JP2887274B2 - Removable adhesive - Google Patents
Removable adhesiveInfo
- Publication number
- JP2887274B2 JP2887274B2 JP1006795A JP679589A JP2887274B2 JP 2887274 B2 JP2887274 B2 JP 2887274B2 JP 1006795 A JP1006795 A JP 1006795A JP 679589 A JP679589 A JP 679589A JP 2887274 B2 JP2887274 B2 JP 2887274B2
- Authority
- JP
- Japan
- Prior art keywords
- polymer
- pressure
- sensitive adhesive
- adhesive
- weight
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
Landscapes
- Adhesive Tapes (AREA)
- Adhesives Or Adhesive Processes (AREA)
Description
【発明の詳細な説明】 〔産業上の利用分野〕 この発明は再剥離型粘着剤、特に半導体ウエハを素子
小片に切断（ダイシング）分離しこれをさらにピツクア
ツプする際に用いる粘着シート用の上記粘着剤に関す
る。DETAILED DESCRIPTION OF THE INVENTION [Industrial Application Field] The present invention relates to a re-peelable pressure-sensitive adhesive, in particular, the above pressure-sensitive adhesive for a pressure-sensitive adhesive sheet used for cutting (dicing) and separating a semiconductor wafer into element pieces and further picking up the same. Agent.
従来より、粘着シートに半導体ウエハを貼り付けて固
定したのち、このウエハを回転丸刃で素子形状に沿つて
切断し、ついで形成された素子小片を粘着シートからピ
ツクアツプすると同時に、マウント工程に移すというダ
イレクトピツクアツプ方式が、作業性や生産性のうえで
望ましいものとして、採用されている。Conventionally, after attaching and fixing a semiconductor wafer to an adhesive sheet, the wafer is cut along a device shape with a rotating round blade, and then the formed element pieces are picked up from the adhesive sheet and transferred to a mounting process. The direct pick-up method has been adopted as desirable in terms of workability and productivity.
この種の粘着シートとしては、たとえば特公昭61−28
572号公報に開示されるように、アクリル酸アルキルエ
ステル系および／またはメタクリル酸アルキルエステル
系ポリマーに放射線重合性の多官能オリゴマーを加えた
粘着剤を透明基材に塗布してなるものが知られている。Examples of this type of adhesive sheet include, for example, Japanese Patent Publication No. 61-28
As disclosed in JP-A-572, an adhesive obtained by applying a radiation-polymerizable polyfunctional oligomer to an alkyl acrylate-based and / or alkyl methacrylate-based polymer to a transparent substrate is known. ing.
この放射線重合性の粘着シートの使用法は、この上に
半導体ウエハを貼り付けて素子小片に切断したのち、こ
のシートにおけるピツクアツプするべき素子小片に対応
する部分に放射線を照射して接着力を低下させ、そのう
えでこの部分の素子小片を粘着シート側からニードルで
突き上げてエアピンセツトで吸着するなどしてピツクア
ツプするものである。つまり、放射線重合性の粘着剤を
使用しているのは、ピツクアツプ時の重合硬化によりそ
の接着力を低下させて、ピツクアツプ作業を容易にする
ためである。This radiation-polymerizable adhesive sheet is used in such a way that a semiconductor wafer is stuck on it and cut into small pieces, and then the portion of this sheet corresponding to the small piece to be picked up is irradiated with radiation to reduce the adhesive strength. Then, the element small piece in this portion is pushed up from the pressure-sensitive adhesive sheet side with a needle, and is sucked up with an air pin set and picked up. That is, the radiation polymerizable pressure-sensitive adhesive is used to reduce the adhesive force by polymerization and curing at the time of pick-up, thereby facilitating the pick-up operation.
しかるに、上記公知の粘着シートでは、粘着剤中の多
官能オリゴマーの量が少ないと、放射線の照射による重
合硬化速度が遅くなるうえに、接着力の低下も小さくな
り、一方上記の量を多くすると、放射線の照射前の凝集
力が小さくなつて素子小片への切断時にズレが生じやす
く、また硬化後は粘着剤の伸びが小さくなり、素子小片
を分離しピツクアツプする際に粘着シートを引き伸ばし
たとき、粘着剤層にクラツクが発生して、素子小片が飛
散するといつた不具合があつた。However, in the above-mentioned known pressure-sensitive adhesive sheet, if the amount of the polyfunctional oligomer in the pressure-sensitive adhesive is small, the rate of polymerization and curing by irradiation with radiation is reduced, and the decrease in adhesion is also reduced. When the cohesive force before the irradiation of radiation is reduced, misalignment is likely to occur when cutting into element pieces, and after curing, the elongation of the adhesive becomes small, and the adhesive sheet is stretched when separating and picking up the element pieces. In addition, cracks occurred in the pressure-sensitive adhesive layer, and small pieces were scattered.
したがつて、この発明は、多官能オリゴマーの多少に
起因した上述の如き問題を回避して、半導体ウエハの素
子小片への切断作業やピツクアツプ作業をより良好に行
えるような再剥離型粘着剤を提供することを目的として
いる。Therefore, the present invention avoids the above-mentioned problems caused by the number of polyfunctional oligomers, and provides a re-peelable pressure-sensitive adhesive which can perform a cutting operation and a pickup operation of a semiconductor wafer in smaller pieces. It is intended to provide.
この発明者らは、上記の目的を達成するために鋭意検
討した結果、粘着剤のベースポリマーとして分子内に放
射線重合性の不飽和結合を導入した特定のアクリル酸ア
ルキルエステル系および／またはメタクリル酸アルキル
エステル系ポリマーを用い、このポリマーに多官能オリ
ゴマーを配合するようにすると、放射線照射前の凝集力
や接着力が大きく、しかも放射線の照射による重合硬化
速度が速くてかつ硬化後の接着力の低下の大きい再剥離
型粘着剤が得られ、これによれば半導体ウエハの素子小
片への切断作業やピツクアツプ作業の大幅な改善を図れ
るものであることを知り、この発明を完成するに至つ
た。The inventors of the present invention have conducted intensive studies to achieve the above object, and as a result, as a base polymer of the pressure-sensitive adhesive, a specific alkyl acrylate-based ester and / or methacrylic acid having a radiation-polymerizable unsaturated bond introduced into the molecule. When an alkyl ester polymer is used and a polyfunctional oligomer is blended with this polymer, the cohesive strength and adhesive strength before irradiation are large, and the polymerization curing speed by irradiation of radiation is high and the adhesive strength after curing is high. It has been found that a re-peelable pressure-sensitive adhesive with a large decrease can be obtained, and that this can greatly improve the work of cutting a semiconductor wafer into element pieces and the work of picking up, and have completed the present invention.
