JP2932784B2 - Induction heating cooker - Google Patents

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an induction cooking device.

[0002]

2. Description of the Related Art In recent years, an induction heating cooker for inducing an eddy current at the bottom of a load pan by using a high-frequency magnetic field for heating has attracted attention as a clean, safe and highly heat-efficient cooking means.

A conventional induction heating cooker will be described below with reference to FIGS. In FIG. 3, 1 is a commercial power supply, 2 is a rectifier for rectifying the commercial power supply 1 to DC, 3 is a choke coil, 4 is a smoothing capacitor, 5 is a resonance capacitor, 6 is a switching element, 7 is a heating coil, and 8 is a switching element. 6 is a control circuit for controlling the conduction time and the like. In FIG. 4, 9 is a main body, 7a, 7b, and 7c are columns for fixing and supporting the heating coil 7, 10 and 11 are printed boards on which components are arranged, and 12 is a printed board 1
This is a lead wire connecting 0 and 11.

[0004] The operation of the induction heating cooker configured as described above will be described below. First, a commercial power supply 1 is connected to a rectifier 2, a choke coil 3, and a smoothing capacitor 4.
To rectify and smooth to a DC power supply. Next, the control circuit 8 drives the switching element 6 by applying a high-frequency pulse voltage, converts a DC power supply into a high-frequency current, and supplies a high-frequency current to the heating coil 7 to heat the load pan. Since the induction heating cooker requires a high output, a large current of 10 A or more flows through the rectifier 2 and the choke coil 3 at the maximum output, and the heating coil 7 and the switching element 6
For example, a large current of several tens of amperes flows. At the same time, heating coil 7
A high voltage of several hundred volts is applied to the switching element 6 and the like. Therefore, each component uses a large component that can withstand a large current and a high voltage. Also, the columns 7a, 7b, 7c supporting the heating coil 7 need to be thick enough to support the weight of the heating coil 7. The occupied area of the pillars 7a, 7b, 7c inside the main body 9 is large, and it is difficult to arrange all necessary components on a single printed circuit board having a simple shape. The connection was made with the lead wire 12.

[0005]

However, in the above-mentioned conventional configuration, since the two printed boards 10 and 11 are connected by the lead wire 12, the cost of the lead wire 12 is high, the assembling workability is poor, and the lead wire is poor. There is a problem that high-frequency noise is radiated from the wire 12. In order to solve this problem, when a configuration is adopted in which all necessary components are arranged on one printed circuit board, a large through hole for penetrating any of the columns 7a, 7b, 7c is required in the printed circuit board. Therefore, there is a problem that the solder or the flux blows out from the large through hole to the upper surface of the printed circuit board during the solder dip. There is another method in which the printed circuit board is composed of a single printed circuit board having a complicated shape while avoiding the columns 7a, 7b, and 7c. However, there is a problem that the cost is increased.

SUMMARY OF THE INVENTION The present invention solves the above-mentioned problems, and all necessary components can be arranged on a single low-cost printed circuit board to improve assemblability and reduce noise.
It is a first object of the present invention to provide an induction heating cooker which can prevent solder and flux from blowing up on the upper surface of a printed circuit board during solder dipping.

A second object of the present invention is to provide an induction heating cooker capable of further reducing the size of a printed circuit board in addition to the first object.

[0008]

In order to achieve the above object, the present invention firstly provides a rectifier for rectifying a commercial power supply into direct current, a choke coil, a smoothing capacitor, a resonance capacitor, a switching element, or the conduction of the switching element. A printed circuit board on which a control circuit or the like for controlling time is disposed, a heating coil, and a support for fixing and supporting the heating coil, wherein the printed circuit board has a connection portion around a portion where the support is located A slit is provided so that the connection portion can be cut so that an inner portion of the slit can be removed.

Secondly, a rectifier for rectifying a commercial power supply to DC, a choke coil, a smoothing capacitor, a resonance capacitor, a switching element, a printed circuit board on which a control circuit for controlling the conduction time of the switching element, and the like, a heating coil, A support for fixing and supporting the heating coil, and the printed circuit board is provided with a slit around a portion where the support is located, leaving a connection portion, and the connection portion is cut off so that the connection portion can be cut. The portion can be removed, and the vicinity of the connection portion is farther from the outer periphery of the cross section of the support than the outer periphery of the other slit.

