JP2883266B2 - Imaging device - Google Patents

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an image forming apparatus such as an optical printer head or an image reading apparatus such as an image sensor.

[0002]

2. Description of the Related Art A conventional image apparatus, for example, an image apparatus used for an image forming apparatus such as an optical printer head is generally shown in FIG.
As shown in FIG. 5, a lens plate 21 made of a resin such as polycarbonate in which a plurality of lenses 22 are linearly arranged and supported at predetermined intervals, and a large number of light emitting diode element array chips 23 are linearly arranged and mounted. A base plate 24 made of a resin such as polycarbonate is used as a pair of support 2
Each of the lenses 25 and 25 has a structure in which each lens 22 and each light-emitting diode element array chip 23 are fixedly provided so as to correspond one-to-one, and each light-emitting diode element 23a of each light-emitting diode element array chip 23 is Light is selectively emitted individually in response to an external electric signal, and light emitted by the light emitting diode element 23a is transmitted through a lens 22 to an external photosensitive member 26.
By forming an image on the surface of the photoconductor 26 and forming a latent image on the photoreceptor 26, the device functions as an image forming apparatus.

The light-emitting diode element array chip 23 mounted linearly on the base plate 24 generally has 64 light-emitting diode elements 23a linearly arranged therein, and has a B4 size. When used in an image forming apparatus, 32 of the light emitting diode element array chips 23 are mounted on the base plate 24 such that each of them corresponds to each lens one by one.

Each of the light emitting diode element array chips 23 has a common electrode on the lower surface thereof, and the common electrode is connected to a common electrode wiring previously formed on the upper surface of the base plate 24 by, for example, epoxy resin. The common electrode is electrically connected to the common electrode wiring by bonding via a conductive resin adhesive to which silver powder has been added.
Implemented on 24.

Further, each light emitting diode element array chip 23 mounted on the upper surface of the base plate 24 has its individual electrode electrically connected to an individual electrode wiring formed on the upper surface of the base plate 24 via a bonding wire. By connecting the common electrode wiring and the individual electrode wiring on the upper surface of the base plate 24 to an external electric circuit, each light emitting diode element 23a of the light emitting diode element array chip 23 is electrically connected to the external electric circuit. I have.

Further, each lens 22 supported on the lens plate 21 and each light emitting diode element array chip 23 mounted on the base plate 24 are imaged on the surface of the photoreceptor 26 when the positions thereof are displaced. Each lens 22 and each light emitting diode element array chip 23 are positioned with extremely high precision because it is impossible to form a clear and accurate latent image due to blurring, white streaks, black streaks, etc. It has been adjusted.

[0007]

However, in this conventional image device, the individual electrodes provided on the light emitting diode element array chip 23 are connected to the individual electrode wirings of the base plate 24 via bonding wires, and the light emitting diode Since the number of individual electrodes of the element array chip 23 is extremely large, several thousands, it takes a long time to electrically connect the individual electrodes of the light emitting diode element array chip 23 to the individual electrode wiring of the base plate 24. However, there is a disadvantage that the image apparatus as a product is expensive.

Further, each light emitting diode element array chip 23
Since the conductive resin adhesive for bonding and fixing the light emitting diode element array chip 23 on the base plate 24 requires a heat of 150 ° C. to be applied for about one hour for its thermal curing, it takes a long time for the bonding and fixing. When mounted on the light-emitting diode element array chip 23, the adhesive fixing position of the light-emitting diode element array chip 23 is likely to shift, and when the light-emitting diode element array chip 23 shifts, the light emitted by each light-emitting diode element 23a Therefore, it is impossible to form an image on the external photoreceptor 26 via the photoreceptor, and a clear and accurate latent image cannot be formed on the photoreceptor surface.

Further, in the above conventional example, an image apparatus used for an image forming apparatus such as an optical printer head has been described as an example. However, an image sensor or the like using a solid-state image pickup device array chip (CCD device array chip) has been described. Even in an image device used for an image reading device or the like, the imaging of external image information on the solid-state image sensor array chip becomes uneven due to a positional shift between the lens and the solid-state image sensor array chip, and the solid-state image sensor array chip However, it has a disadvantage that it is impossible to generate an accurate electric signal corresponding to the image information.

[0010]

SUMMARY OF THE INVENTION The present invention has been made in view of the above-mentioned drawbacks, and has as its object to accurately irradiate light emitted from a light-emitting diode element onto a photoreceptor surface through a lens, thereby providing a latent image having a high image quality on the photoreceptor. Alternatively, the external image information can be accurately formed on the solid-state imaging device array chip via a lens, and the solid-state imaging device array chip can generate an accurate electric signal corresponding to the external image information. An object of the present invention is to provide an image device having good productivity.