すなわち、この発明は、半導体ウエハを素子小片に切
断分離しこれをさらにピツクアツプする際に用いる粘着
シート用の再剥離型粘着剤において、分子内に放射線重
合性の不飽和結合を有してなるヨウ素価が0.5〜20で重
量平均分子量が20万〜200万である常温で粘着性を有す
るアクリル酸アルキルエステル系および／またはメタク
リル酸アルキルエステル系の重合性ポリマーと、このポ
リマー100重量部に対して１〜50重量部となる割合の放
射線重合性の多官能オリゴマーとを主成分として含んで
なり、半導体ウエハに対する180度剥離接着力（剥離速
度300mm/分）が、放射線の照射前で200〜1,000g/25mm
で、放射線の照射による重合硬化後で５〜50g/25mmとな
る再剥離型粘着剤に係るものである。That is, the present invention relates to a re-peelable pressure-sensitive adhesive for a pressure-sensitive adhesive sheet used for cutting and separating a semiconductor wafer into element pieces and further picking up the same, wherein iodine having a radiation-polymerizable unsaturated bond in a molecule is provided. Having a viscosity of 0.5 to 20 and a weight average molecular weight of 200,000 to 2,000,000, having an adhesive property at room temperature and having an acrylic acid alkyl ester type and / or methacrylic acid alkyl ester type polymerizable polymer, and 100 parts by weight of the polymer. 1 to 50 parts by weight of a radiation-polymerizable polyfunctional oligomer as a main component, and has a 180-degree peeling adhesive force (peeling speed of 300 mm / min) to a semiconductor wafer of 200 to 1,000 before radiation irradiation. g / 25mm
The present invention relates to a re-peelable pressure-sensitive adhesive which becomes 5 to 50 g / 25 mm after polymerization and curing by irradiation of radiation.
この発明において使用する重合性ポリマーは、アクリ
ル酸アルキルエステル系および／またはメタクリル酸ア
ルキルエステル系ポリマー〔以下、単に（メタ）アクリ
ル系ポリマーという〕の分子内に放射線重合性の不飽和
結合を導入してなる常温で粘着性を有するポリマーであ
つて、この不飽和結合の導入量がヨウ素価で表して0.5
〜20、好適には１〜10の範囲となるものである。ここ
で、ヨウ素価が0.5未満となるものでは重合硬化後の接
着力の低下が小さくなり、また20を超えると重合硬化後
の粘着剤の伸びが小さくなるため、いずれもこの発明の
目的に適さない。The polymerizable polymer used in the present invention is obtained by introducing a radiation polymerizable unsaturated bond into a molecule of an alkyl acrylate polymer and / or an alkyl methacrylate polymer (hereinafter, simply referred to as a (meth) acrylic polymer). A polymer having tackiness at room temperature, and the amount of unsaturated bonds introduced is represented by an iodine value of 0.5.
-20, preferably 1-10. Here, when the iodine value is less than 0.5, the decrease in adhesive strength after polymerization and curing is small, and when it exceeds 20, the elongation of the pressure-sensitive adhesive after polymerization and curing is small, and both are suitable for the purpose of the present invention. Absent.
このような重合性ポリマーに放射線重合性の多官能オ
リゴマーを配合すると、放射線の照射により粘着剤層の
全体が均一にかつ速やかに重合架橋して一体化するた
め、重合硬化による弾性率の増加が著しくなつて、接着
力の低下が大きくなる。したがつて、多官能オリゴマー
の配合量を必要以上に多くする必要がないため、放射線
照射前の凝集力の低下や重合硬化後の伸びの低下などの
問題をきたすおそれは全くない。When a radiation-polymerizable polyfunctional oligomer is blended with such a polymerizable polymer, the entire pressure-sensitive adhesive layer is uniformly and quickly polymerized and crosslinked by irradiation with radiation, thereby increasing the elastic modulus due to polymerization and curing. When it becomes remarkable, the decrease in the adhesive strength becomes large. Therefore, it is not necessary to increase the blending amount of the polyfunctional oligomer more than necessary, and there is no possibility of causing problems such as a decrease in cohesive strength before irradiation and a decrease in elongation after polymerization and curing.
これに対し、従来の非重合性の（メタ）アクリル系ポ
リマーに多官能オリゴマーを配合した粘着剤では、放射
線の照射により多官能オリゴマーのみが重合硬化して、
その重合物と上記ポリマーとがミクロ適に相分離する結
果、上記ポリマーの物性がそのまま残存するため、接着
力の低下が小さいものとなる。これを補うために、多官
能オリゴマーを多くすると、既述のとおり、放射線照射
前の凝集力の低下や重合硬化後の伸びの低下などの問題
をきたすことになるものである。In contrast, in a conventional non-polymerizable (meth) acrylic polymer, a polyfunctional oligomer is mixed with a polyfunctional oligomer, and only the polyfunctional oligomer is polymerized and cured by irradiation with radiation.
As a result of the micro-phase separation of the polymer and the polymer, the physical properties of the polymer remain as they are, so that the decrease in adhesive strength is small. If the number of polyfunctional oligomers is increased to compensate for this, as described above, problems such as a decrease in cohesive strength before irradiation and a decrease in elongation after polymerization and curing are caused.
この発明に用いる上記の重合性ポリマーは、たとえば
分子内に官能基を持つた（メタ）アクリル系ポリマー
〔以下、官能基含有（メタ）アクリル系ポリマーとい
う〕をあらかじめ合成し、これに分子内に上記の官能基
と反応する官能基と放射線重合性の不飽和結合とを有す
る化合物〔以下、官能基含有不飽和化合物という）を反
応させることにより、得ることができる。As the polymerizable polymer used in the present invention, for example, a (meth) acrylic polymer having a functional group in a molecule (hereinafter referred to as a (meth) acrylic polymer containing a functional group) is previously synthesized, It can be obtained by reacting a compound having a functional group that reacts with the above functional group and a radiation polymerizable unsaturated bond (hereinafter, referred to as a functional group-containing unsaturated compound).
