JP2881876B2 - Diamond coated cutting tool and cutting edge finishing method - Google Patents

Diamond coated cutting tool and cutting edge finishing method

Info

Publication number
JP2881876B2
JP2881876B2 JP33011389A JP33011389A JP2881876B2 JP 2881876 B2 JP2881876 B2 JP 2881876B2 JP 33011389 A JP33011389 A JP 33011389A JP 33011389 A JP33011389 A JP 33011389A JP 2881876 B2 JP2881876 B2 JP 2881876B2
Authority
JP
Japan
Prior art keywords
diamond
edge
cutting
tool
coating layer
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
JP33011389A
Other languages
Japanese (ja)
Other versions
JPH03190605A (en
Inventor
明彦 池ヶ谷
直治 藤森
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Sumitomo Electric Industries Ltd
Original Assignee
Sumitomo Electric Industries Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Sumitomo Electric Industries Ltd filed Critical Sumitomo Electric Industries Ltd
Priority to JP33011389A priority Critical patent/JP2881876B2/en
Publication of JPH03190605A publication Critical patent/JPH03190605A/en
Application granted granted Critical
Publication of JP2881876B2 publication Critical patent/JP2881876B2/en
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Description

【発明の詳細な説明】 〔産業上の利用分野〕 本発明は、基材表面に気相合成法によりダイヤモンド
の被覆層を形成したダイヤモンドコーテイング切削工具
及びその切刃部仕上方法に関する。
Description: TECHNICAL FIELD The present invention relates to a diamond-coated cutting tool in which a diamond coating layer is formed on a substrate surface by a vapor phase synthesis method, and a method for finishing a cutting edge portion thereof.

〔従来の技術〕[Conventional technology]

ダイヤモンドは高硬度で、AlやCu等の軟質金属と殆ど
反応しないという特性を有するので、これらの軟質金属
をプラスチツク等の軟質材料の高速切削に適した切削工
具として利用されている。
Since diamond has high hardness and has a property of hardly reacting with soft metals such as Al and Cu, these soft metals are used as cutting tools suitable for high-speed cutting of soft materials such as plastics.

かかるダイヤモンド切削工具としては、単結晶ダイヤ
モンドの切刃を母材に取付けた単結晶ダイヤモンド工
具、及び微粒ダイヤモンドを高温高圧で焼結した焼結体
ダイヤモンド工具が従来から実用に供され、特にSiを含
むAl合金の加工等に重用されている。
As such a diamond cutting tool, a single crystal diamond tool in which a single crystal diamond cutting edge is attached to a base material and a sintered diamond tool obtained by sintering fine diamond at a high temperature and a high pressure have been conventionally put into practical use. It is used heavily for the processing of Al alloys.

しかしながら、これらのダイヤモンド切削工具は高価
であるうえ、ブレーカー付切削チツプ等の複雑形状の切
削工具には適用が困難である等の問題点があつた。
However, these diamond cutting tools are disadvantageous in that they are expensive and difficult to apply to cutting tools having complicated shapes such as cutting chips with breakers.

一方、近年になり気相合成法によつて低圧気相中から
ダイヤモンド薄膜を合成することが可能となつた。そこ
で、高価で複雑形状の切削工具には適さない単結晶ダイ
ヤモンド工具や焼結体ダイヤモンド工具に代り、複雑形
状の基体上にもダイヤモンド薄膜を簡単に被覆出来る気
相合成法の利点を生かして、工具形状の基体表面にダイ
ヤモンド被覆層を設けたダイヤモンドコーテイング切削
工具が新しい安価なダイヤモンド工具として期待されて
いる。
On the other hand, in recent years, it has become possible to synthesize a diamond thin film from a low-pressure gas phase by a gas phase synthesis method. Therefore, instead of single crystal diamond tools and sintered diamond tools that are not suitable for expensive and complicated shaped cutting tools, take advantage of the vapor phase synthesis method that can easily coat diamond thin films on complex shaped substrates, A diamond-coated cutting tool provided with a diamond coating layer on the surface of a tool-shaped substrate is expected as a new inexpensive diamond tool.