[0011]

An image device according to the present invention is an image device in which a lens member having a plurality of lenses mounted thereon is disposed on the image element member. A plurality of image elements and individual electrodes on the upper surface, a first substrate having a common electrode wiring attached on the upper surface below a plurality of image element array chips having a common electrode attached on the lower surface,
A second substrate having an opening for light transmission above the image element array chip and having individual electrode wirings adhered to the lower surface is arranged, and the common electrode of each image element array chip is placed on the first substrate. The first electrode is connected to the common electrode wiring on the upper surface of the substrate via a first solder, and the individual electrode is connected to the individual electrode wiring on the second substrate lower surface via a second solder having a higher melting temperature than the first solder. It is characterized by being formed.

Further, the image device according to the present invention is an image device in which a lens member having a plurality of lenses mounted thereon is disposed on the image element member. A first substrate having a common electrode wiring attached to an upper surface thereof below a plurality of image element array chips having a common electrode attached to a lower surface of the image element array chip and the image element array chip; A transparent second substrate having individual electrode wiring adhered to the lower surface is disposed above the common electrode wiring, and the common electrode of each image element array chip is connected to the common electrode wiring on the upper surface of the first substrate via the first solder. Connect the individual electrodes to the second
Wherein the individual electrode wiring on the lower surface of the substrate is flip-chip connected via a second solder having a higher melting temperature than the first solder.

[0013]

According to the image apparatus of the present invention, the individual electrodes of each image element array chip are electrically connected to the individual electrode wiring provided on the second substrate by flip-chip connection by soldering. Even if there are thousands of individual electrodes, all of them at once at the individual electrode wiring of the second substrate,
In addition, the electrical connection is made firmly, and as a result, the productivity and reliability of the image device become extremely excellent.

According to the image apparatus of the present invention, the common electrode wiring attached to the first substrate and the common electrode of the image element array chip are joined, and the individual electrode wiring attached to the second substrate is provided. And the individual electrodes of the image element array chip are melted and solidified in a short time, and the self-alignment effect (the common electrode wiring attached to the first substrate and the common electrode and the The individual electrodes of the image element array chip and the individual electrodes of the image element array chip were joined by solder having a function of attracting them so as to face each other. It is mounted very accurately at a predetermined position on the first substrate in a state where it is electrically connected to the individual electrode wirings adhered to the first substrate. As a result, this image device is mounted on an image forming device such as an optical printer head. When used in, the center of each lens is always located at the center of the light emitting diode element array chip, and the light emitted by the light emitting diode element of each light emitting diode element array chip can be satisfactorily irradiated on the entire surface of the photoconductor, A clear and accurate latent image can be formed on the photoconductor. At the same time, when this image device is used for an image reading device such as an image sensor, since each lens and each image element array chip always face each other accurately, external image information is transferred to the solid-state image sensor array via the lens. An image can be accurately formed on the entire surface of the chip, and an accurate electric signal corresponding to external image information can be generated in the solid-state imaging device array chip.

Further, according to the image apparatus of the present invention, the melting temperature of the second solder for joining the individual electrode wiring adhered to the second substrate and the individual electrode of the image element array chip is applied to the first substrate. Since the melting temperature of the first solder for joining the attached common electrode wiring and the common electrode of the image element array chip is higher than the melting temperature of the first solder, the individual electrode wiring and the individual electrode of the image element array chip are attached to the second substrate. After bonding the common electrode of the image element array chip to the common electrode wiring attached to the first substrate via the first solder, the second solder As a result, the individual electrodes of the image element array chip are always bonded to the individual electrode wirings adhered to the second substrate, and the individual electrodes of the image element array chip are connected to each other. Second
It is possible to accurately and surely electrically connect to an external electric circuit via the individual electrode wiring attached to the substrate.

[0016]

BRIEF DESCRIPTION OF THE DRAWINGS FIG. 1 to 3 show an embodiment in which the image apparatus of the present invention is applied to an optical printer head as an image forming apparatus, wherein 1 is an image element member, 5 is a lens member, and 8 is a support.

The image element member 1 includes a first substrate 2,
It comprises a plurality of light emitting diode element array chips 3 and a second substrate 4 having an opening A for light transmission at the center.

