JPH07250208A - Imaging device - Google Patents

Abstract

PURPOSE:To provide an imaging device with which a latent image with high picture quality can be formed at a photosensitive body by respectively selectively driving and emitting respective light emitting diodes or exact electric signals corresponding to external image information can be generated at respective solid-state imaging device arrays. CONSTITUTION:Concerning this imaging device, an image element member 1, which is composed of a base plate 4 linearly arranging and forming plural rectangular common electrode wires 6 on its upper face and plural rectangular image element arrays 5 provided with common electrodes 7 on their lower faces, linearly arranging and mounting the plural image element arrays 5 on the base plate 4 by adhering the common electrodes 7 of the image element arrays 5 through a conductive adhesive agent 8 to the common electrode wires 6 of the base plate 4 and a lens member 2 composed of plural lenses 10 are fixed together at a certain interval between them, and the common electrode wires 6 which is rectangularly formed on the base plate are provided with notched parts 9 near outer peripheries facing to the adjacent common electrode wires at least.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an image forming apparatus used in an image forming apparatus such as an optical printer head or an image reading apparatus such as an image sensor.

[0002]

2. Description of the Related Art A conventional image forming apparatus, for example, an image forming apparatus used in an image forming apparatus such as an optical printer head, usually has a lens made of a resin such as polycarbonate in which a plurality of lenses are linearly arranged and supported at predetermined intervals. A plate and a base plate made of a resin such as polycarbonate in which a plurality of light emitting diode element arrays are linearly mounted are provided side by side so that each lens and each light emitting diode element array have a one-to-one correspondence. It has a fixed structure.Each light emitting diode element of each light emitting diode element array is made to selectively emit light in response to an external electric signal, and the light emitted by the light emitting diode element is externally transmitted through a lens. By forming an image on the surface of the photoconductor and forming a latent image on the photoconductor, it functions as an image forming apparatus.

A light-emitting diode element array linearly arranged and mounted on the base plate generally has 64 light-emitting diode elements linearly arranged therein, which is suitable for a B4 size image forming apparatus. When used, the 32 light emitting diode element arrays are mounted and mounted on the base plate so that each of the 32 light emitting diode element arrays has a one-to-one correspondence with each lens.

Further, each of the light emitting diode element arrays has a common electrode on the lower surface thereof, and the common electrode wiring previously formed by depositing the common electrode on the upper surface of the base plate is made of, for example, epoxy resin or silver powder. The common electrode is mounted on the base plate while being electrically connected to the common electrode wiring by adhering it via a conductive adhesive containing added.

Further, in each light emitting diode element array mounted on the upper surface of the base plate, its individual electrode is electrically connected to an individual electrode wiring adhered to the upper surface of the base plate through a bonding wire, By connecting the common electrode wiring and the individual electrode wiring on the upper surface of the base plate to an external electric circuit, each light emitting diode element of the light emitting diode element array is electrically connected to the external electric circuit.

Further, when each lens supported by the lens plate and each light emitting diode element array mounted on the base plate are displaced from each other, the image formed on the surface of the photoconductor is blurred, white stripes or black. Each lens and each light emitting diode element array are aligned with extremely high precision because it is impossible to form a sharp and accurate latent image by generating streaks or the like.

[0007]

However, in this conventional image device, the common electrodes of the respective light emitting diode element arrays are adhered to each other so that the plurality of light emitting diode element arrays are linearly arranged and mounted on the base plate without gaps. The common electrode wirings are also formed on the upper surface of the base plate with a small interval of about 100 μm. Therefore, when the common electrode of the light emitting diode element array is adhered to the common electrode wiring of this base plate through a conductive adhesive and the light emitting diode element array is mounted on the base plate, the adjacent space between the common electrode wiring is narrow and Due to the weight of the light emitting diode element array acting on the adhesive, a part of the conductive adhesive flows out and adheres to the adjacent common electrode wiring side, resulting in an electrical short circuit between the adjacent common electrode wirings. In the case where the driving light emission of each light emitting diode element is a dynamic drive method, it becomes impossible to individually and selectively cause each light emitting diode element of each light emitting diode element array to lose its function as an image forming apparatus. It had drawbacks.