[0010]

According to the induction heating cooker of the present invention, first, a slit is provided around a portion where a support for fixing and supporting a heating coil is provided, leaving a connection portion. By cutting the inside of the slit and making it possible to remove the inside of the slit, there is no through hole of the post before the solder dip, and the inside of the slit is removed after the solder dip, so that the through hole of the post can be created it can.

Second, a slit is provided around a portion where a support for fixing and supporting the heating coil is located, a slit is provided so that the connecting portion can be cut, and an inner portion of the slit can be removed. So, there is no through hole of the post before the solder dip, and by removing the inner part of the slit after the solder dip, a through hole of the post can be created,
Further, by keeping the vicinity of the connecting portion farther from the outer periphery of the cross section of the column than the outer peripheral portion of the other slits, the cut surface after cutting the connecting portion is prevented from contacting the column, and the outer peripheral portion of the slit other than near the connecting portion is the cross section of the column. It is possible to approach the outer periphery, and it is possible to increase the area of the printed circuit board necessary for component placement or wiring pattern formation in the vicinity of the through hole.

[0012]

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS One embodiment of the first means of the present invention will be described below with reference to FIG.

In FIG. 1, 21 is a commercial power supply, 22 is a rectifier for rectifying the commercial power supply 21 to DC, 23 is a choke coil, 24 is a smoothing capacitor, 25 is a resonance capacitor,
26 is a switching element, 27 is a heating coil, 28 is a control circuit for controlling the conduction time and the like of the switching element 26,
29 is the main body, 27a, 27b and 27c are heating coils 27
Is a printed circuit board on which the components are arranged, 31 (shaded portion) is a slit for easily removing the unnecessary board 32 after the solder dip from the printed board, and 33 is a slit on the unnecessary board 32. A through-hole for penetrating the post 27 c after the removal is provided.
3 is a connection unit for connecting the first and second terminals. FIG. 1A is a component layout diagram of the printed circuit board 30 before the solder dip, and FIG. 1B is a component layout diagram of the printed circuit board 30 after the solder dip.
(C) shows a layout when the printed circuit board 30 is incorporated in the main body 29.

The operation of the induction cooking device configured as described above will be described below. The circuit operation is the same as that of the conventional example. First, the commercial power supply 21 is rectified and smoothed into a DC power supply by the rectifier 22, the choke coil 23, and the smoothing capacitor 24. Next, the control circuit 28 drives the switching element 26 by applying a high-frequency pulse voltage, converts a DC power supply into a high-frequency current, and supplies a high-frequency current to the heating coil 27 to heat the load pan. On the printed circuit board 30,
As shown in FIG. 1A, a slit 31 is provided in a portion where the support column 27c of the heating coil 27 penetrates, leaving the connection portion 34. After the solder dip, the connection portion 34 is cut and the unnecessary substrate 3 is cut.
2 is removed, as shown in FIG.
A through-hole 33 is formed to allow c to pass therethrough. In addition, the diameter of the unnecessary substrate 32 is larger than that of the support 27c because the cut portion of the connection 34 protrudes inward from the through hole 33 and does not contact the support 27c after the connection 34 is cut. In this way, since the unnecessary substrate 32 is present at the time of solder dipping, it is possible to prevent the solder and the flux from blowing up. Further, since it has a simple rectangular board shape, it can be manufactured at low cost, and all the necessary components can be arranged on one printed board 30. Therefore, there is no need for a lead wire for connecting each printed board as in the conventional example. This improves the assemblability and reduces noise.

As described above, according to this embodiment, the slit 31 is provided around the portion where the column 7c for fixing and supporting the heating coil 27 is left, leaving the connection portion 34, and the unnecessary substrate is removed after the solder dip. By making 32 removable,
All necessary components can be arranged on one low-cost printed circuit board 30 to improve assemblability and reduce noise, and to prevent solder and flux from blowing up on the upper surface of the printed circuit board 30 during solder dip. Can be done. Furthermore, in the present embodiment, the unnecessary portion 32 can be easily removed by making the two connecting portions of the connecting portion 34 adjacent to each other.

