JP2885283B2 - Circuit element for flip chip connection - Google Patents

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a circuit element for flip-chip connection connected to a substrate by flip-chip connection, a method for manufacturing the same, and a method for flip-chip connection.

[0002]

2. Description of the Related Art A flip-chip connecting circuit element is a circuit element having an electronic circuit and / or an electric circuit.
A circuit element that is electrically connected to the substrate by flip-chip connection. In addition, the flip-chip connection circuit element includes a plurality of external connection terminals arranged on a specific one plane, and connection metal bumps provided on each of the plurality of external connection terminals. Such a flip-chip connection circuit element generally means a semiconductor element or an integrated circuit element. In this specification, however, the flip-chip connection circuit element has a single surface such as a multilayer inductance, a capacitance and a resistance formed by multilayer wiring on a multilayer ceramic substrate. A circuit element having a plurality of external connection terminals provided thereon includes all circuit elements that can be flip-chip connected.

[0003] The flip-chip connection refers to a connection method in which a flip-chip connection circuit element is directly connected face-down to a substrate.

Further, conventionally, flip-chip connection methods are roughly classified into the following three types.

The first method is to use a metal such as solder which melts at a relatively low temperature of about 200 ° C. as a material of a metal bump for connection provided on an external connection terminal. First
In the method, first, a metal bump for connection is provided to an external connection terminal using a metal that melts at a relatively low temperature,
The flip-chip connecting circuit element provided with the connecting metal bump is placed face down at a predetermined position on the substrate, and then heated to a temperature equal to or higher than the melting temperature of the connecting metal bump to form the connecting metal bump. By melting, the external connection terminal of the circuit element is electrically connected to the wiring pattern provided on the substrate side.

A second method is a method of using a metal which can be easily bonded by a heating load, such as Au, as a material of a metal bump for connection provided on an external connection terminal. In the second method, a metal bump for connection is provided to an external connection terminal using this kind of metal, and a connection pattern is formed on the substrate side using the same kind of metal, and the metal bump for connection is provided. The flip-chip connecting circuit element is placed face down on a predetermined position on the substrate, and then heat-pressed to electrically connect the external connection terminals of the circuit element and the wiring pattern provided on the substrate side. Connect to

A third method is to electrically connect the connection metal bumps of the flip-chip connection circuit element to the connection pattern on the substrate via a conductive adhesive.

In any of the first to third methods, in order to secure the connection between the substrate and the flip-chip connection circuit element, the flip-chip connection circuit element must be mounted on the substrate. At the time of connection, it is necessary to surely make contact and connection between the connection pattern on the substrate side and the connection metal bump of the flip-chip connection circuit element. Therefore, in any of the first to third methods described above, a method is employed in which a predetermined load is applied after the flip-chip connecting circuit element is arranged at a predetermined position on the substrate.

Conventionally, as a flip-chip connecting circuit element to which this kind of connecting method is applied, for example, a circuit element having a structure shown in FIG. 9 (conventional example 1) is given.

The flip-chip connection circuit element 1 of the prior art 1 has a plurality of external connection terminals 2 formed at substantially constant intervals around the outer periphery of a specific plane. Each of the external connection terminals 2 includes a connection metal bump 3 provided on each of the external connection terminals 2. Note that, in the flip-chip connection circuit element 1 of Conventional Example 1, it is ideal that the plurality of connection metal bumps 3 are formed to have a certain height.

The flip-chip connecting circuit element 1 of the prior art 1 is connected to the substrate 9 as shown in FIG. More specifically, the surface of the flip-chip connection circuit element 1 on which the connection metal bumps 3 are provided faces the surface of the substrate 9 on which the connection pattern 10 is formed, and is positioned at a predetermined position. A constant load is applied to the chip connection circuit element 1 from the surface opposite to the surface on which the connection metal bumps 3 are provided, using the load jig 11, or a load is applied while heating. By slightly deforming the connection metal bump 3, the connection pattern 10 of the substrate 9 and the flip-chip connection circuit element 1
Are electrically connected to the connection metal bumps 3 included in.

Another example of a flip-chip connection circuit element to which flip-chip connection is applied is the one disclosed in Japanese Patent Application Laid-Open No. 2-105420 (conventional example 2).