In the above-mentioned conventional example, an image device used in an image forming device such as an optical printer head has been described as an example, but it is used in an image reading device such as an image sensor using a solid-state image sensor array. Even in such an image device, there is a drawback that an electrical short circuit occurs between the adjacent solid-state image sensor arrays and it becomes impossible to generate an accurate electric signal corresponding to image information in the solid-state image sensor array.

[0009]

SUMMARY OF THE INVENTION The present invention has been conceived in view of the above-mentioned drawbacks, and an object thereof is to selectively drive each light emitting diode element to emit light, thereby forming a latent image of high image quality on a photoreceptor. An object of the present invention is to provide an image device capable of generating an accurate electric signal corresponding to external image information in each solid-state image sensor array.

[0010]

According to the present invention, there is provided a base plate having a plurality of rectangular common electrode wirings linearly arranged on an upper surface thereof, and a plurality of rectangular image element arrays having common electrodes on a lower surface thereof. An image element member in which a plurality of image element arrays are linearly arranged and mounted on the base plate by adhering a common electrode of the image element array to the common electrode wiring of the base plate via a conductive adhesive; An image device in which a lens member composed of individual lenses is fixed together with a space therebetween, wherein the common electrode wiring forming the quadrangular shape of the base plate is at least in the vicinity of an outer periphery that is in contact with an adjacent common electrode wiring. It is characterized in that a notch is provided.

[0011]

According to the image device of the present invention, in the vicinity of the outer peripheral portion of the rectangular common electrode wiring formed on the base plate,
Since the common electrode of at least the common electrode wiring is provided with a notch on the side facing each other, the common electrode of the image element array is bonded to the common electrode wiring through the conductive adhesive, and the image element array is mounted on the base plate. Even if part of the conductive adhesive tries to flow out to the adjacent common electrode wiring side, the outflow is effectively blocked by the notch provided in the common electrode wiring,
As a result, each common electrode wiring is electrically independent, and each image element array bonded to the common electrode wiring is also electrically independent. When this image device is used in an image forming apparatus such as an optical printer head, Each light emitting diode element of each light emitting diode element array can be made to selectively emit light individually, and an extremely accurate latent image can be formed on the photoconductor. At the same time, when this image device is used in an image reading device such as an image sensor, since each solid-state image pickup element array is electrically independent, each solid-state image pickup element array is provided with accurate electrical information corresponding to external image information. A signal can also be generated.

Further, in the image device of the present invention, 100 μm from the outer periphery of the common electrode wiring formed on the base plate.
If the notch is provided in the position within the range, when the common electrode of the image element array is bonded to the common electrode wiring through the conductive adhesive, the bonding area between the common electrode wiring and the conductive adhesive becomes large, and as a result, , The electrical connection between the common electrode wiring formed on the base plate and the common electrode of the image element array is reliable,
In addition, the mounting of each image element array on the base plate becomes firm, which makes it possible to make the reliability of the image device extremely high.

[0013]

The present invention will now be described in detail with reference to the accompanying drawings. 1 to 4 show an embodiment in which the image device of the present invention is applied to an optical printer head as an image forming device, 1 is an image element member, 2 is a lens member, and 3 is a support.

The image element member 1 is a base plate 4
And a plurality of light emitting diode element arrays 5 linearly arranged and mounted on the base plate 4.

The base plate 4 of the image element member 1 acts as a supporting member for supporting the light emitting diode element array 5, and is formed of, for example, an aluminum oxide sintered body, crystallized glass, quartz or the like.

