JP2915305B2 - Matting plating method and matting plating method for meter reader - Google Patents

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention applies matte plating, for example, to buttons for clothes, decorative accessories for furniture, decorative articles to be attached to sporting goods, and various other objects to be plated (so-called workpieces). The present invention relates to such a matte plating method and a matte plating method compatible with a meter reader.

[0002]

2. Description of the Related Art Hitherto, as a method of applying matte plating to the surface of a plated object in the above-described example, a fine surface is applied to the surface of the plated object by using several kinds of surfactants by an electroplating means. There is a method of forming a matte plating layer by providing irregularities.

However, the surface of the above-mentioned plated object (for example, buttons and various decorative parts) itself generally has an uneven portion. When matte plating is performed by a plating method, there are the following problems.

That is, when performing electroplating, an object to be plated (a so-called work) is applied to a negative electrode via a negative electrode plate (cathode), and the object to be plated applied to the negative electrode and an anode (positive electrode plate) are applied. Is the distance between the anode and the convex portion of the body to be plated having the uneven portion,
The current density (unit: A / cm2) of the convex portion of the object to be plated is large, and the current density of the concave portion of the object to be plated is small. Due to the difference that occurs, a good matte plating layer is formed on the convex portion of the object to be plated, but the matte plating layer is insufficiently formed on the concave portion of the object to be plated. There has been a problem that the matte state of the formed matte plating layer as a whole varies greatly.

[0005] On the other hand, when a button for clothing is selected as the above-mentioned body to be plated, sufficient control of sewing needles is impossible due to recent high dependency on overseas sewing, and a matte plating layer having a coercive force is required. It becomes difficult to identify a broken needle that has a coercive force, and it is determined to be defective by a needle detector that detects broken needles.Therefore, it is required to apply matte plating that is compatible with a needle detector that does not have magnetism. You.

[0006]

The invention according to claim 1 of the present invention uses a uniform surface roughening means using 100 to 200 mesh emery powder and a barrel plating means which makes the current density substantially uniform. Accordingly, it is an object of the present invention to provide a matte plating method capable of applying a final decorative plating layer having a uniform matte state.

[0007] The invention of claim 2, wherein the present invention is 100
By using a uniform surface roughening means using emery powder of ~ 200 mesh and a barrel plating means having a substantially uniform current density, it is possible to apply an acidic chemical nickel plating layer having a uniform matte state, An object of the present invention is to provide a matte plating method that can form a magnetic chemical nickel plating layer and that is compatible with a needle detector.

[0008]

According to a first aspect of the present invention, an underplating is formed by applying an underplating to an object to be plated made of resin, metal, or ceramic. After a copper plating layer is formed by an electric barrel plating means, 100 to 20
A 0 mesh emery powder is sprayed to perform honing treatment, and a matte copper plating layer or a glossy nickel plating layer is formed on the surface of the honed copper plating layer by an electric barrel plating means. It is a matte plating method in which a final decorative plating layer is formed on the surface of a plating layer or a nickel plating layer having only luster.

The invention according to a second aspect of the present invention provides a method for forming a chemical copper plating layer by applying a chemical copper plating to a resin or ceramic plate to be plated, and applying an electric barrel plating means on the surface of the chemical copper plating layer. After forming the copper plating layer,
A 100-200 mesh emery powder is sprayed on the surface of the copper plating layer to perform honing treatment, and a matte copper plating layer is formed on the surface of the honed copper plating layer by an electric barrel plating means. It is characterized in that it is a matte plating method corresponding to a needle detector for forming an acidic chemical nickel plating layer on the surface of a copper plating layer.

[0010]

According to the first aspect of the present invention, an undercoating layer (for example, when the material is a resin, a chemical After a copper plating layer (a copper sulfate plating layer or a chemical nickel plating layer) is formed, and a copper plating layer (a copper sulfate plating layer or a copper pyrophosphate plating layer) is formed on the surface of the base plating layer by an electric barrel plating means, the above-described copper plating layer is formed. The surface of the copper plating layer is uniformly roughened by spraying 100 to 200 mesh of emulsified powder on the surface of the plating layer, and an electric barrel is formed on the copper plating surface after such honing treatment. Non-glossy copper plating layer (non-glossy copper plating layer) or luster only with no leveling property (that is, it does not fill in fine irregularities formed by emery powder) Kkerumekki layer is formed, then the final decorative plating layer is formed.