The flip-chip connecting circuit element 1 of the conventional example 2 is a rectangular circuit element as shown in FIG. 11, and prevents the bending of the circuit element when the external connection terminals 2 are distributed. It is for doing. In order to achieve the object, the flip-chip connection circuit element 1 according to the conventional example 2 includes an external connection terminal 2 and a connection metal bump 3.
In addition, a height correction metal bump 13 having a height higher than the connection metal bump 3 is provided.

The flip-chip connecting circuit element 1 of the second prior art having such a configuration is connected to the substrate 9 as shown in FIG. Specifically, the surface of the flip-chip connection circuit element 1 on which the connection metal bumps 3 and the height correction metal bumps 13 are provided faces a surface of the substrate 9 on which the connection patterns 10 are formed, and is positioned at a predetermined position. Then, a certain load is applied to the flip-chip connecting circuit element 1 from the surface opposite to the surface on which the connecting metal bumps 3 are provided by using a load jig 14 (such as a collet). By applying or applying a load while heating to slightly deform the connection metal bumps 3,
Is electrically connected to the connection metal bump 3 of the flip-chip connection circuit element 1. Here, since the flip-chip connecting circuit element 1 of the conventional example 2 is provided with the metal bumps 13 for height correction, when a load is applied, the flip-chip connecting circuit element has a small number of external connection terminals 2 in the flip-chip connecting circuit element. Due to the deformation of the flip-chip connection circuit element 1 that occurs, it is possible to correct a situation in which a pressure difference occurs and the degree of crushing of the connection metal bumps 3 varies.

[0015]

However, in each of the above-described conventional examples 1 and 2, the connection metal bump provided on the flip-chip connection circuit element and the connection pattern of the substrate are used for flip-chip connection. However, there is a problem in that the connection varies greatly when the connection is made. Such a large variation in connection is one of the causes of a decrease in yield, and is not preferable from the viewpoint of reliability in circuit operation.

In the flip-chip connection circuit element of Conventional Example 1, the connection metal bump has a certain height as described above, and the connection metal bump has a certain height when the element is mounted on a substrate. If a uniform pressure is applied to each connection metal bump as a load, each connection metal bump is theoretically deformed by a certain amount, and a reliable connection between the flip-chip connection circuit element and the substrate is achieved. It is possible to get. However, in the actual production process, there is variation in the height of each connection metal bump provided to target a certain height, and there is also a warp or undulation on the substrate side, and the warp or undulation is present. It is common that there is also variation. Further, it is difficult to secure perfect parallelism with respect to the pressing surface even with a pressing jig used when a load is applied to the flip-chip connecting circuit element. Therefore, it is practically difficult to apply a uniform pressure to each connection metal bump. As a result, it has been difficult to secure uniform and reliable connection between the connection metal bump and the connection pattern formed on the substrate.

From the viewpoint of absorbing such a variation in the height of the connection metal bumps and a variation in the mounting board such as warpage and undulation with a constant pressing amount, increasing the load is preferable. In addition, the deformation amount of the connection metal bump may be increased, but this method also has the following problems.

That is, if a large load is applied to the flip-chip connecting circuit element made of a material that is vulnerable to mechanical stress, the flip-chip connecting circuit element may be damaged. Therefore, it is difficult to apply a large load to the flip-chip connecting circuit element made of such a material. Further, when a substrate made of a flexible material is used, the substrate may be deformed by a load, and mechanical stress may remain after the element is connected. Further, even when the flip-chip connection circuit element itself is mechanically guaranteed, the flip-chip connection circuit element may damage the external connection terminal and the connection pattern on the substrate side, which is not preferable in terms of reliability.

Similarly, in the case of the flip-chip connecting circuit element of the prior art example 2, even when the height of the connecting metal bump is adjusted to the deformation amount of the flip-chip connecting circuit element at the time of pressurization, the connection is not changed. The variation could not be suppressed.

Further, in each of the flip-chip connecting circuit elements of the first and second conventional examples, there is a problem that the setting of the load amount is complicated.

That is, in order to set the pressurizing conditions for the flip-chip connecting circuit elements having different numbers of external connection terminals or the flip-chip connecting circuit elements having different shapes or sizes, several pressurizing conditions are required. Then, it is necessary to actually test and confirm the amount of deformation and the deformed state of the metal bump for connection, and the state of connection to the substrate, after actually mounting it on the substrate. Therefore, as a matter of course, it is necessary to set the pressurizing condition every time the type of the flip-chip connecting circuit element increases. There are also products that mount a plurality of flip-chip connection circuit elements with different pressurization conditions on a substrate. In such products, the pressurization conditions for each flip-chip connection circuit element must be set individually. Must
It was complicated and there was a problem in productivity.