There is no limitation on the number of connecting portions of the connecting portion.
Needless to say, about one or two places are good in terms of cutting workability.

Next, an embodiment of the second means of the present invention will be described with reference to FIG. In FIG. 2, 41
Is a commercial power supply, 42 is a rectifier for rectifying the commercial power supply 41 to DC, 43 is a choke coil, 44 is a smoothing capacitor,
5 is a resonance capacitor, 46 is a switching element, 47 is a heating coil, 48 is a control circuit for controlling the conduction time of the switching element 46, 49 is a main body, 47a, 47b, 4
7c is a column for fixing and supporting the heating coil 47, 50 is a printed circuit board on which each component is arranged, 51 (shaded portion) is a slit for easily removing the unnecessary board 52 after solder dip from the printed circuit board, 53 Is a through hole for penetrating the column 47c after removing the unnecessary substrate 52, and 54 is a connecting portion for connecting the unnecessary substrate 52 and the through hole 53. FIG.
FIG. 2A is a component layout diagram of the printed circuit board 50 before the solder dip, and FIG.
2 (c) shows a layout when the printed circuit board 50 is incorporated in the main body 49. FIG.

The operation of the induction cooking device configured as described above will be described below. The circuit operation is the same as that of the first embodiment. First, a commercial power supply 41 is rectified and smoothed into a DC power supply by a rectifier 42, a choke coil 43, and a smoothing capacitor 44. Next, the control circuit 48 drives the switching element 46 by applying a high-frequency pulse voltage, converts a DC power supply into a high-frequency current, and supplies a high-frequency current to the heating coil 47 to heat the load pan. As shown in FIG. 2A, the slits 5 are formed on the printed circuit board 50 while leaving the connecting portions 54 at the portions where the columns 47c of the heating coil 47 penetrate.
2 is provided, and the connection portion 54 is cut after the solder dip to remove the unnecessary substrate 52, thereby creating a through hole 53 for penetrating the column 47c as shown in FIG. 2B.

Further, after the connection portion 54 is cut, the cut portion of the connection portion 54 does not come into contact with the column 47c.
The slit width near the connecting portion 54 is increased so that the connecting portion 54 can be cut with a tool such as a nipper, and the outer peripheral portion of the slit 51 other than near the connecting portion 54 is similar to the cross-sectional outer periphery of the column 47c. The clearance between the column 47c and the outer periphery of the cross section of the column 47c is made as small as possible as long as the printed board 50 can be inserted without difficulty. Therefore, when the solder is dipped, the unnecessary substrate 52 is present, so that the solder and the flux can be prevented from blowing up. In addition, the clearance between the outer periphery of the slit 51 other than the vicinity of the connection portion 54 and the outer periphery of the cross section of the support column 47c can be reduced to increase the area of the printed circuit board necessary for component placement or wiring pattern formation in the vicinity of the through hole. As in the first embodiment, all the necessary components can be arranged on one printed circuit board 50. Therefore, there is no need for a lead wire for connecting each printed circuit board as in the conventional example, so that the assemblability is improved and the noise is reduced. Can be achieved.

As described above, according to the present embodiment, the slit 51 is provided around the portion where the column 47c for fixing and supporting the heating coil 47 is left except for the connecting portion 54.
By making the unnecessary substrate 52 removable after the solder dip, all the necessary components can be arranged on one low-cost printed circuit board 50, so that the assemblability can be improved and the noise can be reduced. The flux can be prevented from blowing up on the upper surface of the printed circuit board 50. Furthermore, by keeping the vicinity of the connecting portion 54 farther from the outer periphery of the cross section of the column 47c than the outer peripheral portion of the other slit 51, the cut surface of the connecting portion 54 after cutting is prevented from contacting the column 47c. The outer periphery of the slit 51 can be close to the outer periphery of the cross section of the column 47c, so that the through-hole 53 can be made smaller and the strength of the printed circuit board can be increased. And the size of the entire printed circuit board 50 can be reduced. Further, in the present embodiment, by removing the unnecessary substrate 52 easily by connecting the two connection portions of the connection portion 54 and increasing the slit width near the connection portion 54, the connection using a tool such as a nipper is performed. If the portion 54 is cut, no sharp cutting residue will appear on the cut surface, and safety during assembly work can be achieved.

