JP2954155B1 - Lead frame manufacturing equipment - Google Patents

Abstract

An object of the present invention is to provide a lead frame which can be easily processed, has good separability from a laminated state, and can maintain product quality, and a manufacturing apparatus therefor. SOLUTION: In a lead frame 1 having an island portion 4 on which a semiconductor chip is mounted, a lead wire connecting portion 5, and a frame portion 2 supporting the island portion 4 and the lead wire connecting portion 5, A plurality of hemispherical projections 9 are provided on the surface of the frame portion 2, and the positions of the projections 9 are set such that the projections 9 are not located at the same position between adjacent ones when a plurality of lead frames 1 are stacked. Have been.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a lead frame as a semiconductor connecting part used in a semiconductor device, and more particularly to a lead frame which can be easily separated from a stacked state and taken out, and a manufacturing apparatus therefor. It is about.

[0002]

2. Description of the Related Art As is well known, a lead frame has conventionally been known as a semiconductor connection component used in a semiconductor device. The lead frame includes an island portion on which the semiconductor chip is mounted, a lead wire connection portion, and a frame portion supporting the island portion and the lead wire connection portion. It is intended to be treated as a sheet-shaped lead frame in which a plurality of the island portions and the lead wire connecting portions are connected. Then, the sheet-shaped lead frames are stacked and packaged in units of 50 sheets, 100 sheets, or the like, with the orientation and center of each lead frame aligned. In order to supply the sheets one by one, a plurality of sheets are stacked and stored in the storage section of the supply device with the orientation and center of the lead frame aligned.

Here, the above-mentioned island portion is formed so as to be slightly offset from the frame portion so that a semiconductor chip can be received, and these island portions and lead wire connection portions are plated with gold or silver. Have been.

[0004]

However, in the above-mentioned conventional lead frame, when the lead frames are stacked, the plating on the back surface of the upper lead frame and the plating on the front surface of the lower lead frame are crimped. If the recessed island portions dig into each other, it is difficult to separate them, and it is necessary to stop the line, which causes a problem of lowering the production efficiency. In addition, depending on the handling at the time of separation, the island portion and the like may be deformed, and the product quality may be degraded.

In order to deal with such a problem, for example, Japanese Utility Model Laid-Open No. 59-159959 (known example 1), Japanese Utility Model Laid-Open No. 60-151143 (known example 2), and
As described in -99223 (known example 3), a technique has been devised in which protrusions are provided on the front surface or the back surface of the lead frame to easily separate the stacked lead frames. However, known example 1
, Because the projection is provided on the inclined part of the stage support bar that is often plated,
There is a problem that the processing stability of this portion is poor and solder residue adheres at the time of processing. In addition, in the known example 2, since a burr is formed by a wedge-shaped groove and used as a projection, processing distortion is likely to occur, precision control is difficult, and when the lead frame is thin, a sufficient projection height can be obtained. There is a problem that can not be. And in the publicly known example 3,
Management for alternately stacking the lead frame provided with the protrusion and the lead frame not provided with the protrusion is required, and there is a problem that the operation becomes complicated. Accordingly, the present invention is easily processed is, a good separation of the stacked state, and there is provided an apparatus for manufacturing a lead frame that can maintain product quality.

[0006]

In order to solve the above problems, the present invention provides an island on which a semiconductor chip is mounted.
Part, lead wire connection part, these island part and lead
It has a frame part that supports the wire connection part,
A plurality of hemispherical projections are provided on one of the flat surfaces,
When multiple projections are stacked,
Are set so that projections are not in the same position
An apparatus for manufacturing a lead frame, comprising:
Feeding device for feeding the frame and cutting it into strips
Along with a mold that dimples the island
A pan for forming a plurality of projections on this mold is provided.
The punch is provided based on data from a personal computer.
To move each lead frame to form a protrusion.
A punch operation control device for changing the position is provided
It is characterized by the following.

[0007] Therefore, the laminated lead frame
Make sure that the protrusions are not in the same position
Lead frames can be manufactured continuously while shaping
Packaging and the like can be performed by laminating them in order. Also laminated
By adjusting the data on the PC according to the number of sheets,
The molding position can be easily set. Also manufactured leads
If frames are stacked, adjacent lead frames
The projections come into contact with the
Storage, and storage for packaging and loading into automatic machines is cheap.
To standardize. Also, by providing the projection on a flat surface,
In addition to facilitating the work, each lead frame laminated
Enough clearance can be given between
Facilitates frame separation. The above protrusion is a hemispherical protrusion
Dispersion of processing strain and easy management of processing height
Plan.

[0008] The flat plate provided with the protrusion of the lead frame.
If the flat surface is a frame, process the projections on the frame.
Facilitates and does not affect functional parts by distortion.

[0009]

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS One embodiment of the present invention will be described below with reference to the drawings. In FIG. 1, reference numeral 1 denotes a lead frame, and the lead frame 1 is provided with a frame portion 2 as a flat surface extending in the left-right direction of FIG. An island portion 4 on which the semiconductor chip is mounted is supported by the frame portion 2 via a support portion 3.
Are arranged below by dimple processing so as to bend the support portion 3 so as to be lower than the frame portion 2 so as to receive the semiconductor chip attached thereto.