Further, in the flip-chip connection circuit element of Conventional Example 2, in order to newly form a metal bump for height correction, the area of the external connection terminal of the circuit element is changed. . For this reason, in accordance with the shape and size of the flip-chip connection circuit element, and in accordance with the warpage and undulation of the substrate to be mounted, when forming a height correction metal bump, corresponding to the height correction metal bump, It was necessary to determine the area of the external connection terminal. Such a thing,
The circuit element for flip-chip connection of Conventional Example 2 has a problem that it is not versatile because it is not realistic and it is necessary to design the element in accordance with the method of construction and the substrate.

SUMMARY OF THE INVENTION It is an object of the present invention to provide a flip-chip connection circuit element in which connection reliability and productivity are improved in order to solve the above-mentioned problems.

Another object of the present invention is to provide a flip-chip connection method using the flip-chip connection circuit element in order to solve the above-mentioned problems.

[0025]

According to the present invention, in order to solve the above-mentioned problems, a flip-chip connecting circuit element is provided with a connection detecting metal bump. This connection detection metal bump is for detecting whether the connection metal bump is appropriately deformed during mounting,
It has an appropriate amount of deformation in advance. Further, when mounting the flip-chip connecting circuit element of the present invention having the connection detecting metal bumps on a substrate, a load is applied to the flip-chip connecting circuit element in a normal flip-chip mounting process, and the connection is performed. It is assumed that the connection metal bump is connected to the substrate when the detection metal bump is in contact with and connected to the substrate.

The present invention specifically provides the following first to fourth flip-chip connecting circuit elements.

That is, according to the present invention, a plurality of external connection terminals provided with a predetermined electronic circuit and / or an electric circuit as a first flip-chip connection circuit element and arranged on one specific plane, A circuit element having a connection metal bump provided on each of the plurality of external connection terminals, wherein when connected by flip-chip connection, the specific plane faces the substrate and A flip-chip connection circuit element, which is a circuit element configured to electrically connect a wiring and the plurality of external connection terminals, comprising at least one or more connection detection metal bumps, The detection metal bump has a lower height than the connection metal bump, thereby obtaining a flip-chip connection circuit element.

According to the present invention, as the second flip-chip connecting circuit element, the first flip-chip connecting circuit element has the same number of connection detecting terminals as the number of the connection detecting metal bumps. The flip-chip connection circuit element is obtained, wherein the connection detection metal bump is provided on the corresponding connection detection terminal.

Further, according to the present invention, as the third flip-chip connecting circuit element, in the first or second flip-chip connecting circuit element, the predetermined electronic circuit and / or electric circuit may be used. Can obtain a flip-chip connection circuit element formed on a semiconductor substrate.

Further, according to the present invention, in the first or second flip-chip connecting circuit element, the predetermined electronic circuit and / or electric circuit may be used as a fourth flip-chip connecting circuit element. Is a circuit element for flip-chip connection characterized by being formed by multilayer wiring on a plurality of ceramic substrates.

Further, according to the present invention, there are provided the first to fourth methods for manufacturing a flip-chip connection circuit element, wherein the flip-chip connection circuit element has the same height as the connection metal bump on the specific plane of the circuit element. A predetermined number of first metal bumps having a predetermined height are formed, and a pressure is applied to each of the first metal bumps to form a second metal bump having a predetermined height lower than the connection metal bump.
And a method of manufacturing a circuit element for flip-chip connection, wherein the second metal bump is used as the connection-detection metal bump.

Further, according to the present invention, there is provided a flip-chip connection method for mounting any one of the first to fourth flip-chip connection circuit elements on a substrate. The flip-chip connection circuit element according to any one of the above, and the substrate are prepared, the specific plane is opposed to the plane on which the wiring is provided on the substrate, and the connection metal bump is provided on the wiring on the substrate. The flip-chip connecting circuit element is disposed so as to be in contact with the metal bump, and the surface of the flip-chip connecting circuit element, which is a surface on the back side of the specific plane, is pressed. Is terminated when the substrate comes into contact with the substrate, thereby obtaining a flip chip connection method.

