JPH08132672A - Image apparatus - Google Patents

Abstract

PURPOSE: To provide an image apparatus in which a light emitting diode element can accurately emit a light in response to an external electric signal, or a solid state image sensor array can accurately output an electric signal corresponding to external image information by effectively electrically connecting the individual electrodes of the array to individual electrode wires and a common electrode to a common electrode wire. CONSTITUTION: An image apparatus comprises a lens member made of a plurality of lenses, and an image element member 1 having many image element arrays 5 fixed to the member. The member 1 has a plurality of image element arrays 5 arranged between a first board 4 made of a transparent material formed with a plurality of individual electrode wirings 4a, and a second board 6 made of a material which is easily thermally deformed and formed with a common electrode wire 6a in such a manner that the individual electrodes 5a of the array 5 are connected to the wirings 4a of the board 4 in a flip-chip manner and a common electrode 5c is connected to the wire 6a of the board 6.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an image forming apparatus used in an image forming apparatus such as an optical printer head or an image reading apparatus such as an image sensor.

[0002]

2. Description of the Related Art A conventional image forming apparatus, for example, an image forming apparatus used in an image forming apparatus such as an optical printer head, usually has a lens made of a resin such as polycarbonate in which a plurality of lenses are linearly arranged and supported at predetermined intervals. A plate and a base plate made of a resin such as polycarbonate in which a large number of light emitting diode element arrays are linearly mounted are provided side by side so that each lens and each light emitting diode element array have a one-to-one correspondence. It has a fixed structure.Each light emitting diode element of each light emitting diode element array is made to selectively emit light in response to an external electric signal, and the light emitted by the light emitting diode element is externally transmitted through a lens. By forming an image on the photoconductor and forming a latent image on the photoconductor, it functions as an image forming apparatus.

A light-emitting diode element array linearly arranged and mounted on the base plate generally has 64 light-emitting diode elements linearly arranged therein, which is suitable for a B4 size image forming apparatus. When used, the 32 light emitting diode element arrays are mounted on the base plate so that each of the 32 light emitting diode element arrays has a one-to-one correspondence with each lens.

Further, each of the light emitting diode element arrays has a common electrode on the lower surface thereof, and the common electrode wiring previously formed by depositing the common electrode on the upper surface of the base plate is made of, for example, epoxy resin or silver powder. The common electrode is mounted on the base plate while being electrically connected to the common electrode wiring by adhering via a conductive resin adhesive added with.

Further, in each light emitting diode element array mounted on the upper surface of the base plate, its individual electrode is electrically connected to an individual electrode wiring adhered to the upper surface of the base plate through a bonding wire, By connecting the common electrode wiring and the individual electrode wiring on the upper surface of the base plate to an external electric circuit, each light emitting diode element of the light emitting diode element array is electrically connected to the external electric circuit.

However, in this conventional image device, the individual electrodes provided in the light emitting diode element array are connected to the individual electrode wirings of the base plate through the bonding wires, and the individual electrodes of the light emitting diode element array are in the thousands. Since it is extremely large, it takes a long time to electrically connect the individual electrodes of the light-emitting diode element array to the individual electrode wirings of the base plate, which deteriorates the workability of manufacturing the image device and makes the image device as a product expensive. Had.

In the above embodiments, the image forming apparatus used in the image forming apparatus such as the optical printer head has been described as an example. However, in the image reading apparatus such as the image sensor using the solid-state image sensor array, The image device used has the same drawbacks.

Therefore, in order to solve the above-mentioned drawbacks, the applicant of the present invention has previously arranged an image element array facing a lens between a first substrate made of a transparent material having individual electrode wiring and a second substrate having common electrode wiring. In addition, an image device is proposed in which the individual electrodes of each image element array are flip-chip connected to the individual electrode wirings of the first substrate and the common electrodes are connected to the common electrode wirings of the second substrate.

According to such an image device, the individual electrodes of the image element array and the individual electrode wirings of the second substrate are flip-chip connected, that is, the first substrate is mounted on the image element array mounted on the second substrate. Since the individual electrodes of the element array and the individual electrode wirings of the first substrate are placed so as to be in contact with each other, and the individual electrodes and the individual electrode wirings are connected by being joined by soldering, the individual image element array is connected. Even if there are thousands of electrodes, all of them are electrically connected to the individual electrode wirings of the first substrate at once and firmly, and as a result, the productivity of the image device becomes extremely excellent.