官能基含有（メタ）アクリル系ポリマーは、常温で粘
着性を有するポリマーとして、一般の（メタ）アクリル
系ポリマーの場合と同様に、アルキル基の炭素数が通常
２〜18の範囲にあるアクリル酸アルキルエステルおよび
／またはメタクリル酸アルキルエステルを主モノマーと
し、これと官能基含有モノマーとさらに必要に応じてこ
れらと共重合可能な他の改質用モノマーとを常法により
共重合させることにより、得られるものであつて、その
分子量は、重量平均分子量で通常20〜200万程度であ
る。The functional group-containing (meth) acrylic polymer is a polymer having tackiness at room temperature, and is an acrylic acid having an alkyl group usually having a carbon number of 2 to 18 as in the case of a general (meth) acrylic polymer. An alkyl ester and / or a methacrylic acid alkyl ester as a main monomer, and a functional group-containing monomer, and if necessary, another copolymerizable monomer copolymerizable therewith, are copolymerized by a conventional method. The molecular weight is usually about 200 to 2,000,000 in weight average molecular weight.
上記の官能基含有モノマーとしては、アクリル酸、メ
タクリル酸などのカルボキシル基含有モノマー、アクリ
ル酸ヒドロキシエチル、メタクリル酸ヒドロキシエチル
などのヒドロキシル基含有モノマー、アクリル酸グリシ
ジル、メタクリル酸グリシジルなどのエポキシ基含有モ
ノマー、アクリル酸イソシアネートエチル、メタクリル
酸イソシアネートエチルなどのイソシアネート基含有モ
ノマー、アクリル酸アミノエチル、メタクリル酸アミノ
エチルなどのアミノ基含有モノマーなどがある。これら
官能基含有モノマーの使用量としては、モノマー全体の
通常１〜20重量％、好適には２〜10重量％である。Examples of the functional group-containing monomer include acrylic acid, carboxyl group-containing monomer such as methacrylic acid, hydroxyl group-containing monomer such as hydroxyethyl acrylate and hydroxyethyl methacrylate, and epoxy group-containing monomer such as glycidyl acrylate and glycidyl methacrylate. Isocyanate group-containing monomers such as isocyanate ethyl acrylate and isocyanate ethyl methacrylate; and amino group-containing monomers such as aminoethyl acrylate and aminoethyl methacrylate. The amount of the functional group-containing monomer to be used is generally 1 to 20% by weight, preferably 2 to 10% by weight of the whole monomer.
また、共重合可能な他の改質用モノマーとしては、酢
酸ビニル、アクリロニトリル、スチレンなどの一般の
（メタ）アクリル系ポリマーに用いられている各種のモ
ノマーをいずれも使用できる。その使用量としては、モ
ノマー全体の通常30重量％以下とするのがよい。Further, as other copolymerizable modifying monomers, any of various monomers used in general (meth) acrylic polymers such as vinyl acetate, acrylonitrile, and styrene can be used. The amount used is generally preferably 30% by weight or less based on the entire monomers.
このような官能基含有（メタ）アクリル系ポリマーに
反応させる官能基含有不飽和化合物としては、上記ポリ
マーの官能基に応じて上述した官能基含有モノマーと同
様のものを使用できる。たとえば、上記ポリマーの官能
基がカルボキシル基の場合はエポキシ基含有モノマーや
イソシアネート基含有モノマーが、同官能基がヒドロキ
シル基の場合はイソシアネート基含有モノマーが、同官
能基がエポキシ基の場合はカルボキシル基含有モノマー
やアクリルアミドなどのアミド基含有モノマーが、同官
能基がアミノ基の場合はエポキシ基含有モノマーが、そ
れぞれ用いられる。As the functional group-containing unsaturated compound to be reacted with such a functional group-containing (meth) acrylic polymer, the same compounds as the above-mentioned functional group-containing monomers according to the functional groups of the polymer can be used. For example, when the functional group of the polymer is a carboxyl group, an epoxy group-containing monomer or an isocyanate group-containing monomer is used. When the functional group is a hydroxyl group, an isocyanate group-containing monomer is used. When the functional group is an epoxy group, the carboxyl group is used. When the functional group is an amino group, an amide group-containing monomer such as acrylamide or an epoxy group-containing monomer is used.
官能基含有（メタ）アクリル系ポリマーと官能基含有
不飽和化合物との反応は、この反応により得られる常温
で粘着性を有する重合性ポリマーのヨウ素価が前記の範
囲となるような使用量を選択して、かつ反応原料中にイ
ソシアネート基などを含むときは溶媒として特に非反応
性の酢酸エチル、トルエンなどを用いて、通常20〜50℃
で１〜10時間反応させればよく、その際必要なら適宜の
触媒を使用しても差し支えない。In the reaction between the functional group-containing (meth) acrylic polymer and the functional group-containing unsaturated compound, the amount used is selected so that the iodine value of the polymerizable polymer having tackiness at room temperature obtained by this reaction falls within the above range. And, when the reaction raw material contains an isocyanate group or the like, using a non-reactive ethyl acetate, toluene or the like as a solvent, usually 20 ~ 50 ℃
For 1 to 10 hours, and if necessary, an appropriate catalyst may be used.
この発明において用いる多官能オリゴマーは、その分
子量が通常10,000以下であるのがよく、より好ましくは
放射線の照射による粘着剤層の三次元網状化が効率よく
なされるように、その分子量が5,000以下でかつ分子内
の放射線重合性の不飽和結合の数が２〜６個のものを用
いるのがよい。このような特に好適な多官能オリゴマー
としては、たとえばトリメチロールプロパントリアクリ
レート、テトラメチロールメタンテトラアクリレート、
ペンタエリスリトールトリアクリレート、ペンタエリス
リトールテトラアクリレート、ジペンタエリスリトール
モノヒドロキシペンタアクリレート、ジペンタエリスリ
トールヘキサアクリレートまたは上記同様のメタクリレ
ート類などが挙げられる。その他、１・４−ブチレング
リコールジアクリレート、１・６−ヘキサンジオールジ
アクリレート、ポリエチレングリコールジアクリレー
ト、市販のオリゴエステルアクリレートまたは上記同様
のメタクリレート類なども使用することができる。The polyfunctional oligomer used in the present invention preferably has a molecular weight of usually 10,000 or less, more preferably a molecular weight of 5,000 or less so that the three-dimensional network of the pressure-sensitive adhesive layer by radiation irradiation is efficiently formed. It is preferable to use those having 2 to 6 radiation-polymerizable unsaturated bonds in the molecule. Such particularly suitable polyfunctional oligomers include, for example, trimethylolpropane triacrylate, tetramethylolmethanetetraacrylate,
Examples thereof include pentaerythritol triacrylate, pentaerythritol tetraacrylate, dipentaerythritol monohydroxypentaacrylate, dipentaerythritol hexaacrylate, and methacrylates similar to the above. In addition, 1,4-butylene glycol diacrylate, 1,6-hexanediol diacrylate, polyethylene glycol diacrylate, commercially available oligoester acrylate, or methacrylates similar to those described above can also be used.