[0011] Thus, the above-mentioned 100-200 mesh
The surface of the copper plating layer formed on the surface of these uneven portions is uniformly roughened even if the body to be plated has uneven portions (so-called peaks and valleys) by the emery powder, and the current density is substantially reduced. Since the matte copper plating layer or the nickel plating layer having only luster is formed by the uniform electric barrel plating means, there is an effect that a final decorative plating layer having a uniform matte state can be formed. By the way, the matt state is that the convex part of the plating object is rubbed against the convex part of each plating object by rotating the barrel, and the concave part is plated by glossy, semi-glossy plating solution. The protrusions are slightly glossy to the extent that they do not vary, so that the matte state is exactly opposite to the matte state by the conventional electroplating method.

According to the second aspect of the present invention,
A non-magnetic chemical copper plating layer (electroless copper plating layer) is formed on an object to be plated (a so-called work) made of resin or ceramic other than metal, and an electric barrel plating is applied to the surface of this chemical copper plating layer. After the copper plating layer (copper sulfate plating layer or pyrophosphoric acid plating layer) is formed by means, 100 to 20
By spraying 0 mesh emery powder, the surface of the copper plating layer is uniformly roughened (honed), and the surface of the copper plating layer after such honing treatment is matted with an electric barrel plating means. Is formed, and an acidic chemical nickel plating layer is formed on the surface of the matte copper plating layer.

Phosphorus precipitates from sodium hypophosphite used as a reducing agent when the above-mentioned acidic chemical nickel plating layer is formed, and becomes an acidic chemical nickel plating layer of a Ni—P alloy having a phosphorus content percentage of 10 wt% or more. Both the non-magnetic effect of the copper constituting the layer and the non-magnetic effect of the high-phosphorus type make it possible to form a matte plating layer (specifically, a chemical nickel plating layer) that is non-magnetic and compatible with a needle detector. It is effective when the body is selected as a button for clothes.

In addition, the above-mentioned 100 to 200 mesh emery powder uniformly roughens the surface of the copper plating layer and matte copper plating by an electric barrel plating means that makes the current density substantially uniform. Since the layer is formed, there is an effect that an acidic chemical nickel plating layer having a uniform matte state can be formed. In addition, by performing acidic chemical nickel plating, corrosion resistance is remarkably improved as compared with a conventional plated body of only electrolytic plating, and trouble can be prevented.

Further, when the above-mentioned high phosphorus type acidic chemical nickel plating film is activated and then subjected to Ag plating to form a black chemical conversion film on Ag, antique (ancient color) silver corresponding to a needle detector is obtained. It became possible to form a final decorative plating layer of color.

[0016]

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS One embodiment of the present invention will be described below in detail with reference to the drawings. First Embodiment First, a matte plating method (an embodiment corresponding to claim 1) will be described with reference to FIGS. In this case, the material to be plated may be any of resin, metal, and ceramic because it is not necessary to make the material non-magnetic, but in the following description, ABS (Acrylic)
The description will be given using a lonitrile butadiene Styrene copolymer (a thermoplastic resin).

In FIG. 1, a plating object 1 made of ABS resin which has been subjected to ordinary degreasing and other pretreatment is provided, and the surface of the plating object 1 is subjected to chemical plating as an underlying plating (alkaline chemical copper plating or chemical plating). Nickel plating is performed to form a chemical plating layer 2 (alkaline chemical copper plating layer or chemical nickel plating layer) as shown in FIG.

The objects 1 to be plated on which the above-mentioned chemical plating layer 2 is formed are put into a barrel of a barrel plating apparatus, and the surface of the above-mentioned chemical plating layer 2 is electrically barrel-plated as shown in FIG. A copper plating layer 3 (copper sulfate CuSO4 plating layer or copper pyrophosphate plating layer) having a layer thickness of 30 to 50 [mu] m is formed.

After the object 1 on which the above-mentioned copper plating layer 3 is formed is taken out from the barrel and dried, as shown in FIG. 4, emery powder 4 (corundum and magnetite are extremely deposited on the surface of the copper plating layer 3). Honing treatment is performed by injecting a natural mineral or man-made emery powder that is intimately mixed with a fine structure from a predetermined distance at a constant pressure.

