JP2894579B2 - Pre-bonding treatment method for circuit boards - Google Patents
Pre-bonding treatment method for circuit boardsInfo
- Publication number
- JP2894579B2 JP2894579B2 JP4064239A JP6423992A JP2894579B2 JP 2894579 B2 JP2894579 B2 JP 2894579B2 JP 4064239 A JP4064239 A JP 4064239A JP 6423992 A JP6423992 A JP 6423992A JP 2894579 B2 JP2894579 B2 JP 2894579B2
- Authority
- JP
- Japan
- Prior art keywords
- gold layer
- ultraviolet light
- energy density
- irradiation
- laser beam
- Prior art date
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- Cleaning Or Drying Semiconductors (AREA)
Description
【０００１】[0001]
【産業上の利用分野】この発明は、回路基板のボンディ
ング前処理方法に関する。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a method for pre-bonding a circuit board.
【０００２】[0002]
【従来の技術】従来、例えば、ＰＧＡ（ピングリッドア
レイ）などのように回路基板上にボンディング性の良い
金層を設けたものがある。例えば、この金層のところで
電子部品等を接合（ボンディング）するのであるが、金
層の表面にゴミ、ほこりやオイル等の汚れ（汚染物）が
付着していると、接合信頼性が低下するため、接合を行
う前に金層の表面を浄化する必要がある。2. Description of the Related Art Conventionally, for example, a PGA (pin grid array) or the like is provided with a gold layer having good bonding properties on a circuit board. For example, electronic components and the like are joined (bonded) at the gold layer. If dirt (dust, oil, etc.) adheres to the surface of the gold layer, the bonding reliability decreases. Therefore, it is necessary to clean the surface of the gold layer before joining.
【０００３】従来の金層の表面の浄化方法としては、フ
ロン等の化学薬品を用いて金層の表面を洗浄し汚染物を
除去する湿式方法（化学的方法）が先ず挙げられるが、
この他、レーザ光線を金層の表面に照射して汚染物を除
去する乾式方法（物理的方法）もある（特開平２−２５
６２４９号公報）。As a conventional method of cleaning the surface of the gold layer, a wet method (chemical method) of cleaning the surface of the gold layer with a chemical such as chlorofluorocarbon to remove contaminants is first mentioned.
In addition, there is also a dry method (physical method) of irradiating the surface of the gold layer with a laser beam to remove contaminants (Japanese Patent Laid-Open No. 2-25).
No. 6249).
【０００４】[0004]
【発明が解決しようとする課題】ただ、前者の化学薬品
を使う湿式方法の場合、廃液の処理にコストがかかるこ
と、化学薬品の使用自体が公害発生の原因になるという
問題がある。その他にも、液体を用いると乾燥工程が必
要になるだけでなく、基板表面が酸化されるという問題
もあり、それにより、工程が複雑になり、設備も高価な
ものになるという問題もある。However, in the case of the former wet method using a chemical, there is a problem that it is costly to treat the waste liquid, and the use of the chemical itself causes pollution. In addition, when a liquid is used, not only a drying step is required, but also there is a problem that the substrate surface is oxidized, which causes a problem that the process becomes complicated and equipment becomes expensive.
【０００５】これに対し、後者のレーザ光線を使う乾式
方法の場合、金層の表面が溶融し下地金属層のと間で合
金化が起こり金属間化合物が生成し、金層の物理的特性
が劣化するという問題がある。また、レーザ光線を使う
場合、汚染物が完全に除去されないことがある。これ
は、レーザ光線には強度分布が存在しており、強度の弱
い部分では汚染物が十分に除去されずに残留することが
あるからである。レーザ光線を走査し単位面積当たりの
トータルの照射エネルギーを等しくしたとしても、照射
の時間的なズレやピークパワーの違いにより、除去現象
に差が出るため、結局、除去されずに残る汚染物が出る
ことを防ぐことは難しい。On the other hand, in the case of the latter dry method using a laser beam, the surface of the gold layer is melted and alloyed with the underlying metal layer to form an intermetallic compound, and the physical properties of the gold layer are reduced. There is a problem of deterioration. When a laser beam is used, contaminants may not be completely removed. This is because the laser beam has an intensity distribution, and contaminants may remain in portions where the intensity is low without being sufficiently removed. Even if the laser beam is scanned and the total irradiation energy per unit area is equalized, the difference in removal phenomena will occur due to the difference in irradiation time and the difference in peak power. It is difficult to prevent leaving.
