JP2917826B2 - Electronic component mounting method and mounting device - Google Patents

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a mounting method and a mounting apparatus for mounting electronic components on a substrate, and more particularly, to a holding means for transferring electronic components one by one from a component supply means and mounting the components on the substrate. The present invention relates to a method and an apparatus for mounting electronic components in a mounting apparatus provided.

[0002]

2. Description of the Related Art Conventionally, a tape feeder, a stick feeder, a tray and the like have been used as a supply unit of an electronic component in a mounting apparatus. In any case, the electronic components
The supplied electronic components are sequentially supplied to a predetermined holding position, and are held by the holding means.

The mounting head section supporting the holding means moves up and down and rotates the holding means, and is moved between the holding position and the mounting position of the electronic component by the robot section. When moving to the mounting position, the camera attached to the mounting head captures images of the horizontal and rotational holding postures of the electronic components held by the holding means, and transfers the captured data to the shift amount detecting means. The position and orientation of the electronic component that is sent and held is calculated, and using the calculation result, the electronic component is
It is accurately mounted on the mounting position on the board. However, when the electronic component is held, the electronic component is misaligned in the component supply unit, so that the center position of the holding unit and the center of the electronic component are misaligned, and an error occurs in holding the component. Sometimes. In order to solve this problem, Japanese Patent Application Laid-Open No. 2-10894 discloses a technique of recognizing the position of an electronic component in a component supply unit, correcting the position of a holding unit, and reducing errors in holding the electronic component.

[0004]

In the conventional example disclosed in Japanese Patent Application Laid-Open No. 2-10894, in order to image an electronic component in the component supply unit, an image capturing time and a recognition time of the electronic component required a holding operation. It is added to the time and the mounting time increases. Further, when the camera is provided on the mounting head, since the optical axis of the camera does not coincide with the center of the holding means, the time required for moving the mounting head for imaging increases.

An object of the present invention is to provide a method and an apparatus for mounting an electronic component, which can correct a holding position without increasing a processing time required for the mounting.

[0006]

Means for Solving the Problems The feature of the present invention, parts subjected
Holding the electronic component supplied to a substantially predetermined position by the supply means.
With the stage held, the center of the holding means and the center of the electronic component
Determine the amount of deviation, transfer the electronic components to the board, and correct the amount of deviation.
The following holding means is mounted on the electronic part based on the amount of displacement.
Of electronic components to correct the holding position when holding products
In the method, in the first holding, the electronic component is held.
The center of the holding means at the reference position designated for holding
Holding position shift when holding and holding the electronic component
In the second hold, the first hold position shift amount is calculated.
The holding position when the holding means holds the electronic component.
Correction, and thereafter, correction of the holding position for the N-th holding
Averages the holding position deviation amount until the (N-1) th holding
It is to do with the value that was set .

[0007]

[0008] Another feature of the present invention is the mounting of the electronic component.
In the method, when the electronic component is held by the holding means,
If the deviation exceeds the allowable value,
And the amount of deviation in this case is (N-
1) Do not use for averaging the amount of deviation until the first holding
In .

[0009]

Another feature of the present invention is that the component supply means is substantially
An electronic component supplied to a predetermined position is held by holding means.
The amount of deviation between the center of the holding means and the center of the electronic component in the state
The amount is obtained by the amount detecting means, and the holding means corrects the shift amount and
The product is transferred and mounted on the board, and the holding position correction means is
The next time the electronic component is held by the holding means based on the displacement
In the electronic component mounting device that corrects the holding position,
The amount detecting means holds the electronic component in the first holding
Position the center of the holding means at the designated reference position.
Holding position shift amount when the electronic component is held after being placed
And the following for the N-th holding (N-
1) Calculate the average value of the holding position deviation amount until the first holding
The holding position correction means is performed once for the second holding.
The holding means holds the electronic component based on the eye holding position shift amount.
The holding position at the time of
Of the holding position for the holding until the (N-1) th holding
This is performed using the average value of the holding position deviation amounts.