Since the flip-chip connecting circuit element of the present invention includes the connection detecting metal bump lower in height than the connection metal bump in addition to the connection metal bump as described above, A flip chip connection method can be applied. In the flip chip connection method, as a method for confirming whether or not the connection detection metal bump has contacted the substrate (or a pattern formed on the substrate), an electrical inspection of the connection pattern on the substrate side,
Alternatively, an electrical inspection between the substrate-side connection pattern and the metal bump may be performed. By employing such a detection method, it is possible to electrically easily confirm that the connection metal bumps have also been appropriately deformed. Also,
It is not necessary to individually set load conditions when mounting circuit elements having different external connection terminals or flip-chip connection circuit elements having different shapes and sizes on the substrate.

Conventionally, there is a flip-chip connecting circuit element provided with a heat-dissipating dummy bump as a heat-dissipating measure for the circuit element, in addition to the connecting metal bump. It has the same height as the bump, and is different from the connection detecting metal bump of the present invention.

[0035]

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS A flip-chip connecting circuit element according to an embodiment of the present invention, a method of manufacturing the flip-chip connecting circuit element, and a flip chip mounting the flip-chip connecting circuit element on a substrate will be described below. The connection method will be described with reference to the drawings.

In this embodiment, the circuit elements for flip-chip connection are not only semiconductor elements and integrated circuit elements that are generally used, but also multilayer inductance and capacitance formed by multilayer wiring on a multilayer ceramic substrate. And a circuit element having a plurality of external connection terminals provided on one surface such as a resistor and the like, and includes all circuit elements that can be flip-chip connected.

The circuit element for flip-chip connection of the present embodiment has a configuration as shown in FIGS.

That is, the flip-chip connection circuit element 1 of the present embodiment includes a plurality of external connection terminals 2, a plurality of connection metal bumps 3, a plurality of connection detection metal bumps 4, a plurality of connection detection terminals 5, 6 and 7 are provided.

More specifically, the plurality of external connection terminals 2 and the plurality of connection detection terminals 5, 6, and 7 are mixed at substantially constant intervals around a specific flat surface of the flip-chip connection circuit element 1. Is formed. Here, the connection detection terminals 5, 6, and 7 are terminals that do not need to be connected to an external circuit (not shown) or terminals that are not connected to the internal circuit of the flip-chip connection circuit element 1. In any case, the connection detection terminals 5, 6, and 7 are terminals that are not involved in the circuit operation of the flip-chip connection circuit element 1.

The plurality of connection metal bumps 3 are provided on the corresponding external connection terminals 2. The plurality of connection detection metal bumps 4 are connected to the corresponding connection detection terminals 5, 6, 7.
It is provided above. Each of the connection metal bump 3 and the connection detection metal bump 4 is formed of a metal or an alloy, and can be formed of, for example, the following materials. When a circuit element and a board are connected by soldering, a relatively low temperature (200 to 300 ° C.) such as tin lead or gold tin is used.
Before and after). In the case where the circuit element and the substrate are connected by heat and pressure or in the case where they are connected with a conductive adhesive, a preferable material is gold. In the case where a solder material is used as the material, for example, the metal bump can be formed as follows.
That is, a predetermined amount of a solder material is supplied onto the external connection terminal 2 and the connection detection terminals 5, 6, and 7, and the entire flip-chip connection circuit element 1 is heated to the melting temperature of the solder material. The solder material on the connection detection terminals 5, 6, 7 is melted. During this melting, the solder material becomes substantially spherical due to surface tension, and the connection metal bump 3 and the connection detection metal bump 4
Is formed. Although the connection detecting metal bumps 4 formed at this time still have substantially the same height as the connection metal bumps 3, the height is adjusted in a process to be described later. Is done. At this point, the height of the metal bumps, which has been considered as a problem, varies. Specifically, the height (spherical shape) of the formed metal bump is determined by the area of the external connection terminal 2 (connection detection terminals 5, 6, and 7) and the amount of the supplied solder material. Since the amount of the solder material is very small, there is a limit in precision in supplying a constant amount. Therefore, the metal bumps to be formed vary in height. The average value of the height of the formed connection metal bumps 3 is generally in the range of 50 to 80 μm, and varies depending on the product. However, the variation is usually about 5 μm if the configuration of the product is determined.