【０００６】この発明は、上記事情に鑑み、回路基板の
ボンディング前処理方法として、金層の物理的特性を劣
化させずに浄化することが出来る方法を提供することを
第１の課題とし、加えて、浄化むらも出ないように出来
る方法を提供することを第２の課題とする。SUMMARY OF THE INVENTION In view of the above circumstances, it is a first object of the present invention to provide, as a pre-bonding treatment method for a circuit board, a method capable of purifying a gold layer without deteriorating its physical characteristics. Another object of the present invention is to provide a method capable of preventing uneven purification.
【０００７】[0007]
【課題を解決するための手段】前記課題を解決するた
め、本発明にかかる回路基板のボンディング前処理方法
（以下、単に「前処理方法」とも言う）では、回路基板
に設けられた金層の表面に、紫外線レーザ光を前記金層
の表面が溶融しないエネルギー密度で照射する。 上記紫
外線光の照射を、金層の表面で紫外線光の照射エネルギ
ー密度が均一になるように、複数の光線を部分的に重ね
るようにして同時照射で行うこともできる。 In order to solve the above-mentioned problems, a method for pre-bonding a circuit board according to the present invention (hereinafter, also simply referred to as a “pre-processing method”) uses a gold layer provided on the circuit board. on the surface, an ultraviolet laser beam the surface of the gold layer that be irradiated at an energy density which does not melt. The irradiation of the ultraviolet <br/> external light, so that the irradiation energy density of the ultraviolet light on the surface of the gold layer is uniform, can be performed simultaneously irradiated so as to overlap the plurality of light beams partially.
【０００８】この発明で使われる紫外線光としては、例
えば、エキシマレーザ光線が好ましい。このエキシマレ
ーザ光線の場合、照射エネルギー密度は、金層の表面の
溶融を確実に招かないですむということからすると、
０．５Ｊ／ｃｍ2 未満であることが望ましい。また、例
えば、上記エキシマレーザ光線の場合、エネルギー密度
は横方向ではほぼ均一であるが、縦方向ではガウシアン
分布に近い形で変化している。そのため、例えば、一本
のエキシマレーザを複数の光線にいったん分割してか
ら、再び、横方向は揃えて縦方向だけを少しずらせて部
分的に重なるように同時照射すると、重なり部分端であ
るガウシアン分布の裾のところでエネルギー密度が高ま
って全体としてみると広い範囲で照射エネルギー密度が
均一となる。As the ultraviolet light used in the present invention, for example, an excimer laser beam is preferable. In the case of this excimer laser beam, the irradiation energy density is determined from the fact that melting of the surface of the gold layer is not required.
Desirably, it is less than 0.5 J / cm 2 . Further, for example, in the case of the above-described excimer laser beam, the energy density is substantially uniform in the horizontal direction, but changes in a form close to a Gaussian distribution in the vertical direction. Therefore, for example, if one excimer laser is once divided into a plurality of light beams and then irradiated again simultaneously so that the horizontal direction is aligned and only the vertical direction is slightly shifted, the Gaussian at the overlapping end is obtained. The energy density increases at the bottom of the distribution, and the irradiation energy density becomes uniform over a wide range as a whole.
【０００９】[0009]
【作用】前記前処理方法では、紫外線光を前記金層の表
面が溶融しないエネルギー密度で照射しているため、金
層の表面での溶融が防げるため、金層の物理的特性を劣
化させず、短時間で有機物等の汚染物を除去することが
出来る。その結果、表面外観は綺麗で接合信頼性も高ま
る。In the pretreatment method, since the ultraviolet light is applied at an energy density that does not melt the surface of the gold layer, the melting on the surface of the gold layer can be prevented, so that the physical properties of the gold layer are not deteriorated. Thus, contaminants such as organic substances can be removed in a short time. As a result, the surface appearance is clean and the bonding reliability is improved.