The above honing processing conditions are as follows. Emery powder: 100 to 200 mesh Injection pressure: 1.0 to 4.0 kg / cm2 Injection time: 10 to 60 minutes
Even if the object to be plated 1 has an uneven portion, the entire surface of the copper plating layer 3 corresponding to the concave portion and the convex portion is uniformly roughened, and the surface of the copper plating layer 3 has fine irregularities (coated). Not the unevenness of the plated body 1 itself, but a number of not shown) are formed.

Next, the object to be plated 1 having been subjected to the honing treatment
Are put into the barrel of the barrel plating apparatus, and the surface of the roughened copper plating tank 3 is coated with a matte copper plating layer 5 (copper plating without brightener) as shown in FIG. Specifically, a nickel pyrophosphate plating layer or a copper sulfate plating layer) or a nickel layer having only gloss and no leveling property is formed. Here, when the matte copper plating layer 5 is formed, the pH is adjusted with ammonia NH3, so that ammonia substitutes for the pure brightener.

Next, as shown in FIG. 6, a final decorative plating layer 6 is formed on the surface of the above-mentioned matte copper plating layer 5 or nickel plating layer having only luster. As the final decorative plating layer 6, for example, an acidic chemical nickel plating layer or the like can be formed. Thus, the above-described 100 to 2
The surface of the copper plating 3 is uniformly roughened with the emery powder 4 of 00 mesh, and the leveling property is provided only by the matte copper plating layer 5 or the glossiness by the electric barrel plating means which makes the current density substantially uniform. In other words, since a nickel plating layer that does not fill the fine irregularities formed by the emery powder 4 is formed, there is an effect that the final decorative plating 6 having a uniform matte state can be formed.

(Second Embodiment) Next, a matte plating method (an embodiment corresponding to claim 2) corresponding to a needle detector will be described with reference to FIGS.
In this case, the material of the object to be plated may be any material other than metal, that is, any of resin and ceramic. However, in the following description, an ABS resin is used as a resin that can be plated.

In FIG. 7, AB having undergone normal pre-processing
An object to be plated 11 made of S resin is provided.
Is subjected to alkaline chemical copper plating to form a chemical copper plating layer 12 as shown in FIG.

The objects 11 to be plated on which the above-mentioned chemical copper plating layer 12 has been formed are put into the barrel of a barrel plating apparatus, and the surface of the above-mentioned chemical copper plating layer 12 is shown in FIG. Thus, a copper plating layer 13 (copper sulfate plating layer or copper pyrophosphate plating layer) having a layer thickness of 30 to 50 μm is formed.

After the object to be plated 11 on which the above-mentioned copper plating layer 13 is formed is taken out from the barrel and dried, FIG.
As shown in (1), honing treatment is performed by spraying emery powder 14 from the predetermined distance to the surface of the copper plating layer 13 at a constant pressure.

The above honing conditions are as follows. Emery powder: 100 to 200 mesh Injection pressure: 1.0 to 4.0 kg / cm2 Injection time: 10 to 60 minutes The entire surface of the copper plating layer 13 is uniform by the above honing treatment by spraying the emery powder 14. A large number of fine irregularities (not the irregularities of the object to be plated 11 itself, not shown) are formed on the surface.

Next, the object 1 to be plated after the honing treatment
Are charged into the barrel of a barrel plating apparatus, and the surface of the roughened copper plating layer 13 is coated with a matte copper plating layer 15 (copper without brightener) as shown in FIG. A plating layer, specifically, a copper pyrophosphate plating layer or a copper sulfate plating layer) is formed. Here, when the matte copper plating layer 15 is formed, the pH is adjusted with ammonia.
When adjusted, ammonia replaces the pure brightener.

Next, an acidic chemical nickel plating layer 16 is formed on the surface of the above-mentioned matte copper plating layer 15 as shown in FIG. Phosphorus precipitates from sodium hypophosphite used as a reducing agent when the acidic chemical nickel plating layer 16 is formed, and becomes an acidic chemical nickel plating layer 16 of a Ni.P alloy having a phosphorus content of 10% by weight or more.