[0010]

However, in this image device, there are variations in the individual heights of the image element arrays, and the common electrodes of the image element arrays are connected to the common electrode wiring of the second substrate by soldering or conductive resin. When connecting via an adhesive, there are variations in the amount of solder or conductive resin adhesive interposed between the common electrode of each image element array and the common electrode wiring of the second substrate, and individual electrode wiring is provided. Since both the first substrate and the second substrate having the common electrode wiring are formed of a material which is not easily thermally deformed, the second substrate is formed on the second substrate.
Each image element array mounted on the substrate has a height variation in the position of its individual electrode, and as a result, each individual electrode and each individual electrode wiring contact the first substrate on the image element array. When the individual electrodes and the individual electrode wirings are flip-chip connected to each other via solder in this way, it becomes impossible to bring all the individual electrodes into contact with the individual electrode wirings of the first substrate, and all individual electrodes This has led to the drawback that the electrodes cannot be reliably and firmly electrically connected to the individual electrode wiring.

[0011]

SUMMARY OF THE INVENTION The present invention has been devised in view of the above drawbacks, and an object thereof is to securely electrically connect individual electrodes of an image element array to individual electrode wirings and common electrodes to common electrode wirings for light emission. An object of the present invention is to provide an image device capable of accurately causing a diode element to emit light in accordance with an external electric signal, or taking out an accurate electric signal corresponding to external image information from a solid-state image sensor array.

[0012]

SUMMARY OF THE INVENTION The present invention is an image device in which a lens member composed of a plurality of lenses and an image element member having a large number of image element arrays are fixed together. A plurality of image elements between a first substrate made of a transparent material on which a plurality of individual electrode wirings are formed and a second substrate made of a material that is easily deformed by heat and on which a common electrode wiring is formed. An array is arranged, and individual electrodes of each image element array are connected to individual electrode wirings of the first substrate by flip-chip connection, and common electrodes are connected to common electrode wirings of the second substrate. Is.

[0013]

According to the image device of the present invention, the plurality of individual electrode wirings are formed on the first substrate made of a transparent material, and the second substrate on which the common electrode wirings are formed are made of a material which is easily deformed by heat. Therefore, by mounting the image element array on the first substrate such that the individual electrodes of the image element array come into contact with the individual electrode wirings of the first substrate, the image element array can be firmly flip-chip connected. In addition, since the second substrate is made of a material that is easily deformed by heat,
Even if there are variations in the height of the image element array mounted on the substrate, the common electrode of the image element array is transformed into the common electrode wiring of the second substrate, so that the second substrate is thermally deformed to ensure electrical conductivity. Can be connected to.

[0014]

The present invention will now be described in detail with reference to the accompanying drawings. 1 to 3 show an embodiment in which the image device of the present invention is adopted in an optical printer head as an image forming device, 1 is an image element member, 2 is a lens member, and 3 is a support.

The image element member 1 is, as shown in FIG.
It comprises a first substrate 4, a plurality of light emitting diode element arrays 5 and a second substrate 6.

The first substrate 4 of the image element member 1 is made of a transparent material such as crystallized glass or quartz, and a plurality of light emitting diode element arrays 5 are linearly arranged and mounted on the lower surface thereof.

The first substrate 4 acts as a supporting member for supporting the light emitting diode element array 5, and the individual electrode wirings 4a attached to the lower surface of the first substrate 4 are provided with the individual electrodes 5a of each light emitting diode element array 5. Flip-chip connection, specifically, the light emitting diode element array 5 on the upper surface of the first substrate 4,
The individual electrode wirings 4a attached to the first substrate 4 and the solder bumps previously attached to the individual electrodes 5a of the light emitting diode element array 5 are placed so as to face each other, and then the solder Each light emitting diode element array is formed by melting the bumps by heating and soldering the individual electrode wiring 4a of the first substrate 4 and the individual electrode 5a of the light emitting diode element array 5 to each other.
5 are arrayed and mounted on the lower surface of the first substrate 4. Further, in this case, even if the total number of the individual electrodes 5a of each light emitting diode element array 5 is large, all of the individual electrodes 5a are attached to the individual electrode wiring 4a attached to the surface of the first substrate 4 at a time by soldering, In addition, since the individual electrodes 5a of the light emitting diode element array 5 and the rear electrode wiring 4a of the first substrate 4 can be electrically connected to each other in a very short time because of the strong electrical connection, the image device is assembled. Workability and productivity are greatly improved.

Since the first substrate 4 is made of a transparent material such as crystallized glass or quartz, the light emitted from the light emitting diode element array 5 passes through the first substrate 4 and travels to the lens member 2 described later. Become.

