JP2885404B2 - Crimping method and device - Google Patents

Description

DETAILED DESCRIPTION OF THE INVENTION [Object of the Invention] (Industrial Application Field) The present invention relates to a pressure bonding method applied to, for example, connecting a liquid crystal display panel and a printed circuit board with an anisotropic conductive film and an apparatus therefor. .

(Prior Art) In FIG. 3, 1 is a liquid crystal display panel (LCD), and 2 is a printed circuit board (FPC). When the liquid crystal display panel 1 is connected to the printed circuit board 2, an anisotropic conductive film is disposed between the liquid crystal display panel 1 and the printed circuit board 2, and each terminal 1a of the liquid crystal display panel 1 is connected to the printed circuit board 2. 2 and each terminal 2a. By the way, the actual crimping device will be described with reference to the schematic configuration diagram of FIG. 4. The liquid crystal display panel 1 is mounted on the positioning stage 3 while being attached to the positioning stage 3, and the printed circuit board 2 is mounted on another positioning stage 4. It is placed on. An imaging device 5 is arranged above the liquid crystal display panel 1 and the printed circuit board 2 so that the liquid crystal display panel 1 and the printed circuit board 2 are projected on a monitor television (not shown). However, while monitoring the image projected on the monitor television, for example, the positioning stage 3 and the positioning stage 4 are relatively moved in the X and Y directions, and each terminal 1a of the liquid crystal display panel 1 and each terminal 2a of the printed circuit board 2 are moved. Are positioned. Thereafter, the thermocompression bonding head 6 is pressurized from above the liquid crystal display panel 1 and heated to connect the liquid crystal display panel 1 and the printed board 2.

In the above-described pressure bonding apparatus, the positioning stage 3 receives the pressure of the thermocompression bonding head 6. Therefore, if the positioning stage 3 is configured to be movable, the positioning stage 3 may move when the thermocompression bonding head 6 is pressed. When the positioning stage 3 moves in this way, not only does the position of each terminal 1a of the liquid crystal display panel 1 and each terminal 2a of the printed circuit board 2 shift, but also,
The parallelism between the liquid crystal display panel 1 and the thermocompression bonding head 6 cannot be maintained. Therefore, it is impossible to connect the liquid crystal display panel 1 and the printed board 2 with high accuracy. Therefore, in order to increase the rigidity of the movable portion of the positioning stage 3, the positioning stage 3 is large and expensive.

The positioning between the liquid crystal display panel 1 and the printed board 2 is performed by the imaging device 5 provided above. For example, a resist or pattern is formed on the surface of the printed board 2 facing downward and the printed board 2 is positioned. Is non-transmissive, the resist and pattern are hidden by the printed circuit board 2 and cannot be imaged by the imaging device 5. In such a case, it becomes impossible at all to perform positioning between the liquid crystal display panel 1 and the printed board 2 in consideration of the positions of these resists and patterns.

(Problems to be Solved by the Invention) As described above, it is difficult to reliably connect each terminal 1a of the liquid crystal display panel 1 and each terminal 2a of the printed circuit board 2 in a positioned state. If a resist or pattern is formed on the surface of the printed circuit board 2 on which an image cannot be captured, it is difficult to position the resist or pattern in accordance with the position of the resist or pattern.

SUMMARY OF THE INVENTION It is an object of the present invention to provide a pressure bonding method and an apparatus therefor capable of positioning the liquid crystal display panel and the printed circuit board with high precision by positioning without being affected by a resist or a pattern forming position.

[Structure of the Invention] (Means for Solving the Problems) The present invention provides at least one of a first stage on which a first body to be crimped is placed and a second stage on which a second body to be crimped is placed. Either of them is moved in the XY direction and the θ direction, and the first object to be pressed and the second object to be pressed are placed in the same field of view by the imaging means at the positioning position, and imaged from below, and based on the imaging result, The first and second crimped bodies are positioned by using the first and second crimped bodies, and the positioned crimping heads and pressure receivers which are opposed to each other with the first and second crimped bodies interposed therebetween are used. This is a pressure bonding method in which pressure is applied by using pressure bonding.