【００１０】それに、紫外線光の照射による浄化方法
は、乾式方法であるため湿式方法の場合には必要な廃液
処理や水洗処理が不要であり、基板酸化の心配がなく工
程が複雑化することもない。また、複数の光線を部分的
に重ねるようにして同時照射して、金層の表面で紫外線
光の照射エネルギー密度が均一になるようにすれば、浄
化むらのない適切な浄化が達成される。In addition, since the purification method by irradiation with ultraviolet light is a dry method, a wet method does not require a waste liquid treatment or a water washing treatment, and there is no need to worry about oxidation of the substrate, and the process may be complicated. Absent. Also, multiple rays can be partially
When the irradiation energy density of the ultraviolet light is made uniform on the surface of the gold layer, appropriate purification without purification unevenness is achieved.
【００１１】[0011]
【実施例】以下、この発明の実施例を説明する。実施例
では、ＰＧＡ（Pin Grid Array) におけるボンディング
前処理として、金層の表面の浄化を行う。Embodiments of the present invention will be described below. In this embodiment, the surface of the gold layer is purified as a bonding pretreatment in a PGA (Pin Grid Array).
【００１２】ＰＧＡ１では、図３にみるように、ＩＣ
（集積回路）等の電子部品が直接搭載されるキャビティ
部ａとインナーリード部ｂのそれぞれに浄化対象の金メ
ッキにより形成された金層がある。いずれの場合も、金
層の下にＮｉメッキの層と銅メッキや銅箔の銅の層があ
る。金層が最も上であるから、汚染物Ｇは、図３にみる
ように、金層の表面に付着することになる。In PGA1, as shown in FIG.
Each of the cavity portion a and the inner lead portion b on which electronic components such as (integrated circuits) are directly mounted has a gold layer formed by gold plating to be purified. In each case, there is a Ni plating layer and a copper plating or copper foil copper layer below the gold layer. Since the gold layer is at the top, the contaminant G will adhere to the surface of the gold layer as shown in FIG.
【００１３】キャビティ部ａの浄化にあたっては、紫外
線光を、図１に示す如く、マスクイメージング法で縮小
集光するとともに金層の表面が溶融しないエネルギー密
度で照射する。この時、紫外線光の縮小面積がキャビテ
ィ部ａの面積よりも小さい場合は紫外線光またはＰＧＡ
１（あるいは双方）を走査するようにして、キャビティ
部ａの全域に対し紫外線光を照射するようにする。In purifying the cavity a, as shown in FIG. 1, ultraviolet light is reduced and condensed by a mask imaging method and irradiated at an energy density at which the surface of the gold layer does not melt. At this time, if the reduced area of the ultraviolet light is smaller than the area of the cavity a, the ultraviolet light or PGA
1 (or both) is scanned so that the entire area of the cavity part a is irradiated with ultraviolet light.
【００１４】この時、紫外線光としては、エキシマレー
ザ光線（ＸｅＣｌ〔波長λ＝３０８ｎｍ〕、ＫｒＦ〔波
長λ＝２４８ｎｍ〕、ＡｒＦ〔波長λ＝１９３ｎ
ｍ〕）、あるいは、ＹＧＡレーザ光線第４次高調波〔波
長λ＝２６６ｎｍ〕などが適当である。９×９ｍｍの正
方形のキャビティ部ａで、ＫｒＦのエキシマレーザ光線
を用いると、１ショットの照射範囲を３×３ｍｍにし、
エネルギー密度が０．２〜０．４Ｊ／ｃｍ2 になるよう
に出力を設定し、ＰＧＡ１を２．１ｍｍ／秒の速度で走
査させると、金層の表面を溶融させずに汚染物だけをう
まく除去できる。At this time, as the ultraviolet light, excimer laser light (XeCl [wavelength λ = 308 nm], KrF [wavelength λ = 248 nm], ArF [wavelength λ = 193n]
m]) or the fourth harmonic of a YGA laser beam [wavelength λ = 266 nm]. When a KrF excimer laser beam is used in a 9 × 9 mm square cavity a, the irradiation range of one shot is set to 3 × 3 mm,
When the output is set so that the energy density becomes 0.2 to 0.4 J / cm 2 and the PGA 1 is scanned at a speed of 2.1 mm / sec, only the contaminants can be removed without melting the surface of the gold layer. Can be removed.
