JP2908881B2 - 印刷回路基板構造とヒートシンク構造との組立体を作成する方法および印刷回路基板構造とヒートシンク構造との組立体 - Google Patents

印刷回路基板構造とヒートシンク構造との組立体を作成する方法および印刷回路基板構造とヒートシンク構造との組立体

Info

Publication number
JP2908881B2
JP2908881B2 JP8522512A JP52251296A JP2908881B2 JP 2908881 B2 JP2908881 B2 JP 2908881B2 JP 8522512 A JP8522512 A JP 8522512A JP 52251296 A JP52251296 A JP 52251296A JP 2908881 B2 JP2908881 B2 JP 2908881B2
Authority
JP
Japan
Prior art keywords
circuit board
printed circuit
heat
heat sink
exchange element
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
JP8522512A
Other languages
English (en)
Japanese (ja)
Other versions
JPH10502773A (ja
Inventor
カッチマール，ローマン
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Nortel Networks Ltd
Original Assignee
Northern Telecom Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Northern Telecom Ltd filed Critical Northern Telecom Ltd
Publication of JPH10502773A publication Critical patent/JPH10502773A/ja
Application granted granted Critical
Publication of JP2908881B2 publication Critical patent/JP2908881B2/ja
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0201—Thermal arrangements, e.g. for cooling, heating or preventing overheating
    • H05K1/0203—Cooling of mounted components
    • H05K1/0204—Cooling of mounted components using means for thermal conduction connection in the thickness direction of the substrate
    • H05K1/0206—Cooling of mounted components using means for thermal conduction connection in the thickness direction of the substrate by printed thermal vias
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/40—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs
    • H01L23/4006—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs with bolts or screws
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/42—Fillings or auxiliary members in containers or encapsulations selected or arranged to facilitate heating or cooling
    • H01L23/433—Auxiliary members in containers characterised by their shape, e.g. pistons
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/40—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs
    • H01L23/4006—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs with bolts or screws
    • H01L2023/4037—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs with bolts or screws characterised by thermal path or place of attachment of heatsink
    • H01L2023/405—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs with bolts or screws characterised by thermal path or place of attachment of heatsink heatsink to package
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/40—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs
    • H01L23/4006—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs with bolts or screws
    • H01L2023/4037—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs with bolts or screws characterised by thermal path or place of attachment of heatsink
    • H01L2023/4056—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs with bolts or screws characterised by thermal path or place of attachment of heatsink heatsink to additional heatsink
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/40—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs
    • H01L23/4006—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs with bolts or screws
    • H01L2023/4037—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs with bolts or screws characterised by thermal path or place of attachment of heatsink
    • H01L2023/4062—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs with bolts or screws characterised by thermal path or place of attachment of heatsink heatsink to or through board or cabinet
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/40—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs
    • H01L23/4006—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs with bolts or screws
    • H01L2023/4037—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs with bolts or screws characterised by thermal path or place of attachment of heatsink
    • H01L2023/4068—Heatconductors between device and heatsink, e.g. compliant heat-spreaders, heat-conducting bands
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0201—Thermal arrangements, e.g. for cooling, heating or preventing overheating
    • H05K1/0203—Cooling of mounted components
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/02—Fillers; Particles; Fibers; Reinforcement materials
    • H05K2201/0203—Fillers and particles
    • H05K2201/0206—Materials
    • H05K2201/0209—Inorganic, non-metallic particles
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/06—Thermal details
    • H05K2201/066—Heatsink mounted on the surface of the printed circuit board [PCB]
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09209—Shape and layout details of conductors
    • H05K2201/09372—Pads and lands
    • H05K2201/0949—Pad close to a hole, not surrounding the hole
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09209—Shape and layout details of conductors
    • H05K2201/095—Conductive through-holes or vias
    • H05K2201/0959—Plated through-holes or plated blind vias filled with insulating material
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09209—Shape and layout details of conductors
    • H05K2201/09654—Shape and layout details of conductors covering at least two types of conductors provided for in H05K2201/09218 - H05K2201/095
    • H05K2201/0969—Apertured conductors
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10613—Details of electrical connections of non-printed components, e.g. special leads
    • H05K2201/10621—Components characterised by their electrical contacts
    • H05K2201/10689—Leaded Integrated Circuit [IC] package, e.g. dual-in-line [DIL]
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10613—Details of electrical connections of non-printed components, e.g. special leads
    • H05K2201/10621—Components characterised by their electrical contacts
    • H05K2201/10734—Ball grid array [BGA]; Bump grid array
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/01—Tools for processing; Objects used during processing
    • H05K2203/0104—Tools for processing; Objects used during processing for patterning or coating
    • H05K2203/0126—Dispenser, e.g. for solder paste, for supplying conductive paste for screen printing or for filling holes
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
    • H05K3/4038—Through-connections; Vertical interconnect access [VIA] connections
    • H05K3/4053—Through-connections; Vertical interconnect access [VIA] connections by thick-film techniques
    • H05K3/4069—Through-connections; Vertical interconnect access [VIA] connections by thick-film techniques for via connections in organic insulating substrates