As described above, the non-magnetic copper (metal that does not have magnetism instead of iron group metal such as Fe, Ni, Cr, Co, Mn, and Mo) constituting each of the plating layers 12, 13, and 15 is used. The action of the high-phosphorus type non-magnetic (refer to the acidic chemical nickel plating layer 16) makes it possible to form the non-magnetic and matte plating layer 16 corresponding to the needle detector. In particular, the object to be plated 11 is used as a button for clothes. It is effective when selected.

Further, the surface of the copper plating layer 13 is uniformly roughened by the above-mentioned 100-200 mesh dust powder 14, and the electric current density is substantially uniform. Since the bright copper plating layer 15 is formed, the acid chemical nickel plating layer 16 having a uniform matte state is not formed.
There is an effect that can be formed.

Further, the above-mentioned high-phosphorus type acidic chemical nickel plating film is activated, and silver plating is performed thereon to form a black chemical conversion film on silver. ) A final decorative plating layer (not shown) of a silver color can be formed.

In the correspondence between the structure of the present invention and the above-described embodiment, the undercoat plating layer of the present invention corresponds to the chemical plating layer 2 (alkaline chemical copper plating layer, chemical nickel plating layer) of the embodiment. Similarly, the copper plating layers 3 and 13
Corresponds to the copper sulfate plating layer or copper pyrophosphate plating layer, matte copper plating layer 5 and 15 corresponds to the copper sulfate plating layer or copper pyrophosphate plating layer, the final decorative plating layer 6, an acidic chemical nickel Although corresponding to the plating layer, the present invention is not limited to only the configuration of the above-described embodiment.

[Brief description of the drawings]

FIG. 1 is an explanatory view of an object to be plated showing a matte plating method of the present invention.

FIG. 2 is an explanatory view of a base plating layer forming step.

FIG. 3 is an explanatory diagram of a copper plating layer forming step.

FIG. 4 is an explanatory view of a honing step.

FIG. 5 is an explanatory diagram of a matte copper plating layer forming process.

FIG. 6 is an explanatory diagram of a final decorative plating layer forming step.

FIG. 7 is an explanatory view of an object to be plated showing a matte plating method corresponding to a needle detector of the present invention.

FIG. 8 is an explanatory diagram of a chemical copper plating layer forming step.

FIG. 9 is an explanatory diagram of a copper plating layer forming step.

FIG. 10 is an explanatory view of a honing step.

FIG. 11 is an explanatory diagram of a matte copper plating layer forming step.

FIG. 12 is an explanatory view of a step of forming an acidic chemical nickel plating.

[Explanation of symbols]

 1, 11: Plated object 2: Chemical plating layer 3, 13: Copper plating layer 4, 14: Emery powder 5, 15: Matte copper plating layer 6: Final decorative plating layer 12: Chemical copper plating layer 16: Acid chemistry Nickel plating layer

Continuation of the front page (56) References JP-A-2-115390 (JP, A) JP-A-4-74890 (JP, A) JP-A-2-36310 (JP, U) JP-B-40-26134 (JP) , B1) Practical application A microfilm (JP, U) photographing the contents of the specification and drawings attached to the application form of Japanese Patent Application No. 63-108160 (Japanese Utility Model Application No. 2-36310) (58) Fields investigated (Int. . ^6, DB name) C25D 5/00 - 7/12

Claims (2)

(57) [Claims] 1. An underplating layer is formed by applying a baseplate to a body made of resin, metal or ceramic, and a copper plating layer is formed on the surface of the baseplate layer by an electric barrel plating means. 100 on the copper plating layer surface
A 200-mesh emery powder is sprayed to perform honing treatment. A matte copper plating layer or a gloss-only nickel plating layer is formed on the honed copper plating layer surface by an electric barrel plating means. A matte plating method in which a final decorative plating layer is formed on the surface of a copper plating layer or a nickel plating layer having only luster. 2. A method for forming a copper plating layer by applying a chemical copper plating to a plating object made of resin or ceramic, forming a copper plating layer on the surface of the chemical copper plating layer by an electric barrel plating means, 100 on the copper plating layer surface
Honing treatment by spraying emery powder of ~ 200 mesh, forming a matte copper plating layer on the surface of the honed copper plating layer by an electric barrel plating means, acid on the surface of the matte copper plating layer A matte plating method compatible with a needle detector that forms a chemical nickel plating layer.