into a ball shape by heating, and then the horn support (1) is lowered (arrow B).
Go to The capillary (4) is further lowered to come into contact with the connected portion (10), and the end of the thin metal wire (11) is crushed by the tip of the capillary (4) and connected to the connected portion (10).
【０００５】キャピラリ（４）が被接続部（１０）に当
接しないとき、可動接点（８）は固定接点（７）に接触
し、可動接点（８）と固定接点（７）との間には電流が
流れる。キャピラリ（４）が被接続部（１０）に当接し
たとき、ホーン固定部（２）の下方への移動は停止する
が、ホーン支持部（１）は所定の発振パルス信号に基づ
いて予め定められた範囲内で下方に移動されるため、図
３に示すように、可動接点（８）は固定接点（７）から
離間する。接触検出装置（９）は、固定接点（７）及び
可動接点（８）間の電圧又は電流を検出して固定接点
（７）及び可動接点（８）の離間を検出し、キャピラリ
（４）の被接続部（１０）への接触を検知することがで
きる。キャピラリ（４）が被接続部（１０）に接触し
て、固定接点（７）と可動接点（８）との間に電流が流
れないことを感知したとき、キャピラリ（４）に荷重を
加えて、金属細線（１１）を被接続部（１０）上に押し
潰すことができる。このように、固定接点（７）に対す
る可動接点（８）の接触状態を検出することにより被接
続部（１０）に対するキャピラリ（４）の接触状態を検
出することができる。When the capillary (4) does not come into contact with the portion to be connected (10), the movable contact (8) contacts the fixed contact (7), and the movable contact (8) is located between the movable contact (8) and the fixed contact (7). Means that current flows. When the capillary (4) comes into contact with the connected part (10), the downward movement of the horn fixing part (2) stops, but the horn supporting part (1) is determined in advance based on a predetermined oscillation pulse signal. The movable contact (8) moves away from the fixed contact (7) as shown in FIG. The contact detection device (9) detects the voltage or current between the fixed contact (7) and the movable contact (8) to detect the separation between the fixed contact (7) and the movable contact (8), and detects the separation of the capillary (4). The contact with the connected portion (10) can be detected. When the capillary (4) comes into contact with the connected portion (10) and detects that no current flows between the fixed contact (7) and the movable contact (8), a load is applied to the capillary (4). In addition, the thin metal wire (11) can be crushed on the connected portion (10). As described above, by detecting the contact state of the movable contact (8) with the fixed contact (7), the contact state of the capillary (4) with the connected portion (10) can be detected.
【０００６】[0006]
【発明が解決しようとする課題】ところで、ワイヤボン
ディング装置を長期間使用すると、固定接点（７）及び
可動接点（８）の表面が摩耗したり、スパークによる
煤、その他の異物が付着して薄い絶縁膜が形成され、キ
ャピラリ（４）の被接続部（１０）への当接を良好に感
知できない場合がある。このため、被接続部（１０）に
対するキャピラリ（４）の荷重のスタート時のばらつき
等が生じ、ワイヤボンディングの確実な操作が阻害され
る。However, when the wire bonding apparatus is used for a long period of time, the surfaces of the fixed contact (7) and the movable contact (8) are worn out, soot and other foreign matter due to sparks adhere to the wire, and become thin. In some cases, an insulating film is formed, and the contact of the capillary (4) with the connected portion (10) cannot be detected well. For this reason, the load of the capillary (4) with respect to the connected portion (10) varies at the start, and the like, and a reliable operation of wire bonding is hindered.
【０００７】本発明は、被接続部に対するキャピラリの
当接を検出する接点の接触状態を監視するキャピラリ接
触状態検出装置を提供することを目的とする。An object of the present invention is to provide a capillary contact state detecting device for monitoring a contact state of a contact for detecting contact of a capillary with a connected portion.
【０００８】[0008]
【課題を解決するための手段】本発明によるキャピラリ
接触状態検出装置は、上昇位置と下降位置との間で垂直
方向に移動可能に設けられ且つ固定接点（７）を備えた
ホーン支持部（１）と、先端部にキャピラリ（４）が取
り付けられ且つ微小間隔だけ移動可能にホーン支持部
（１）に取り付けられると共に可動接点（８）を備えた
ホーン（３）とを備えている。キャピラリ（４）が被接
続部（１０）に当接しないとき、可動接点（８）は固定
接点（７）に接触し、キャピラリ（４）が非接触部（１
０）に当接するとき、可動接点（８）は固定接点（７）
から離間する。固定接点（７）に対する可動接点（８）
の接触状態を検出することにより被接続部（１０）に対
するキャピラリ（４）の接触状態を検出することができ
る。このキャピラリ接触状態検出装置では、固定接点
（７）及び可動接点（８）の少なくとも一方に接続され
た比較入力端子（１８ａ）及び基準電圧（１９）に接続
された基準入力端子（１８ｂ）とを有する比較回路（１
８）と、バイアス電源（２１）に接続された一端及び比
較回路（１８）の比較入力端子に接続された他端を有す
る抵抗（２０）とを備えている。固定接点（７）及び可
動接点（８）の他方は低電位状態に保持される。比較回
路（１８）は固定接点（７）と可動接点（８）との接触
を検出したとき、出力を発生する。SUMMARY OF THE INVENTION A capillary contact state detecting device according to the present invention is provided such that a horn support portion (1) provided vertically movable between a raised position and a lowered position and having a fixed contact (7). ), And a horn (3) having a capillary (4) attached to the distal end thereof and being attached to the horn support (1) so as to be movable by a minute interval and having a movable contact (8). When the capillary (4) does not contact the connected portion (10), the movable contact (8) contacts the fixed contact (7), and the capillary (4) moves to the non-contact portion (1).