Other forms of the metal bump include a mushroom type bump and a straight wall type bump. The mushroom type bump refers to a mushroom-shaped bump in which metal serving as a bump material is isotropically grown by plating. Further, the straight wall type bump refers to a bump having a vertically standing shape by limiting the growth of a metal serving as a bump material only in a thick resist. Since this straight wall type bump does not spread isotropically, it can cope with miniaturization.

Next, a method of manufacturing the flip-chip connection circuit element 1 of the present embodiment will be described with reference to FIG.

In the flip-chip connection circuit element 1 of the present embodiment, the connection metal bumps 3 are formed on the external connection terminals 2, and the same height as the connection metal bumps 3 is formed on the connection detection terminals 5, 6 and 7. After forming the connection-detecting metal bump 4 having a height, as shown in FIG. 3, only the connection-detecting metal bump 4 is loaded using the load jig 8 to raise the connection-detecting metal bump 4 to a predetermined height. It is manufactured by deforming it. Here, the deformation amount t of the connection detecting metal bump 4 (FIG. 2)
Is determined by the variation in height of the formed connection metal bumps 3 and the degree of warpage and undulation of the substrate on which the flip-chip connection circuit element 1 is mounted. For example,
When the maximum warpage or undulation of the mounting board is 10 μm with respect to one side of the flip-chip connection circuit element 1,
Considering the variation in the height of the connection metal bump 3 of 5 μm and the margin for connection of 3 μm, the deformation amount t is about 1 μm.
It is determined to be 8 μm. The specific numerical values are merely examples, and the actual variation is 5 μm, and the margin for connection is not necessarily 3 μm. Also, the deformation amount t
Is determined by performing an evaluation in advance from the method of forming the metal bumps and the state of the substrate as in this example. Furthermore,
FIG. 3 shows the deformation of the connection detection metal bumps 4 provided on the connection detection terminals 5. However, the connection detection metal bumps 4 provided on the connection detection terminals 6 and 7 are also shown. It goes without saying that it is deformed in the same manner.

Next, a method of connecting a flip chip to a circuit board for mounting the circuit element 1 for flip chip connection of the present embodiment on a substrate will be described with reference to FIGS.

FIG. 4 is a plan view when the flip-chip connecting circuit element 1 of the present embodiment is arranged at a predetermined position on the substrate 9. 4 to 8, the substrate 9 shows a part of an actual substrate. Here, a typical example of the substrate 9 is a glass epoxy substrate if it is an organic substrate, and a ceramic substrate if it is an inorganic substrate. A connection pattern 10 is formed on the substrate 9 corresponding to the external connection terminal 2 of the flip-chip connection circuit element 1, and a connection pattern 10A corresponding to the connection detection terminals 5, 6, 7 is provided. 10B,
10C is provided. The connection pattern 10 provided on the substrate 9 is drawn out to the periphery and connected to a peripheral circuit (not shown). On the other hand, the connection pattern 10A,
Reference numerals 10B and 10C denote separated patterns that are not connected to other circuits, and are respectively drawn in the peripheral direction of the substrate.

As can be more clearly understood from FIG. 5, when connecting, the flip-chip connecting circuit element 1 of the present embodiment is connected to the connecting pattern 10 on which the connecting metal bump 3 is provided on the substrate 9. To face. Furthermore, metal bumps 3 for connection
The flip-chip connection circuit element 1 is mounted at a predetermined position on the substrate 9 so that the connection pattern 10 and the connection pattern 10 are matched. At this point, the connection detection metal bumps 4 are not in contact with the connection patterns 10A (similarly, 10B and 10C) because the heights of the connection detection metal bumps 4 are lower than those of the connection metal bumps 3. Although not shown, at this point, there is a possibility that the connection metal bumps 3 may not be in contact due to variations in the height of the metal bumps 3 or warpage and undulation of the substrate. Next, on the surface of the flip-chip connection circuit element 1 on which the connection metal bumps 3 are not provided, the load jig 11 suitable for the shape and size of the flip-chip connection circuit element 1 is used for flip-chip connection. A load is applied to the circuit element 1 for use and the substrate 9.

When a load is applied, the connection metal bump 3
Gradually deforms, the distance between the metal bump 1 for flip chip connection and the substrate 9 is reduced, and as shown in FIG.
The connection detection metal bump 4 is connected to the connection pattern 10A (10
B, 10C).

