JP2884586B2 - Polyamide resin composition for hollow molding - Google Patents
Polyamide resin composition for hollow moldingInfo
- Publication number
- JP2884586B2 JP2884586B2 JP1073773A JP7377389A JP2884586B2 JP 2884586 B2 JP2884586 B2 JP 2884586B2 JP 1073773 A JP1073773 A JP 1073773A JP 7377389 A JP7377389 A JP 7377389A JP 2884586 B2 JP2884586 B2 JP 2884586B2
- Authority
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- Japan
- Prior art keywords
- weight
- polyamide resin
- mica
- polyamide
- resin composition
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Description
【発明の詳細な説明】 〔産業上の利用分野〕 本発明は中空成形用ポリアミド樹脂組成物に関する。
さらに詳しくは、表面性、耐熱性を同時に満足する中空
成形用ポリアミド樹脂組成物に関する。The present invention relates to a polyamide resin composition for hollow molding.
More specifically, the present invention relates to a polyamide resin composition for hollow molding which simultaneously satisfies surface properties and heat resistance.
〔従来技術の説明〕 ポリアミド樹脂にガラス繊維を充填した強化材料は高
温時剛性や耐熱性に優れ、特公昭40−5233号公報、特開
昭60−171133号公報及び特開昭60−170664号公報に述べ
られている通り、自動車のエンジン廻りに使われてい
る。[Description of the Prior Art] A reinforcing material obtained by filling a glass fiber into a polyamide resin is excellent in rigidity and heat resistance at high temperature, and is disclosed in Japanese Patent Publication Nos. 40-5233, 60-171133 and 60-170664. As described in the gazette, it is used around automobile engines.
ポリアミド樹脂にガラス繊維を充填すると高温時特
性、耐熱性に優れる反面、成形品表面にガラス繊維が浮
き出し、内面平滑性が要求される部品や外観重視の部品
には使用することが困難であった。When filled with glass fiber in polyamide resin, it excels in high temperature properties and heat resistance, but the glass fiber emerges on the surface of the molded product, making it difficult to use for parts that require inner surface smoothness and parts that emphasize appearance. .
本発明は、かかる問題点を解決し、良好なブロー特性
を維持しつつ、かつ、表面性及び耐熱性を兼ね備えた中
空成形用ポリアミド樹脂組成物を提供することにある。An object of the present invention is to solve the above problems and to provide a polyamide resin composition for hollow molding having good surface properties and heat resistance while maintaining good blow properties.
即ち、本発明の中空成形用組成物は、（Ａ）数平均分
子量20000〜50000を有するポリアミド樹脂87〜30重量
％、および （Ｂ）変成ポリオレフィン３〜20重量％、並びに （Ｃ）マイカ（雲母）あるいは、マイカと他の無機質か
らなりその場合のマイカの割合が５重量％以上の無機充
填剤、10〜50重量％からなることを特徴とする。That is, the composition for hollow molding of the present invention comprises (A) 87 to 30% by weight of a polyamide resin having a number average molecular weight of 20,000 to 50,000, (B) 3 to 20% by weight of a modified polyolefin, and (C) mica (mica). Or mica and another inorganic substance, wherein the ratio of mica in this case is 5% by weight or more of inorganic filler and 10 to 50% by weight.
本発明で用いられる（Ａ）成分のポリアミド樹脂は、
一般にポリアミド樹脂として知られているものであれば
いかなるものでもよく、例えば、ポリアミド６、ポリア
ミド66、ポリアミド11、ポリアミド12、ポリアミド61
0、ポリアミド612、ポリアミド６とポリアミド66のブレ
ンド、ポリアミド６とポリアミド12のブレンド、ポリア
ミド6/66コポリアミド等が挙げられる。なかでも、ポリ
アミド６、ポリアミド66やポリアミド6/66コポリマーが
好ましい。The polyamide resin of the component (A) used in the present invention includes:
Any resin may be used as long as it is generally known as a polyamide resin. Examples thereof include polyamide 6, polyamide 66, polyamide 11, polyamide 12, and polyamide 61.