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Power Engineering (AREA)
  • Thermal Sciences (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
JP8522512A 1995-01-25 1996-01-19 印刷回路基板構造とヒートシンク構造との組立体を作成する方法および印刷回路基板構造とヒートシンク構造との組立体 Expired - Fee Related JP2908881B2 (ja)

Applications Claiming Priority (6)

Application Number Priority Date Filing Date Title
CA2141091 1995-01-25
US51627195A 1995-08-17 1995-08-17
US516,271 1995-08-17
US2,141,091 1995-08-17
US08/516,271 1995-08-17
PCT/CA1996/000028 WO1996023397A1 (en) 1995-01-25 1996-01-19 Printed circuit board and heat sink arrangement

Publications (2)

Publication Number Publication Date
JPH10502773A JPH10502773A (ja) 1998-03-10
JP2908881B2 true JP2908881B2 (ja) 1999-06-21

Family

ID=25677755

Family Applications (1)

Application Number Title Priority Date Filing Date
JP8522512A Expired - Fee Related JP2908881B2 (ja) 1995-01-25 1996-01-19 印刷回路基板構造とヒートシンク構造との組立体を作成する方法および印刷回路基板構造とヒートシンク構造との組立体

Country Status (6)

Country Link
EP (1) EP0807372A1 (de)
JP (1) JP2908881B2 (de)
KR (1) KR19980701642A (de)
CN (1) CN1114338C (de)
AU (1) AU697409B2 (de)
WO (1) WO1996023397A1 (de)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN107076458A (zh) * 2014-10-21 2017-08-18 韦巴斯托股份公司 具有集成的温度传感器的加热装置

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DE19701731A1 (de) * 1997-01-20 1998-07-23 Bosch Gmbh Robert Steuergerät bestehend aus mindestens zwei Gehäuseteilen
US5847452A (en) * 1997-06-30 1998-12-08 Sun Microsystems, Inc. Post mounted heat sink method and apparatus
US6741480B2 (en) 1999-07-15 2004-05-25 Incep Technologies, Inc. Integrated power delivery with flex circuit interconnection for high density power circuits for integrated circuits and systems
US20030214800A1 (en) 1999-07-15 2003-11-20 Dibene Joseph Ted System and method for processor power delivery and thermal management
US6304450B1 (en) 1999-07-15 2001-10-16 Incep Technologies, Inc. Inter-circuit encapsulated packaging
US6452113B2 (en) 1999-07-15 2002-09-17 Incep Technologies, Inc. Apparatus for providing power to a microprocessor with integrated thermal and EMI management
US6618268B2 (en) 1999-07-15 2003-09-09 Incep Technologies, Inc. Apparatus for delivering power to high performance electronic assemblies
US6801431B2 (en) 1999-07-15 2004-10-05 Incep Technologies, Inc. Integrated power delivery and cooling system for high power microprocessors
US6356448B1 (en) 1999-11-02 2002-03-12 Inceptechnologies, Inc. Inter-circuit encapsulated packaging for power delivery
GB9929800D0 (en) 1999-12-17 2000-02-09 Pace Micro Tech Plc Heat dissipation in electrical apparatus
DE10210041B4 (de) * 2002-03-07 2009-04-16 Continental Automotive Gmbh Wärmeableitvorrichtung zum Ableiten von Wärme, die von einem elektrischen Bauelement erzeugt wird und Verfahren zum Herstellen einer derartigen Wärmeableitvorrichtung
JP4078400B2 (ja) * 2003-03-19 2008-04-23 テクトロニクス・インターナショナル・セールス・ゲーエムベーハー 電子デバイスの放熱システム
SE529673C2 (sv) * 2004-09-20 2007-10-16 Danaher Motion Stockholm Ab Kretsarrangemang för kylning av ytmonterade halvledare
US7889502B1 (en) * 2005-11-04 2011-02-15 Graftech International Holdings Inc. Heat spreading circuit assembly
US7303005B2 (en) * 2005-11-04 2007-12-04 Graftech International Holdings Inc. Heat spreaders with vias
US7365988B2 (en) 2005-11-04 2008-04-29 Graftech International Holdings Inc. Cycling LED heat spreader
EP1916884B1 (de) 2006-10-27 2011-04-06 Agie Charmilles SA Leiterplatteneinheit und Verfahren zur Herstellung dazu
US20090165302A1 (en) * 2007-12-31 2009-07-02 Slaton David S Method of forming a heatsink
CN101505579B (zh) * 2008-02-05 2012-01-11 台达电子工业股份有限公司 散热模块及其支撑件
DE102008033193A1 (de) * 2008-07-15 2010-02-04 Continental Automotive Gmbh Motorsteuerungsvorrichtung eines Fahrzeugs
DE102008039921B4 (de) * 2008-08-27 2021-06-10 Vitesco Technologies GmbH Verfahren zur Herstellung eines elektronischen Geräts mit diskretem Bauelement
CN101873784B (zh) * 2009-04-27 2012-08-08 台达电子工业股份有限公司 电子元件的散热模块及其组装方法
CN101965121A (zh) * 2010-10-09 2011-02-02 肖方一 一种发热元件的导热结构的制备方法及该导热结构
DE102012206980A1 (de) * 2012-04-26 2013-10-31 Robert Bosch Gmbh Vorrichtung zum Positionieren einer Leiterplatte
US9036352B2 (en) * 2012-11-30 2015-05-19 Ge Aviation Systems, Llc Phase change heat sink for transient thermal management
JP2017199819A (ja) * 2016-04-28 2017-11-02 日立オートモティブシステムズ株式会社 電子制御装置
KR102580830B1 (ko) * 2016-07-13 2023-09-20 삼성전기주식회사 인쇄회로기판
KR102573804B1 (ko) * 2018-12-18 2023-09-01 현대자동차주식회사 통합 제어 유닛, 이를 포함하는 차량 및 그 제어 방법

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DE3477101D1 (en) * 1983-03-25 1989-04-13 Mitsubishi Electric Corp Heat radiator assembly for cooling electronic parts
GB8601746D0 (en) * 1986-01-24 1986-02-26 British Telecomm Heat sink
US4849856A (en) * 1988-07-13 1989-07-18 International Business Machines Corp. Electronic package with improved heat sink
US4914551A (en) * 1988-07-13 1990-04-03 International Business Machines Corporation Electronic package with heat spreader member
DE4106185A1 (de) * 1991-02-27 1992-09-03 Standard Elektrik Lorenz Ag Kuehlvorrichtung fuer elektronische einrichtungen
US5467251A (en) * 1993-10-08 1995-11-14 Northern Telecom Limited Printed circuit boards and heat sink structures

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN107076458A (zh) * 2014-10-21 2017-08-18 韦巴斯托股份公司 具有集成的温度传感器的加热装置
KR20190052177A (ko) * 2014-10-21 2019-05-15 베바스토 에스이 통합 온도 센서를 가진 가열 디바이스
KR102132572B1 (ko) * 2014-10-21 2020-07-09 베바스토 에스이 통합 온도 센서를 가진 가열 디바이스

Also Published As

Publication number Publication date
AU4428396A (en) 1996-08-14
JPH10502773A (ja) 1998-03-10
EP0807372A1 (de) 1997-11-19
WO1996023397A1 (en) 1996-08-01
AU697409B2 (en) 1998-10-08
KR19980701642A (ko) 1998-06-25
CN1169235A (zh) 1997-12-31
MX9705577A (es) 1997-11-29
CN1114338C (zh) 2003-07-09

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