多官能オリゴマーとしては、上記の化合物のうちの１
種を単独で用いてもよいし２種以上を併用してもよい。
その使用量は、上記の重合性ポリマー100重量部に対し
て、１〜50重量部、好適には５〜20重量部である。１重
量部未満となると、放射線の照射による重合硬化後のガ
ラス転移点の上昇が小さくかつ架橋率も小さいため、接
着力の低下が小さくなる。また50重量部を超えると、放
射線照射前の粘着剤の可塑化が著しくなつて半導体ウエ
ハの切断時にズレや接着不良が発生し、また放射線照射
後は粘着剤の伸びの不足などの不具合が生じてくる。As the polyfunctional oligomer, one of the above compounds may be used.
The seeds may be used alone or in combination of two or more.
The amount used is 1 to 50 parts by weight, preferably 5 to 20 parts by weight, based on 100 parts by weight of the polymerizable polymer. When the amount is less than 1 part by weight, the increase in the glass transition point after polymerization and curing by irradiation with radiation is small and the crosslinking ratio is small, so that the decrease in the adhesive strength is small. If the amount exceeds 50 parts by weight, plasticization of the adhesive before irradiation is remarkable, causing misalignment and poor adhesion when cutting the semiconductor wafer, and problems such as insufficient elongation of the adhesive after irradiation. Come.
この発明の再剥離型粘着剤は、上記の重合性ポリマー
および多官能オリゴマーを必須成分とするほか、その重
合硬化のための放射線として紫外線などの活性光線を用
いるときは、通常光重合開始剤を配合するのが好まし
い。The removable pressure-sensitive adhesive of the present invention contains the above-mentioned polymerizable polymer and polyfunctional oligomer as essential components.When an actinic ray such as ultraviolet ray is used as radiation for the polymerization and curing, a photopolymerization initiator is usually used. It is preferable to mix them.
この光重合開始剤としては、たとえばイソプロピルベ
ンゾインエーテル、イソブチルベンゾインエーテル、ベ
ンゾフエノン、ミヒラーケトン、クロロチオキサント
ン、ドデシルチオキサントン、ジメチルチオキサント
ン、ジエチルチオキサントン、アセトフエノンジエチル
ケタール、ベンジルジメチルケタール、α−ヒドロキシ
シクロヘキシルフエニルケトン、２−ヒドロキシメチル
フエニルプロパンなどが挙げられ、これらのうちの１種
を単独であるいは２種以上を混合して使用することがで
きる。Examples of the photopolymerization initiator include isopropyl benzoin ether, isobutyl benzoin ether, benzophenone, Michler's ketone, chlorothioxanthone, dodecylthioxanthone, dimethylthioxanthone, diethylthioxanthone, acetophenone diethylketal, benzyldimethylketal, α-hydroxycyclohexylphenyl ketone , 2-hydroxymethylphenylpropane, etc., and one of these can be used alone or as a mixture of two or more.
この光重合開始剤の使用量としては、通常上記の重合
性ポリマー100重量部に対して0.1〜５重量部の範囲とす
るのがよい。この使用量が少なすぎると、粘着剤の放射
線照射による三次元網状化が不充分となつて、接着力の
低下の程度が小さすぎるため、好ましくない。逆にこの
使用量が多すぎると、それに見合う効果が得られないば
かりか、被着体の表面にこの光重合開始剤が残留するた
め、好ましくない。なお、必要に応じてこの光重合開始
剤とともに、トリエチルアミン、テトラエチルペンタミ
ン、ジメチルアミノエタノールなどのアミン化合物を光
重合促進剤として併用してもよい。The amount of the photopolymerization initiator used is usually preferably in the range of 0.1 to 5 parts by weight based on 100 parts by weight of the polymerizable polymer. If the amount is too small, the pressure-sensitive adhesive is not sufficiently three-dimensionally reticulated due to irradiation, and the degree of decrease in adhesive strength is too small, which is not preferable. Conversely, if the amount is too large, not only the effect corresponding thereto is not obtained but also the photopolymerization initiator remains on the surface of the adherend, which is not preferable. If necessary, an amine compound such as triethylamine, tetraethylpentamine, or dimethylaminoethanol may be used as a photopolymerization accelerator together with the photopolymerization initiator.
この発明の再剥離型粘着剤には、以上の成分のほか、
粘着剤としての凝集力の調節を図る目的で、所望により
イソシアネート化合物、メラミン化合物、エポキシ化合
物などの一般の粘着剤に配合される各種の多官能性化合
物を適宜配合してもよい。また、可塑剤、樹脂、界面活
性剤、ワツクス、微粒子充填剤などの公知の添加剤を加
えることもできる。The removable adhesive of the present invention, in addition to the above components,
For the purpose of controlling the cohesive force of the pressure-sensitive adhesive, various kinds of polyfunctional compounds such as isocyanate compounds, melamine compounds, and epoxy compounds may be appropriately compounded as needed. Further, known additives such as a plasticizer, a resin, a surfactant, a wax, and a fine particle filler can also be added.
このように構成される再剥離型粘着剤を用いて粘着シ
ートを作製するには、この粘着剤を公知の方法で基材上
に塗布したのち、必要に応じて乾燥して、通常５〜40μ
ｍ程度の厚みを有する粘着剤層を形成すればよい。基材
としては、プラスチツクフイルムが好ましく、放射線と
して特に紫外線などの活性光線を用いるときは、通常18
0〜460nmの光を透過しうる透明基材としてポリエチレ
ン、ポリプロピレン、ポリエチレンテレフタレート、ポ
リ塩化ビニルなどの厚みが通常10〜100μｍ程度のプラ
スチツクフイルムが好適である。In order to prepare a pressure-sensitive adhesive sheet using the removable pressure-sensitive adhesive thus configured, the pressure-sensitive adhesive is applied on a substrate by a known method, and then dried as necessary, and usually 5 to 40 μm.
An adhesive layer having a thickness of about m may be formed. As the base material, a plastic film is preferable.
As a transparent substrate capable of transmitting light of 0 to 460 nm, a plastic film having a thickness of usually about 10 to 100 μm, such as polyethylene, polypropylene, polyethylene terephthalate, or polyvinyl chloride, is preferable.