The first substrate 2 of the image element member 1 functions as a support member for supporting the light emitting diode element array chips 3, and a plurality of light emitting diode element array chips 3 are linearly arranged and mounted on the upper surface thereof. ing.

The first substrate 2 is made of an aluminum oxide sintered body, crystallized glass, quartz, or the like. For example, when the first substrate 2 is made of an aluminum oxide sintered body, a raw material powder of alumina, silica, calcia, magnesia, or the like is used. An appropriate organic solvent and solvent are added and mixed to form a slurry, and a ceramic green sheet (green ceramic sheet) is obtained by employing a doctor blade method or a calendar roll method, which is well known in the art. It is manufactured by punching a ceramic green sheet into a predetermined shape and firing at a high temperature (about 1500 ° C.).

The light-emitting diode element array chip 3 mounted on the first substrate 2 is composed of a plurality of light-emitting diode elements 3a, and the light-emitting diode elements 3a are individually and selectively corresponding to external electric signals. The latent image for forming an image is formed on the photosensitive member P by emitting light and irradiating the emitted light on the surface of the photosensitive member P.

The light emitting diode element 3a is made of GaAsP.
And GaP-based light emitting diodes are used.
In the case of an aAsP-based light emitting diode, first, GaAs
Is heated to a high temperature in a furnace, and a gas containing an appropriate amount of AsH ₃ (arsine), PH ₃ (phosphine), and Ga (gallium) is brought into contact with the substrate surface to form an n-type semiconductor Ga on the substrate surface.
Growing a single crystal of AsP (gallium-arsenic-phosphorus),
Next, a windowed film of Si ₃ N ₄ (silicon nitride) is deposited on the surface of the GaAsP single crystal, and the window is exposed to a gas of Zn (zinc), and Zn is partially applied to the n-type semiconductor GaAsP single crystal. It is formed by diffusing to form a p-type semiconductor and having a pn junction.

In the case of a B4 size optical printer head, 2048 light emitting diode elements 3a (8 light emitting elements per 1 mm) are arranged in a straight line. By arranging the 32 light emitting diode element array chips 3 as a unit in a linear manner, 2048 light emitting diode elements 3a are formed on the first substrate.
2 Arrayed on top.

The mounting of the light emitting diode element array chip 3 on the first substrate 2 is performed as shown in FIG.
A common electrode wiring 2a of a predetermined pattern is previously formed on the upper surface of the substrate 2 and a common electrode 31 on the lower surface of the light emitting diode element array chip is connected to the common electrode wiring 2a by the first solder S.
_This is done by joining through _one . in this case,
Self-alignment effect with the first solder S ₁ is melted and solidified in a short time, i.e., so as to face the common electrode 31 of the light emitting diode element array chip 3 and the common electrode line 2a which is deposited on the first substrate 2 to each other Due to the drawing effect, the light emitting diode element array chip 3 is mounted very accurately at a predetermined position of the common electrode wiring 2a attached to the first substrate 2, and as a result, it can be used as an image forming apparatus. When provided, the light emitting diode element array chip
3 is always positioned at the center of each lens 7 described later,
The light emitted from the light emitting diode elements 3a of each light emitting diode element array chip 3 can be satisfactorily applied to the entire surface of the photoconductor P.

The common electrode wiring 2a formed on the first substrate 2 is formed by depositing a conductive material such as aluminum or copper on the upper surface of the first substrate 2 to a predetermined thickness by vapor deposition or sputtering. At the same time, this is processed into a predetermined pattern by an etching method, and thereafter, the surface is nickel-plated or gold-plated to be formed on the upper surface of the first substrate 2.

The light emitting diode element array chip 3 mounted on the first substrate 2 further has an upper surface made of plastic such as glass epoxy resin on the upper surface thereof, and has an opening A for light transmission at the center. A second substrate 4 having an individual electrode wiring 4a adhered to the lower surface is fixedly joined.