[0011]

Another feature of the present invention is the mounting of the electronic component.
The shift amount detecting means of the device is held by the holding means with a camera.
Image of the electronic components, process the image data, and
It is to detect the displacement amount.

[0013] According to the present invention, it is possible to store
Electronic components are supplied at a reference position assumed in advance.
The amount and direction of the deviation from
It has been empirically known that electronic components
When holding the battery, the center of the holding
Correction of deviation from the center position of slave parts, processing time is increased
Process without doing. Also, according to the present invention, accurate
Electronic components can be held and highly reliable electronic components
Equipment can be realized. In addition, since the operation of recognizing electronic components by the camera is performed while moving to the mounting position,
The mounting time is the same as when the holding position is not corrected,
There is no increase in mounting time due to the addition of functions.

[0014]

BRIEF DESCRIPTION OF THE DRAWINGS FIG. 1 is a perspective view of an electronic component mounting apparatus according to an embodiment of the present invention.

FIG. 1 is a view schematically showing an electronic component mounting apparatus according to an embodiment of the present invention, in which electronic components are supplied by a tape feeder. In the component supply unit 7,
A large number of tape feeders 8 for feeding the electronic components 1 stored on the reel 9 at a pitch are provided. Input data screen 6
Displays various information such as data of the board 3 and data of the component 1.

As shown in FIG. 4, the mounting head unit 2 includes a nozzle 5 for holding the electronic component 1 supplied to a predetermined position from each of the tape feeders 8 and a camera 28 for imaging the attitude of the held electronic component 1. Moving mirror 26, fixed mirror 2
7, LED lighting 30 and diffusion plate 29 are provided.

The electronic component 1 is taped as shown in FIG. 5, 32 is a component storage hole, 33 is a tape, and 34 is a tape.
Is a pitch feed hole.

The mounting robot unit 10 horizontally moves the mounting head unit 2 described above. The board transfer section 4 automatically adjusts the rail interval to the board width set by the input data editing means 12 shown in FIG. 2, and carries in the board 3 at the stop position and at the stop position.

As shown in FIG. 2, the control unit 11 of the mounting apparatus shown in FIG.
3, a holding position correcting means 15 and a mounting position correcting means 14 are provided.

The input data editing means 12 registers board data and component data and creates a mounting program. The shift amount detecting means 13 is composed of the input data editing means 12
And a storage unit for storing data relating to the operation of the mounting apparatus and data based on various information given by the controller 28. Based on an image captured by the camera 28, the relative position between the component center and the nozzle center is determined. A shift amount indicating a position shift, a holding posture, a component presence / absence check, a component abnormality detection, and the like are performed. The mounting position correcting units 14 and 15 perform control related to the operation of the mounting apparatus based on the data sent from the displacement amount detecting unit 13.

In the first holding, the shift amount detecting means 13 determines that the center of the nozzle 5 is located at the reference position,
Is calculated and stored. In the second and subsequent holdings, after correcting the center position of the nozzle 5 with a value obtained by averaging the stored shift amounts up to the previous time,
The electronic component 1 is held. In this way, by using the calculation result calculated each time the data is held for the next holding operation,
The time required to correct the position of the nozzle 5 is reduced,
Mistakes in holding the electronic component 1 are also reduced.

Here, a method of calculating a shift amount for correcting the position of the nozzle 5 according to the present invention will be described. Electronic component 1
In the first holding operation, the nozzle 5 is moved to a reference position, which is a predetermined position, and the electronic component 1 is held. In the component recognition operation, the camera 28 picks up an image of the electronic component 1 held by the nozzle 5 and converts the picked-up image data to the shift amount detecting means 13.
Process in. At this time, in the processing of the imaging data,
A shift amount between the center of the nozzle 5 and a predetermined position, that is, a reference position is calculated, and the calculation result is stored in a storage unit provided in the shift amount detecting means 13.