この粘着シートを用いて半導体ウエハの素子小片への
切断分離およびピツクアツプを行うには、常法によりま
ずこの粘着シートを半導体ウエハに貼り付けて素子小片
に切断する。このときの半導体ウエハに対する180度剥
離接着力（剥離速度300mm/分）は、通常200〜1,000g/25
mmであり、上記の切断時に加えられる通常2kg/cm2程度
の水圧によつてもこの粘着シートから素子小片が剥がれ
落ちることはなく、上記シート上に良好に保持されてい
る。In order to cut and separate the semiconductor wafer into element pieces and to pick up the semiconductor wafer using the adhesive sheet, the adhesive sheet is first attached to a semiconductor wafer and cut into element pieces by a conventional method. At this time, the 180-degree peel adhesion to the semiconductor wafer (peel speed 300 mm / min) is usually 200 to 1,000 g / 25.
mm, and even with a water pressure of about 2 kg / cm 2 applied during the above-mentioned cutting, the element small pieces do not peel off from the pressure-sensitive adhesive sheet and are favorably held on the sheet.
つぎに、この素子小片をピツクアツプする前に紫外線
などの活性光線やその他電子線、γ線のような電離性放
射線を照射して重合硬化する。これにより、粘着シート
の粘着性はほとんど失われて、素子小片に対する接着力
が180度剥離接着力（剥離速度300mm/分）で通常５〜50g
/25mm、好ましくは10〜30g/25mmと大幅に低下する。こ
のため、その後のピツクアツプ作業が大幅に改良され
て、マウント工程への移行も良好に行える。また、上記
のピツクアツプ時に粘着シートを引き伸ばしてピツクア
ツプ作業をより容易にする場合でも、粘着剤層にクラツ
クが生じるなどの弊害は特にない。Next, before picking up the element piece, it is irradiated with an actinic ray such as an ultraviolet ray or other ionizing radiation such as an electron beam or γ-ray to be polymerized and cured. As a result, the adhesiveness of the adhesive sheet is almost lost, and the adhesive strength to the element piece is 180 ° peeling adhesive strength (peeling speed 300 mm / min), usually 5 to 50 g.
/ 25 mm, preferably 10 to 30 g / 25 mm. For this reason, the subsequent pick-up operation is greatly improved, and the transition to the mounting step can be performed well. Further, even when the pressure-sensitive adhesive sheet is stretched at the time of pick-up to make the pick-up work easier, there is no particular problem such as cracking of the pressure-sensitive adhesive layer.
以上のように、この発明においては、特定の重合性ポ
リマーに多官能オリゴマーを特定量配合する構成とした
ことにより、放射線照射前の凝集力や接着力が大きく、
しかも放射線の照射による重合硬化速度が速くてかつ硬
化後の接着力の低下の大きい再剥離型粘着剤を得ること
ができ、この粘着剤によれば半導体ウエハの素子小片へ
の切断作業やピツクアツプ作業の大幅な改善を図ること
ができる。As described above, in the present invention, a specific amount of a polyfunctional oligomer is blended with a specific polymerizable polymer, so that the cohesive force and adhesive force before irradiation are large,
Moreover, it is possible to obtain a removable pressure-sensitive adhesive which has a high polymerization curing speed by irradiation of radiation and a large decrease in adhesive strength after curing, and according to this pressure-sensitive adhesive, a work for cutting a semiconductor wafer into small pieces and a work for picking up. Can be greatly improved.
つぎに、この発明の実施例を記載してより具体的に説
明する。なお以下、部とあるのは重量部である。また、
ヨウ素価はDas法に基づき反応条件を40℃,24時間にして
測定算出したものである。Next, an embodiment of the present invention will be described in more detail. Hereinafter, parts are parts by weight. Also,
The iodine value was measured and calculated based on the Das method with the reaction conditions at 40 ° C. for 24 hours.
実施例１ アクリル酸ｎ−ブチル79部、アクリル酸エチル15部、
アクリル酸１部およびアクリル酸２−ヒドロキシエチル
５部を、トルエン中で常法により共重合して、重量平均
分子量が65万の官能基含有ポリマーを含む固形分濃度が
35重量％のポリマー溶液を得た。Example 1 79 parts of n-butyl acrylate, 15 parts of ethyl acrylate,
Acrylic acid (1 part) and 2-hydroxyethyl acrylate (5 parts) are copolymerized in a conventional manner in toluene to give a solid content concentration containing a functional group-containing polymer having a weight average molecular weight of 650,000.
A 35% by weight polymer solution was obtained.
つぎに、このポリマー溶液に、官能基含有ポリマー10
0部に対してメタクリル酸２−イソシアネートエチル
（昭和ローデイオ社製のMDI）3.5部を加え、40℃で６時
間かけて反応させることにより、ヨウ素価が5.2の常温
で粘着性を有する重合性ポリマーを含むポリマー溶液と
した。Next, a functional group-containing polymer 10 was added to the polymer solution.
To 3.5 parts of 2-isocyanatoethyl methacrylate (MDI manufactured by Showa Rhodeio Co., Ltd.) was added to 0 parts, and the mixture was allowed to react at 40 ° C. for 6 hours to give a polymerizable polymer having an iodine value of 5.2 and an adhesive property at room temperature. A polymer solution containing
この重合性ポリマー溶液に、重合性ポリマー100部に
対してペンタエリスリトールトリアクリレート20部、ベ
ンゾフエノン0.5部およびポリイソシアネート化合物
（日本ポリウレタン社製のコロネートＬ）0.3部を配合
し、再剥離型粘着剤の溶液を調製した。To this polymerizable polymer solution, 20 parts of pentaerythritol triacrylate, 0.5 part of benzophenone, and 0.3 part of a polyisocyanate compound (Coronate L manufactured by Nippon Polyurethane Co.) are mixed with 100 parts of the polymerizable polymer, and a re-peelable adhesive is prepared. A solution was prepared.
この溶液を厚さが38μｍのポリプロピレンフイルムに
塗布し、過熱乾燥して、厚さが10μｍの粘着剤層を形成
し、その上面に剥離紙を貼り合わせて粘着シートとし
た。剥離紙を除去し、直径10cmのシリコンウエハを粘着
剤層面に貼り合わせて、JIS−Ｚ−0237に基づき初期接
着力を測定したところ、550g/25mmであつたが、粘着剤
層に電子線を実効吸収線量2Mrad（電圧150KeV,電流5m
A）照射したのち、その接着力を調べたところ、10g/25m
mと著しく低下していた。This solution was applied to a polypropylene film having a thickness of 38 μm, and dried by heating to form a pressure-sensitive adhesive layer having a thickness of 10 μm. The release paper was removed, a silicon wafer having a diameter of 10 cm was bonded to the adhesive layer surface, and the initial adhesive force was measured based on JIS-Z-0237.The result was 550 g / 25 mm, but an electron beam was applied to the adhesive layer. Effective absorbed dose 2Mrad (voltage 150KeV, current 5m
A) After irradiation, the adhesive strength was examined to be 10g / 25m
m.