Next, a method of detecting contact with the connection detecting metal bump 4 connection patterns 10A, 10B and 10C in the present embodiment will be described with reference to FIGS. As shown in FIG. 7, the detection of contact is performed using the probe 12A and the probe 12B when a load is applied. The probes 12A and 12B are electrically connected to the connection patterns 10A and 10B. Although not shown, the probe is also electrically connected to the connection pattern 10C. When the height (deformation) of the connection metal bump 3 is the same as the height (deformation) of the connection detection metal bump 4 under a load, the connection corresponding to the connection patterns 10A, 10B, and 10C is performed. Each of the detection metal bumps 4 becomes electrically conductive. Therefore, the electrical state of each of the probes 12A and 12B (including the probe connected to the connection pattern 10C) is constantly monitored at the time of load, so that the connection detection metal bump 4
And contact with the connection patterns 10A, 10B, and 10C can be confirmed. In addition, as a method for confirming the change in the electrical state, the connection pattern 10A
(The same applies to 10B and 10C).

In the present embodiment, the contact can be detected in parallel with the load, so that the condition of the load can be adjusted. For example, in the flip-chip connection circuit element 1 of the present embodiment, since the connection detection metal bumps 4 are arranged at three places,
While monitoring the deformation amounts of the three connection detection metal bumps 4, the flip-chip connection circuit element 1 is deformed so that the connection metal bumps 3 are deformed to an appropriate deformation amount with respect to the warpage or undulation on the substrate side. FIG. 7 shows the load state of the load jig 11 for
Can be adjusted as indicated by the dotted line. As a result, in the present embodiment, high reliability regarding the connection can be obtained. In addition, since these concepts can be easily applied to the flip-chip connection circuit element 1 having any size and shape,
It has high versatility and high productivity.

As a method of confirming the connection, there is also a method as shown in FIG. FIG. 8 shows the area A in FIG. The flip-chip connection circuit element 1 is:
An internal wiring 5A for electrically connecting the external connection terminal 2 and the connection detection terminal 5 inside is provided. When the flip-chip connection circuit element 1 having such a configuration is mounted on a substrate as described above, when a proper contact state is reached, the connection pattern 10A includes the connection detection metal bump 4, the connection detection terminal 5, An electrical path is formed with the connection pattern 10 via the element internal wiring 5A, the external connection terminal 2, and the connection metal bump 3. Therefore, as shown in FIG. 8, the testers 15A and 15B are kept in contact with the connection patterns 10A and 10 respectively, and one of the
By supplying 5C, if a contact state is reached, a current flows. Therefore, by performing load while monitoring the electrical state using the ammeter 15, connection can be easily detected.

In this embodiment, an example has been described in which the external connection terminal 2 and the connection detection terminals 5, 6, and 7 are mixed and provided at substantially constant intervals.
It is needless to say that the same concept can be applied to a flip-chip connection circuit element in which terminals are dispersedly arranged.

In this embodiment, the flip-chip connection circuit element having three connection detection terminals 5, 6, and 7 has been described. It is not limited to a form. For example, when the flip-chip connection circuit element is of a relatively small scale and the number of external connection terminals 2 is small, the same effect can be obtained even with one connection detection terminal. However, when the flip-chip connection circuit element has a relatively large scale and the number of external connection terminals is large, it is preferable that a plurality of connection detection terminals are appropriately dispersed around the element.

[0053]

As described above, the circuit element for flip-chip connection of the present invention can be used in addition to the metal bump for connection.
Since the connection detection metal bump has a height lower than the connection metal bump, the connection of the connection metal bump can be easily performed by contacting and connecting the connection detection metal bump to a corresponding connection pattern. Can be detected.
In addition, even in the case where the height of the connection metal bump varies, or the substrate has warpage or undulation, a highly reliable connection can be obtained. Consequently, according to the present invention,
The yield can be improved. In addition, the concept of the present invention can be applied to any type of flip-chip connection circuit element, and therefore has high versatility, and can be easily implemented to improve productivity. Can be planned.

[Brief description of the drawings]

FIG. 1 is a front view showing a structure of a flip-chip connecting circuit element according to an embodiment of the present invention.

FIG. 2 is a side view showing the structure of the flip-chip connection circuit element according to the embodiment of the present invention.