Next, when the electronic component 1 is taken out from the same component supply unit 7 for the second holding operation, the amount of this deviation is used by using the previous deviation stored in the storage unit. The position of the nozzle 5 is corrected from the reference position. As a result, the relative displacement between the center position of the nozzle and the center position of the electronic component becomes smaller than the previous time. After the second holding operation, the calculation result obtained by averaging the shift amount calculated by the camera 28 and the shift amount calculated by the shift amount detecting means 13 and the first shift amount is corrected at the time of the third holding operation. The amount of deviation for

When the first holding operation is performed, the nozzle 5
The holding position given to the nozzle 5 is referred to as a reference position. In the second holding operation, the amount of deviation calculated at the time of the first holding operation is given to the nozzle 5 as a correction amount with respect to the reference position. Command the nozzle 5. In this way, the shift amount to be corrected at the Nth time is (N-1)
A value obtained by averaging the calculation results up to the first time is given as a deviation amount.

For averaging, a weighted average method may be used. Further, all the shift amounts from the first time to the (N-1) th time may be accumulated in the storage unit and averaged to obtain the Nth time shift amount. Thus, the mounting head unit 2
In the case of moving, the holding position instructed to the nozzle 5 is corrected toward the center of the component by sequentially correcting the holding position using the displacement amount up to the previous time, so that accurate holding of the electronic component becomes possible. Thus, highly reliable electronic component mounting can be realized.

The operation of the electronic component mounting apparatus of the present invention configured as described above will be described in detail based on the standard automatic operation flow shown in FIG.

First, the board 3 is carried into the mounting apparatus by the board transport unit 4 and fixed. Next, a holding operation of the electronic component 1 is performed (step 301).

In the process of adding the holding position correction amount up to the previous time (step 302), the holding position correction means 15
From the displacement amounts of the plurality of tape feeders 8 stored in the storage unit of the displacement amount detecting means 13, data of the displacement amount for correcting the holding position of the tape feeder 8 for supplying the electronic component 1 this time is obtained. The mounting head unit 2 is moved after the take-out position and the current holding position are corrected by the data of the displacement amount.

In the component holding operation (step 303), when the nozzle 5 holds the electronic component 1, the mounting head unit 2 raises the nozzle 5 and simultaneously performs the mounting position moving operation (step 304).

In the mounting position moving operation (step 304), based on the mounting program input to the input data editing means 12, the mounting robot unit 10 moves the nozzle so that the center of the electronic component 1 is positioned at the mounting position. Move 5

When moving to the mounting position, the camera 28 performs a component recognition operation (step 305). In this component recognition operation, a rotation about the vertical direction is applied to rotate the electronic component 1 so as to match the angle of the mounting position, and then the nozzle 5 attached to the mounting head unit 2 is raised to the imaging position ( (Fig. 4). At the same time, the moving mirror 26 is moved to a position directly below the held electronic component 1, and the LED lighting 30 and the diffusion plate 29
Illuminates the electronic component 1 from above, using the movable mirror 26, the fixed mirror 27, and the camera 28 to image the holding posture of the electronic component 1. On the other hand, heart 35 in a nozzle 5 which has been stored in advance
The deviation amount detection means 13 detects the attitude of the electronic component 1, the detection of the relative positional deviation between the center 35 of the nozzle 5 and the center 36 of the electronic component 1, and recognition of various states such as component abnormality.

In the recognition result process (step 306), it is determined whether or not the electronic component is held. FIG. 6 shows the electronic component 1 when the holding posture of the electronic component 1 is imaged.
Where (△ X, △ Y, △ θ) indicates the amount of deviation between the center 36 of the electronic component and the center 35 of the nozzle. This shift amount is also called an offset amount.

The operation of recognizing the electronic component 1 by the camera 28 is performed during the movement to the mounting position.
This is the same as the case where the holding position is not corrected, and the addition of the function does not increase the mounting time.

If the component recognition operation is normal, data registration processing (step 308) is performed. In this data registration process, the shift amount detecting means 13 temporarily stores the calculation results of the shift amount separately for each of the plurality of tape feeders 8, and then calculates the mounting position correction amount (step 309), a component mounting operation (step 310) is performed.

