JP2930073B1 - Resin granular material manufacturing method and granulator - Google Patents

Abstract

An object of the present invention is to provide a method and a device for producing a resin granule having a uniform particle size, a high production efficiency, and a resin granule having a desired shape. SOLUTION: The method for producing a resin particulate material is as follows.
And the resin 7 is discharged from the molding machine 3 into the chamber 13, and the discharged resin 7 is cut in the chamber 13 in a reduced pressure atmosphere to produce the resin granules 17. By this method, a resin suitable for sealing a semiconductor device can be manufactured. The granulator is a molding machine 3 for discharging the resin 7.
And a chamber 13 into which the resin 7 is discharged from the molding machine 3.
3 has a cutter 11 for cutting the discharged resin 7 therein, and the discharged resin 7
1 is a granulating device that is cut in a reduced pressure atmosphere.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a method for producing resin granules and a granulating apparatus, and more particularly to a method for producing resin granules used for sealing a semiconductor device and a granulating apparatus for producing the resin granules. About.

[0002]

2. Description of the Related Art As a method of granulating a preform of an epoxy resin used for transfer molding and encapsulation of a semiconductor device, a so-called tablet (resin granular material), Japanese Patent Laid-Open Publication No.
No. 0806 is cited. This granulation method is a method using a tableting machine. Further, Japanese Patent Application Laid-Open No. 10-41327 discloses a method for producing a granular semiconductor sealing material in which a mixture containing a resin component is heated and granulated in a non-pressurized state.

[0003]

SUMMARY OF THE INVENTION Japanese Patent Laid-Open No. 2-5080
The granulation method described in Japanese Patent Publication No. 6 is a manufacturing method using a tableting machine, so that tablet manufacturing efficiency is not always good.
In addition, in the case of the method for manufacturing a granular semiconductor sealing material described in Japanese Patent Application Laid-Open No. 10-41237, it is difficult to obtain a desired particle shape.

[0004] As another method for producing a resin granular material used for encapsulating a semiconductor device, a resin, a curing agent, an inorganic filler, and the like are blended, and then, as shown in FIGS. While being heated at 3, the mixture is kneaded by a screw 5 built in the molding machine 3, and the kneaded resin 7 is extruded forward, extruded into the atmosphere from a discharge hole 9 formed at the tip of the molding machine 3, and extruded. A method of manufacturing the tablet-shaped resin granules 19 by cutting the resin 7 using the cutter 11 is exemplified.

[0005] The method of manufacturing the resin granules 19 using the molding machine 3 shown in FIGS. However, the extruded resin is subjected to a force that is pushed by the subsequent resin in the molding machine 3, and the internal pressure of the resin is high. When extruded in this state, the extruded resin is extruded from the discharge hole 9 while maintaining a high internal pressure, and the internal pressure of the resin is released under the atmosphere to the extruded resin, as shown in FIG.
Swelling occurs. For this reason, irregularities were generated on the outer surface of the resin particles 19, and the particle diameter was likely to vary. When resin granules 19 having a large variation in particle size are to be loaded into a pot during transfer molding, a clogging of a pipe such as a hopper bridge occurs, and a measurement variation occurs.
There is a problem that a semiconductor device obtained by sealing becomes defective.

SUMMARY OF THE INVENTION The present invention has been made in view of the above circumstances, and has a method for producing a resin granule capable of obtaining a resin granule having a desired production shape with no variation in particle size, good manufacturing efficiency, and the like. It is an object to provide a granulating device.

[0007]

According to the method of the present invention for producing a granular resin material, a resin is supplied to a molding machine, the resin is discharged from the molding machine into a chamber, and the discharged resin is subjected to a reduced pressure atmosphere in the chamber. This is a method of manufacturing resin granules by cutting inside.
Further, the method for producing a resin particulate material of the present invention comprises supplying a resin to a molding machine, discharging the resin from the molding machine into a chamber, cutting the discharged resin in a reduced-pressure atmosphere in the chamber, and forming a semiconductor. This is a manufacturing method for producing resin particulates for sealing the device. The granulating apparatus of the present invention is a granulating apparatus including a molding machine that discharges a resin, and a chamber in which the resin is discharged from the molding machine, wherein the chamber is configured to discharge the discharged resin. This is a granulating apparatus that includes a cutter for cutting inside, and the discharged resin is cut in a reduced-pressure atmosphere by the cutter.