FIG. 3 is a diagram illustrating a main part of a method for manufacturing a flip-chip connection circuit element according to an embodiment of the present invention.

FIG. 4 is a front view showing a state where the flip-chip connecting circuit element according to the embodiment of the present invention is mounted on a substrate.

5 is a side view of the state shown in FIG. 4, showing a state in which a load is applied to the flip-chip connecting circuit element.

FIG. 6 is a side view showing a state where a load is further applied from the state shown in FIG. 5;

FIG. 7 is a diagram showing a method of confirming contact between a connection detection metal bump and a wiring pattern and adjusting a load.

FIG. 8 is a diagram showing another method for confirming contact between a connection detection metal bump and a wiring pattern.

FIG. 9 is a side view showing the structure of the flip-chip connection circuit element of Conventional Example 1.

FIG. 10 is a diagram showing a flip chip connection method in Conventional Example 1.

FIG. 11 is a side view showing a structure of a flip-chip connection circuit element of Conventional Example 2.

FIG. 12 is a diagram showing a flip chip connection method in Conventional Example 2.

[Explanation of symbols]

 DESCRIPTION OF SYMBOLS 1 Flip chip connection circuit element 2 External connection terminal 3 Connection metal bump 4 Connection detection metal bump 5 Connection detection terminal 6 Connection detection terminal 7 Connection detection terminal 8 Load jig 9 Substrate 10 Connection pattern 10A Connection pattern 10B Connection pattern 10C Connection pattern 11 Load jig 12A probe 12B probe 13 Metal bump for height correction 14 Load jig 5A Element internal wiring 15 Ammeter 15A Tester 15B Tester 15C Electromotive force A area

──────────────────────────────────────────────────続 き Continued on the front page (51) Int.Cl. ⁶ Identification code FI H01L 21/92 604T

Claims (6)

(57) [Claims] 1. A plurality of external connection terminals provided with a predetermined electronic circuit and / or an electric circuit, arranged on a specific one plane, and connection metal bumps provided on each of the plurality of external connection terminals. When connected by flip-chip connection, the specific plane is opposed to the substrate, and the wiring on the substrate and the plurality of external connection terminals are electrically connected. A flip-chip connection circuit element, which is a circuit element configured to include at least one or more connection detection metal bumps, wherein the connection detection metal bumps are lower in height than the connection metal bumps. And the substrate or the substrate
Contact with one of the connection patterns formed on the board
Can be confirmed by an electrical inspection of the connection pattern.
The connection detecting metal bump is provided on the substrate or the connection.
For connection when it comes into contact with one of the patterns
A circuit element for flip-chip connection, wherein the metal bump can be connected to a substrate . 2. The flip-chip connection circuit element according to claim 1, further comprising the same number of connection detection terminals as the number of the connection detection metal bumps, wherein the connection detection metal bumps correspond to the corresponding connection. A flip-chip connection circuit element provided on a detection terminal. 3. The flip-chip connection circuit element according to claim 1, wherein said predetermined electronic circuit and / or electric circuit is formed on a semiconductor substrate. Circuit element for flip chip connection. 4. The flip-chip connection circuit element according to claim 1, wherein the predetermined electronic circuit and / or the electric circuit is formed by multilayer wiring on a plurality of ceramic substrates. A flip-chip connection circuit element, comprising: 5. The method of manufacturing a circuit element for flip-chip connection according to claim 1, wherein the same height as the metal bump for connection is provided on the specific plane of the circuit element. A predetermined number of first metal bumps having a height are formed, and a pressure is applied to each of the first metal bumps to form a second metal bump having a predetermined height lower than the connection metal bump. And a method of manufacturing a flip-chip connection circuit element, wherein the second metal bump is used as the connection detection metal bump. 6. A flip-chip connection method for mounting the flip-chip connection circuit element according to claim 1 on a substrate, wherein the flip-chip connection circuit element is mounted on a substrate. Preparing the flip-chip connection circuit element described above and the substrate, making the specific plane face a plane on which wiring is provided on the substrate, and contacting the connection metal bump with the wiring on the substrate. In this manner, the flip-chip connection circuit element is arranged, and a pressure is applied to a surface of the flip-chip connection circuit element, which is on a back side of the specific plane, and the connection detection metal bump is formed on the flip-chip connection circuit element. A flip-chip connection method, wherein pressurization is terminated when the flip-chip is brought into contact with a substrate.