つぎに、この粘着シートに直径５インチの大きさの半
導体ウエハを貼り付け、回転丸刃を用いて50mm2の大き
さの素子小片に切断した。この切断は2kg/cm2の水圧の
水で洗浄しながら行つたものであるが、その際に素子小
片が剥がれ落ちることはなかつた。この切断後、粘着シ
ートの基材側から高圧水銀ランプ（40W/cm）で発生した
光を集光して５秒間ピツクアツプするべき素子小片に対
応する部分にのみ光照射したのち、この照射部分の素子
小片をニードルで突き上げるとともに、エアピンセツト
で吸着することにより、ピツクアツプした。このピツク
アツプ作業は非常に容易で、しかも粘着剤層の素子小片
への移行は認められず、隣接する素子小片の飛散も生じ
なかつた。Next, a semiconductor wafer having a diameter of 5 inches was attached to the pressure-sensitive adhesive sheet, and cut into element pieces having a size of 50 mm 2 using a rotating round blade. This cutting was performed while washing with water at a water pressure of 2 kg / cm 2 , but at this time, the element pieces did not peel off. After this cutting, the light generated by the high-pressure mercury lamp (40 W / cm) is condensed from the substrate side of the adhesive sheet, and the light is irradiated only to the portion corresponding to the element piece to be picked up for 5 seconds. The element small piece was pushed up with a needle and sucked up with an air pin set to pick up the element. This pick-up operation was very easy, and no migration of the pressure-sensitive adhesive layer to the element pieces was recognized, and no scattering of adjacent element pieces occurred.
実施例２ アクリル酸ｎ−ブチル80部、アクリル酸エチル15部お
よびアクリル酸５部を、乳化重合法により共重合して、
重量平均分子量が98万の固形の官能基含有ポリマーを得
た。Example 2 80 parts of n-butyl acrylate, 15 parts of ethyl acrylate and 5 parts of acrylic acid were copolymerized by an emulsion polymerization method.
A solid functional group-containing polymer having a weight average molecular weight of 980,000 was obtained.
つぎに、この官能基含有ポリマー100部にメタクリル
酸グリシジル５部を加え、トルエン中で40℃で24時間か
けて反応させることにより、ヨウ素価が6.0の常温で粘
着性を有する重合性ポリマーを含む固形分濃度が20重量
％のポリマー溶液とした。Next, 5 parts of glycidyl methacrylate was added to 100 parts of the functional group-containing polymer and reacted in toluene at 40 ° C. for 24 hours to contain a polymerizable polymer having an iodine value of 6.0 and having tackiness at room temperature. A polymer solution having a solid content of 20% by weight was obtained.
この重合性ポリマー溶液を用いた以外は、以下実施例
１と同様にして、再剥離型粘着剤の調製および粘着シー
トの作製を行い、このシートの初期接着力および電子線
照射後の接着力を調べたところ、初期接着力は520g/25m
m、電子線照射後の接着力は20g/25mmであつた。また、
この粘着シートを用いて実施例１と同様の方法で半導体
ウエハの切断およびピツクアツプ作業を行つてみたとこ
ろ、両作業共に実施例１と同様に良好に行うことができ
た。Except for using this polymerizable polymer solution, the preparation of a re-peelable pressure-sensitive adhesive and the preparation of a pressure-sensitive adhesive sheet were carried out in the same manner as in Example 1, and the initial adhesive force of the sheet and the adhesive force after electron beam irradiation were measured. Upon examination, the initial adhesive strength was 520g / 25m
m, the adhesive strength after electron beam irradiation was 20 g / 25 mm. Also,
The semiconductor wafer was cut and picked up using the adhesive sheet in the same manner as in Example 1. As a result, both operations could be performed as well as in Example 1.
実施例３ アクリル酸ｎ−ブチル88部、アクリロニトリル５部お
よびメタクリル酸グリシジル７部を、酢酸エチル中で常
法により共重合して、重量平均分子量が58万の官能基含
有ポリマーを含む固形分濃度が30重量％のポリマー溶液
を得た。Example 3 88 parts of n-butyl acrylate, 5 parts of acrylonitrile and 7 parts of glycidyl methacrylate were copolymerized in a conventional manner in ethyl acetate to give a solid content concentration containing a functional group-containing polymer having a weight average molecular weight of 580,000. Obtained a polymer solution of 30% by weight.
つぎに、このポリマー溶液に、官能基含有ポリマー10
0部に対してアクリル酸３部を加え、40℃で24時間かけ
て反応させることにより、ヨウ素価が6.5である常温で
粘着性を有する重合性ポリマーを含むポリマー溶液とし
た。Next, a functional group-containing polymer 10 was added to the polymer solution.
By adding 3 parts of acrylic acid to 0 parts and reacting at 40 ° C. for 24 hours, a polymer solution containing a polymerizable polymer having an iodine value of 6.5 and having tackiness at room temperature was obtained.
この重合性ポリマー溶液を用いた以外は、以下実施例
１と同様にして、再剥離型粘着剤の調製および粘着シー
トの作製を行い、このシートの初期接着力および電子線
照射後の接着力を調べたところ、初期接着力は280g/25m
m、電子線照射後の接着力は10g/25mmであつた。また、
この粘着シートを用いて実施例１と同様の方法で半導体
ウエハの切断およびピツクアツプ作業を行つてみたとこ
ろ、両作業共に実施例１と同様に良好に行うことができ
た。Except for using this polymerizable polymer solution, the preparation of a re-peelable pressure-sensitive adhesive and the preparation of a pressure-sensitive adhesive sheet were carried out in the same manner as in Example 1, and the initial adhesive force of the sheet and the adhesive force after electron beam irradiation were measured. Upon examination, the initial adhesive strength was 280g / 25m
m, the adhesive strength after electron beam irradiation was 10 g / 25 mm. Also,
The semiconductor wafer was cut and picked up using the adhesive sheet in the same manner as in Example 1. As a result, both operations could be performed as well as in Example 1.