[0008]

DESCRIPTION OF THE PREFERRED EMBODIMENTS FIG. 1 is a perspective view of an essential part showing an example of a granulating apparatus according to the present invention, showing a state in which resin granules are manufactured, and FIG. It is sectional drawing which expanded and showed a part of apparatus. The granulator is provided with a molding machine 3 for discharging the resin 7 from a discharge hole 9 formed at the tip thereof, and a resin 7 is provided at a front portion of the molding machine 3 so as to cover the discharge hole 9. And a chamber 13 for discharging the resin 7. The chamber 13 includes a cutter 11 for cutting the discharged resin 7 therein, and the chamber 13 decompresses the inside thereof. This is a granulating apparatus in which the discharged resin 7 is cut by the cutter 11 in a reduced-pressure atmosphere in the chamber 13 to produce resin granules 17.

[0009] Examples of the resin include thermosetting resins such as epoxy resin, polyimide resin, and phenol resin.
The thermosetting resin is appropriately blended with a curing agent, a curing accelerator, an inorganic filler such as silica or alumina, a coloring agent such as carbon black or titanium oxide, and a release agent such as stearic acid.

The resin is supplied to a molding machine 3 such as an extruder or an injection molding machine.
Is fed into a cylinder in the molding machine 3 and is melted. The melted resin is kneaded by a rotating screw 5 built in the cylinder, and the kneaded resin 7 is extruded forward. Then, the ink reaches the discharge hole 9 formed at the tip of the molding machine 3, and is then extruded into the chamber 13 formed so as to cover the discharge hole 9, and is discharged from the discharge hole 9. The resin discharged into the chamber 13 is cut into a predetermined length (about 0.5 to 5 mm) under reduced pressure in the chamber 13 by the rotating cutter 11, granulated into a columnar shape or the like, and formed into a resin granular material 17. It is said. In addition,
The preferred sectional shape of the discharge hole 9 is a polygon or a circle.

In order to cut the discharged resin in the chamber 13 by using the cutter 11 in a reduced pressure atmosphere, the pressure in the chamber 13 is reduced. For this purpose, an exhaust pipe 15 for reducing the pressure inside the chamber 13 is attached to the chamber 13, and the exhaust pipe 15 is connected to a vacuum pump (not shown). The air inside the chamber 13 passes through the hole of the exhaust pipe 15 and is discharged into the atmosphere by a vacuum pump. It is preferable that the pressure inside the chamber 13 is reduced to about 100 mmHg or less.

The chamber 13 is an enclosure for keeping the space including the outside of the discharge hole 9 and the cutter 11 at a reduced pressure.
It can be made of a pressure-resistant plate material that can withstand a vacuum, for example, a plate material such as a metal plate, a plastic plate, and a glass plate. When at least a part of the chamber 13 is transparent,
Since the cutting state of the resin by the cutter 11 can be observed from the outside of the chamber 13, the production of the resin granules 17 is easy. Therefore, the chamber 1 is formed using a transparent glass plate or the like.
It is preferable to provide a transparent window in 3.

When a predetermined amount of the resin granules 17 obtained by the cutting is collected at the bottom of the chamber 13, the resin granules 17 are taken out of the chamber 13. When removing the resin particles 17, the pressure in the chamber 13 is returned to normal pressure.

According to the granulating apparatus of the present invention, the resin 7 discharged from the discharge hole 9 is discharged into the reduced-pressure atmosphere in the chamber 13 and cut by the cutter 11 in the reduced-pressure atmosphere. For this reason, the resin passing through the discharge holes 9 is sucked in the direction of the chamber 13 by the reduced pressure. As a result, the difference between the internal pressure of the resin before passing through the discharge holes 9 and the internal pressure of the resin after passing through the discharge holes 9 is reduced. Therefore, the release amount of the resin internal pressure after the discharge becomes small, and the resin that has passed through the discharge holes 9 does not expand as shown in FIG. Since the resin without swelling is cut by the cutter 11, the resin granules 17
Is substantially equal to the cross-sectional shape of the discharge hole 9. Therefore, by adjusting the cross-sectional shape of the discharge hole 9, it is possible to manufacture the resin granular material 17 having a desired shape.