しかし、気相合成法で合成されるダイヤモンドは無定
形炭素の含有量が少なく、結晶性が高い為明瞭な稜線を
もつた結晶面(所謂自形面)が表面に現われゴツゴツし
た表面肌となる。この為、ダイヤモンドコーテイング切
削工具の切刃は滑らかでなく、前記の単結晶ダイヤモン
ド工具や焼結体ダイヤモンド工具に比較して、切れ味が
劣り被削材の仕上面も劣る欠点があつた。
However, diamond synthesized by the vapor phase synthesis method has a low content of amorphous carbon and has high crystallinity, so that a crystal face having a clear ridge line (a so-called self-shaped face) appears on the surface, resulting in a rough surface. . For this reason, the cutting edge of the diamond-coated cutting tool is not smooth, and the cutting edge is inferior and the work surface of the work material is also inferior to those of the single crystal diamond tool and the sintered diamond tool.

又、ダイヤモンド工具が軟質材料の被削材と殆ど溶着
しないと云つても、上記の如く表面に明瞭な稜線をもつ
た結晶面が現われているダイヤモンドコーテイング切削
工具では切刃表面の稜と稜との間に被削材が入り込むの
で、単結晶ダイヤモンド工具や焼結体ダイヤモンド工具
に比べ溶着が生じやすく、工具寿命が短くなる欠点があ
つた。
Even if a diamond tool hardly adheres to a work material of a soft material, a diamond-coated cutting tool in which a crystal face having a clear ridgeline appears on the surface as described above, the ridge and the ridge of the cutting edge surface. Since the work material enters between them, welding is more likely to occur as compared with a single crystal diamond tool or a sintered diamond tool, and the tool life is short.

〔発明が解決しようとする課題〕[Problems to be solved by the invention]

本発明はかかる従来の事情に鑑み、複雑形状の切削工
具にも適用可能であつて、被削材の仕上面が単結晶ダイ
ヤモンド工具や焼結体ダイヤモンド工具に比較して遜色
なく、しかも安価で工具寿命の長いダイヤモンドコーテ
イング切削工具を提供することを目的とする。
In view of such a conventional situation, the present invention is applicable to a cutting tool having a complicated shape, and the finished surface of a work material is as inexpensive as a single crystal diamond tool or a sintered diamond tool, and at a low cost. An object of the present invention is to provide a diamond-coated cutting tool having a long tool life.

〔課題を解決するための手段〕[Means for solving the problem]

上記目的を達成するため、本発明は、基材表面上に気
相合成法によるダイヤモンド被覆層を有するダイヤモン
ドコーテイング切削工具において、すくい面以外の切刃
のエツジ及びエツジから逃げ面側0.1mm以内のダイヤモ
ンド被覆層表面を、面粗さRmax0.5μm以下に平滑化し
たことを特徴とする。
In order to achieve the above object, the present invention provides a diamond-coated cutting tool having a diamond coating layer formed on a substrate surface by a vapor phase synthesis method, wherein the edge of the cutting edge other than the rake face and the flank side of the edge are within 0.1 mm. The surface of the diamond coating layer is smoothed to a surface roughness Rmax of 0.5 μm or less.

又、かかるダイヤモンドコーテイング切削工具を得る
切刃部の仕上方法としては、すくい面以外の切刃のエツ
ジ及びエツジから逃げ面側0.1mm以内のダイヤモンド被
覆層表面を、研磨砥粒を付着させたブラシを用いて,基
材を露出させることなく、面粗さRmax0.5μm以下に平
滑化することを特徴とする。
Further, as a method of finishing the cutting edge portion to obtain such a diamond-coated cutting tool, the edge of the cutting edge other than the rake face and the diamond coating layer surface within 0.1 mm flank side of the edge from the edge, a brush having abrasive abrasive particles attached. The surface is smoothed to a surface roughness Rmax of 0.5 μm or less without exposing the substrate.