The second substrate 4 functions to electrically connect the individual electrodes 32 of each light-emitting diode element array chip 3 to an external electric circuit, and as shown in FIG. The individual electrode 32 of each light emitting diode element array chip 3 is attached to the individual electrode wiring 4a attached, and the common electrode wiring 2a and the common electrode 31 of each light emitting diode element array chip 3 attached to the first substrate 2. flip-chip connection via the second solder S ₂ is higher melting temperature than the first solder S ₁ for joining, in particular the light emitting diode element array chip 3
Opposing sandwiching of the second substrate 4 on the upper surface, the second solder S ₂ between the individual electrodes 32 of the light emitting diode element array chip 3 and the second individual electrode wires 4a which is deposited on the lower surface of the substrate 4 Then, the second solder S ₂ is heated and melted, and the individual electrode 32 of each light emitting diode element array chip 3 and the individual electrode wiring 4 a of the second substrate 4 are joined. The individual electrodes 32 of each light emitting diode element array chip 3 are electrically connected to the individual electrode wiring 4a of the second substrate 4 connected to an external electric circuit. In this case, the individual electrodes of each light emitting diode element array chip 3
32 is a large number of thousands, but all of them are on the second substrate
4 is electrically connected to the individual electrode wirings 4a attached to the lower surface at a time and firmly, and as a result, the productivity and reliability of the image device are extremely excellent.

The individual electrode wirings 4a attached to the second substrate 4 and the individual electrodes 32 of the light emitting diode element array chip 3 are melted and solidified in a short time, and have a self-alignment effect (the second substrate 4). 4 Individual electrode wiring 4a attached to 4
A and act to attract to the individual electrodes 32 are opposed to each other of the light emitting diode element array chip 3) the second solder S ₂
In this case, the light emitting diode element array chip 3 can reliably electrically connect the individual electrodes 32 to the individual electrode wirings 4a attached to the second substrate 4.

Further, the connection between the individual electrode wiring 4a of the second substrate 4 and the individual electrode 32 of the light emitting diode element array chip 3 is performed by the common electrode wiring 2a of the first substrate 2 and the common electrode of the light emitting diode element array chip 3. conducted prior to bonding with the 31, in this case, the light emitting diode element array chip 3 of the melting temperature of the second solder S ₂ to bond the individual electrodes 32 and the individual electrode wires 4a of the second substrate 4 light emitting diode element The common electrode 31 of the array chip 3 and the common electrode wiring 2a of the first substrate 2
When to be joined via a first solder S ₁ the common electrode 31 to the first common electrode line 2a of the substrate 2 of the light-emitting diode element array chip 3 is higher than the melting temperature of the first solder S ₁ for bonding bets The second solder S ₂ joining the individual electrode wiring 4 a of the second substrate 4 and the individual electrode 32 of the light emitting diode element array chip 3 is melt-softened by the heat for melting the first solder S _1. As a result, the individual electrodes 32 of the light emitting diode element array chip 3 are always joined to the individual electrode wirings 4a of the second substrate 4, and the individual electrodes 32 of the light emitting diode element array chip 3 are covered on the second substrate 4. Electrical connection can be made accurately and reliably to an external electric circuit via the attached individual electrode wiring 4a.

The second substrate 4 made of the glass epoxy resin or the like is manufactured, for example, by pouring a sol-like epoxy resin into glass fiber, and then thermally curing the epoxy resin. Electrode wiring 4a
Is formed on the lower surface of the second substrate 4 by employing the same material and the same method as the common electrode wiring 2a provided on the upper surface of the first substrate 2.

An opening A provided in the center of the second substrate 4 has a function of transmitting light emitted from each light emitting diode element 3a to a lens member 5 which will be described later. The second substrate 4
Is formed in a predetermined shape at the center of the.

Further, the image element member 1 comprising the first substrate 2, the light emitting diode element array chip 3 and the second substrate 4 is provided with a lens member 5 at an upper portion thereof at a predetermined distance.

The lens member 5 comprises a lens plate 6 in which a plurality of holes 6a are linearly arranged and a plurality of lenses 7, and the lens 7 is brought into contact with the holes 6a provided in the lens plate 6. It is formed by bonding and fixing through an adhesive.

The lens plate 6 of the lens member 5 functions as a support member for supporting a plurality of lenses 7 at predetermined intervals on the upper surface, and the holes 6a are emitted from the respective light emitting diode elements 3a of the light emitting diode element array chip 3. Light lens 7
It has the effect of transmitting light through.

The lens plate 6 is formed of the same material as the first substrate 2 on which the light emitting diode element array chip 3 is mounted, such as crystallized glass or quartz. When the lens plate 6 and the first substrate 2 are used in an image forming apparatus, heat is applied to both the lens plate 6 and the first substrate 2 so that the lens plate 6 and the first substrate 2 are substantially the same. No thermal displacement occurs between each lens 7 supported on the lens plate 6 and each light emitting diode element array chip 3 mounted on the first substrate 2 due to thermal expansion. As a result, the light emitted from each light emitting diode element 3a forms an accurate and clear image on the surface of the photoconductor P via the lens 7, and
P makes it possible to form a high-quality latent image.