【００１５】一方、ＰＧＡ１のインナーリード部ｂの浄
化にあたっては、図２にみるように形状が個々に異なる
ことから、紫外線光を集光したときの形状がリード部全
体形状と同じとなるような形状のマスクを使うことが好
ましい。つまり、インナーリード部ｂへの紫外線光の照
射は、紫外線光またはＰＧＡ１を全く走査せずに一括照
射で浄化できるようにすることが好ましい。ただし、１
ショットによる照射範囲が１つのリード幅よりも小さい
場合は、走査させるようにしてもよい。具体的には、リ
ード部での形状が、幅０．３ｍｍの場合、照射範囲を
０．１×０．３ｍｍに設定してＰＧＡ１を走査させれ
ば、インナーリード部ｂにある金層の表面を溶融させず
に汚染物Ｇだけをうまく除去できる。On the other hand, in purifying the inner lead portions b of the PGA 1, since the shapes are different from each other as shown in FIG. 2, the shape when the ultraviolet light is condensed becomes the same as the entire shape of the lead portions. It is preferable to use a mask having a shape. That is, it is preferable that the inner lead portion b be irradiated with ultraviolet light so that the inner lead portion b can be purified by batch irradiation without scanning with ultraviolet light or PGA1 at all. However, 1
When the irradiation range of the shot is smaller than one lead width, scanning may be performed. Specifically, when the shape of the lead portion is 0.3 mm in width, the irradiation range is set to 0.1 × 0.3 mm and the PGA 1 is scanned, so that the surface of the gold layer in the inner lead portion b is obtained. Can be successfully removed without melting the contaminants G.
【００１６】上記の実施例の場合、キャビティ部ａとイ
ンナーリード部ｂに対し同時に紫外線光を照射するよう
にしてもよい。また、インナーリード部ｂにおいては、
キャビティ部ａの４辺に向かって４群Ａ〜Ｄのインナー
リード部があるが、各群毎に紫外線光を照射してもよい
し、全群Ａ〜Ｄに同時に紫外線光を照射するようにして
もよい。又、各群中の各リード部１個づづ順に紫外線光
を照射してもよい。In the case of the above embodiment, the cavity portion a and the inner lead portion b may be simultaneously irradiated with ultraviolet light. In the inner lead portion b,
There are four groups A to D of inner lead portions toward the four sides of the cavity part a. Ultraviolet light may be applied to each group, or all groups A to D may be simultaneously irradiated with ultraviolet light. You may. Further, the ultraviolet light may be applied to each of the leads in each group in order.