0, polyamide 612, a blend of polyamide 6 and polyamide 66, a blend of polyamide 6 and polyamide 12, and a polyamide 6/66 copolyamide. Of these, polyamide 6, polyamide 66 and polyamide 6/66 copolymer are preferred.
上記ポリアミド樹脂は、数平均分子量が20000以上500
00未満、好ましくは30000〜40000である。The polyamide resin has a number average molecular weight of 20,000 or more and 500
It is less than 00, preferably 30,000 to 40,000.
数平均分子量が20000未満の場合は、安定した成形性
が得られず、厚みムラが生じやすい。また、数平均分子
量が50000を越えると溶融粘性が高くなりすぎて、製品
加工性が悪くなる。When the number average molecular weight is less than 20,000, stable moldability cannot be obtained, and thickness unevenness tends to occur. On the other hand, if the number average molecular weight exceeds 50,000, the melt viscosity becomes too high, resulting in poor product processability.
本発明で用いられる（Ｂ）成分である変成ポリオレフ
ィンはエチレン及び／又はプロピレン99.9〜90モル％と
0.1〜10モル％の不飽和カルボン酸又はその誘導体がブ
ロック又はグラフト重合したものである。前記不飽和カ
ルボン酸及びその誘導体としては、アクリル酸、メタク
リル酸、マレイン酸、フマル酸等の不飽和モノあるい
は、ジカルボン酸又はこれらのアミドエステル、金属塩
又は酸無水物が挙げられ、これらは１種もしくは２種以
上の混合系で使用される。The modified polyolefin as the component (B) used in the present invention contains 99.9 to 90 mol% of ethylene and / or propylene.
0.1 to 10 mol% of unsaturated carboxylic acid or its derivative is obtained by block or graft polymerization. Examples of the unsaturated carboxylic acids and derivatives thereof include unsaturated mono- or dicarboxylic acids such as acrylic acid, methacrylic acid, maleic acid, and fumaric acid, and amide esters, metal salts, and acid anhydrides thereof. It is used in a kind or a mixed system of two or more kinds.
（Ｂ）成分の配合割合は、ポリアミド樹脂組成物中、
３〜20重量％である。The compounding ratio of the component (B) in the polyamide resin composition is as follows:
It is 3 to 20% by weight.
（Ｂ）成分の配合量が３重量％未満の場合は、得られ
る組成物のブロー特性が悪く、また、20重量％を越える
と耐熱性が低下し、実用性に乏しくなる。When the amount of the component (B) is less than 3% by weight, the resulting composition has poor blow properties. When the amount exceeds 20% by weight, the heat resistance is reduced and the practicality is poor.
更に、本発明で用いられる（Ｃ）成分は、マイカ（雲
母）あるいは、マイカと他の無機質からなりその場合の
マイカの割合が５重量％以上の無機充填剤である。Further, the component (C) used in the present invention is mica (mica) or an inorganic filler composed of mica and another inorganic substance, in which the ratio of mica is 5% by weight or more.
無機質としては、ワラストナイト、タルク、カオリ
ン、焼成クレーなどが挙げられ、これらを単独、あるい
は組み合わせて用いてもよい。Examples of the inorganic substance include wollastonite, talc, kaolin, and calcined clay, and these may be used alone or in combination.
さらに、（Ｃ）成分の平均粒径が22±10μ、好ましく
は22±３μで、かつ、アスペクト比が10〜40、好ましく
は13〜22のものが用いられる。Further, a component (C) having an average particle size of 22 ± 10 μm, preferably 22 ± 3 μm and an aspect ratio of 10 to 40, preferably 13 to 22 is used.
（Ｃ）成分の配合割合は、10〜50重量％である（Ｃ）
成分の配合割合が、10重量％未満では、補強効果が小さ
く、耐熱的に満足したものが得られず、また50重量％を
越えると、表面性が悪くなる。The mixing ratio of the component (C) is 10 to 50% by weight.
If the compounding ratio of the component is less than 10% by weight, the reinforcing effect is small, and satisfactory heat resistance cannot be obtained, and if it exceeds 50% by weight, the surface properties deteriorate.