Further, the individual electrode wiring 4a previously applied to the surface of the first substrate 4 functions to connect each individual electrode 5a of the light emitting diode element array 5 to an external electric circuit, and A conductive material such as aluminum or copper is deposited on the surface to a predetermined thickness by a plating method, a vapor deposition method, a sputtering method or the like, and this is processed into a predetermined pattern by an etching method, and then nickel plating and gold plating are applied to the surface. As a result, it is deposited on the surface of the first substrate 4.

Further, the light emitting diode element array 5 mounted on the first substrate 4a comprises a plurality of light emitting diode elements.
5b, the light emitting diode element 5b selectively emits light in response to an external electric signal, and emits the emitted light to the photoconductor P.
The latent image for forming an image is formed on the photoconductor P by irradiating the surface of the photoconductor P.

The light emitting diode element 5b is a GaAsP type, Ga
P-based light-emitting diodes are used.For example, in the case of GaAsP-based light-emitting diodes, the GaAs substrate is first heated to a high temperature in a furnace and AsH ₃ (arsine), PH ₃ (phosphine), Ga (gallium) are used. ) Is contacted with a gas to grow a single crystal of n-type semiconductor GaAsP (gallium-arsenic-phosphorus) on the substrate surface, and then Si ₃ is grown on the GaAsP single crystal surface.
A windowed film of N ₄ (silicon nitride) is deposited, and Zn (zinc) gas is exposed to the window to form an n-type semiconductor GaAsP.
Zn is diffused into a part of the single crystal to form a p-type semiconductor, and pn
It is formed by providing a bond.

In the case of a B4 size optical printer head, the number of the light emitting diode elements 5b is 2048 (8 per 1 mm).
Are arranged linearly, and specifically, a light emitting diode element array in which 64 light emitting diode elements 5b are one unit
32 light emitting diode elements 5b are linearly arranged, and thus 2048 light emitting diode elements 5b are arranged and mounted on the first substrate 4.

Further, a second substrate 6 having a common electrode wiring 6a is bonded and fixed to the lower surface of the light emitting diode element array 5 mounted on the first substrate 4.

The second substrate 6 serves to electrically connect the common electrode wiring 6a to the common electrode 5c of the light emitting diode element array 5, and the common electrode 5c of the light emitting diode element array 5 is commonly used by the second substrate 6. The second substrate 6 is bonded and fixed to the lower surface of the light emitting diode element array 5 by bonding the electrode wiring 6a via solder or the like.

The second substrate 6 is made of a material such as Unirate (trade name of Unitika Co., Ltd.), which is easily deformed by heat at the soldering temperature of the common electrode 5c and the common electrode wiring 6a of the light emitting diode element array 5. As a result, when the second substrate 6 having the common electrode wiring 6a is bonded and fixed to the lower surface of the light emitting diode element array 5 mounted on the first substrate 4, the height of each light emitting diode element array 5 varies. Because of this, even if there is height variation in the position of the common electrode 5c of each light emitting diode element array 5, the common electrode wiring 6a of the second substrate 6 causes each light emission by thermally deforming the second substrate 6. Common electrode 5c of diode element array 5
As a result, the individual electrodes 5a of each light emitting diode element array 5 are connected via the individual electrode wiring 4a of the first substrate 4, and the common electrode 5c is connected to the common electrode wiring 6a of the second substrate 6. Is electrically connected to an external electric circuit via each of the light emitting diode elements 5b of the light emitting diode element array 5 in accordance with an external electric signal, and selectively emits light accurately. It is possible to form an accurate latent image.

The common electrode wiring 6a attached to the upper surface of the second substrate 6 functions to connect each common electrode 5c of the light emitting diode element array 5 to an external electric circuit, and A conductive material such as aluminum or copper is deposited on the surface to a predetermined thickness by a plating method, a vapor deposition method, a sputtering method or the like, and this is processed into a predetermined pattern by an etching method, and then nickel plating and gold plating are applied to the surface. As a result, it is deposited on the surface of the second substrate 6.

Further, the image element member 1 including the first substrate 4, the light emitting diode element array 5 and the second substrate 6 is provided with a lens member 2 on the upper part thereof at a constant distance. It is composed of a lens plate 2a in which a plurality of holes are linearly arranged and formed, and a lens 2b adhered and fixed to the lens plate 2a via an adhesive such as resin so as to close the holes.