比較例１ ペンタエリスリトールトリアクリレート20部を用いな
かつた以外は、実施例１と同様にして再剥離型粘着剤の
調製および粘着シートの作製を行つた。この粘着シート
の初期接着力および電子線照射後の接着力を調べたとこ
ろ、初期接着力は450g/25mm、電子線照射後の接着力は1
80g/25mmであつた。また、この粘着シートを用いて実施
例１と同様の方法で半導体ウエハの切断およびピツクア
ツプ作業を行つてみたところ、切断作業は良好に行えた
が、ピツクアツプ作業はうまく行えなかつた。Comparative Example 1 A peelable pressure-sensitive adhesive was prepared and a pressure-sensitive adhesive sheet was prepared in the same manner as in Example 1, except that 20 parts of pentaerythritol triacrylate was not used. When the initial adhesive force and the adhesive force after electron beam irradiation of this pressure-sensitive adhesive sheet were examined, the initial adhesive force was 450 g / 25 mm, and the adhesive force after electron beam irradiation was 1
It was 80g / 25mm. Further, when the semiconductor wafer was cut and picked up in the same manner as in Example 1 using this pressure-sensitive adhesive sheet, the cutting operation was successfully performed, but the pick-up operation was not successfully performed.
比較例２ 官能基含有ポリマーにメタクリル酸２−イソシアネー
トエチルを反応させないで、つまり重合性ポリマーをつ
くらないで、上記の官能基含有ポリマーに直接ペンタエ
リスリトールトリアクリレートおよびポリイソシアネー
ト化合物を配合するようにした以外は、実施例１と同様
にして再剥離型粘着剤の調製および粘着シートの作製を
行つた。この粘着シートの初期接着力および電子線照射
後の接着力を調べたところ、初期接着力は520g/25mm、
電子線照射後の接着力は350g/25mmであつた。また、こ
の粘着シートを用いて実施例１と同様の方法で半導体ウ
エハの切断およびピツクアツプ作業を行つてみたが、両
作業共良好に行うことができなかつた。Comparative Example 2 Without reacting 2-isocyanatoethyl methacrylate with the functional group-containing polymer, that is, without producing a polymerizable polymer, pentaerythritol triacrylate and a polyisocyanate compound were directly mixed with the functional group-containing polymer. Except for the above, the preparation of a removable pressure-sensitive adhesive and the preparation of a pressure-sensitive adhesive sheet were performed in the same manner as in Example 1. When examining the initial adhesive strength of this adhesive sheet and the adhesive strength after electron beam irradiation, the initial adhesive strength was 520 g / 25 mm,
The adhesive strength after electron beam irradiation was 350 g / 25 mm. Further, cutting and picking-up work of the semiconductor wafer were carried out in the same manner as in Example 1 using this adhesive sheet, but both work could not be performed satisfactorily.
───────────────────────────────────────────────────── フロントページの続き (56)参考文献 特開 昭62−138575（ＪＰ，Ａ) 特開 昭61−207476（ＪＰ，Ａ) 特開 昭63−301282（ＪＰ，Ａ) ────────────────────────────────────────────────── ─── Continuation of the front page (56) References JP-A-62-138575 (JP, A) JP-A-61-207476 (JP, A) JP-A-63-301282 (JP, A)
Claims (1)
をさらにピツクアツプする際に用いる粘着シート用の再
剥離型粘着剤において、分子内に放射線重合性の不飽和
結合を有してなるヨウ素価が0.5〜20で重量平均分子量
が20万〜200万である常温で粘着性を有するアクリル酸
アルキルエステル系および／またはメタクリル酸アルキ
ルエステル系の重合性ポリマーと、このポリマー100重
量部に対して１〜50重量部となる割合の放射線重合性の
多官能オリゴマーとを主成分として含んでなり、半導体
ウエハに対する180度剥離接着力（剥離速度300mm/分）
が、放射線の照射前で200〜1,000g/25mmで、放射線の照
射による重合硬化後で５〜50g/25mmとなる再剥離型粘着
剤。1. A re-peelable pressure-sensitive adhesive for a pressure-sensitive adhesive sheet which is used for cutting and separating a semiconductor wafer into element pieces and further picking up the element pieces. Of 0.5 to 20 and a weight average molecular weight of 200,000 to 2,000,000, and having an adhesive property at room temperature, such as an alkyl acrylate and / or methacrylate alkyl polymer, and 1 to 100 parts by weight of the polymer. 180-degree peel adhesion to semiconductor wafers (peel rate 300 mm / min)
Is a removable pressure-sensitive adhesive that has a weight of 200 to 1,000 g / 25 mm before irradiation with radiation and 5 to 50 g / 25 mm after polymerization and curing by irradiation.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1006795A JP2887274B2 (en) | 1989-01-13 | 1989-01-13 | Removable adhesive |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1006795A JP2887274B2 (en) | 1989-01-13 | 1989-01-13 | Removable adhesive |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH02187478A JPH02187478A (en) | 1990-07-23 |
| JP2887274B2 true JP2887274B2 (en) | 1999-04-26 |
Family
ID=11648108
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1006795A Expired - Lifetime JP2887274B2 (en) | 1989-01-13 | 1989-01-13 | Removable adhesive |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP2887274B2 (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR20200062255A (en) | 2017-09-29 | 2020-06-03 | 사이덴 가가쿠 가부시키가이샤 | Adhesive sheet |
Families Citing this family (19)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2819881B2 (en) * | 1991-08-09 | 1998-11-05 | 東洋インキ製造株式会社 | Reactive adhesive |
| US6448337B1 (en) | 1999-10-07 | 2002-09-10 | 3M Innovative Properties Company | Pressure sensitive adhesives possessing high load bearing capability |
| KR100351706B1 (en) * | 2000-06-27 | 2002-09-11 | 한솔제지주식회사 | Photosensitive adhesive compositions for dicing tape |
| KR100351705B1 (en) * | 2000-06-27 | 2002-09-11 | 한솔제지주식회사 | Photosensitive adhesive compositions for dicing tape |
| JP4803778B2 (en) * | 2001-07-03 | 2011-10-26 | 日東電工株式会社 | Re-peelable pressure-sensitive adhesive and re-peelable pressure-sensitive adhesive sheet |
| JP4518535B2 (en) * | 2003-07-01 | 2010-08-04 | 日東電工株式会社 | Dicing adhesive sheet, dicing adhesive sheet, semiconductor element manufacturing method, semiconductor element |
| JP2006111651A (en) * | 2004-10-12 | 2006-04-27 | Nippon Synthetic Chem Ind Co Ltd:The | Pressure-sensitive adhesive sheet |
| KR101386764B1 (en) * | 2006-10-03 | 2014-04-21 | 가부시끼가이샤 이테크 | Adhesive composition and adhesive sheet |
| JP5235294B2 (en) * | 2006-11-10 | 2013-07-10 | 日東電工株式会社 | Heat-foaming type removable acrylic adhesive tape or sheet |
| JP2009064975A (en) | 2007-09-06 | 2009-03-26 | Nitto Denko Corp | Dicing adhesive sheet and dicing method |
| JP4553400B2 (en) | 2008-02-18 | 2010-09-29 | 日東電工株式会社 | Dicing die bond film |