When contacting 0), the movable contact (8) becomes a fixed contact (7).
Separate from. Movable contact (8) relative to fixed contact (7)
By detecting the contact state of the capillary (4), the contact state of the capillary (4) with respect to the connected portion (10) can be detected. In this capillary contact state detecting device, a comparison input terminal (18a) connected to at least one of the fixed contact (7) and the movable contact (8) and a reference input terminal (18b) connected to a reference voltage (19) are provided. Comparison circuit (1
8), and a resistor (20) having one end connected to the bias power supply (21) and the other end connected to the comparison input terminal of the comparison circuit (18). The other of the fixed contact (7) and the movable contact (8) is kept in a low potential state. The comparison circuit (18) generates an output when detecting contact between the fixed contact (7) and the movable contact (8).
【０００９】固定接点（７）と可動接点（８）との接触
状態が劣化すると、比較入力端子（１８ａ）に印加され
る電圧のレベルが上昇するため、比較回路（１８）は接
触状態の劣化を表す出力を発生する。When the state of contact between the fixed contact (7) and the movable contact (8) deteriorates, the level of the voltage applied to the comparison input terminal (18a) increases, so that the comparison circuit (18) deteriorates the state of contact. Produces an output that represents
【００１０】本発明の実施の形態では、例えば、比較回
路（１８）の出力によりキャピラリ停止装置（１３）及
び警報装置（１４）を作動する。また、例えば、可動接
点（８）は比較回路（１８）の比較入力端子（１８ａ）
に接続され、固定接点（７）は低電位状態に保持され
る。In the embodiment of the present invention, for example, the capillary stop device (13) and the alarm device (14) are operated by the output of the comparison circuit (18). Also, for example, the movable contact (8) is a comparison input terminal (18a) of the comparison circuit (18).
, And the fixed contact (7) is kept in a low potential state.
【００１１】固定接点（７）は、第１の双方向スイッチ
（７０）の第１の端子（７１）に接続され、第１の双方
向スイッチ（７０）の第２の端子（７２）は電圧変化検
出回路（９ｂ）に接続され、第１の双方向スイッチ（７
０）の第３の端子（７３）は低電位状態に保持される。
可動接点（８）は、第２の双方向スイッチ（８０）の第
１の端子（８１）に接続され、第２の双方向スイッチ
（８０）の第２の端子（８２）は電圧変化検出回路（９
ｂ）に接続され、第２の双方向スイッチ（８０）の第３
の端子（８３）は比較回路（１８）の比較入力端子（１
８ａ）に接続される。第１の双方向スイッチ（７０）及
び第２の双方向スイッチ（８０）はスイッチ切換回路
（１５）により切り換えられる。キャピラリ（４）が被
接続部（１０）に当接するか否かを電圧変化検出回路
（９ｂ）により監視し、固定接点（７）と可動接点
（８）との接触状態を比較回路（１８）により監視す
る。従って、第１の双方向スイッチ（７０）及び第２の
双方向スイッチ（８０）を切り換えることにより、固定
接点（７）と可動接点（８）とを利用して、キャピラリ
（４）と被接続部（１０）との接触状態及び固定接点
（７）と可動接点（８）との接触状態を同時に監視する
ことができる。The fixed contact (7) is connected to a first terminal (71) of a first bidirectional switch (70), and a second terminal (72) of the first bidirectional switch (70) is connected to a voltage terminal. The first bidirectional switch (7) is connected to the change detection circuit (9b).
The third terminal (73) of (0) is kept in a low potential state.
The movable contact (8) is connected to a first terminal (81) of the second bidirectional switch (80), and the second terminal (82) of the second bidirectional switch (80) is connected to a voltage change detection circuit. (9
b) and the third of the second bidirectional switch (80)
Is a comparison input terminal (1) of the comparison circuit (18).
8a). The first bidirectional switch (70) and the second bidirectional switch (80) are switched by a switch switching circuit (15). The voltage change detection circuit (9b) monitors whether the capillary (4) is in contact with the connected portion (10), and compares the contact state between the fixed contact (7) and the movable contact (8) with a comparison circuit (18). Monitor by Therefore, by switching the first bidirectional switch (70) and the second bidirectional switch (80), the capillary (4) is connected to the capillary (4) using the fixed contact (7) and the movable contact (8). The contact state with the part (10) and the contact state with the fixed contact (7) and the movable contact (8) can be simultaneously monitored.
【００１２】[0012]
【発明の実施の形態】次に、本発明によるキャピラリ接
触状態検出装置の実施の形態を図１について説明する。
図１では、図２及び図３に示すワイヤボンデイング装置
と実質的に同一の箇所には、同一の符号を付して説明を
省略する。FIG. 1 shows an embodiment of a capillary contact state detecting device according to the present invention.