〔作用〕 前記した被削材の仕上面が単結晶ダイヤモンド工具や焼
結体ダイヤモンド工具に比較して劣る等のダイヤモンド
コーテイング切削工具の欠点は、ダイヤモンド被覆層表
面に現われた明瞭な稜線をもつた結晶面を平滑化するこ
とで解消できると考えられる。
[Operation] The disadvantage of the diamond-coated cutting tool, such as that the finished surface of the work material is inferior to a single-crystal diamond tool or a sintered diamond tool, has a clear ridge line that appears on the surface of the diamond coating layer. It is considered that the problem can be solved by smoothing the crystal plane.

表面を平滑化する手段としては、単結晶ダイヤモンド
工具や焼結体ダイヤモンド工具において通常行なわれて
いるように、スカイフ研磨等でラツプ仕上を施すことが
考えられるが、処理コストが高く、ダイヤモンドコーテ
イング切削工具に特有の低コストというメリツトが損な
われる。更に、複雑形状の基材表面にも被覆可能な気相
合成法によれば、ブレーカー付切削チツプやドリル等の
複雑形状のダイヤモンドコーテイング切削工具を安価に
提供出来るが、ラツプ盤を用いるラツプ仕上では複雑形
状の切削工具の処理が困難である。
As a means for smoothing the surface, it is conceivable to apply a lap finish by skif polishing or the like, as is usually performed for a single crystal diamond tool or a sintered diamond tool, but the processing cost is high, and the diamond coating cutting is expensive. The advantage of low cost that is unique to tools is lost. Furthermore, according to the vapor-phase synthesis method capable of coating even a complex-shaped base material surface, a diamond-coated cutting tool having a complicated shape such as a cutting chip with a breaker or a drill can be provided at a low cost, but the lapping using a lapping machine is not possible. It is difficult to process cutting tools with complicated shapes.

そこで本発明者等は、被削材の仕上面の優劣を左右す
るのは種として切刃のエツジとエツジ近傍の逃げ面の滑
らかさであるから、この部分のみを簡便に平滑化できし
かも複雑形状の切削工具にも対応出来る手段としてブラ
シ研磨が最適であるとの結論に達した。
Therefore, the present inventors consider that the edge of the cutting edge and the smoothness of the flank in the vicinity of the edge as a seed determine the superiority of the finished surface of the work material. We concluded that brush polishing is the most suitable means to handle cutting tools with different shapes.

本発明においては、切刃部の中でも特にエツジとエツ
ジから逃げ面側をブラシ研磨するのであるが、ブラシに
よる研磨であるが故に、実際は第1図に示すように、エ
ツジ1と逃げ面2側だけでなく、すくい面3側も同時に
若干研磨されてしまう。しかし、このすくい面3側の研
磨は本来不要なものであり、本発明における研磨の範囲
又は平滑化の範囲には含まれない。
In the present invention, in particular, the edge and the flank side of the edge are brush-polished among the cutting edge portions. However, since the polishing is performed by a brush, the edge 1 and the flank 2 side are actually used as shown in FIG. In addition, the rake face 3 is slightly polished at the same time. However, the polishing of the rake face 3 is essentially unnecessary and is not included in the polishing range or the smoothing range in the present invention.

本発明のダイヤモンドコーテイング切削工具では、上
記の如く少なくとも切刃のエツジ1並びにその近傍の逃
げ面2のダイヤモンド被覆層4の表面が平滑化されてい
るので、被削材の仕上面が単結晶ダイヤモンド工具や焼
結体ダイヤモンド工具とほぼ同等のレベルの仕上がり状
態まで改善される。
In the diamond-coated cutting tool of the present invention, at least the edge 1 of the cutting edge and the surface of the diamond coating layer 4 on the flank 2 near the edge are smoothed as described above, so that the finished surface of the work material is made of single-crystal diamond. The finished state is improved to a level almost equal to that of tools and sintered diamond tools.