The lens plate 2a of the lens member 2 acts as a support member for supporting a plurality of lenses 2b on the upper surface at a predetermined interval, and the holes serve as lenses for emitting light emitted by each light emitting diode element 5b of the light emitting diode element array 5. It has the function of transmitting to 2b.

Each lens 2b supported by the lens plate 2a transmits light emitted from each emitting diode element 5b to the photoconductor P.
A lens formed of a transparent resin such as an acrylic resin or a polycarbonate resin or a transparent inorganic material such as glass, which has the function of irradiating the surface, is preferably used.

Each of the lenses 2b is linearly adhered to the lens plate 2a at a predetermined interval by adhering a part of the outer surface to the lens plate 2a via an epoxy resin adhesive, for example.

Further, the image element member 1 and the lens member 2
By fixing each of them to a pair of supports 3, each light emitting diode element array 5 and each lens 2b are provided side by side so as to correspond one-to-one with a predetermined distance.

The support 3 has a first alignment reference surface 3a on the top thereof and a second alignment reference surface 3b on the bottom thereof, and the lens plate 2a is attached to the first alignment reference surface 3a of the support 3. Of the image element member on the lower surface of the second alignment reference surface 3b.
By fixing the outer peripheral portion of the upper surface of the first substrate 4 to each other, the respective light emitting diode element arrays 5 and the respective lenses 2b are in a one-to-one correspondence with a predetermined distance therebetween. The support 3 is made of, for example, glass epoxy resin or the like.

Thus, according to the image device of the present invention, a predetermined power is applied to each light emitting diode element 5b of the image element member 1 to individually and selectively cause each light emitting diode element 5b to emit light, and each light emitting diode element 5b. The light emitted by 5b is reflected by the lens 2b.
An image is formed on the surface of the external photoconductor P via the, and a predetermined latent image is formed on the photoconductor P to function as an image forming apparatus.

The present invention is not limited to the above-described embodiments, and various modifications can be made without departing from the scope of the present invention. For example, in the above-mentioned embodiments, the optical printer head, etc. However, the light emitting diode element array may be replaced with a solid-state image pickup element array to be used in an image reading apparatus such as an image sensor.

[0035]

According to the image device of the present invention, a plurality of individual electrode wirings are formed on a first substrate made of a transparent material, and a second substrate on which common electrode wirings are formed is made of a material which is easily thermally deformed. Since the image element array is formed, the image element array is mounted on the first substrate such that the individual electrodes of the image element array come into contact with the individual electrode wirings of the first substrate, thereby firmly flip-chip connecting the image element array. In addition, since the second substrate is formed of a material that is easily thermally deformed, even if the height of the image element array mounted on the first substrate varies, the common electrode of the image element array is By electrically deforming the second substrate to the common electrode wiring of the two substrates, the electrical connection can be surely made. As a result, the individual electrodes of the image element array and the common electrode can be electrically connected to the external electric circuit. In fact, when it is used as an image forming device, it can form an accurate latent image on the photoconductor according to an external electric signal, and when it is used as an image reading device, solid-state imaging is possible. It becomes possible to extract an accurate electric signal corresponding to external image information from the element array.

[Brief description of drawings]

FIG. 1 is a vertical cross-sectional view showing an embodiment in which an image device of the present invention is used in an optical printer head as an image forming device.

2 is a cross-sectional view of the optical printer head shown in FIG.

FIG. 3 is an enlarged sectional view of a main part of the optical printer head shown in FIG.

[Explanation of symbols]

 Image element member 2 Lens member 3 Support 1st substrate 4a Individual electrode wiring 5 .... Light emitting diode element array 5a ... Individual electrode 5b ... Light emitting diode element 5c ... Common electrode 6 ... Second substrate 6a ... Common Electrode wiring P ・ ・ ・ ・ Photoconductor

─────────────────────────────────────────────────── ─── Continuation of the front page (51) Int.Cl. ⁶ Identification code Office reference number FI technical display location H01L 33/00 NM

Claims (1)

[Claims] 1. An image device comprising a lens member composed of a plurality of lenses and an image element member having a large number of image element arrays fixed side by side, wherein the image element member comprises a plurality of individual electrode wirings. A plurality of image element arrays are arranged between the first substrate made of a transparent material in which the elements are formed and the second substrate made of a material that is easily deformed by heat and in which the common electrode wiring is formed, and each image element is arranged. An image device in which the individual electrodes of the array are connected to the individual electrode wirings of the first substrate by flip-chip connection, and the common electrodes are connected to the common electrode wirings of the second substrate.