Also, the present invention provides a first stage on which a first body to be crimped is mounted, a second stage on which a second body to be crimped is mounted,
The positioning stage for moving at least one of the first and second stages in the XY direction and the θ direction, and the first to-be-pressed body and the second to-be-pressed body are placed in the same field of view at the positioning position. Imaging means for imaging from below, and first and second positioned by driving a positioning stage based on an imaging result obtained by putting the first and second objects to be pressed into the imaging visual field of the imaging means. A crimping head for crimping the first and second crimped bodies by applying at least pressure to the first and second crimped bodies, and facing the crimped head with the first and second crimped bodies interposed therebetween. A crimping apparatus comprising: a crimping unit that is disposed and has a pressure receiver that receives pressure from a crimping head; and a moving unit that relatively moves the positioning stage and the crimping unit.

(Operation) With the provision of such means, at least one of the first stage on which the first body to be pressed is placed and the second stage on which the second body to be pressed is placed are used for positioning. The stage is moved in the XY direction and the θ direction by the stage, and the first body to be pressed and the second body to be pressed are placed in the same field of view by the imaging means at the positioning position and imaged from below, and based on the imaging result, The first and second crimped bodies are crimped by applying pressure using the crimping heads and pressure receivers of crimping means arranged opposite to each other with the first and second crimped bodies interposed therebetween.

Hereinafter, an embodiment of the present invention will be described with reference to the drawings.

FIG. 1 is an overall configuration diagram of the crimping device. In the figure
Reference numeral 10 denotes a positioning stage. The positioning stage 10 has an X-direction stage 12 mounted on a base stage 11, a Y-direction stage 13 on the X-direction stage 12, and a Y-direction stage. A θ-direction stage 14 is mounted on 13. Reference numerals 12a, 13a, and 14a denote motors for driving the respective stages 12, 13, and 14, respectively. And
The positioning stage 10 moves on each of the rails R1 and R2, and reciprocates between an alignment position and a thermocompression bonding position. An LCD stage 15 is fixed to the base stage 11 of the positioning stage 10. In FIG. 1, it is fixed and not shown. An FPC stage 16 is provided on the θ-direction stage 14. The LCD stage 15 is provided with a step 15a corresponding to the outer shape of the liquid crystal display panel 1 and provided with a suction device. The liquid crystal display panel 1 is abutted against the step 15a and is mounted by being suctioned by the suction device. It has become. On the other hand, a positioning pin and a suction device (not shown) are provided on the FPC stage 16, and the printed circuit board 2 is positioned by the pins and sucked by the suction device.
Is to be placed.

On the other hand, a mirror stage 17 is fixedly arranged below the LCD stage 15. As shown in FIG. 2, mirrors 18 and 19 are arranged on the mirror stage 17 at positions corresponding to both ends of the liquid crystal display panel 1, respectively. Then, imaging devices 20 and 21 are provided on the reflection optical paths of the mirrors 18 and 19, respectively. These imaging devices 20 and 21 capture images of the respective ends of the liquid crystal display panel and the printed board 2 from below through mirrors 18 and 19, respectively, and transmit the image signals to the monitor television 22. As shown in the monitor television screens 22a and 22b of FIG. 1, the liquid crystal display panel 1 and the printed board 2 are included in each of the monitor television screens 22a and 22b in each imaging field of view 21. ing. Note that lens barrels 22 and 24 each having an enlargement optical system are attached to each of the imaging devices 20 and 23, and an illumination device that irradiates in the same direction as the optical axis of the enlargement optical system is mounted on each of the lens barrels 22 and 24. Is provided. An illuminating device is arranged around each of the mirrors 18 and 19 to illuminate the liquid crystal display panel 1 and the printed circuit board 2. The monitor television 22 divides a display screen into two and displays an image captured by the imaging device 20 on one screen 22a, and displays an image captured by the imaging device 21 on the other screen 22b.