この組成物の製造方法には、特に制限はなく、公知の
方法のいずれも採用することができる。The method for producing the composition is not particularly limited, and any known method can be employed.
例えば、ポリアミドと変性ポリオレフィンおよび無機
充填剤を予備混練して、押出機に供給し、溶融混練した
のち、冷却してペレット化する方法、あるいは、それぞ
れを別々に押出機にフィードしてペレット化する方法な
どが挙げられる。For example, a method in which a polyamide, a modified polyolefin and an inorganic filler are pre-kneaded, supplied to an extruder, melt-kneaded, and then cooled and pelletized, or each is separately fed to an extruder and pelletized. And the like.
さらに、本発明のポリアミド樹脂組成物からは前期ポ
リアミド樹脂組成物を溶融押し出しをして、まず最初に
パリソンを一旦成形し、ついで、目的とする中空成形品
をを得る事ができる。Further, from the polyamide resin composition of the present invention, the above-mentioned polyamide resin composition is melt-extruded to first form a parison first, and then a desired hollow molded article can be obtained.
以下、実施例について本発明を具体的に説明するが、
パリソン特性、表面性及び耐熱性は、下記の方法にて評
価した。Hereinafter, the present invention will be specifically described with reference to Examples,
The parison characteristics, surface properties and heat resistance were evaluated by the following methods.
パリソン特性：耐ドローダウン性として評価した。耐
ドローダウン性は、50mmφの押出機につけた外径73mm
φ、内径67mmφの円形ダイスから、回転数80rpmで押し
出した時に、ダイス下面より12cmの長さの溶融パリソン
重量をW12、ダイス下面より60cmの長さのものをW60と
し、その比W60／W12値にて評価した。Parison characteristics: Evaluated as drawdown resistance. The drawdown resistance is 73mm in outer diameter attached to a 50mmφ extruder.
φ, when extruded from a circular die with an inner diameter of 67 mmφ at a rotation speed of 80 rpm, the weight of the molten parison 12 cm long from the lower surface of the die is W 12 , and the length of 60 cm from the lower surface of the die is W 60 , and the ratio W 60 / W 12 value was evaluated.
ポリアミドの押し出し温度は、230℃にておこなっ
た。The extrusion temperature of the polyamide was 230 ° C.
全くドローダウンしないものは５の値を示すが、今回
は3.5以上を（○）、3.5未満を不可（×）とした。A sample which does not draw down at all shows a value of 5, but this time, 3.5 or more was evaluated as (○) and less than 3.5 was evaluated as unacceptable (×).
表面性：前記の組成物を用い、中空成形機（プラユー
（株）製スクリュー径75mm）により、約90mmの直径を有
し、肉厚2mmのパリソンを作製した。引き続きこのパリ
ソンを用いて、縦400mm、横100mm、高さ200mm、平均肉
厚1mmで容量8lの中空成形容器（約300gr/個）を成形
し、得られた成形品の表面性を目視で観察し、表面荒れ
がないのを○、表面荒れを呈するものを×とした。Surface properties: A parison having a diameter of about 90 mm and a thickness of 2 mm was produced using a hollow molding machine (Plue Co., Ltd., screw diameter: 75 mm) using the above composition. Continuously, using this parison, a hollow molded container (approximately 300 gr / piece) with a length of 400 mm, a width of 100 mm, a height of 200 mm, an average thickness of 1 mm and a capacity of 8 liters was molded, and the surface properties of the molded product were visually observed. ○ indicates no surface roughness, and × indicates surface roughness.
耐熱性:ASTMD−648に準拠した熱変形温度を尺度とし
た。Heat resistance: The heat distortion temperature based on ASTM D-648 was used as a scale.
実施例１ ポリアミド樹脂として、UBE1030B（宇部興産（株）
製、数平均分子量30000）を45重量％、変性ポリオレフ
ィンとして、Ｎ−タフマー（MC206,三井石油化学（株）
製）を15重量％、無機充填剤として、平均粒子径18μｍ
でアスペクト比35であるマイカを40重量％配合し、通常
の２軸混練機により、混練してペレットを作製し、この
ペレットを用いて、パリソン特性、表面性および耐熱性
を評価し、結果を第１表に示す。Example 1 As a polyamide resin, UBE1030B (Ube Industries, Ltd.)