An example of the method for producing the resin granules of the present invention is shown in FIG.
2, the resin is supplied to an extruder 3 having a built-in rotatable screw 5, and a resin 7 is formed from a discharge hole 9 formed at the tip of the molding machine 3 so as to cover the discharge hole 9. In this method, the resin 7 discharged is extruded into the chamber 13, and the discharged resin 7 is cut by the cutter 11 in a reduced-pressure atmosphere in the chamber 13 to produce a resin particle 17 having a columnar shape or the like. If an extruder is used as the molding machine 3, the resin 7 can be continuously discharged from the many discharge holes 9, and the discharged resin 7 can be continuously cut by the rotating cutter 11. Therefore, according to the method for producing resin particles of the present invention, resin particles 17 can be efficiently produced. Note that it is preferable to manufacture the resin granules 17 while evacuating the chamber 13 with a vacuum pump.

The manufactured granular resin granules 17 are suitable as a resin for encapsulating a semiconductor device, particularly as a resin for transfer molding and encapsulation of a semiconductor device. When performing transfer molding using the resin granules 17, the resin granules 17 as a sealing material are charged into a pot provided in a mold attached to the transfer molding machine,
After being heated and melted, for example, pressurizing with a plunger, sending a sealing material to a cavity for resin molding in which a semiconductor element or the like is arranged via a runner and a gate provided in the mold, and further heating. To cure the sealing material to seal the semiconductor element and the like.

According to the method for producing a resin particle of the present invention,
Since there are no irregularities on the surface of the resin granules 17 and there is no variation in the particle diameter, even when the resin granules 17 are loaded in the pot, piping such as a hopper bridge does not occur. Therefore, a measurement variation hardly occurs, and a semiconductor device obtained by sealing hardly becomes defective. Further, by adjusting the cross-sectional shape of the discharge hole 9 and the cut length of the discharged resin, it is easy to manufacture the resin granular material 17 having a particle shape suitable for transfer molding.

[0018]

As described above, according to the method and the apparatus for producing resin granules of the present invention, since the pressure in the chamber provided with the cutter and the cutter is reduced, the dispersion of the particle diameter is reduced. No resin granules are obtained. In addition, since a molding machine is used, the production efficiency of resin particulates is good. Further, resin granules having a desired shape can be obtained. The resin particles are suitable as a sealing material for sealing a semiconductor element or the like, particularly as a sealing material used for transfer molding and encapsulation, and a semiconductor device obtained by encapsulation has a high yield.

[Brief description of the drawings]

FIG. 1 is a perspective view of a main part showing an example of a granulating apparatus of the present invention.

FIG. 2 is an enlarged sectional view of the granulating apparatus shown in FIG.

FIG. 3 is a perspective view of a main part showing an example of a granulating apparatus of a comparative example.

FIG. 4 is an enlarged sectional view of the granulating apparatus shown in FIG. 3;

[Explanation of symbols]

1. Granulation device 3. Molding machine 5. Screw 7.
..Resin, 9 ··· Discharge hole, 11 ·· Cutter, 13 ···
Chamber, 15 exhaust pipe, 17, 19 resin granular material

Claims (3)

(57) [Claims] 1. A resin is supplied to a molding machine, the resin is discharged from the molding machine into a chamber, and the discharged resin is cut in a reduced-pressure atmosphere in the chamber to produce resin granules. A method for producing resin particulates. 2. A method for supplying a resin to a molding machine, discharging the resin from the molding machine into a chamber, cutting the discharged resin in a reduced-pressure atmosphere in the chamber, and sealing the semiconductor device. A method for producing a resin particle, characterized by producing a resin particle. 3. A granulating apparatus comprising a molding machine for discharging a resin and a chamber into which the resin is discharged from the molding machine, wherein the chamber is for cutting the discharged resin. With the cutter inside,
A granulating apparatus, wherein the discharged resin is cut in a reduced-pressure atmosphere by the cutter.