Each of the lenses 7 supported by the lens plate 6 receives light emitted from each of the light emitting diode elements 3a.
A lens formed of a transparent resin such as an acrylic resin or a polycarbonate resin or a transparent inorganic material such as a glass, which has an effect of irradiating the surface of P 2, is preferably used.

Each lens 7 is linearly bonded to the lens plate 6 at predetermined intervals by bonding a part of the outer surface of the lens 7 to the lens plate 6 via an epoxy resin-based elastic adhesive.

Further, the image element member 1 and the lens member 5
By fixing each of them to a pair of supports 8, 8, the respective light emitting diode element array chips 3 and the respective lenses 7 are provided side by side so as to correspond to each other at a predetermined distance.

The pair of supports 8, 8 have a first reference surface 8a at an upper portion thereof and a second reference surface 8b at a lower portion thereof, and the lens member 5 is provided on the first reference surface 8a of the support member 8. Lens plate 6
By fixing the first substrate 2 of the image element member 1 to the second reference surface 8b of the support body 8, each light emitting diode element array chip 3 and each lens 7 are separated from each other by a predetermined distance. It corresponds to one to one. In this case, the first substrate 2 of the image element member 1 that is in contact with the second reference surface 8b of the support 8 is formed of a highly rigid material such as an aluminum oxide sintered body that is unlikely to deform. Even when an external force or thermal stress is applied to the first substrate 2 when the image element member 1 is fixed to the support 8 and the like, the first substrate 2 is not deformed such as warping or twisting. As a result, the first substrate
2 Each light emitting diode element array chip mounted on
3 can always accurately face each lens 7.

Thus, according to the imaging apparatus of the present invention, a predetermined power is applied to each light emitting diode element 3a of the image element member 1 to cause each light emitting diode element 3a to selectively and individually emit light. The light emitted by 3a forms an image on the surface of the external photoconductor P via the lens 7 of the lens member 5, and a predetermined latent image is formed on the photoconductor P to function as an image forming apparatus.

It should be noted that the present invention is not limited to the above-described embodiment, and various modifications can be made without departing from the scope of the present invention. For example, the distance between the image element member 1 and the lens member 5 can be changed. If the light-shielding plate 9 is arranged between the adjacent light-emitting diode element array chips 3, light emitted from the light-emitting diode elements 3a of each light-emitting diode element array chip 3 leaks to the adjacent light-emitting diode element array chip 3 side. In this case, the leakage is completely blocked by the light-shielding plate 9, and as a result, the light emitted from the light emitting diode elements 3a of each light emitting diode element array chip 3 is transmitted to the photosensitive member only through the corresponding lens 7 in one-to-one correspondence. Irradiation and image formation is performed on P 2, and there is no bleeding or the like due to unnecessary light irradiation on the photoconductor P 1, and it is possible to form an extremely clear latent image. Therefore, it is preferable to arrange a light shielding plate 9 between the image element member 1 and the lens member 5 and between the adjacent light emitting diode element array chips 3.

In the above embodiment, a lens member 5 is used in which a plurality of lenses 7 are adhered and fixed to a lens plate 6 in which a plurality of holes 6a are linearly arranged. It may be changed to a so-called selfoc lens in which a number of self-focusing lenses are arranged.

Further, in the above-described embodiment, the second substrate 4 on which the individual electrode wirings 4a of the image element member 1 are adhered is formed of glass epoxy resin, but this is formed of a transparent inorganic material such as glass or a transparent resin such as acrylic resin. It may be formed of plastic. In this case, since the second substrate 4 itself is transparent, the light emitted from the light emitting diode element 3a is applied to the second substrate 4 by a lens member.
There is no need to provide an opening for transmission to the 5 side.

Further, in the above-described embodiment, the case where the present invention is applied to an image forming apparatus such as an optical printer head has been described as an example. It can also be used for reading devices.

[0044]

According to the image apparatus of the present invention, the individual electrodes of each image element array chip are electrically connected to the individual electrode wiring provided on the second substrate by flip-chip connection by solder bonding. Even if there are thousands of individual electrodes of the array chip, all of them are electrically connected to the individual electrode wirings of the second substrate at once and firmly. As a result, the productivity and reliability of the image device are extremely low. It will be excellent.