かかる本発明による作用効果を得るためには、エツジ
1及びエツジ1から逃げ面2側の少なくとも0.1mm以内
を、面粗さRmax0.5μm以下に平滑化する必要がある。
しかし、エツジ1から逃げ面2側の2mmを超える範囲を
研磨しても、通常の切削では効果がない。
In order to obtain the effect of the present invention, it is necessary to smooth the edge 1 and at least 0.1 mm of the flank 2 side from the edge 1 to a surface roughness Rmax of 0.5 μm or less.
However, even if the area exceeding 2 mm on the flank 2 side from the edge 1 is polished, ordinary cutting has no effect.

しかも、被削材との溶着も殆ど発生しないばかりか、
ダイヤモンド被覆層の剥離を抑える効果も認められ、相
乗して工具寿命を延長しうることが確認された。又、簡
便なブラシホーニングによるので、複雑形状の切削工具
にも対応でき、ラツプ仕上よりも処理コストも遥かに安
い利点がある。
Moreover, not only does the welding with the work material hardly occur,
The effect of suppressing the peeling of the diamond coating layer was also recognized, and it was confirmed that the tool life could be prolonged synergistically. Further, since the brush honing is simple, it is possible to cope with a cutting tool having a complicated shape, and there is an advantage that the processing cost is much lower than that of lapping.

ブラシに付着させる研磨砥粒の材質としては、ダイヤ
モンド、立方晶窒化硼素(C−BN)、アルミナ(Al
2O3)、酸化クロム(Cr2O3)等が好ましいが、特にダイ
ヤモンド又はC−BNを用いると研磨の効率が良い。砥粒
の粒径に関しては、微粒すぎると研磨の効率が悪く、逆
に粗粒すぎると基材が露出しない範囲で被覆層のみを研
磨する調整が難しいので、#100〜#1500程度の粒径が
好ましい。又、平滑な表面を効率良く得るためには、最
初に粗粒のブラシを使用し、次に微粒のブラシを使うこ
とが有効である。尚、切削工具の形状に応じて、線径や
強度の異なるブラシを使い分けたり研磨個所がブラシに
入り込む深さを変えることも、研磨を適切且つ効率的に
行なう上で有効である。
The material of the abrasive grains to be attached to the brush includes diamond, cubic boron nitride (C-BN), alumina (Al
2 O 3 ), chromium oxide (Cr 2 O 3 ), etc. are preferred, but the use of diamond or C-BN in particular provides good polishing efficiency. Regarding the particle size of the abrasive grains, if the particle size is too fine, the polishing efficiency is poor. Is preferred. In order to efficiently obtain a smooth surface, it is effective to use a coarse-grained brush first and then a fine-grained brush. It is also effective to use brushes having different wire diameters and strengths in accordance with the shape of the cutting tool and to change the depth at which the polishing portion enters the brush in order to perform polishing appropriately and efficiently.

〔実施例〕〔Example〕

実施例1 W−フイラメントCVD装置を用い、Si3N4を主成分とす
る型番SPGN 12030の切削チツプ(住友電気工業(株)製
NS 130)を基材とし、その表面上にダイヤモンド被覆層
を形成してダイヤモンドコーテイング切削チツプを作製
した。基材表面を#270の電着砥石を用いて傷入れ処理
し、フイラメント温度2200℃、フイラメントと基材間の
距離7mm、基材であるチツプの切刃部の表面温度を970℃
に設定し、反応容器内に原料ガスとしてH2 1000SCCM,CH
4 7SCCMを導入しながら圧力80torrで成膜し、12時間の
反応により膜厚7μmのダイヤモンド被覆層を得た。こ
のダイヤモンド被覆層表面の結晶粒径は4〜7μmで、
表面粗さRmaxは1.8μmであつた。
Example 1 Using a W-filament CVD apparatus, a cutting chip of model number SPGN 12030 containing Si 3 N 4 as a main component (manufactured by Sumitomo Electric Industries, Ltd.)
NS 130) was used as a substrate, and a diamond coating layer was formed on the surface thereof to produce a diamond-coated cutting chip. The surface of the substrate is scratched using a # 270 electrodeposition grindstone, the filament temperature is 2200 ° C, the distance between the filament and the substrate is 7 mm, and the surface temperature of the cutting edge of the chip as the substrate is 970 ° C.
H 2 1000 SCCM, CH as raw material gas in the reaction vessel
A film was formed at a pressure of 80 torr while introducing 47 SCCM, and a 7-μm-thick diamond coating layer was obtained by a reaction for 12 hours. The crystal grain size on the surface of the diamond coating layer is 4 to 7 μm,
The surface roughness Rmax was 1.8 μm.