When the base plate 4 is formed of an aluminum oxide sintered body, for example, a suitable organic solvent or a solvent is added to and mixed with a raw material powder of alumina, silica, calcia, magnesia, etc. The ceramic green sheet (ceramic green sheet) is obtained by employing a doctor blade method, a calendar roll method or the like which is well known in the art, and thereafter, the ceramic green sheet is punched into a predetermined shape and at a high temperature (about 1500). It is manufactured by firing at (° C).

The light emitting diode element array 5 mounted on the upper surface of the base plate 4 comprises a plurality of light emitting diode elements 5a, and the light emitting diode elements 5a individually and selectively emit light in response to an external electric signal. By irradiating the surface of the photoconductor P with the emitted light, a latent image for forming an image is formed on the photoconductor P.

The light emitting diode element 5a is a GaAsP type, Ga
P-based light-emitting diodes are used.For example, in the case of GaAsP-based light-emitting diodes, the GaAs substrate is first heated to a high temperature in a furnace and AsH ₃ (arsine), PH ₃ (phosphine), Ga (gallium) are used. ) Is contacted with the gas to grow an n-type semiconductor GaAsP (gallium-arsenic-phosphorus) single crystal on the substrate surface, and then a Si ₃ N ₄ (silicon nitride) windowed film is formed on the GaAsP single crystal surface. It is attached and Zn (
It is formed by exposing a (zinc) gas to diffuse Zn into a part of the GaAsP single crystal of the n-type semiconductor to form a p-type semiconductor and having a pn junction.

In the case of a B4 size optical printer head, the light emitting diode elements 5a are 2048 (8 per 1 mm).
Are arranged linearly, and specifically, a light emitting diode element array in which 64 light emitting diode elements 5a are one unit
By arranging 32 5 linearly, 2048 light emitting diode elements 5a are arranged on the base plate 4.

The mounting of the light emitting diode element array 5 on the base plate 4 is performed as shown in FIGS.
Pre-shaped rectangular common electrode wiring on the top surface of the base plate 4.
A plurality of 6 are arranged in a straight line, and the common electrode 7 on the lower surface of the light emitting diode element array 5 is bonded to the common electrode wiring 6 with a conductive adhesive 8 such as solder or epoxy resin containing silver powder. It is done by letting.

Common electrode wiring 6 on the base plate 4
Electrically connects the common electrode 7 of the light-emitting diode element array 5 to an external electric circuit and acts as a base metal layer when the light-emitting diode element array 5 is mounted on the base plate 4, for example, aluminum on the upper surface of the base plate 4. A metal material such as copper or copper is deposited to a predetermined thickness by a vapor deposition method, a sputtering method, or the like and is processed into a predetermined square shape by an etching method, and then the surface of the base plate 4 is plated with nickel or gold. It is linearly arranged on the upper surface.

As shown in FIG. 4, the common electrode wiring 6 is also provided with a notch 9 at least in the vicinity of the outer periphery which is in contact with the adjacent common electrode wiring.

When the common electrode 7 of the light-emitting diode element array 5 is bonded to the common electrode wiring 6 via the conductive adhesive 8, the notch 9 has a portion of the conductive adhesive 8 adjacent to the common electrode wiring side. The common electrode wiring 6 is electrically independent of each other, and each light emitting diode element array 5 bonded to the common electrode wiring 6 is also electrically blocked. Independently, it becomes possible to selectively emit light from each light emitting diode element 5a.

The notch 9 has a width T ₁ of 50 μm.
If it is less than the range, the conductive adhesive 8 cannot be effectively prevented from flowing out, and if it is more than 100 μm, the bonding area between the common electrode wiring 6 and the conductive adhesive 8 is narrowed and the light emitting diode element is The reliability of the electrical connection between the common electrode 7 of the array 5 and the common electrode wiring 6 on the base plate 4 may decrease, and it may be difficult to firmly mount the light emitting diode element array 5 on the base plate 4. . Therefore, it is preferable to set the width T ₁ of the notch 9 in the range of 50 to 100 μm.