According to the image apparatus of the present invention, the common electrode wiring attached to the first substrate and the common electrode of the image element array chip are joined, and the individual electrode wiring attached to the second substrate is provided. And the individual electrodes of the image element array chip are melted and solidified in a short time, and the self-alignment effect (the common electrode wiring attached to the first substrate and the common electrode and the The individual electrodes of the image element array chip and the individual electrodes of the image element array chip were joined by solder having a function of attracting them so as to face each other. Is mounted very accurately at a predetermined position on the first substrate in a state in which it is securely connected to the individual electrode wirings adhered to the image forming apparatus. When used for, the center of each lens is always located at the center of the light emitting diode element array chip, and the light emitted by the light emitting diode element of each light emitting diode element array chip can be satisfactorily irradiated on the entire surface of the photoconductor, A clear and accurate latent image can be formed on the photoconductor. At the same time, when this image device is used in an image reading device such as an image sensor, since each lens and each image element array chip are always exactly facing each other, external image information is transferred to the solid-state image sensor array via the lens. An image can be accurately formed on the entire surface of the chip, and an accurate electric signal corresponding to external image information can be generated in the solid-state image sensor array chip.

Further, according to the image apparatus of the present invention, the melting temperature of the second solder for joining the individual electrode wiring adhered to the second substrate and the individual electrode of the image element array chip is applied to the first substrate. Since the melting temperature of the first solder for joining the attached common electrode wiring and the common electrode of the image element array chip is higher than the melting temperature of the first solder, the individual electrode wiring and the individual electrode of the image element array chip are attached to the second substrate. After bonding the common electrode of the image element array chip to the common electrode wiring attached to the first substrate via the first solder, the second solder As a result, the individual electrodes of the image element array chip are always bonded to the individual electrode wirings adhered to the second substrate, and the individual electrodes of the image element array chip are connected to each other. Second
It is possible to accurately and surely electrically connect to an external electric circuit via the individual electrode wiring attached to the substrate.

[Brief description of the drawings]

FIG. 1 is a cross-sectional view illustrating an embodiment in which an image forming apparatus according to the present invention is applied to an optical printer head as an image forming apparatus.

FIG. 2 is a sectional view taken along line XX of FIG.

FIG. 3 is an enlarged sectional view of a main part for describing an image element member of the image device shown in FIG.

FIG. 4 is a cross-sectional view of a conventional image device.

FIG. 5 is a sectional view taken along line YY of FIG. 5;

[Explanation of symbols]

1 ··· Image element member 2 ··· First substrate 2a
... Common electrode wiring, 3 ... Light emitting diode element array chip, 3a ... Light emitting diode element, 4 ...
· 2nd substrate, 4a · · · · individual electrode wiring, 5 · · · lens member, 6 · · · lens plate, 7 · · · lens, 31 · · · common electrode, 32 · · ·・ Individual electrode, S ₁・
... first solder, S ₂ ···· second solder, A ···· opening

──────────────────────────────────────────────────続 き Continued on the front page (51) Int.Cl. ⁶ identification code FI H04N 1/028 1/036 (58) Fields investigated (Int.Cl. ⁶ , DB name) B41J 2/44 B41J 2/45 B41J 2/455 H01L 27/14 H01L 33/00 H04N 1/028 H04N 1/036

Claims (2)

(57) [Claims] 1. An image apparatus comprising: a lens member having a plurality of lenses mounted on an image element member, wherein the image element member has a plurality of image elements and individual electrodes on an upper surface. A first substrate having a common electrode wiring adhered to an upper surface thereof below a plurality of image element array chips having a common electrode adhered to a lower surface thereof; A second substrate having an opening for use and an individual electrode wiring attached on the lower surface is disposed, and a common electrode of each image element array chip is connected to the common electrode wiring on the upper surface of the first substrate by a first solder. Wherein the individual electrodes are flip-chip connected to individual electrode wirings on the lower surface of the second substrate via a second solder having a melting temperature higher than that of the first solder. . 2. An image apparatus comprising: a lens member having a plurality of lenses mounted on an image element member, wherein the image element member has a plurality of image elements and individual electrodes on an upper surface. A first substrate having a common electrode wiring attached on the upper surface below a plurality of image element array chips having a common electrode attached on the lower surface, and a lower substrate on the lower surface above the image element array chip on the upper surface. Disposing a transparent second substrate on which the individual electrode wiring is attached, and connecting the common electrode of each image element array chip to the common electrode wiring on the upper surface of the first substrate via a first solder; Wherein the individual electrode wirings on the lower surface of the second substrate are flip-chip connected via a second solder having a higher melting temperature than the first solder.