| JP2010053346A (en) * | 2008-07-31 | 2010-03-11 | Nitto Denko Corp | Re-releasable adhesive and re-releasable adhesive sheet |
| JP2009197248A (en) * | 2009-06-11 | 2009-09-03 | Nitto Denko Corp | Adhesive sheet for dicing |
| KR20120117828A (en) * | 2009-12-21 | 2012-10-24 | 덴끼 가가꾸 고교 가부시키가이샤 | Adhesive sheet and production method for electronic component |
| JP2010132916A (en) * | 2010-01-29 | 2010-06-17 | Nitto Denko Corp | Re-release type adhesive and re-release type adhesive sheet |
| JP5424941B2 (en) * | 2010-03-09 | 2014-02-26 | 日立マクセル株式会社 | Radiation curable adhesive composition, adhesive film for dicing using the same, and method for producing cut pieces |
| JP4991024B1 (en) | 2010-12-06 | 2012-08-01 | 株式会社きもと | Auxiliary sheet for laser dicing |
| CN104220546B (en) | 2012-03-30 | 2016-07-06 | 木本股份有限公司 | The processing method of being easily peeled property bonding film and metallic plate |
| JP6452189B2 (en) * | 2014-04-01 | 2019-01-16 | 東洋紡株式会社 | Method for manufacturing flexible electronic device |
Family Cites Families (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS61207476A (en) * | 1985-03-12 | 1986-09-13 | Hitachi Chem Co Ltd | Radiation-curable self-adhesive for surface protective film used for drawing process |
| JPS62138575A (en) * | 1985-12-11 | 1987-06-22 | Hitachi Chem Co Ltd | Peeling of surface-protecting adhesive film |
| JP2626978B2 (en) * | 1987-05-30 | 1997-07-02 | ニチバン株式会社 | Pressure sensitive adhesive composition |
-
1989
- 1989-01-13 JP JP1006795A patent/JP2887274B2/en not_active Expired - Lifetime
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR20200062255A (en) | 2017-09-29 | 2020-06-03 | 사이덴 가가쿠 가부시키가이샤 | Adhesive sheet |
Also Published As
| Publication number | Publication date |
|---|---|
| JPH02187478A (en) | 1990-07-23 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| JP2887274B2 (en) | Removable adhesive | |
| JPS60223139A (en) | Bonding sheet for fixing semiconductor wafer | |
| JPH0616524B2 (en) | Adhesive thin plate for fixing semiconductor wafers | |
| JP4066394B2 (en) | Removable adhesive | |
| JPH09286956A (en) | Energy ray curing type pressure-sensitive adhesive composition and its utilization | |
| JP3035179B2 (en) | Adhesive sheet for semiconductor wafer processing | |
| JPS62153376A (en) | Pressure-sensitive adhesive sheet | |
| JP2004256793A (en) | Adhesive tape for sticking wafer | |
| JP2005197630A (en) | Method of manufacturing ic chip | |
| JP2001207140A (en) | Adhesive tape for processing semiconductor wafer | |
| JPH10279894A (en) | Pressure-sensitive adhesive sheet and method for processing semiconductor wafer | |
| JPH0661346A (en) | Adhesive sheet for semiconductor wafer dicing use | |
| TW200300444A (en) | Adhesive material, method for unsticking adhesive material and bound structure | |
| JP2002285134A (en) | Adhesive sheet for processing semiconductor | |
| JP4611706B2 (en) | Adhesive tape | |
| JP2000044894A (en) | Peelable tacky agent composition | |
| JPH1161065A (en) | Pressure-sensitive adhesive sheet for semiconductor wafer | |
| JP2003151940A (en) | Back grind tape and method of polishing semiconductor wafer | |
| JPH10310748A (en) | Tacky sheet for processing semiconductor wafer | |
| JP2005050953A (en) | Adhesive tape for working semiconductor substrate | |
| JP2007109862A (en) | Method of separating adhesive tape | |
| JP6301987B2 (en) | Dicing adhesive tape and semiconductor wafer full-cut dicing method | |
| JPH0215594B2 (en) | ||
| JP4017132B2 (en) | Re-peelable pressure-sensitive adhesive composition | |
| JP2005294535A (en) | Manufacturing method of ic chip with die-attach film |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| S533 | Written request for registration of change of name |
Free format text: JAPANESE INTERMEDIATE CODE: R313533 |
|
| R350 | Written notification of registration of transfer |
Free format text: JAPANESE INTERMEDIATE CODE: R350 |
|
| R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
| R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
| FPAY | Renewal fee payment (prs date is renewal date of database) |
Year of fee payment: 6 Free format text: PAYMENT UNTIL: 20081101 |
|
| FPAY | Renewal fee payment (prs date is renewal date of database) |
Free format text: PAYMENT UNTIL: 20081101 Year of fee payment: 6 |
|
| FPAY | Renewal fee payment (prs date is renewal date of database) |
Free format text: PAYMENT UNTIL: 20091101 Year of fee payment: 7 |
|
| FPAY | Renewal fee payment (prs date is renewal date of database) |
Free format text: PAYMENT UNTIL: 20101101 Year of fee payment: 8 |
|
| FPAY | Renewal fee payment (prs date is renewal date of database) |
Free format text: PAYMENT UNTIL: 20111101 Year of fee payment: 9 |
|
| FPAY | Renewal fee payment (prs date is renewal date of database) |
Year of fee payment: 10 Free format text: PAYMENT UNTIL: 20121101 |
|
| FPAY | Renewal fee payment (prs date is renewal date of database) |
Free format text: PAYMENT UNTIL: 20121101 Year of fee payment: 10 |
|
| S111 | Request for change of ownership or part of ownership |
Free format text: JAPANESE INTERMEDIATE CODE: R313113 |
|
| FPAY | Renewal fee payment (prs date is renewal date of database) |
Year of fee payment: 10 Free format text: PAYMENT UNTIL: 20121101 |
|
| R350 | Written notification of registration of transfer |
Free format text: JAPANESE INTERMEDIATE CODE: R350 |
|
| FPAY | Renewal fee payment (prs date is renewal date of database) |
Free format text: PAYMENT UNTIL: 20121101 Year of fee payment: 10 |
|
| FPAY | Renewal fee payment (prs date is renewal date of database) |
Free format text: PAYMENT UNTIL: 20131101 Year of fee payment: 11 |
|
| R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |