JP2949541B2 - Surface mount components - Google Patents

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to surface-mounted components such as capacitors and filters which are mounted on a circuit board or the like to form various electronic circuits.

[0002]

2. Description of the Related Art Generally, an external electrode formed at an end of a surface mount component has a folded portion at least on a mounting surface in order to improve the reliability of electrical connection with a circuit board or the like. Often. By the way, when the external electrodes are formed at the ends of the component by using a method such as sputtering which is a dry plating method, it is necessary to perform sputtering on at least the end faces and the mounting surface. Therefore, at least twice,
Since the sputtering process must be performed, the number of manufacturing steps is increased.

In addition, since each sputtering is performed independently, the position of the external electrode formed on the end face and the folded portion formed on the mounting surface are apt to be displaced, resulting in poor dimensional accuracy of the external electrode. There was a defect. Therefore, an object of the present invention is to provide a surface mount component having a small number of external electrode forming steps and excellent in electrical connection reliability.

[0004]

In order to solve the above-mentioned problems, a surface-mounted component according to the present invention is provided with a concave portion provided at least on an edge of a mounting surface and an externally formed dry plating film provided on an end surface. The folded portion of the electrode extends to the concave portion. The dry plating film means a plating film formed by a method such as sputtering or vapor deposition.

In the above configuration, if a component having a recess at least at the edge of the mounting surface is set on a plating jig shown in FIG. 4 and subjected to sputtering or vapor deposition,
External electrodes are collectively formed on at least the end surface and the mounting surface. Therefore, the labor of independently forming the external electrodes on the end surface and the mounting surface can be omitted.

[0006]

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS An embodiment of a surface mount component according to the present invention will be described below with reference to the accompanying drawings. FIG. 1 is a diagram of the surface mount component 1 as viewed from the mounting surface side. As shown in FIG. 1, the mounting surface 10 of the surface mount component 1 has a concave portion 10a at the edge.
Is provided. Similarly, the other surface 9 is provided with a concave portion 9a at the edge. The external electrode 12 formed at the end of the component 1 has a folded portion 12a having concave portions 10a and 9a.
Extends. The external electrode 12 is made of Ag, Ag-Pd, N
It is made of a material such as i or Cu.

Next, a procedure for manufacturing the surface mount component 1 will be described. As shown in FIG. 2, a protective sheet 2 made of an insulating material is stacked with an internal sheet 3 provided with and / or not provided with internal conductors (not shown) on its surface. A notch 2 a is provided in advance at the edge of the protection sheet 2. Each of the stacked sheets 2 and 3 is press-bonded and fired to obtain a laminate shown in FIG. The notch 2 a provided in the protective sheet 2 is provided with the concave portion 10 a of the mounting surface 10 and the surface 9.
Recesses 9a, 10a of the surfaces 9, 10 easily.
a can be formed.

As shown in FIG. 4, in order to form an external electrode on the component 1, a concave portion or a hole 20a of the holding jig 20 is formed.
Then, the part 1 is inserted and set in the direction of the arrow. As shown in FIG. 5, when the component 1 is set, the concave portions 9a,
A gap is formed between the portion 10a and the inner wall of the recess 20a. After the component 1 is set, the mask 21 is placed on the holding jig 20. The mask 21 is provided with holes 22 for forming electrodes at desired positions. The mask 21
The positions and diameters of the holes 22 provided in the holes need not be high-precision dimensions.

Next, vapor or sputtering is performed, and the vapor deposition metal or sputtering metal scattered from the vapor deposition source or sputtering source passes through the hole 22 and
The end of the component 1 is reached, and the external electrode 12 is formed at the end.
At this time, a part of the deposition metal or the sputtering metal
2, the inner wall of the recess 20a and the recess 9 of the component 1
a and 10a,
The folded portion 12a of the external electrode 12 is formed on the surface of the concave portions 9a and 10a.

Therefore, the external electrode 1 including the folded portion 12a is formed by a single deposition or sputtering process.
2 can be formed collectively, so that the number of external electrode forming steps of this embodiment is smaller than that of the conventional external electrode forming step. In addition, since the external electrode 12 does not separately form the end surface portion and the folded portion 12a, no displacement occurs between the end surface portion and the folded portion 12a, and the external electrode 12 having excellent dimensional accuracy can be obtained.

As shown in FIG. 6, the surface mounting component 1 having the above-described structure is mounted on the circuit board 3 with the mounting surface 10 facing downward.
0 is electrically connected. That is, the external electrode 12 is connected by the solder 35 in a state where the folded portion 12 a on the mounting surface 10 side faces the mounting electrode 31 provided on the circuit board 30. The component 1 can be mounted on a circuit board with high connection reliability by using either the reflow soldering method or the flow soldering method. In particular, when the reflow soldering method is adopted, the dimension of A shown in the figure is 0 to 20 because the applied thickness of the solder paste is about 200 μm.
It is preferable to design so as to be 0 μm.

The surface mount component according to the present invention is not limited to the above embodiment, but can be variously modified within the scope of the invention. In particular, the external electrodes need only be formed on at least the end face and the mounting face, and need not necessarily be formed on three faces as in the above-described embodiment.

[0013]

As is apparent from the above description, according to the present invention, the folded portion of the external electrode provided on the end face extends to at least the concave portion provided on the edge of the mounting surface. Therefore, when forming the external electrodes, if the dry plating treatment is performed by setting the external electrodes in a plating jig shown as an example in FIG.
External electrodes can be collectively formed on at least the end face and the mounting surface. Therefore, a surface mount component capable of forming external electrodes in a smaller number of steps than the conventional number of steps for forming external electrodes is obtained.

Further, since the external electrode does not separately form the end face portion and the folded portion, no misalignment occurs between the end face portion and the folded portion, and an external electrode with good dimensional accuracy can be obtained. As a result, one having excellent electrical connection reliability can be obtained.

[Brief description of the drawings]

FIG. 1 is a perspective view of one embodiment of a surface mount component according to the present invention as viewed from a mounting surface side.

FIG. 2 is an exploded perspective view of the surface mount component shown in FIG.

FIG. 3 is an exemplary perspective view for explaining a procedure for manufacturing the surface mount component shown in FIG. 1;

FIG. 4 is a perspective view for explaining a manufacturing procedure following FIG. 3;

FIG. 5 is a sectional view for explaining the manufacturing procedure following FIG. 4;

FIG. 6 is a sectional view showing a mounting state of the surface mount component shown in FIG. 1;

[Description of Signs] 1 ... Surface mount component 10 ... Mounting surface 9a, 10a ... Concave portion 12 ... External electrode 12a ... Folding portion

Claims (1)

(57) [Claims] 1. A surface mounting component, wherein a concave portion is provided at least at an edge of a mounting surface, and a folded portion of an external electrode formed of a dry plating film provided on an end surface extends to the concave portion.