If the notch 9 is formed at a position within 100 μm from the outer periphery of each common electrode wiring 6, the common electrode 7 of each light emitting diode element array 5 is formed on the base plate.
4 When the conductive electrode 8 is bonded to the common electrode wiring 6 on the upper surface of the common electrode wiring 6, the bonding area between the conductive adhesive 8 and the common electrode wiring 6 is increased, and the common electrode of the light emitting diode element array 5 is
The electrical connection between 7 and the common electrode wiring 6 can be ensured, and each light emitting diode element array 5 can be mounted firmly on the base plate 4. Therefore, the notch 9
Is preferably formed at a position within 100 μm from the outer periphery of each common electrode wiring 6.

Further, the image element member 1 including the base plate 4 and the plurality of light emitting diode element arrays 5 is also provided with a lens member 2 on the upper portion thereof with a certain distance.

The lens member 2 comprises a lens plate 9 in which a plurality of holes 9a are linearly arranged and a plurality of lenses 10. The lens 10 is brought into contact with the holes 9a provided in the lens plate 9. It is formed by adhering and fixing together with an adhesive.

The lens plate 9 of the lens member 2 acts as a support member for supporting a plurality of lenses 10 on the upper surface at a predetermined interval, and the hole 9a is provided with the light emitting diode element array 5
The function of transmitting the light emitted from each light emitting diode element (5a) to the lens (10).

The lens plate 9 is made of the same material as the base plate 4 on which the light emitting diode element array 5 such as crystallized glass or quartz is mounted, and the lens plate 9 is made of the same material as the base plate 4. When used as an image forming apparatus, even if heat is applied to both the lens plate 9 and the base plate 4, the lens plate 9 and the base plate 4 are thermally expanded by substantially the same amount and are supported by the lens plate 9. Each lens
There is no positional deviation between the light emitting diode element array 5 mounted on the base plate 4 and the light emitting diode element array 5 mounted on the base plate 4, and as a result, the light emitted by each light emitting diode element 5a is transmitted to the surface of the photoconductor P through the lens 10. Accurate and clear image formation,
The photoreceptor P can form a high-quality latent image.

Further, each lens 10 supported by the lens plate 9 has a function of irradiating the surface of the photoconductor P with light emitted from each light emitting diode element 5a, and transparent resin such as acrylic resin or polycarbonate resin, or glass or the like. A lens formed of the transparent inorganic material is preferably used.

A part of the outer surface of each lens 10 is adhered to the lens plate 9 linearly at a predetermined interval by adhering it to the lens plate 9 via an epoxy resin type elastic adhesive.

Further, the image element member 1 and the lens member 2
By fixing each of them to a pair of support bodies 3, 3, each light emitting diode element array 5 and each lens 10 are provided side by side so as to correspond one-to-one with a predetermined distance.

The pair of supports 3, 3 have a first
Of the lens plate of the lens member 2 on the first reference surface 3a of the support 3
9 is fixed by abutting and fixing the base plate 4 of the image element member 1 to the second reference surface 3b of the support 3 so that each light emitting diode element array 5 and each lens 10 are separated by a predetermined distance to form a one-to-one correspondence. It is adapted. In this case, if the base plate 4 of the image element member 1 that is in contact with the second reference surface 3b of the support 3 is made of a highly rigid material such as an aluminum oxide sintered body that does not easily deform, When fixing the image element member 1 to the 3
Even if external force or thermal stress is applied to the base plate 4, the base plate 4 does not deform such as warp or twist, and as a result, each light emitting diode element array 5 mounted on the base plate 4 is always attached to each lens 10. Can be exactly opposite.

Thus, according to the image device of the present invention, a predetermined power is applied to each light emitting diode element 5a of the image element member 1 to individually and selectively cause each light emitting diode element 5a to emit light, and each light emitting diode element 5a. The light emitted from 5a is imaged on the external photoconductor P surface via the lens 10 of the lens member 2,
By forming a predetermined latent image on the photoconductor P, it functions as an image forming apparatus.