このダイヤモンドコーテイング切削チツプと、比較の
為に同一型番の焼結体ダイヤモンド切削チツプ(住友電
気工業(株)製スミダイヤDA 150)及び単結晶ダイヤモ
ンド切削チツプ(住友電気工業(株)製スミクリスタル
ワンユースチツプ)を用いて純Alの切削試験を行ない、
被削材の表面仕上り状態を評価した。切削条件はV=40
0m/min、f=0.1mm/rev、d=0.1mmで乾式切削である。
1分間切削後の被削材の表面粗さRmaxは、ダイヤモンド
コーテイング切削チツプが5.6μm、焼結体ダイヤモン
ド切削チツプが4.2μm、及び単結晶ダイヤモンド切削
チツプが3.1μmであつた。又、焼結体ダイヤモンド切
削チツプと単結晶ダイヤモンド切削チツプによる被削材
仕上げ面が鏡面に近い美しい金属光沢を有するのに対
し、ダイヤモンドコーテイング切削チツプではやや白味
がかつた外観を呈していた。
For the purpose of comparison, this diamond coated cutting chip and a sintered diamond cutting chip (Sumidia DA 150 manufactured by Sumitomo Electric Industries, Ltd.) and a single crystal diamond cutting chip (Sumicrystal One Use manufactured by Sumitomo Electric Industries, Ltd.) of the same model number for comparison. Perform a cutting test of pure Al using a chip)
The surface finish of the work material was evaluated. Cutting conditions are V = 40
Dry cutting at 0 m / min, f = 0.1 mm / rev, d = 0.1 mm.
The surface roughness Rmax of the work material after cutting for 1 minute was 5.6 μm for the diamond-coated cutting chip, 4.2 μm for the sintered diamond cutting chip, and 3.1 μm for the single-crystal diamond cutting chip. Also, the finished surface of the work material by the sintered diamond cutting chip and the single crystal diamond cutting chip has a beautiful metallic luster close to a mirror surface, whereas the diamond coated cutting chip has a slightly whitish appearance.

次に、第2図に示す如く上記ダイヤモンドコーテイン
グ切削チツプ5を自公転するターンテーブル6に固定
し、#400のダイヤモンド砥粒を付着させた回転する研
磨ブラシ7を押し付けて軽く研磨し、更に#1200のダイ
ヤモンド砥粒を付着させた回転する研磨ブラシで仕上げ
研磨を行ない、基材が露出しないように注意しながら切
刃のエツジ及びエツジ近傍の逃げ面を含むダイヤモンド
被覆層表面を平滑化した。得られた切刃のエツジ及びエ
ツジから逃げ面側少なくとも0.1mmを含む研磨面は光沢
がある鏡面に近い状態になり、そのRmaxは0.4μmであ
つた。
Next, as shown in FIG. 2, the diamond-coated cutting tip 5 is fixed to a revolving turntable 6, and a rotating polishing brush 7 to which diamond abrasive grains of # 400 are adhered is pressed to lightly grind it. Finish polishing was performed with a rotating polishing brush to which 1200 diamond abrasive grains were attached, and the surface of the diamond coating layer including the edge of the cutting blade and the flank near the edge was smoothed while taking care not to expose the substrate. The edge of the obtained cutting edge and the polished surface including at least 0.1 mm on the flank side of the edge became a state close to a glossy mirror surface, and its Rmax was 0.4 μm.

この本発明によるダイヤモンドコーテイング切削チツ
プを用いて上記と同様の切削試験を行なつたところ、被
削材の表面粗さRmaxは4.1μmとなり、鏡面に近い美し
い金属光沢に仕上がり、焼結体ダイヤモンド切削チツプ
及び単結晶ダイヤモンド切削チツプと比較しても遜色な
い仕上り面が得られた。
When a cutting test similar to the above was conducted using the diamond-coated cutting tip according to the present invention, the surface roughness Rmax of the work material was 4.1 μm, and the metal was finished to have a beautiful metallic luster close to a mirror surface. A finished surface comparable to that of the chip and the single crystal diamond cutting chip was obtained.

実施例2 W−フイラメントCVD装置を用い、直径2.0mmの超硬合
金製マイクロドリル(住友電気工業(株)製イゲタロイ
マイクロドリルTN 200)にダイヤモンド被覆層を形成し
て、6本のダイヤモンドコーテイングドリルを作製し
た。フイラメント温度2200℃、フイラメントとドリル先
端の距離15mm、ドリル先端の表面温度980℃に設定し、
反応容器内に原料ガスとしてH2を500SCCM及びCH4を7.5S
CCMで導入しながら圧力40torrで8時間成膜して、ドリ
ル先端に膜厚約5μmのダイヤモンド被覆層を得た。こ
のダイヤモンド被覆層表面の結晶粒径は3〜5μmで、
表面粗さRmaxは1.1μmであつた。
Example 2 Using a W-filament CVD apparatus, a diamond coating layer was formed on a cemented carbide micro drill having a diameter of 2.0 mm (IGETALLOY micro drill TN 200 manufactured by Sumitomo Electric Industries, Ltd.), and six diamond coating drills were formed. Was prepared. Set the filament temperature at 2200 ° C, the distance between the filament and the drill tip at 15mm, and the surface temperature at the drill tip at 980 ° C.
7.5S to 500SCCM and CH 4 and H 2 as the raw material gas into the reaction vessel
The film was formed at a pressure of 40 torr for 8 hours while introducing with a CCM to obtain a diamond coating layer having a thickness of about 5 μm at the tip of the drill. The crystal grain size on the surface of the diamond coating layer is 3-5 μm,
The surface roughness Rmax was 1.1 μm.

得られたダイヤモンドコーテイングドリルのうち3本
のドリル先端を、#1500のダイヤモンド砥粒を付着させ
た回転ブラシで基材が露出しないように注意しながら研
磨し、切刃のエツジ及びエツジ近傍の逃げ面を含むダイ
ヤモンド被覆層表面を平滑化した。得られた切刃のエツ
ジ及びエツジから逃げ面側少なくとも0.1mmを含む研磨
面は光沢がある鏡面に近い状態になり、そのRmaxは0.3
μmであつた。
Of the obtained diamond coating drills, three drill tips were polished with a rotating brush to which # 1500 diamond abrasive particles were adhered so as not to expose the base material, and the edge of the cutting blade and the escape near the edge were removed. The surface of the diamond coating layer including the surface was smoothed. The edge of the obtained cutting edge and the polished surface including at least 0.1 mm on the flank side from the edge are in a state close to a glossy mirror surface, and the Rmax is 0.3.
μm.

上記研磨処理を施した3本のダイヤモンドコーテイン
グドリルと、未研磨の3本のダイヤモンドコーテイング
ドリルを用いて、4枚重ねたガラスエポキシ多層基板に
N=2000rpm、F=2000mm/minの切削条件で穴あけ試験
を行なつた。未研磨の3本のダイヤモンドコーテイング
ドリルでは1860ヒツト、2010ヒツト及び2130ヒツトでス
ミヤ(多層基板における絶縁不良)は発生し、工具寿命
となつたのに対し、研磨処理したダイヤモンドコーテイ
ングドリルでは3740ヒツト、3920ヒツト及び4060ヒツト
までスミヤの発生がなく、工具寿命が約3倍に延びた。
尚、基材として用いた超硬合金製マイクロドリルでの同
様の穴あけ試験では400ヒツトで工具寿命に達した。
Using three diamond-coated drills subjected to the above polishing treatment and three unpolished diamond-coated drills, four glass epoxy multilayer substrates are drilled under cutting conditions of N = 2000 rpm and F = 2000 mm / min. The test was performed. Three uncoated diamond coated drills produced smears (insulation failure on multi-layer substrate) at 1860 hits, 2010 hits and 2130 hits, resulting in tool life, whereas the polished diamond coated drills had 3740 hits. There was no smearing up to 3920 hits and 4060 hits, and the tool life was extended about three times.
In a similar drilling test using a cemented carbide microdrill used as a substrate, the tool life was reached at 400 hits.

〔発明の効果〕〔The invention's effect〕

本発明によれば、複雑形状の切削工具にも適用可能で
あつて、被削材の仕上面が単結晶ダイヤモンド工具や焼
結体ダイヤモンド工具に比較して遜色なく、又被削材の
溶着をなくすと共にダイヤモンド被覆層の剥離を抑える
ことにより従来より長い工具寿命を有するダイヤモンド
コーテイング切削工具を安価に提供することが出来る。
According to the present invention, it is applicable to a cutting tool having a complicated shape, and the finished surface of the work material is comparable to that of a single crystal diamond tool or a sintered diamond tool. By eliminating the diamond coating layer and suppressing the peeling of the diamond coating layer, a diamond-coated cutting tool having a longer tool life than before can be provided at low cost.

【図面の簡単な説明】[Brief description of the drawings]

第1図は本発明のダイヤモンドコーテイング切削工具の
切刃部の断面図、第2図は実施例1で用いたブラシ研磨
装置の概略の斜視図である。 1…エツジ、2…逃げ面 3…すくい面、4…ダイヤモンド被覆層 5…切削工具、6…ターンテーブル 7…研磨ブラシ
FIG. 1 is a sectional view of a cutting edge portion of a diamond-coated cutting tool according to the present invention, and FIG. 2 is a schematic perspective view of a brush polishing apparatus used in Example 1. DESCRIPTION OF SYMBOLS 1 ... Edge, 2 ... Flank surface 3 ... Rake surface, 4 ... Diamond coating layer 5 ... Cutting tool, 6 ... Turntable 7 ... Polishing brush

───────────────────────────────────────────────────── フロントページの続き (58)調査した分野(Int.Cl.6,DB名) B23B 27/14 B23P 15/28 ──────────────────────────────────────────────────続 き Continued on the front page (58) Field surveyed (Int.Cl. 6 , DB name) B23B 27/14 B23P 15/28

Claims (3)

(57)【特許請求の範囲】(57) [Claims] 【請求項1】基材表面上に気相合成法によるダイヤモン
ド被覆層を有するダイヤモンドコーテイング切削工具に
おいて、すくい面以外の切刃のエツジ及びエツジから逃
げ面側0.1mm以内のダイヤモンド被覆層表面を、面粗さR
max0.5μm以下に平滑化したことを特徴とする上記ダイ
ヤモンドコーテイング切削工具。
1. A diamond-coated cutting tool having a diamond coating layer formed by a vapor phase synthesis method on a substrate surface, wherein the edge of the cutting edge other than the rake face and the diamond coating layer surface within 0.1 mm on the flank side of the edge are: Surface roughness R
The diamond-coated cutting tool as described above, which is smoothed to a maximum of 0.5 μm or less.
【請求項2】切刃のエツジ及びエツジから逃げ面側2mm
以内のダイヤモンド被覆層表面を、面粗さRmax0.5μm
以下に平滑化したことを特徴とする、請求項(1)記載
のダイヤモンドコーテイング切削工具。
2. The edge of the cutting edge and the flank side 2 mm from the edge
The surface of the diamond coating layer within
The diamond-coated cutting tool according to claim 1, wherein the cutting tool is smoothed.
【請求項3】基材表面上に気相合成法によるダイヤモン
ド被覆層を有するダイヤモンドコーテイング切削工具に
おいて、すくい面以外の切刃のエツジ及びエツジから逃
げ面側0.1mm以内のダイヤモンド被覆層表面を、研磨砥
粒を付着させた研磨ブラシを用いて、基材を露出させる
ことなく、面粗さRmax0.5μm以下に平滑化することを
特徴とするダイヤモンドコーテイング切削工具の切刃部
仕上方法。
3. A diamond-coated cutting tool having a diamond coating layer formed on a substrate surface by a vapor phase synthesis method, wherein the edge of the cutting edge other than the rake face and the diamond coating layer surface within 0.1 mm on the flank side from the edge are formed by: A method for finishing a cutting edge portion of a diamond-coated cutting tool, wherein the surface is smoothed to a surface roughness Rmax of 0.5 μm or less without using a polishing brush to which abrasive grains are attached.
JP33011389A 1989-12-20 1989-12-20 Diamond coated cutting tool and cutting edge finishing method Expired - Fee Related JP2881876B2 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP33011389A JP2881876B2 (en) 1989-12-20 1989-12-20 Diamond coated cutting tool and cutting edge finishing method