In FIG. 1, substantially the same parts as those of the wire bonding apparatus shown in FIGS. 2 and 3 are denoted by the same reference numerals, and description thereof is omitted.
【００１３】本実施例のキャピラリ接触状態検出装置
は、図１に示すように、接点監視回路（１２）と、接点
監視回路（１２）の出力を受信するキャピラリ停止装置
（１３）及び警報装置（１４）と、接点監視回路（１
２）を切り換えるスイッチ切換回路（１５）と、スイッ
チ切換回路（１５）に接続されたタイミング回路（１
６）と、被接続部（１０）を搬送する搬送装置（１７）
を備えている。接点監視回路（１２）は、可動接点
（８）に接続された比較入力端子（１８ａ）及び基準電
圧（１９）に接続された基準入力端子（１８ｂ）とを有
する比較回路（１８）と、バイアス電源（２１）に接続
された一端及び比較回路（１８）の比較入力端子に接続
された他端を有する抵抗（２０）とを備えている。固定
接点（７）は接地され、低電位状態に保持される。比較
回路（１８）は固定接点（７）と可動接点（８）とが接
触して、比較入力端子（１８ａ）の電圧が基準電圧（１
９）より高いとき、固定接点（７）と可動接点（８）と
の接触を検出して出力を発生する。比較回路（１８）の
出力は、キャピラリ停止装置（１３）及び警報装置（１
４）に付与される。可動接点（８）は比較回路（１８）
の比較入力端子（１８ａ）に接続され、固定接点（７）
は接地され、低電位状態に保持される。固定接点（７）
と可動接点（８）との接触状態が劣化すると、比較入力
端子（１８ａ）に印加される電圧のレベルが上昇するた
め、比較回路（１８）は接触状態の劣化を表す出力を発
生する。As shown in FIG. 1, the capillary contact state detecting device of this embodiment has a contact monitoring circuit (12), a capillary stop device (13) for receiving an output of the contact monitoring circuit (12), and an alarm device ( 14) and a contact monitoring circuit (1
2) and a timing circuit (1) connected to the switch switching circuit (15).
6) and a transport device (17) for transporting the connected portion (10)
It has. The contact monitoring circuit (12) includes a comparison circuit (18) having a comparison input terminal (18a) connected to the movable contact (8) and a reference input terminal (18b) connected to a reference voltage (19), and a bias circuit. A resistor (20) having one end connected to the power supply (21) and the other end connected to the comparison input terminal of the comparison circuit (18); The fixed contact (7) is grounded and kept at a low potential. In the comparison circuit (18), the fixed contact (7) and the movable contact (8) come into contact with each other, and the voltage of the comparison input terminal (18a) is changed to the reference voltage (1).
9) When it is higher, the contact between the fixed contact (7) and the movable contact (8) is detected to generate an output. The output of the comparison circuit (18) is output to the capillary stop device (13) and the alarm device (1).
4). The movable contact (8) is a comparison circuit (18)
Fixed contact (7) connected to the comparison input terminal (18a) of the
Are grounded and kept in a low potential state. Fixed contact (7)
When the contact state between the contact and the movable contact (8) deteriorates, the level of the voltage applied to the comparison input terminal (18a) increases, so that the comparison circuit (18) generates an output indicating the deterioration of the contact state.
【００１４】スイッチ切換回路（１５）はスイッチ切換
回路（１５）により切り換えられる第１の双方向スイッ
チ（７０）と、第２の双方向スイッチ（８０）とを有す
る。固定接点（７）は、第１の双方向スイッチ（７０）
の第１の端子（７１）に接続され、第１の双方向スイッ
チ（７０）の第２の端子（７２）は電圧変化検出回路
（９ｂ）に接続され、第１の双方向スイッチ（７０）の
第３の端子（７３）は低電位状態に保持される。可動接
点（８）は、第２の双方向スイッチ（８０）の第１の端
子（８１）に接続され、第２の双方向スイッチ（８０）
の第２の端子（８２）は電圧変化検出回路（９ｂ）に接
続され、第２の双方向スイッチ（８０）の第３の端子
（８３）は比較回路（１８）の比較入力端子（１８ａ）
に接続される。The switch switching circuit (15) has a first bidirectional switch (70) switched by the switch switching circuit (15) and a second bidirectional switch (80). The fixed contact (7) is a first bidirectional switch (70)
And the second terminal (72) of the first bidirectional switch (70) is connected to the voltage change detection circuit (9b), and the first bidirectional switch (70) is connected to the first bidirectional switch (70). The third terminal (73) is kept in a low potential state. The movable contact (8) is connected to the first terminal (81) of the second bidirectional switch (80), and is connected to the second bidirectional switch (80).
The second terminal (82) is connected to the voltage change detection circuit (9b), and the third terminal (83) of the second bidirectional switch (80) is the comparison input terminal (18a) of the comparison circuit (18).
Connected to.
【００１５】図１に示すワイヤボンディング装置では、
図２に示すワイヤボンディング装置と同様に、ホーン支
持部（１）は、駆動装置（５）の駆動により矢印Ａ、Ｂ
で示す方向に揺動し、キャピラリ（４）を上昇及び下降
することができる。可動接点（８）は、キャピラリ
（４）が被接続部（１０）から浮いた状態のとき固定接
点（７）に当接するが、キャピラリ（４）が被接続部
（１０）に当接する状態のとき固定接点（７）から離間
する。被接続部（１０）は、通常支持体２１の上面に配
置されたリードフレームに形成された複数個のボンディ
ング領域を構成し、各ボンディング領域がキャピラリ
（４）の下方に配置されるように、リードフレームは搬
送装置（１７）によって水平方向に間欠的に移動され
る。キャピラリ（４）が被接続部（１０）に当接してボ
ンディングを行うボンディング期間中、被接続部（１
０）はキャピラリ（４）の下方に保持され搬送装置（１
７）によって水平方向に移動されないが、キャピラリ
（４）が被接続部（１０）から離間する非ボンディング
期間中、被接続部（１０）は搬送装置（１７）によって
水平方向に移動される。In the wire bonding apparatus shown in FIG.
Similarly to the wire bonding apparatus shown in FIG. 2, the horn support (1) is driven by the driving device (5) to drive the arrows A and B.
The capillary (4) can be raised and lowered by swinging in the direction shown by. The movable contact (8) is in contact with the fixed contact (7) when the capillary (4) is floating from the connected portion (10), but in a state where the capillary (4) is in contact with the connected portion (10). When separated from the fixed contact (7). The connected part (10) forms a plurality of bonding areas formed on a lead frame usually arranged on the upper surface of the support 21, and each of the bonding areas is arranged below the capillary (4). The lead frame is intermittently moved in the horizontal direction by the transfer device (17). During the bonding period in which the capillary (4) abuts on the connected part (10) to perform bonding, the connected part (1) is connected.
0) is held below the capillary (4) and is transported (1).
7), the connected part (10) is moved in the horizontal direction by the transfer device (17) during the non-bonding period in which the capillary (4) is separated from the connected part (10).
【００１６】接触検出装置（９）は、第１の双方向スイ
ッチ（７０）の第２の端子（７２）と第２の双方向スイ
ッチ（８０）の第２の端子（８２）間に接続された抵抗
（９ａ）と、抵抗（９ａ）の両端の電圧変化を検出する
電圧変化検出回路（９ｂ）と、検出された電圧値と基準
電圧（９ｄ）とを比較する比較回路（９ｃ）と、比較回
路（９ｂ）の出力により所定の発振パルス電圧を出力す
る発振回路（９ｅ）と、第２の端子（８２）と抵抗（９
ａ）との間に接続されたバイアス電源（９ｆ）とを有す
る。第１の端子（７１）及び（８１）はスイッチ切換回
路（１５）によってそれぞれ第２の端子（７２）（８
２）又は第３の端子（７３）（８３）に選択的に電気的
に接続される。The contact detecting device (9) is connected between the second terminal (72) of the first bidirectional switch (70) and the second terminal (82) of the second bidirectional switch (80). A resistor (9a), a voltage change detection circuit (9b) for detecting a voltage change across the resistor (9a), a comparison circuit (9c) for comparing the detected voltage value with a reference voltage (9d), An oscillating circuit (9e) for outputting a predetermined oscillating pulse voltage according to the output of the comparing circuit (9b); a second terminal (82);
a) and a bias power supply (9f) connected between the power supply and the power supply. The first terminals (71) and (81) are respectively connected to the second terminals (72) (8) by the switch switching circuit (15).
2) or the third terminals (73) and (83) are selectively electrically connected.
【００１７】キャピラリ（４）が被接続部（１０）から
離間すると、可動接点（８）と固定接点（７）とが閉成
するので、固定接点（７）及び可動接点（８）を介して
バイアス電源（９ｆ）から第２の端子（７２）に電流が
流れ、抵抗（９ａ）の両端の電圧が相対的に小さくな
る。抵抗（９ａ）の両端の電圧値が小さい場合には、接
触検出回路（９）の発振回路（９ｅ）から発振パルス電
圧が出力されない。When the capillary (4) is separated from the connected portion (10), the movable contact (8) and the fixed contact (7) are closed, so that the fixed contact (7) and the movable contact (8) are used. A current flows from the bias power supply (9f) to the second terminal (72), and the voltage across the resistor (9a) becomes relatively small. When the voltage value at both ends of the resistor (9a) is small, the oscillation pulse voltage is not output from the oscillation circuit (9e) of the contact detection circuit (9).
【００１８】逆に、キャピラリ（４）が被接続部（１
０）に当接すると、可動接点（８）が固定接点（７）か
ら開離して、バイアス電源（９ｆ）から端子（７２）に
電流が流れない。このため、抵抗（９ａ）の両端の電圧
が相対的に大きくなり、電圧変化検出回路（９ｂ）によ
り抵抗（９ａ）の両端の電圧値を検出し、この電圧値が
所定の電圧レベル（基準電圧レベル）よりも大きいこと
を検知して、キャピラリ（４）の被接続部（１０）への
接触を感知することができる。また、抵抗（９ａ）の両
端の電圧値が大きい場合には、接触検出回路（９）の発
振回路（９ｅ）から発振パルス電圧が図示しない押圧装
置に入力され、これにより押圧装置に駆動によってキャ
ピラリ（４）は被接続部（１０）に押し付けられる。Conversely, the capillary (4) is connected to the connected portion (1).
0), the movable contact (8) is separated from the fixed contact (7), and no current flows from the bias power supply (9f) to the terminal (72). For this reason, the voltage at both ends of the resistor (9a) becomes relatively large, and the voltage value at both ends of the resistor (9a) is detected by the voltage change detection circuit (9b), and this voltage value is set to a predetermined voltage level (reference voltage). Level), the contact of the capillary (4) with the connected part (10) can be sensed. When the voltage value at both ends of the resistor (9a) is large, an oscillating pulse voltage is input from the oscillating circuit (9e) of the contact detection circuit (9) to a pressing device (not shown). (4) is pressed against the connected portion (10).
【００１９】図１のワイヤボンディング装置を使用し
て、ワイヤボンディングを行う際に、まず、キャピラリ
（４）の先端から金属細線（１１）を所定の長さで繰り
出し、駆動装置（５）によってキャピラリ（４）を被接
続部（１０）の上面に向かって下降させる。このとき、
搬送装置（１７）はスイッチ回路（１５）に同期して停
止状態となり、第１の双方向スイッチ（７０）の第１の
端子（７１）は第２の端子（７２）に接続され、第２の
双方向スイッチ（８０）の第１の端子（８１）は第２の
端子（８２）に接続される。When wire bonding is performed using the wire bonding apparatus shown in FIG. 1, a thin metal wire (11) is first drawn out from a tip of a capillary (4) by a predetermined length, and the capillary is driven by a driving device (5). (4) is lowered toward the upper surface of the connected portion (10). At this time,
The transport device (17) is stopped in synchronization with the switch circuit (15), the first terminal (71) of the first bidirectional switch (70) is connected to the second terminal (72), and The first terminal (81) of the bidirectional switch (80) is connected to the second terminal (82).
【００２０】キャピラリ（４）が被接続部（１０）に当
接すると、可動接点（８）は固定接点（７）から離間
し、電圧変化検出回路（９ｂ）はキャピラリ（４）によ
る被接続部（１０）への当接を検出し、図示しない押圧
装置によって金属細線（１１）の端部をキャピラリ
（４）の先端で被接続部（１０）に押し潰して第１のワ
イヤボンディングを行う。When the capillary (4) comes into contact with the connected part (10), the movable contact (8) is separated from the fixed contact (7), and the voltage change detection circuit (9b) is connected to the connected part by the capillary (4). The contact with (10) is detected, and the end of the thin metal wire (11) is crushed by the tip of the capillary (4) to the connected portion (10) by a pressing device (not shown) to perform first wire bonding.
【００２１】次に、金属細線（１１）を繰り出しながら
キャピラリ（４）を被接続部（１０）から離間させて上
昇する。キャピラリ（４）が被接続部（１０）上の所定
の高さまで上昇したとき、搬送装置（１７）を駆動して
被接続部（１０）を水平方向に移動させ、第２の被接続
部（１０）をキャピラリ（４）の下方に配置する。この
非ボンディング期間にタイミング回路（１６）からの所
定の信号によってスイッチ回路（１５）が駆動され、第
１の双方向スイッチ（７０）の第１の端子（７１）は第
３の端子（７３）に電気的に接続され、第２の双方向ス
イッチ（８０）の第１の端子（８１）は第３の端子（８
３）に電気的に接続されて、接点監視回路（１２）によ
り固定接点（７）と可動接点（８）との接触状態が監視
される。Next, the capillary (4) is lifted away from the portion to be connected (10) while feeding out the thin metal wire (11). When the capillary (4) has risen to a predetermined height above the connected portion (10), the transport device (17) is driven to move the connected portion (10) in the horizontal direction, and the second connected portion ( 10) is arranged below the capillary (4). During this non-bonding period, the switch circuit (15) is driven by a predetermined signal from the timing circuit (16), and the first terminal (71) of the first bidirectional switch (70) becomes the third terminal (73). The first terminal (81) of the second bidirectional switch (80) is electrically connected to the third terminal (8).
3), the contact monitoring circuit (12) monitors the contact state between the fixed contact (7) and the movable contact (8).
【００２２】煤又は絶縁膜等の異物を介在せずに良好な
状態で、固定接点（７）に対し可動接点（８）が接触す
ると、第２の双方向スイッチ（８０）の第３の端子（８
３）から可動接点（８）及び固定接点（７）を介して第
１の双方向スイッチ（７０）の第３の端子（７３）に至
る経路の抵抗値が十分に小さいため、バイアス電圧源
（２１）から抵抗（２０）、可動接点（８）及び固定接
点（７）を介して相対的に大きな電流が流れる。また、
第３の端子（８３）での電位は比較的小さく、比較回路
（１８）の比較入力端子（１８ａ）に印加される電圧は
小さい。When the movable contact (8) comes into contact with the fixed contact (7) in a good condition without any foreign matter such as soot or insulating film, the third terminal of the second bidirectional switch (80) (8
Since the resistance value of the path from 3) to the third terminal (73) of the first bidirectional switch (70) through the movable contact (8) and the fixed contact (7) is sufficiently small, the bias voltage source ( A relatively large current flows from 21) through the resistor (20), the movable contact (8) and the fixed contact (7). Also,
The potential at the third terminal (83) is relatively small, and the voltage applied to the comparison input terminal (18a) of the comparison circuit (18) is small.
【００２３】これに対して、固定接点（７）と可動接点
（８）との間に煤又は絶縁膜等の異物が介在したり、固
定接点（７）又は可動接点（８）の表面が摩耗して、こ
れらの接触状態が不良のとき、固定接点（７）と可動接
点（８）間の抵抗が増大する。このため、端子（８３）
から可動接点（８）及び固定接点（７）を介して第３の
端子（７３）に至る経路の抵抗値が大きくなり、抵抗
（２０）に接点（７）（８）を介してバイアス電源（２
１）から流れる電流が相対的に小さくなる。また、第３
の端子（８３）の電位が比較的大きくなり、比較回路
（１８）の比較入力端子（１８ａ）に相対的に大きな電
圧が印加される。On the other hand, foreign matter such as soot or an insulating film is interposed between the fixed contact (7) and the movable contact (8), and the surface of the fixed contact (7) or the movable contact (8) is worn. Then, when these contact states are defective, the resistance between the fixed contact (7) and the movable contact (8) increases. Therefore, the terminal (83)
The resistance value of the path from the contact through the movable contact (8) and the fixed contact (7) to the third terminal (73) increases, and the resistance (20) is connected to the bias power source (7) through the contacts (7) and (8). 2
The current flowing from 1) becomes relatively small. Also, the third
Becomes relatively large, and a relatively large voltage is applied to the comparison input terminal (18a) of the comparison circuit (18).
【００２４】比較回路（１８）は、比較入力端子（１８
ａ）に印加される電圧のレベルと基準入力端子（１８
ｂ）に印加される電圧のレベル（基準電圧）とを比較
し、比較入力端子（１８ａ）の電圧レベルが他方の入力
端子（１８ｂ）の電圧レベルよりも大きいとき、比較回
路（１８）は警報装置（１４）及び停止装置（１３）に
発振パルスを送出し、発振パルスにより駆動される警報
装置（１４）は、接点（７）（８）の接触不良の警報を
発生すると共に、停止装置（１３）の駆動によりワイヤ
ボンディング装置の駆動を停止して、ワイヤボンディン
グ操作を中止する。このように、接点監視回路（１２）
は、非ボンディング期間中、固定接点（７）と可動接点
（８）との接触状態を監視し、比較入力端子（１８ａ）
の電圧のレベルが基準電圧よりも高いことを検知して、
接点（７）（８）の接触状態の不良を検出することがで
きる。The comparison circuit (18) has a comparison input terminal (18)
a) and the reference input terminal (18)
b) is compared with the voltage level (reference voltage) applied thereto, and when the voltage level of the comparison input terminal (18a) is higher than the voltage level of the other input terminal (18b), the comparison circuit (18) issues an alarm. An oscillating pulse is sent to the device (14) and the stopping device (13), and the alarm device (14) driven by the oscillating pulse generates an alarm of the contact failure of the contacts (7) and (8) and the stopping device ( The driving of the wire bonding apparatus is stopped by the driving of 13), and the wire bonding operation is stopped. Thus, the contact monitoring circuit (12)
Monitors the contact state between the fixed contact (7) and the movable contact (8) during the non-bonding period, and monitors the comparison input terminal (18a).
Detects that the voltage level is higher than the reference voltage,
Defective contact states of the contacts (7) and (8) can be detected.
【００２５】接点監視回路（１２）が固定接点（７）と
可動接点（８）との接触が正常であることを確認したと
き、キャピラリ（４）を第２の被接続部（１０）の上面
に向かって下降させ、第２のワイヤボンディングを行
う。接点監視回路（１２）が固定接点（７）と可動接点
（８）との異常接触又は非接触を確認した場合には、比
較回路（１８）からキャピラリ停止装置（１３）に出力
を送出してキャピラリ（４）の移動を停止して、ワイヤ
ボンディングを中止する。このように、本実施の形態で
は、キャピラリ（４）が被接続部（１０）に当接するか
否かを電圧変化検出回路（９ｂ）により監視し、固定接
点（７）と可動接点（８）との接触状態を比較回路（１
８）により監視する。従って、第１の双方向スイッチ
（７０）及び第２の双方向スイッチ（８０）を切り換え
ることにより、固定接点（７）と可動接点（８）とを利
用して、キャピラリ（４）と被接続部（１０）との接触
状態及び固定接点（７）と可動接点（８）との接触状態
を同時に監視することができる。When the contact monitoring circuit (12) confirms that the contact between the fixed contact (7) and the movable contact (8) is normal, the capillary (4) is moved to the upper surface of the second connected portion (10). To perform the second wire bonding. If the contact monitoring circuit (12) confirms abnormal contact or non-contact between the fixed contact (7) and the movable contact (8), an output is sent from the comparison circuit (18) to the capillary stopping device (13). The movement of the capillary (4) is stopped, and the wire bonding is stopped. As described above, in the present embodiment, whether the capillary (4) is in contact with the connected portion (10) is monitored by the voltage change detection circuit (9b), and the fixed contact (7) and the movable contact (8) are monitored. The contact state with the comparison circuit (1
Monitor by 8). Therefore, by switching the first bidirectional switch (70) and the second bidirectional switch (80), the capillary (4) is connected to the capillary (4) using the fixed contact (7) and the movable contact (8). The contact state with the part (10) and the contact state with the fixed contact (7) and the movable contact (8) can be simultaneously monitored.
【００２６】本発明の前記実施の形態は変更が可能であ
る。例えば、第２の双方向スイッチ（８０）を介して可
動接点（８）を比較回路（１８）の比較入力端子（１８
ａ）に接続する代わりに、固定接点（７）を比較回路
（１８）の比較入力端子（１８ａ）に接続し、可動接点
（８）を低電位状態に保持してもよい。The above embodiment of the present invention can be modified. For example, the movable contact (8) is connected to the comparison input terminal (18) of the comparison circuit (18) via the second bidirectional switch (80).
Instead of being connected to a), the fixed contact (7) may be connected to the comparison input terminal (18a) of the comparison circuit (18), and the movable contact (8) may be kept in a low potential state.
【００２７】[0027]
【発明の効果】本発明によれば、接点の接触状態を監視
してキャピラリの被接続部の当接を確実に検出するの
で、信頼性の高いワイヤボンディングが可能となる。According to the present invention, the contact state of the contact point is monitored and the contact of the connected portion of the capillary is reliably detected, so that highly reliable wire bonding can be performed.
【図１】 本発明によるキャピラリ接触状態検出装置の
実施の形態を示すブロック図FIG. 1 is a block diagram showing an embodiment of a capillary contact state detecting device according to the present invention.
【図２】 従来のワイヤボンディング装置の部分断面図FIG. 2 is a partial cross-sectional view of a conventional wire bonding apparatus.
【図３】 キャピラリが被接続部に当接した状態を示す
図２の断面図FIG. 3 is a cross-sectional view of FIG. 2 showing a state where the capillary is in contact with a connected portion;
１・・ホーン支持部、 ２・・ホーン固定部、 ３・・
ホーン、 ４・・キャピラリ、 ５・・駆動装置、 ６
・・スプリング、 ７・・固定接点、 ８・・可動接
点、 ９・・接触検出装置、 １０・・被接続部、 １
１・・金属細線、１２・・接点監視回路、 １３・・キ
ャピラリ停止装置、 １４・・警報装置、 １５・・ス
イッチ切換回路、 １６・・タイミング回路、 １７・
・搬送装置、 １８・・比較回路、 １８ａ・・比較入
力端子、 １８ｂ・・基準入力端子、 １９・・基準電
圧源、 ２０・・抵抗、 ２１・・バイアス電圧源、
７０・・第１の双方向スイッチ、 ８０・・第２の双方
向スイッチ、 ７１、８１・・第１の端子、 ７２、８
２・・第２の端子、 ７３、８３・・第３の端子、1. Horn support part, 2. Horn fixed part, 3.
Horn, 4. Capillary, 5. Drive unit, 6
..Spring, 7. fixed contact, 8. movable contact, 9. contact detection device, 10. connected part, 1
1 ·· Metal wire, 12 ·· Contact monitoring circuit, 13 ·· Capillary stop device, 14 ··· Alarm device, 15 ·· Switch switching circuit, 16 ··· Timing circuit, 17 ·
・ Transfer device, 18 ・ ・ Comparison circuit, 18a ・ ・ Comparison input terminal, 18b ・ ・ Reference input terminal, 19 ・ ・ Reference voltage source, 20 ・ ・ Resistance, 21 ・ ・ Bias voltage source,
70 first bidirectional switch, 80 second bidirectional switch, 71, 81 first terminal, 72, 8
2nd terminal, 73, 83 third terminal,
Claims (4)
移動可能に設けられ且つ固定接点（７）を備えたホーン
支持部（１）と、先端部にキャピラリ（４）が取り付け
られ且つ微小間隔だけ移動可能に前記ホーン支持部
（１）に取り付けられると共に可動接点（８）を備えた
ホーン（３）とを備え、前記キャピラリ（４）が被接続
部（１０）に当接しないとき、前記可動接点（８）は前
記固定接点（７）に接触し、前記キャピラリ（４）が前
記非接触部（１０）に当接するとき、前記可動接点
（８）は前記固定接点（７）から離間し、前記固定接点
（７）に対する前記可動接点（８）の接触状態を検出す
ることにより前記被接続部（１０）に対する前記キャピ
ラリ（４）の接触状態を検出するキャピラリ接触状態検
出装置において、 前記固定接点（７）及び可動接点（８）の少なくとも一
方に接続された比較入力端子（１８ａ）及び基準電圧
（１９）に接続された基準入力端子（１８ｂ）とを有す
る比較回路（１８）と、 バイアス電源（２１）に接続された一端及び前記比較回
路（１８）の比較入力端子に接続された他端を有する抵
抗（２０）とを備え、 前記固定接点（７）及び可動接点（８）の他方は低電位
状態に保持され、 前記比較回路（１８）は前記固定接点（７）と可動接点
（８）との接触を検出したとき、出力を発生することを
特徴とするキャピラリ接触状態検出装置。A horn support (1) provided vertically movable between a raised position and a lowered position and having a fixed contact (7); a capillary (4) mounted at a tip end; A horn (3) attached to the horn support (1) so as to be movable by a minute interval and having a movable contact (8), when the capillary (4) does not abut on the connected part (10). The movable contact (8) comes into contact with the fixed contact (7), and when the capillary (4) comes into contact with the non-contact portion (10), the movable contact (8) moves away from the fixed contact (7). A capillary contact state detecting device that separates and detects a contact state of the movable contact (8) with the fixed contact (7) to detect a contact state of the capillary (4) with the connected part (10). Fixed A comparison circuit (18) having a comparison input terminal (18a) connected to at least one of the point (7) and the movable contact (8) and a reference input terminal (18b) connected to a reference voltage (19); A resistor (20) having one end connected to a power supply (21) and the other end connected to a comparison input terminal of the comparison circuit (18); the other of the fixed contact (7) and the movable contact (8); Is held in a low potential state, and the comparison circuit (18) generates an output when detecting the contact between the fixed contact (7) and the movable contact (8).