The present invention is not limited to the above-mentioned embodiments, and various modifications can be made without departing from the scope of the present invention. For example, in the above-mentioned embodiments, the lens member 2 is used. A lens plate 9 in which a plurality of holes 9a are linearly arranged is used, and a plurality of lenses 10 are adhered and fixed to the lens plate 9, and a large number of rod-shaped self-focusing lenses are arranged in a so-called self-locking manner. You may change to a lens.

Further, in the above-described embodiment, the case of using it in an image forming apparatus such as an optical printer head has been described as an example, but the light emitting diode element array 5 is replaced with an individual image pickup element array, and an image reading apparatus such as an image sensor. It can also be used for.

[0037]

According to the image device of the present invention, since the cutout portion is provided at least on the side where the adjacent common electrode wirings are in contact with each other in the vicinity of the outer peripheral portion of the rectangular common electrode wirings formed on the base plate, it is common. When the common electrode of the image element array is adhered to the electrode wiring via the conductive adhesive and the image element array is mounted on the base plate, even if part of the conductive adhesive tries to flow out to the adjacent common electrode wiring side. The outflow is effectively blocked by the notch provided in the common electrode wiring, and as a result, each common electrode wiring is electrically independent and each image element array bonded to the common electrode wiring is also electrically independent, When this image device is used in an image forming device such as an optical printer head, it is possible to individually and selectively cause each light emitting diode element of each light emitting diode element array to emit light. Te, it is possible to form a highly accurate latent image on the photoreceptor. At the same time, when this image device is used in an image reading device such as an image sensor, since each solid-state image pickup element array is electrically independent, each solid-state image pickup element array is provided with accurate electrical information corresponding to external image information. A signal can also be generated.

In the image device of the present invention, 100 μm from the outer periphery of the common electrode wiring formed on the base plate.
If the notch is provided in the position within the range, when the common electrode of the image element array is bonded to the common electrode wiring through the conductive adhesive, the bonding area between the common electrode wiring and the conductive adhesive becomes large, and as a result, , The electrical connection between the common electrode wiring formed on the base plate and the common electrode of the image element array is reliable,
In addition, the mounting of each image element array on the base plate becomes firm, which makes it possible to make the reliability of the image device extremely high.

[Brief description of drawings]

FIG. 1 is a cross-sectional view showing an embodiment in which an image forming apparatus of the present invention is applied to an optical printer head as an image forming apparatus.

FIG. 2 is a sectional view taken along line XX of FIG.

FIG. 3 is an enlarged cross-sectional view of main parts for explaining an image element member of the image device shown in FIG.

4 is a partially enlarged plan view of a base plate used for the image device member shown in FIG.

[Explanation of symbols]

 1 ... Image member 2 ... Lens member 4 ... Base plate 5 ... Light emitting diode element array 5a ... Light emitting diode element 6 ... Common electrode wiring 7 ... Common electrode of light emitting diode element array 8 ... Conductive adhesive 9 ... Cutout 9 ... Spacer member

Claims (3)

[Claims] 1. A base plate having a plurality of quadrangular common electrode wirings linearly arranged on an upper surface thereof and a plurality of quadrangular image element arrays having a common electrode on a lower surface thereof. A lens member including a plurality of image element members in which a plurality of image element arrays are linearly arranged and mounted on a base plate by adhering a common electrode of the image element array to the electrode wiring via a conductive adhesive. And an image device in which a common electrode wiring having a rectangular shape of the base plate is provided side by side with a space therebetween, and a cutout portion is provided at least in the vicinity of an outer periphery that is in contact with an adjacent common electrode wiring. An imaging device characterized by the above. 2. The notch provided in the common electrode wiring has a width of 50 to 100 μm.
The image device according to 1. 3. The cutout is 1 from the outer periphery of the common electrode wiring.
The image device according to claim 1, wherein the image device is formed at a position within 00 μm.