【００１７】続いて、他の実施例を説明する。図４にみ
るように、マスクを用いずに金層の表面の汚染物を除去
している。この実施例もエキシマレーザ光線を用いてい
るが、エキシマレーザ光線は、エネルーギー密度が横方
向は均一な強度分布であるが、縦方向はガウシアン分布
に近い形状である。このままでは、レーザ光線を走査し
て単位面積のトータルのエネルギーが同じになるように
しても前記のように汚染物の除去現象に差が出る。そこ
で、図４にみるように、レーザ光をハーフミラーＨ（例
えば５０％透過、５０％反射）で複数にいったん分割
し、縦方向に少しずらせて重ね合わせ同時に照射する
と、図５にみるように、広い範囲で紫外線光の照射エネ
ルギー密度が等しく均一になり、その結果、浄化むらの
ない適切な浄化がなされるようになる。Next, another embodiment will be described. As shown in FIG. 4, contaminants on the surface of the gold layer are removed without using a mask. Although this embodiment also uses an excimer laser beam, the excimer laser beam has a uniform energy distribution in the horizontal direction and a shape close to a Gaussian distribution in the vertical direction. In this state, even if the laser beam is scanned so that the total energy per unit area becomes the same, there is a difference in the phenomenon of removing contaminants as described above. Therefore, as shown in FIG. 4, when the laser beam is divided into a plurality of portions by a half mirror H (for example, 50% transmission and 50% reflection), and the laser beams are slightly overlapped with each other in the vertical direction and irradiated simultaneously, as shown in FIG. Therefore, the irradiation energy density of the ultraviolet light becomes uniform over a wide range, and as a result, appropriate purification without purification unevenness is achieved.
【００１８】[0018]
【発明の効果】本発明のボンディング前処理方法では、
紫外線レーザ光を前記金層の表面が溶融しないエネルギ
ー密度で照射しており、金層の表面での溶融が防げるた
め、金層の物理的特性を劣化させず、短時間で有機物等
の汚染物を除去することが出来るだけでなく、紫外線レ
ーザ光の照射による浄化方法は乾式方法であるので、湿
式方法の場合には必要な廃液処理や水洗処理がなく、基
板酸化の心配や工程が複雑化するという問題がなく非常
に有用である。また、複数の光線を部分的に重ねるよう
にして同時照射して、金層の表面で紫外線レーザ光の照
射エネルギー密度が均一になるようにすれば、浄化むら
のない適切な浄化がなされるという利点がある。According to the bonding pretreatment method of the present invention,
Ultraviolet laser light is irradiated at an energy density at which the surface of the gold layer does not melt, and melting at the surface of the gold layer can be prevented. Not only can be removed, but the purification method by irradiation with ultraviolet laser light is a dry method, so in the case of a wet method, there is no need for waste liquid treatment or water washing treatment, which complicates the process and concerns about substrate oxidation. it is a very useful there is no problem that. Also, partially overlap multiple rays
If the irradiation energy density of the ultraviolet laser beam is made uniform on the surface of the gold layer by the simultaneous irradiation, there is an advantage that appropriate purification without purification unevenness is performed.
【図１】実施例でのＰＧＡのキャビティ部の浄化を行う
時の様子をあらわす説明図である。FIG. 1 is an explanatory diagram showing a state when purifying a cavity of a PGA in an embodiment.
【図２】実施例でのＰＧＡのインナーリード部の浄化を
行う時の様子をあらわす説明図である。FIG. 2 is an explanatory view showing a state when purifying an inner lead portion of PGA in the embodiment.
【図３】実施例で浄化するＰＧＡのキャビティ部および
インナーリード部まわりをあらわす説明図である。FIG. 3 is an explanatory view showing the vicinity of a cavity portion and an inner lead portion of PGA to be purified in an embodiment.
【図４】他の実施例での紫外線光の照射系の概略構成を
あらわす説明図である。FIG. 4 is an explanatory diagram showing a schematic configuration of an ultraviolet light irradiation system in another embodiment.
【図５】他の実施例での紫外線光の照射面におけるエネ
ルギー密度の分布状態をあらわす説明図である。FIG. 5 is an explanatory diagram showing a distribution state of an energy density on a surface irradiated with ultraviolet light in another embodiment.