In the component mounting operation (step 310), the posture of the electronic component 1 in the rotational direction is restricted based on the offset amounts △ X, △ Y, and 今 回 θ calculated this time, and the calculation of the correction amount of the mounting position is performed. The electronic component 1 is accurately positioned at the mounting position on the board 3 carried in by the mounting position correcting means 14.
The position of the nozzle 5 is controlled so that the position of the nozzle 5 can be determined. After the mounting positioning in the X, Y, and θ axis directions is completed, the mounting head unit 2 lowers the nozzle 5 and mounts the electronic component 1 on the substrate as shown in FIG.

After the completion of the mounting of the electronic component 1, based on the offset amount once stored, the shift amount detecting means 13 uses the statistical information for calculating the holding position correction amount for the tape feeder 8 to which the electronic component 1 has been supplied this time. Calculation processing (step 31
Perform 1).

When it is determined in the recognition result processing (step 306) that the electronic component 1 is not normal, that is, when the electronic component 1 is not held, or when the held electronic component 1 is input data as described above, If the data is different from the data registered in step 12, the part discharging operation (step 30) is performed.
Perform 7). This part discharging operation is performed by the mounting robot unit 10.
To move the mounting head unit 2 onto a discharge box (not shown) to discharge components.

In the statistical calculation process (step 311) for calculating the holding position correction amount, as shown in FIG. 8, each time the holding operation is performed, the holding position shift amount M ₁ (△ X ₁ , △ Y ₁ , △).
θ ₁ ), M ₂ (△ X ₂ , △ Y ₂ , △ θ ₂ ), M ₃ (△ X ₃ , △
The arithmetic mean (M ₁ + M ₂ + M ₃ +... + M _N ) / N of Y ₃ , △ θ ₃ ),..., M _N (△ X _N , △ Y _N , △ θ _N ) is obtained, and The correction amount H _{N + 1} of the next holding position of the mounting head unit 2 is stored in the deviation amount detecting means 13 for each tape feeder.

The statistical calculation processing (step 311) for calculating the holding position correction amount will be described with reference to an example of a calculation method from the first sampling number to the Nth sampling number according to the statistical calculation processing method shown in FIG. First, count the number of samplings. In the first holding operation, since the data of the shift amount to be corrected is not given to the storage unit of the shift amount detecting means 13, the holding position is not corrected. That is, the holding position correction amount H ₀ =
0. From the imaging result of the state where the nozzle 5 holds the electronic component 1, the data L ₁ , which is the shift amount between the center 35 of the nozzle 5 and the center 36 of the electronic component 1, which is temporarily stored in the data registration process (step 308), is M _It becomes ₁ and the holding position correction amount becomes H ₁ = M ₁ = L ₁ . This is stored for each tape feeder.

[0040] During the second holding operation, when held in the first, using a displacement amount M _1, it will correct the holding position of the nozzle 5. The correction amount of the holding position is H _2.
However, as described above, although the variation in the shift amount is normally distributed, a value that fluctuates in the range of the normal distribution is included each time the holding operation is performed. raised against the retention deviation amount of (M ₂ -H _1), when the recognition operation after the holding operation is completed, the holding location data L ₂ obtained from the recognition result, (M ₂ -H _1), and this From the result, when the number of times of sampling is the second time, the holding position deviation amount M
₂ = (L ₂ + H ₁ ) is obtained, and the holding position correction amount H ₂ = (M ₁ + M ₂ ) / 2 is calculated from the _first correction amount H ₁ = M ₁ and stored for each tape feeder. When the number of times of sampling is the third time, the same processing is performed. When the number of times of sampling is N times, the holding position shift amount M _N = (L _N + H _{N -1} ) is obtained.
(N-1) The previous holding position correction amount H _N−1 = (M ₁ +
From M ₂ + M ₃ +... M _N−1 ) / (N−1), the holding position correction amount H _N = (M ₁ + M ₂ + M ₃ +.
M _N ) / N is calculated and stored for each tape feeder. However, the data obtained from the recognition result may be extremely different from the previous data. Therefore, an allowable value is set in advance by the input data editing means 12, and if the allowable value is exceeded, a deviation occurs. Amount detection means 13
It is determined that the data is not used, and the number of times of sampling is not counted.