On the other hand, a thermocompression bonding device 25 is provided at a thermocompression bonding point on each of the rails R1 and R2. The thermocompression bonding device 25 includes a thermocompression bonding head 26 and a pressure receiver 27, and is configured to move in directions facing each other. The longitudinal direction of the thermocompression bonding head 26 and the pressure receiver 27 is arranged so as to coincide with the longitudinal direction of the LCD stage 15.

Next, the crimping action of the device configured as described above will be described.

When the positioning stage 10 is located at the position for positioning as shown in FIG. 1, the liquid crystal display panel 1 is brought into contact with the liquid crystal display panel 1 with the terminals facing upward on the step 15a of the LCD stage 15 and is suctioned by the suction device. It is placed. On the other hand, the printed circuit board 2 is placed on the FPC stage 16 while being sucked by the suction device with each terminal facing downward. At this time, an anisotropic conductive film is temporarily attached to the printed board 2. In this state, the liquid crystal display panel 1 and the printed circuit board 2 are respectively illuminated from below by the illumination devices provided in the lens barrels 23 and 24 and the illumination devices provided around the mirrors 1819. Then, the imaging device 20 is
Through one end of the liquid crystal display panel 1 and the printed circuit board 2 in the same field of view, and outputs the image signal. At the same time, the image pickup device 21 picks up the other end side of the liquid crystal display panel 1 and the printed board 2 through the mirror 19 within the same field of view and outputs the image signal. As a result, the other end side of the liquid crystal display panel 1 and the printed circuit board 2 is projected on one screen 22a of the monitor television 22, and the other screen 22b
Shows the other end side of the liquid crystal display panel 1 and the printed circuit board 2. However, the terminals of the liquid crystal display panel 1 and the printed circuit board 2 are positioned while monitoring each terminal on both ends of the liquid crystal display panel 1 and the printed circuit board 2 projected on the monitor television 22. That is, this positioning is performed by driving the X-direction stage 12, the Y-direction stage 13 and the θ-direction stage 14, respectively.
Thereafter, when the positioning between the liquid crystal display panel 1 and the printed circuit board 2 is completed, the positioning stage 10 moves on each of the rails R1 and R2 toward the thermocompression bonding position. Then, when the positioning stage 10 reaches the thermocompression bonding position, the positioning stage 10 stops. At this time, the liquid crystal display panel 1 and the printed board 2 are located between the thermocompression head 26 and the pressure receiver 27, and the longitudinal direction of the liquid crystal display panel 1 and the printed board 2 and the longitudinal direction of the thermocompression head 26 and the pressure receiver 27. And match. Thus, the thermocompression bonding head 26 is lowered and the pressure receiver 27 is raised to press and heat the joint between the liquid crystal display panel 1 and the printed board 2 at a predetermined pressure. As a result, the liquid crystal display panel 1 and the printed circuit board 2 are connected.

When connecting the next liquid crystal display panel 1 to the printed circuit board 2, the positioning stage 10 is moved to the positioning position again to perform positioning between the liquid crystal display panel 1 and the printed circuit board 2, and thereafter the positioning stage 10 is moved. 10 is moved to a thermocompression bonding position and thermocompression is performed.

As described above, in the above-described embodiment, the respective end sides of the liquid crystal display panel 1 and the printed circuit board 2 are put into the same imaging field of view through the respective mirrors 18 and 19, and are imaged from below by the imaging devices 20 and 21 for monitoring. LCD panel 1
The liquid crystal display panel 1 and the printed board 2 can be positioned with a small amount of work by looking at the liquid crystal display panel 1 and the printed board 2 in the same imaging field of view, and the liquid crystal display panel 1 and the printed board 2 are superimposed on each other. Positioning.

Further, the resist and the pattern formed on the printed board 2 can be confirmed by looking at the monitor television 22 or the actual printed board 2, and the liquid crystal display panel 1 and the printed board 2 are not affected by the positions of these registers and patterns. Can be positioned.