１ ＰＧＡ ａ キャビティ部 ｂ インナーリード部 Ｇ 汚染物 1 PGA a Cavity b Inner lead G Contaminant
───────────────────────────────────────────────────── フロントページの続き (56)参考文献 特開 平２−299287（ＪＰ，Ａ) 特開 平２−254721（ＪＰ，Ａ) 特開 平２−197588（ＪＰ，Ａ) 特開 昭63−73627（ＪＰ，Ａ) 特開 昭52−3447（ＪＰ，Ａ) 特開 昭61−67821（ＪＰ，Ａ) 特開 昭61−198210（ＪＰ，Ａ) 特開 昭62−136842（ＪＰ，Ａ) 特開 昭63−299240（ＪＰ，Ａ) 実願 平２−42955号（実開 平４− 2023号）の願書に添付した明細書及び図 面の内容を撮影したマイクロフィルム （ＪＰ，Ｕ) 実願 昭63−160142号（実開 平２− 81039号）の願書に添付した明細書及び 図面の内容を撮影したマイクロフィルム （ＪＰ，Ｕ) ──────────────────────────────────────────────────続 き Continuation of the front page (56) References JP-A-2-299287 (JP, A) JP-A-2-254721 (JP, A) JP-A-2-197588 (JP, A) JP-A-63-1988 73627 (JP, A) JP-A-52-3447 (JP, A) JP-A-61-67821 (JP, A) JP-A-61-198210 (JP, A) JP-A-62-136842 (JP, A) Japanese Patent Application Laid-Open No. 63-299240 (JP, A) Jpn. A microfilm (JP, U) photographing the contents of the specification and drawings attached to the application form of Japanese Application No. 63-160142 (Japanese Utility Model Application No. 2-81039).
Claims (2)
外線レーザ光を、前記金層の表面が溶融しないエネルギ
ー密度で照射することにより、前記金層の表面を浄化す
る回路基板のボンディング前処理方法。On the surface of the 1. A gold provided on the circuit board layer, an ultraviolet laser beam, by which the surface of the gold layer is morphism irradiation energy density which does not melt, the circuit board to clean the surface of the gold layer Bonding pretreatment method.
で前記紫外線光の照射エネルギー密度が均一になるようTo make the irradiation energy density of the ultraviolet light uniform.
に、複数の光線を部分的に重ねるようにして同時照射すSimultaneously irradiate multiple beams partially overlapping
るようにして行う請求項１記載の回路基板のボンディン2. The bonding of a circuit board according to claim 1, wherein the bonding is performed in the following manner.
グ前処理方法。Pretreatment method.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP4064239A JP2894579B2 (en) | 1992-03-19 | 1992-03-19 | Pre-bonding treatment method for circuit boards |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP4064239A JP2894579B2 (en) | 1992-03-19 | 1992-03-19 | Pre-bonding treatment method for circuit boards |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH05267827A JPH05267827A (en) | 1993-10-15 |
| JP2894579B2 true JP2894579B2 (en) | 1999-05-24 |
Family
ID=13252394
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP4064239A Expired - Lifetime JP2894579B2 (en) | 1992-03-19 | 1992-03-19 | Pre-bonding treatment method for circuit boards |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP2894579B2 (en) |
Families Citing this family (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2003149594A (en) * | 2001-11-16 | 2003-05-21 | Ricoh Co Ltd | Laser illumination optical system, and exposure unit, laser processor, and projection unit using the same |
| JP2003270585A (en) * | 2002-03-18 | 2003-09-25 | Ricoh Co Ltd | Laser illumination optical system, and exposure device, laser beam machining device and projection device using the same |
Family Cites Families (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS6373627A (en) * | 1986-09-17 | 1988-04-04 | Fujitsu Ltd | Dry processing device |
| JP2627187B2 (en) * | 1989-01-27 | 1997-07-02 | 新東工業株式会社 | How to remove scale or rust from steel products |
| JPH02254721A (en) * | 1989-03-29 | 1990-10-15 | Hitachi Ltd | Method of removing microscopic foreign substance and device therefor |
| JPH02299287A (en) * | 1989-05-15 | 1990-12-11 | Shin Etsu Chem Co Ltd | Cleaning of printed circuit board |
| JP2553857Y2 (en) * | 1990-04-20 | 1997-11-12 | 株式会社 芝浦製作所 | Light cleaning device |
-
1992
- 1992-03-19 JP JP4064239A patent/JP2894579B2/en not_active Expired - Lifetime
Also Published As
| Publication number | Publication date |
|---|---|
| JPH05267827A (en) | 1993-10-15 |
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