Further, the correction amount H of the holding position of the mounting head unit 2 to the component supply position is not limited to the above-described method, but may be an input data.
It is also possible to arbitrarily set the correction amount using the data editing means 12. In the above description, the holding position correction amount H
Has been described using arithmetic mean, but the present invention is not limited to this, and the correction amount H can be obtained. That is, in the case of a feeder with little variation, it may be sufficient to select an appropriate number (for example, five new ones). It may be operation data. There are other similar calculation methods. In any case, the holding position correction amount H obtained from the calculation result is used.
It is possible to correct the holding position of the nozzle.

After completion of the statistical calculation process (step 311) for calculating the holding position correction amount, a component mounting step process (step 312) is performed. In this component mounting step processing, it is determined whether there is a component to be mounted next based on the program of the mounting step input to the input data editing means 12, and when there is an electronic component to be mounted, The component holding operation (step 303) is repeated. If it does not exist, the installation ends. In the component holding operation, the electronic component 1 is supplied from the same tape feeder in the future using the correction amount based on the stored arithmetic average value, and when the mounting head 2 moves, the position of the center 35 of the nozzle 5 is The moving amount is controlled so as to match the center 36. As a result, FIG.
As shown by 0, the holding position converges to the center of the component, and stable component holding can be performed.

According to the present invention, when taking out the electronic component 1 from the same component supply unit, that is, when performing the second and subsequent holding operations, the shift amount stored in the storage unit is used to determine the shift amount. The position of the nozzle 5 is corrected from the reference position by the amount of. As a result, the relative displacement between the center position of the nozzle and the center position of the electronic component becomes smaller than the previous time. In this way, when the mounting head is moved, the holding position instructed to the nozzle is corrected toward the center of the component by sequentially correcting the holding position using the displacement amount up to the previous time, so that accurate Electronic components can be held, and highly reliable electronic component mounting can be realized.

Since the operation of recognizing the electronic component by the camera is performed during the movement to the mounting position, the mounting time is
This is the same as the case where the holding position is not corrected, and the addition of the function does not increase the mounting time.

Although the present embodiment is a case of a tape feeder, in the case of a stick feeder or a tray feeder, the deviation between the center of the supplied electronic component and the center of the nozzle is the same as in the above-described embodiment. By the method, the shift amount for correcting the nozzle position can be obtained from the image data obtained by the camera.

[0046]

As described above, according to the present invention, the holding mounting
Accurate correction of the deviation of the holding position from the initial stage of work
Required for mounting electronic components on a mounting board.
It is possible to hold and mount electronic components at high speed and accurately without increasing processing time .

[Brief description of the drawings]

FIG. 1 is a view schematically showing an electronic component mounting apparatus according to an embodiment of the present invention.

FIG. 2 is a diagram illustrating a configuration of a control unit of the mounting apparatus of FIG. 1;

FIG. 3 is a flowchart showing the operation of the electronic component mounting apparatus of the present invention during standard automatic operation.

FIG. 4 is an explanatory diagram showing a configuration of a mounting head unit.

FIG. 5 is an explanatory diagram showing a taped electronic component.

FIG. 6 is an explanatory diagram showing a shift amount between an electronic component and a nozzle center when the electronic component is held.

FIG. 7 is an explanatory diagram showing a mounting state of an electronic component.

FIG. 8 is an explanatory diagram showing a method of statistical calculation.

FIG. 9 is an explanatory diagram showing a method of statistical calculation for obtaining a holding position correction amount.

FIG. 10 is an explanatory diagram showing the effect of this processing.