Weight average molecular weight 30,000) as a modified polyolefin, N-tuffmer (MC206, Mitsui Petrochemical Co., Ltd.)
15% by weight, as an inorganic filler, average particle diameter 18 μm
Then, 40% by weight of mica having an aspect ratio of 35 is blended, and the mixture is kneaded with a normal twin-screw kneader to produce a pellet. The pellet is used to evaluate parison characteristics, surface properties, and heat resistance. It is shown in Table 1.
実施例２ 1030Bを52重量％、Ｎ−タフマーを８重量％、マイカ2
0重量％、ワラストナイト20重量％を配合した他は実施
例１と同様に行った。Example 2 52% by weight of 1030B, 8% by weight of N-tuffmer, mica 2
The same procedure as in Example 1 was carried out except that 0% by weight and 20% by weight of wollastonite were added.
実施例３ 1030Bを52重量％、Ｎ−タフマーを８重量％、マイカ1
0重量％、ワラストナイト20重量％、カオリン10重量％
を配合した他は実施例１と同様に行った。Example 3 52% by weight of 1030B, 8% by weight of N-tuffmer, 1 mica
0% by weight, wollastonite 20% by weight, kaolin 10% by weight
Was performed in the same manner as in Example 1 except that
実施例４ 1030Bを75重量％、Ｎ−タフマーを５重量％、マイカ
を20重量％配合した他は実施例１と同様に行った。Example 4 Example 4 was repeated except that 75% by weight of 1030B, 5% by weight of N-tuffmer and 20% by weight of mica were blended.
比較例１ 1030Bを55重量％、Ｎ−タフマーを12重量％、ガラス
繊維を30重量％配合した他は実施例１と同様に評価を行
った。Comparative Example 1 Evaluation was made in the same manner as in Example 1 except that 55% by weight of 1030B, 12% by weight of N-tuffmer, and 30% by weight of glass fiber were blended.
比較例２ 1030Bを60重量％、マイカを30重量％配合した他は、
実施例１と同様に評価を行った。Comparative Example 2 Except that 1030B was blended at 60% by weight and mica at 30% by weight,
Evaluation was performed in the same manner as in Example 1.
比較例３ 1030Bを60重量％、Ｎ−タフマーを８重量％、ワラス
トナイトを30重量％、カオリンを10重量％配合した他は
実施例１と同様の評価を行った。Comparative Example 3 The same evaluation as in Example 1 was carried out except that 60% by weight of 1030B, 8% by weight of N-tuffmer, 30% by weight of wollastonite and 10% by weight of kaolin were blended.
以上の実施例１〜４、比較例１〜３の結果を第１表に
示す。Table 1 shows the results of Examples 1 to 4 and Comparative Examples 1 to 3 described above.
〔発明の効果〕 本発明によれば、表面性、耐熱性を同時に満足する中
空成形品用ポリアミド樹脂組成物が提供される。 [Effects of the Invention] According to the present invention, there is provided a polyamide resin composition for a hollow molded article which satisfies both surface properties and heat resistance.
また、このポリアミド樹脂組成物からは、良好なパリ
ソン特性及び成形性を有すると共に、得られる成形品が
優れた表面性及び耐熱性を有する中空成形品が得られ
る。Further, from the polyamide resin composition, a hollow molded article having excellent surface properties and heat resistance can be obtained while having good parison properties and moldability.