Further, the liquid crystal display panel 1 and the printed circuit board 2 can be easily set on the stages 15 and 16 without obstructing the optical paths of the image pickup devices 20 and 21 while watching the monitor television 22, thereby improving workability. Also, since thermocompression bonding is performed by the thermocompression bonding head 26 and the pressure receiver 27, there is no need to receive pressure on the positioning stage 10 and the LCD stage 15, and the positioning stage 10 can be reduced in size and weight. And at this time each mirror
Since only the positioning stage 10 is moved with the 18, 19 and the pressure receiver 27 arranged in the same direction as the moving direction of the positioning stage 10, high positional accuracy can be maintained. Furthermore, θ
Since the position of the rotation axis of the direction stage 14 is set to a position close to the connection point of the liquid crystal display panel 1, displacement in the XY direction can be minimized when positioning in the θ direction is performed.

The present invention is not limited to the above-described embodiment, and may be modified without departing from the gist thereof. For example,
At least two sets of the combination of the LCD stage 15 and the FPC stage 16 are provided, and one set is positioned at the positioning position, and the other set is set at the thermo-compression position to perform the thermo-compression at alternate positions. Crimping may be performed. In this case, the movement trajectory of the positioning stage 10 is optimally a straight line or an arc. Further, instead of reciprocating the positioning table 10 between the positioning position and the thermocompression bonding position, the thermocompression bonding device 25 may be moved. Furthermore, it can be applied not only to the crimping of the liquid crystal display panel and the printed circuit board but also to the crimping of other crimped bodies.
Also, it is not limited to thermocompression bonding. Further, the image picked up by the image pick-up means is connected to an image processing device, the amount of displacement between the objects to be pressed is calculated, and the first and second stages are automatically driven to automate the device. Can respond.

[Effects of the Invention] As described in detail above, according to the present invention, the liquid crystal display panel and the printed board are viewed in the same imaging field of view, so that the positioning between the liquid crystal display board and the printed board is reduced, and It is possible to provide a crimping method and a device that can position the liquid crystal display plate and the printed circuit board by positioning the board and the printed circuit board in a superimposed state, and can position the liquid crystal display board and the printed circuit board with high precision without being affected by the resist or pattern forming position. .

[Brief description of the drawings]

1 and 2 are views for explaining one embodiment of a crimping apparatus according to the present invention, wherein FIG. 1 is an overall configuration diagram, FIG. 2 is a layout diagram of each mirror, and FIG. FIG. 4 is a diagram showing a connection between a liquid crystal display panel and a printed circuit board, and FIG. 1 ... LCD panel, 2 ... Printed circuit board, 10 ... Positioning stage, 11 ... Base stage, 12 ... X direction stage, 13 ... Y direction stage, 14 ... θ direction stage, 15 ... LCD stage, 16… FPC stage, 17… Mirror stage, 18,19 …… Mirror, 20,21 …… Imaging device,
22 ... monitor television, 25 ... thermocompression bonding equipment, 26 ...
Thermocompression head, 27 ... Pressure receiving.

Claims (2)

(57) [Claims] 1. A method according to claim 1, wherein at least one of a first stage on which the first member to be pressed is mounted or a second stage on which the second member to be pressed is mounted is moved in the XY direction and the θ direction. The first and second crimped bodies are placed in the same field of view by the imaging means at the positioning position and imaged from below, and the first and second crimped bodies are determined based on the imaged results. Positioning and crimping the positioned first and second crimped bodies by applying pressure using a crimping head and a pressure receiver that are opposed to each other with the first and second crimped bodies interposed therebetween. Characteristic crimping method. 2. A first stage on which a first member to be pressed is mounted, a second stage on which a second member to be pressed is mounted, and at least one of the first and second stages A positioning stage for moving the first and second compression-bonded objects in the same field of view at a positioning position and imaging from below, and Means for driving the positioning stage based on the imaging result obtained by placing the first and second pressure-bonded objects in the imaging visual field of the means and pressing the first and second pressure-bonded objects positioned by pressure A crimping head for applying pressure at least to the first and second crimped bodies and a crimping head opposed to the crimping head with the first and second crimped bodies interposed therebetween; Get pressure from A pressing means having a force receiving crimping apparatus according to claim by comprising a moving means for relatively moving said pressing means and said positioning stage.