[Explanation of symbols]

DESCRIPTION OF SYMBOLS 1 ... Electronic component, 2 ... Mounting head part, 3 ... Substrate, 4 ... Board transfer part, 5 ... Nozzle, 6 ... Input data screen, 7 ... Component supply part, 8 ... Tape feeder, 9 ... Re , 10 ... on-board robot unit, 11 ... control unit, 12 ... input data editing means,
13: shift amount detecting means, 14: mounting position correcting means, 15
... holding position correcting means, 26 ... moving mirror, 27 ... fixed mirror, 28 ... camera, 29 ... diffusion plate, 30 ... LED lighting, 31 ... cylinder, 32 ... parts storage hole, 33 ... te
, 34: pitch feed hole, 35: nozzle center, 36: electronic component center, 302: addition processing of the holding position correction amount up to the previous time, 303: component holding operation, 304: mounting position moving operation, 305: component recognition operation , 307 ... Part discharging operation, 3
08: data registration processing, 309: calculation processing of mounting position correction amount, 310: component mounting operation, 311: statistical calculation processing for calculating holding position correction amount, 312: mounting step processing

──────────────────────────────────────────────────続 き Continuing on the front page (72) Inventor Makoto Honma 5-2-2 Koyodai, Ryugasaki-city, Ibaraki Pref. Hitachi Techno Engineering Co., Ltd. Ryugasaki Plant (72) Inventor Terumi Ogawa 5-2-2 Koyodai, Ryugasaki-shi, Ibaraki Hitachi Techno Engineering Co., Ltd. Development Laboratory (72) Inventor Akira Hirai 5-2-2 Koyodai, Ryugasaki City, Ibaraki Prefecture Hitachi Techno Engineering Co., Ltd. Development Laboratory (56) References JP-A-2-191400 (JP, A) 5-50500 (JP, A) JP-A-6-125198 (JP, A) JP-A-7-193397 (JP, A) (58) Fields investigated (Int. Cl. ⁶ , DB name) H05K 13/04

Claims (4)

(57) [Claims] 1. A substantially determine the center and the shift of the center of the electronic component holding means in a state held by the holding means an electronic component supplied to a predetermined position in the component supply unit, displacement and transfer the electronic components on a substrate In the mounting method of the electronic component, the electronic component is mounted after correcting the amount and correcting the holding position when the next holding unit holds the electronic component based on the shift amount. In the first holding, the electronic component is held. The center of the holding means is located at the reference position designated in the step (a), and the holding position shift amount when the electronic component is held is obtained. In the second holding, the holding means is determined based on the first holding position shift amount. Corrects the holding position when holding the electronic component. Hereinafter, the correction of the holding position for the N-th holding is performed by (N−
1) A mounting method of an electronic component, wherein the mounting is performed using a value obtained by averaging the holding position deviation amount until the first holding. 2. The electronic device according to claim 1, wherein when the holding position shift amount of the electronic component by the holding means exceeds an allowable value, the mounting of the electronic component on the substrate is stopped and the holding position shift in this case is stopped. A method of mounting an electronic component, wherein the amount is not used for averaging the holding position shift amount until the (N-1) th holding. 3. A shift amount between the center of the holding means and the center of the electronic component is determined by a shift amount detecting means in a state where the electronic component supplied to a substantially predetermined position by the component feeding means is held by the holding means. The electronic component mounting device corrects the amount of the electronic component, mounts the electronic component on the board, mounts the electronic component on the board, and corrects the holding position when the electronic component is next held by the holding device based on the shift amount. In the first holding, the amount detecting means locates the center of the holding means at a reference position designated for holding the electronic component, obtains a holding position shift amount when holding the electronic component, and The holding position correction means calculates the average value of the holding position shift amount up to the (N-1) th holding for the N-th holding, and the first holding position shift amount in the second holding. Holding the base The holding position when the step holds the electronic component is corrected, and thereafter, the holding position for the N-th holding is corrected by the average value of the holding position shift amounts until the (N-1) -th holding. An electronic component mounting apparatus characterized in that: 4. The electronic device according to claim 3, wherein the shift amount detecting means captures an electronic component held by the holding means with a camera and processes the image data to detect a holding position shift amount. Component mounting equipment.