A pair of lead wire connecting portions 5 are arranged around the island portion 4, and each lead wire connecting portion 5 is
And is supported by a rib 6 as a flat surface attached to the surface. A plurality of sets of the island portion 4 and a pair of lead wire connecting portions 5 configured as described above are arranged to form a sheet-like lead frame 1. The frame 2 has a square hole 7 and a round hole 8 for positioning or for automatic feeding.

The frame 2 is provided with hemispherical projections 9 on the upper and lower surfaces, respectively, closer to the island 4. The projections 9 are arranged so as to be distributed to the right above the frame portion 2 with respect to the center line P of the island portion 4 and to the left below the frame portion 2, and as shown in FIG. In the case where 50 packages (one package) are stacked, the distribution amount is set to be different so that the projections 9 of adjacent ones are not at the same position. Here, the protrusion height T of the protrusion 9 for securing the clearance between the lead frames 1 is 0.15 mm in thickness of the lead frame 1,
Considering the plating thickness of 0.01 mm and the cutting burr height of 0.018 mm, the thickness is preferably about 0.05 mm.

In manufacturing such a lead frame 1, when the reel-shaped lead frame 10 wound as shown in FIG.
The strip-shaped lead frame 1 is cut by the mold 12. At this time, the island portions 4 are dimple-processed and the projections 9 are formed at predetermined positions on the surface of the frame portion 2. Here, a punch (not shown) for processing the projection 9 is provided on the mold 12, and the movement of the punch is controlled by the punch operation control device 14 based on data previously input to the personal computer 13. By moving
As shown in FIG. 2, the protrusions 9 are processed at different positions of the lead frames 1, that is, at positions where the adjacent protrusions 9 in the state where the lead frames 1 are stacked are not at the same position. is there. The lead frame 1 thus cut is sent out through the square holes 7 and the round holes 8 of the frame portion 2 and is stacked on the case 15.

According to the above-described embodiment, if the lead frames 1 to be manufactured are laminated in that order, each lead frame 1 can secure an optimum clearance by each projection 9, so that the lead frame 1 can be easily and stably formed. And can be packaged or stored. In this case, each projection 9
Are placed so that they are not in the same position,
The excess load is distributed in a well-balanced manner to the projections 9 so that the layers can be stacked in a more stable state.

The frame 2 on which the projection 9 is formed is
Unlike the functional part, since it is a part that is not plated, there is no generation of solder residue when processing the projection 9 and the processing stability is good, and it is difficult to separate by separation by pressure bonding of the plating as in the conventional case. There is no such a problem that it becomes. Therefore, there is no line stoppage due to separation failure or the like, which can contribute to improvement in the production efficiency of the semiconductor device, and there is no deformation of each part at the time of separation and no loss of product quality. In addition, since the projections 9 are hemispherical, processing strain can be dispersed and the height of the projections can be easily controlled. The present invention is not limited to the above embodiment. For example, instead of providing the protrusion 9 on the surface of the frame 2, the protrusion 9 may be provided on the surface of the rib 6. It may be provided on the back surface. Also,
Since data control by the personal computer 13 is possible,
If a mold for forming the projection 9 is separately provided and the data is corresponded to the mold, it can be applied to other lead frames of different types, thereby suppressing unnecessary investment in manufacturing the mold for each type. it can.

[0015]

As described above, according to the present invention, adjacent ones of stacked lead frames are connected to each other.
Make sure that the projections are not in the same
Lead frames can be manufactured one after another and stacked in order as they are
This has the effect that packaging and the like can be easily performed. Also,
Adjusting PC data according to the number of layers
There is a high degree of design freedom to easily change the starting molding position.
There is an effect that.

The flat plate provided with the protrusion of the lead frame is provided.
If the flat surface is a frame, process the projections on the frame.
Simplifies the function and does not affect the function
Has the effect.

[0017]

[Brief description of the drawings]

FIG. 1 is a partial plan view of a lead frame according to an embodiment of the present invention.

FIG. 2 is a front view showing a stacked state of the lead frame of FIG. 1;

FIG. 3 is an overall view showing an apparatus for manufacturing the lead frame of FIG. 1;

[Explanation of symbols]

 DESCRIPTION OF SYMBOLS 1 Lead frame 2 Frame part (flat surface) 4 Island part 5 Lead wire connection part 6 Rib (flat surface) 9 Projection 10 Reel-shaped lead frame 11 Supply device 12 Die 13 Personal computer 14 Punch operation control device

Claims (2)

(57) [Claims] An island portion on which a semiconductor chip is mounted
, Lead wire connection part, these island part and lead wire
It has a frame that supports the connection part, and
A plurality of hemispherical projections are provided on some of the flat surfaces.
If the starting positions are adjacent to each other when multiple sheets are stacked
Reset the projections so that they are not in the same position.
An apparatus for manufacturing a lead frame, comprising a reel-shaped lead frame.
Feeding unit that feeds the drum and cutting it into strips
Both are equipped with a mold for dimple processing of the island part.
And a punch for forming a plurality of protrusions on this mold.
This punch is based on the data of the personal computer
By moving, the protrusion forming position of each lead frame
A punch operation control device for changing the
And a lead frame manufacturing apparatus. 2. The lead frame has a projection.
2. The flat surface as defined in claim 1, wherein the flat surface is the frame portion.
An apparatus for manufacturing a lead frame as described in the above.