ピラリ停止装置（１３）及び警報装置（１４）を作動す
る請求項１に記載のキャピラリ接触状態検出装置。2. The capillary contact state detecting device according to claim 1, wherein the capillary stop device and the alarm device are activated by an output of the comparison circuit.
イッチ（７０）の第１の端子（７１）に接続され、前記
第１の双方向スイッチ（７０）の第２の端子（７２）は
電圧変化検出回路（９ｂ）に接続され、前記第１の双方
向スイッチ（７０）の第３の端子（７３）は低電位状態
に保持され、 前記可動接点（８）は、第２の双方向スイッチ（８０）
の第１の端子（８１）に接続され、前記第２の双方向ス
イッチ（８０）の第２の端子（８２）は電圧変化検出回
路（９ｂ）に接続され、前記第２の双方向スイッチ（８
０）の第３の端子（８３）は前記比較回路（１８）の比
較入力端子（１８ａ）に接続され、 前記第１の双方向スイッチ（７０）及び第２の双方向ス
イッチ（８０）はスイッチ切換回路（１５）により切り
換えられ、 前記キャピラリ（４）が被接続部（１０）に当接するか
否かを前記電圧変化検出回路（９ｂ）により監視し、 前記固定接点（７）と可動接点（８）との接触状態を前
記比較回路（１８）により監視する請求項１に記載のキ
ャピラリ接触状態検出装置。3. The fixed contact (7) is connected to a first terminal (71) of a first bidirectional switch (70), and a second terminal (71) of the first bidirectional switch (70). 72) is connected to the voltage change detection circuit (9b), the third terminal (73) of the first bidirectional switch (70) is kept in a low potential state, and the movable contact (8) is connected to the second Bidirectional switch (80)
The second terminal (82) of the second bidirectional switch (80) is connected to the voltage change detection circuit (9b), and the second terminal (81) of the second bidirectional switch (80) is connected to the second terminal (81). 8
0) is connected to a comparison input terminal (18a) of the comparison circuit (18), and the first bidirectional switch (70) and the second bidirectional switch (80) are switches. The voltage change detection circuit (9b) monitors whether or not the capillary (4) comes into contact with the connected portion (10) by the switching circuit (15). The fixed contact (7) and the movable contact ( The capillary contact state detecting device according to claim 1, wherein the contact state with the capillary circuit (8) is monitored by the comparison circuit (18).
８）の比較入力端子（１８ａ）に接続され、前記固定接
点（７）は低電位状態に保持される請求項１に記載のキ
ャピラリ接触状態検出装置。The movable contact (8) is connected to the comparison circuit (1).
The capillary contact state detecting device according to claim 1, wherein the fixed contact (7) is connected to the comparison input terminal (18a) of (8), and the fixed contact (7) is kept in a low potential state.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP9285519A JP2956761B2 (en) | 1997-10-17 | 1997-10-17 | Capillary contact state detection device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP9285519A JP2956761B2 (en) | 1997-10-17 | 1997-10-17 | Capillary contact state detection device |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH11121502A JPH11121502A (en) | 1999-04-30 |
| JP2956761B2 true JP2956761B2 (en) | 1999-10-04 |
Family
ID=17692589
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP9285519A Expired - Fee Related JP2956761B2 (en) | 1997-10-17 | 1997-10-17 | Capillary contact state detection device |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP2956761B2 (en) |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR100562412B1 (en) * | 1999-01-05 | 2006-03-17 | 삼성테크윈 주식회사 | Circuit for monitoring a state of wire bonding |
-
1997
- 1997-10-17 JP JP9285519A patent/JP2956761B2/en not_active Expired - Fee Related
Also Published As
| Publication number | Publication date |
|---|---|
| JPH11121502A (en) | 1999-04-30 |
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