[0021]

As described above, according to the present invention, according to the first means, a slit is provided around a portion where a column for fixing and supporting a heating coil is provided, leaving a connection portion around the portion where a support column is located. By making it possible to cut and remove the inner part of the slit, there is no through hole of the pillar before the solder dip, and the inner part of the slit can be cut after the solder dip to create a through hole of the pillar, An induction heating cooker in which all necessary components can be arranged on a single low-cost printed circuit board, assemblability can be improved and noise can be reduced, and solder and flux can be prevented from blowing up on the upper surface of the printed circuit board during solder dip. Can be provided.

According to the second means, a slit is provided around the portion where the support for fixing and supporting the heating coil is located, leaving a connection portion, and the connection portion can be cut so that the inner portion of the slit can be removed. By doing so, there is no through hole of the post before the solder dip, and the through hole of the post can be created by removing the inner part of the slit after the solder dip. It is possible to prevent the cut surface after cutting of the connection part from coming into contact with the pillar by keeping it farther from the outer circumference of the pillar than the outer circumference, and it is possible to bring the outer circumference of the slit other than near the connection part closer to the outer circumference of the pillar. It is possible to increase the area of the printed circuit board necessary for placing components or forming wiring patterns in the vicinity of the through-hole, thereby making it possible to reduce the size of the printed circuit board and to reduce the size of one small, low-cost board. To provide an induction heating cooker in which all necessary components can be arranged on a lint board, so that assemblability can be improved and noise can be reduced, and solder and flux can be prevented from blowing up to the upper surface of a printed circuit board during solder dipping. it can.

[Brief description of the drawings]

FIG. 1 (a) is a printed circuit board mounting diagram of an induction heating cooker according to an embodiment of the first means of the present invention before solder dip. FIG. 1 (b) is a printed circuit board mounted diagram after solder dip. Same body mounting diagram

FIG. 2 (a) is a printed circuit board mounting diagram before solder dip of an induction heating cooker in one embodiment of the second means of the present invention. FIG. 2 (b) is a printed circuit board mounting diagram after the solder dip. Same body mounting diagram

FIG. 3 is a circuit diagram of a conventional induction heating cooker.

FIG. 4 is a mounting diagram of a conventional induction heating cooker.

[Explanation of symbols]

21, 41 Commercial power supply 22, 42 Rectifier 23, 43 Choke coil 24, 44 Smoothing capacitor 25, 45 Resonant capacitor 26, 46 Switching element 27, 47 Heating coil 27a, 27b, 27c, 47a, 47b, 47c Support 28, 48 Control Circuits 30, 50 Printed circuit boards 31, 51 Slits 33, 53 Through holes 34, 54 Connections

Claims (2)

(57) [Claims] A rectifier for rectifying a commercial power supply into direct current, a choke coil, a smoothing capacitor, a resonance capacitor, a switching element, a printed circuit board on which a control circuit for controlling a conduction time of the switching element, and the like; a heating coil; And a support for fixing and supporting the heating coil, wherein the printed circuit board is provided with a slit around a portion where the support is located, leaving a connection portion so that the connection portion can be cut and the inside portion of the slit is formed. Induction heating cooker that can be removed. 2. A printed circuit board on which a rectifier for rectifying a commercial power supply to a direct current, a choke coil, a smoothing capacitor, a resonance capacitor, a switching element, or a control circuit for controlling a conduction time of the switching element, a heating coil; And a support for fixing and supporting the heating coil, wherein the printed circuit board is provided with a slit around a portion where the support is located, leaving a connection portion so that the connection portion can be cut and the inside portion of the slit is formed. An induction heating cooker that can be removed, and the vicinity of the connection portion is farther from the outer periphery of the cross section of the support than the outer periphery of the other slit.