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP33011389A JP2881876B2 (en) 1989-12-20 1989-12-20 Diamond coated cutting tool and cutting edge finishing method

Publications (2)

Publication Number Publication Date
JPH03190605A JPH03190605A (en) 1991-08-20
JP2881876B2 true JP2881876B2 (en) 1999-04-12

Family

ID=18228944

Family Applications (1)

Application Number Title Priority Date Filing Date
JP33011389A Expired - Fee Related JP2881876B2 (en) 1989-12-20 1989-12-20 Diamond coated cutting tool and cutting edge finishing method

Country Status (1)

Country Link
JP (1) JP2881876B2 (en)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2000246512A (en) 1998-12-28 2000-09-12 Ngk Spark Plug Co Ltd Diamond coating cutting tool
JP2019077080A (en) * 2017-10-23 2019-05-23 兼房株式会社 Chip saw
WO2021241499A1 (en) * 2020-05-28 2021-12-02 京セラ株式会社 Coated tool, and cutting tool provided with same

Also Published As

Publication number Publication date
JPH03190605A (en) 1991-08-20

Similar Documents

Publication Publication Date Title
CN1125719C (en) Diamond-coated tools and process for making
RU2131329C1 (en) Cutting tool insert and method of its manufacture
EP1198609B2 (en) Process for producing a hard-material-coated component
EP0127416A2 (en) Cutting tool and the production thereof and use of the same
JPH02106210A (en) Helical tooth polycrystalline diamond tool and manufacture thereof
JP3252711B2 (en) Coated silicon nitride based tool
JP2881876B2 (en) Diamond coated cutting tool and cutting edge finishing method
JPH0621360B2 (en) Diamond-coated sintered bond excellent in peel resistance and method for producing the same
CN103924211A (en) Cvd Coated Polycrystalline C-bn Cutting Tools
JP2595203B2 (en) High adhesion diamond coated sintered alloy and method for producing the same
JPH04201102A (en) Diamond-covered throw away tip
JPH04280974A (en) Boron nitride coated hard material
JP2001341007A (en) Coated cutting tool
JP4009190B2 (en) Throw-away tip and manufacturing method thereof
JPS5925970A (en) Coated sintered hard alloy
JPH09241826A (en) Cemented carbide structural body, its production and cutting tool using the same
JPH01208397A (en) Diamond coated product and cutting tool using said product
JPH01259171A (en) Cutting tool member coated with hard film
JPH0788580B2 (en) Diamond coated cemented carbide and method for producing the same
JP2002038205A (en) Coated cemented carbide having hard composite layer and its production method
JP4744486B2 (en) Throw-away tip and method for manufacturing throw-away tip
JP2734134B2 (en) Diamond coated tool and manufacturing method thereof
JPS62218071A (en) Diamond grinding sheet
JP2002273614A (en) Diamond coating end mill
JPH0463604A (en) Manufacture of cutting tool made of rigid layer-covered tungusten carbide group cemented carbide alloy

Legal Events

Date Code Title Description
LAPS Cancellation because of no payment of annual fees