フロントページの続き (51)Int.Cl.6 識別記号 ＦＩ Ｃ０８Ｌ 51:06） (56)参考文献 特開 昭60−170664（ＪＰ，Ａ) 特開 昭60−228235（ＪＰ，Ａ) 特開 昭62−169851（ＪＰ，Ａ) 特開 平２−24353（ＪＰ，Ａ) 特開 昭52−32945（ＪＰ，Ａ) 特開 昭60−18542（ＪＰ，Ａ) 特開 昭64−48856（ＪＰ，Ａ) 特開 昭56−167740（ＪＰ，Ａ) 特開 昭60−53550（ＪＰ，Ａ) 特開 昭62−252453（ＪＰ，Ａ) 特開 昭60−171133（ＪＰ，Ａ) (58)調査した分野(Int.Cl.6，ＤＢ名) C08L 77/00 - 77/12 C08L 23/00 - 23/36 C08K 3/00 - 13/08 C08L 51/06 Continuation of the front page (51) Int.Cl. 6 Identification code FI C08L 51:06) (56) References JP-A-60-170664 (JP, A) JP-A-60-228235 (JP, A) JP-A Sho 62-169851 (JP, A) JP-A-2-24353 (JP, A) JP-A-52-32945 (JP, A) JP-A-60-18542 (JP, A) JP-A-64-48856 (JP, A A) JP-A-56-167740 (JP, A) JP-A-60-53550 (JP, A) JP-A-62-252453 (JP, A) JP-A-60-171133 (JP, A) (58) Survey 6 (Int.Cl. 6 , DB name) C08L 77/00-77/12 C08L 23/00-23/36 C08K 3/00-13/08 C08L 51/06
Claims (1)
ポリアミド樹脂87〜30重量％、および （Ｂ）変性ポリオレフィン３〜20重量％、並びに （Ｃ）平均粒子径が22±10μｍでアスペクト比が10〜40
であるマイカ（雲母）あるいは、マイカと他の無機質か
らなりその場合のマイカの割合が５重量％以上の無機充
填剤、10〜50重量％からなる中空成形用ポリアミド樹脂
組成物。(1) 87 to 30% by weight of a polyamide resin having a number average molecular weight of 20,000 to 50,000, (B) 3 to 20% by weight of a modified polyolefin, and (C) an average particle diameter of 22 ± 10 μm and an aspect ratio. Is 10-40
Or a mica (mica), or an inorganic filler comprising mica and another inorganic substance, in which the ratio of mica is 5% by weight or more, and a polyamide resin composition for hollow molding comprising 10 to 50% by weight.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1073773A JP2884586B2 (en) | 1989-03-28 | 1989-03-28 | Polyamide resin composition for hollow molding |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1073773A JP2884586B2 (en) | 1989-03-28 | 1989-03-28 | Polyamide resin composition for hollow molding |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH02252759A JPH02252759A (en) | 1990-10-11 |
| JP2884586B2 true JP2884586B2 (en) | 1999-04-19 |
Family
ID=13527865
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1073773A Expired - Lifetime JP2884586B2 (en) | 1989-03-28 | 1989-03-28 | Polyamide resin composition for hollow molding |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP2884586B2 (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR100828724B1 (en) | 2006-04-13 | 2008-05-09 | 주식회사 엘지화학 | Nanocomposite blend composition and fuel tank cap prepared therefrom |
Families Citing this family (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP6852676B2 (en) * | 2015-10-09 | 2021-03-31 | 宇部興産株式会社 | Polyamide resin composition |
| JP7468189B2 (en) * | 2020-06-26 | 2024-04-16 | Ｕｂｅ株式会社 | Polyamide resin composition |
Family Cites Families (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH07108949B2 (en) * | 1984-02-15 | 1995-11-22 | 東レ株式会社 | Blow hollow molded products |
| JPS60228235A (en) * | 1984-04-25 | 1985-11-13 | 株式会社クラレ | Heat-resistant shock-resistant bottle |
| JPS62169851A (en) * | 1986-01-22 | 1987-07-27 | Daiseru Hiyurusu Kk | Polyamide resin composition |
-
1989
- 1989-03-28 JP JP1073773A patent/JP2884586B2/en not_active Expired - Lifetime
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR100828724B1 (en) | 2006-04-13 | 2008-05-09 | 주식회사 엘지화학 | Nanocomposite blend composition and fuel tank cap prepared therefrom |
Also Published As
| Publication number | Publication date |
|---|---|
| JPH02252759A (en) | 1990-10-11 |
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