JP2878043B2 - Microwave package - Google Patents

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a microwave package used for a microwave module such as a radar.

[0002]

2. Description of the Related Art FIG. 15 shows, for example, "ASPECTS OF MODERNRADAR" (Eli Br
ookner, published by Artech House, 1988), showing the structure of a conventional microwave package.
1A to 1C, 1 is a base metal, 2,
Each of the ceramic substrates 2 is laminated on the upper surface of the base metal 1 and fixed by brazing or the like.

[0003] 3 is a cavity, 5 is a transmitting high power amplifier (transmitting circuit), 6 is a receiving low noise amplifier (receiving circuit), 7
Each of a and 7b is a transmission / reception switching circuit. Transmission high power amplifier 5, reception low noise amplifier 6, and transmission / reception switching circuit 7
Each of a and 7b is mounted on the upper surface of the base metal 1.

Each of 8a and 8b is a microwave terminal, and is provided at both ends in the width direction of the ceramic substrate 2 as shown in the figure. The microwave terminal 8a is connected to the transmission / reception switching circuit 7a by wire bonding or the like, and the microwave terminal 8b is connected to the transmission / reception switching circuit 7b by wire bonding or the like.

Each of 9a to 9f is a power supply and control signal external terminal, and is provided substantially at the center of the peripheral portion in the longitudinal direction of the ceramic substrate 2. Each of 10a to 10f is a power supply
A control signal internal terminal, provided in the cavity 3;
The power / control signal external terminals 9a to 9f are connected to the ends on the cavity side. Power / control signal internal terminal 10
a and 10b are connected to the reception low-noise amplifier circuit 6 by wire bonding or the like, and are provided with power / control signal internal terminals 10c.
Is connected to the transmission / reception switching circuit 7b by wire bonding or the like. Also, power / control signal internal terminals 10d, 10d
e is connected to the transmission power amplifier circuit 5 by wire bonding or the like, and the power / control signal internal terminal 10f is connected to the transmission / reception switching circuit 7a by wire bonding or the like.
11 is a cavity side wall, each of 13a and 13b is a microstrip line, and 14 is a cover.

Next, the operation will be described. In the transmission state, the transmission microwave signal supplied to the microwave terminal 8b enters the transmission high power amplifier circuit 5 through the microstrip line 13b by switching between transmission and reception by the transmission / reception switching circuit 7b. Here, after the high power amplification, the transmission / reception switching of the transmission / reception switching circuit 7a causes the microwave terminal 8a
Output from

On the other hand, in the receiving state, the microwave terminal 8a
The reception microwave signal supplied to the transmission / reception switching circuit 7a
Switching of the microstrip line 1
The signal enters the reception low noise amplifier circuit 6 through 3a. Here, after the low noise amplification, the signal is output from the microwave terminal 8b by switching of the transmission / reception switching circuit 7b.

Power and control signals The power and control signals supplied to the external terminals 9a to 9f are transmitted via the power and control signal internal terminals 10a to 10f to the transmission high power amplifier 5, the reception low noise amplifier 6, and the transmission / reception switching. Input to the circuit 7.

[0009]

Since the conventional microwave package is configured as described above, the microwave characteristics are degraded due to the interference between the transmission circuit and the reception circuit. In addition, there is a problem that the maximum usable frequency is limited due to resonance in the waveguide mode.

[0010] As shown in FIG.
In addition, power supply and control signals need to be applied in the width direction due to restrictions on the arrangement of parts and the structure of the package, so that a large area is occupied when a large number of packages are arranged and used in the width direction. There was also a problem of becoming.

Although not particularly described, in a conventional microwave package, a microwave signal formed between a ceramic substrate 2 on a base metal 1 in an input / output section provided with the microwave terminal is provided. Since the ground pattern (not shown) is floating above the base metal 1 in terms of high frequency, there is a problem that an impedance mismatch occurs at the input / output section and reflection is increased.

SUMMARY OF THE INVENTION The present invention has been made to solve the above-described problems, and provides good microwave characteristics over a wide band and minimizes the occupied area when a plurality of devices are arranged. It is an object to provide a microwave package that can be used.

[0013]

In the microwave package according to the present invention, the circuit is divided into at least two circuits, a transmitting circuit and a receiving circuit, and these are mounted in the first and second cavities. Further, a plurality of through-holes are provided inside the side walls of the cavity, between the first and second ground patterns, which are patterned, along the periphery of each of the first and second cavities. in this case,
The distance between the through holes is set to 1/8 or less of the wavelength distance of the working frequency of the microwave.

According to a second aspect of the present invention, there is provided a microwave package, wherein the first and the second packages are arranged along both sides of the triplate line at intervals of 1/8 or less of the wavelength distance of the working frequency of the microwave.
A plurality of through holes for conducting the second ground pattern are provided.

According to a third aspect of the present invention, there is provided a microwave package, wherein a groove for penetrating the first ground pattern and the second ground pattern is provided inside each of the first and second cavities. First and second grooves
Side metallization is applied to a portion on the side where the cavity portion faces each other, and a portion on the side facing the triplate line formed on the insulating substrate between the first and second ground patterns. In addition, side metallization is applied to the side surface of the outer peripheral portion of each insulating substrate.

In a microwave package according to a fourth aspect of the present invention, the dimensions of each of the first and second cavities are reduced to half or less with respect to the wavelength of the operating frequency.

According to a fifth aspect of the invention, there is provided a microwave package wherein the first and second cavities are displaced in the longitudinal direction.

According to a sixth aspect of the present invention, there is provided a microwave package comprising: a power supply / control signal external terminal for supplying a power supply and a control signal to each of a transmission circuit and a reception circuit; A microwave terminal for inputting / outputting a microwave signal is provided on the same surface at one end in the longitudinal direction of the microwave package body.

According to a seventh aspect of the present invention, in the microwave signal input / output portion, the microwave signal ground pattern and the base metal are electrically connected by a side metallization pattern.

In the microwave package according to the present invention, the microwave signal ground pattern and the base metal are electrically connected to each other by a through hole on a side surface in an input / output portion of the microwave signal.

According to a ninth aspect of the present invention, in the microwave signal input / output portion, the microwave signal ground pattern and the base metal are electrically connected by via holes.

[0022]

According to the first aspect of the present invention, the microwave package is divided into a transmitting circuit and a receiving circuit by at least first and second cavities, and a plurality of microwave packages are provided around each of the first and second cavities. Is formed to conduct the first and second ground patterns, so that interference between the transmission circuit and the reception circuit is suppressed.

In the microwave package according to the second aspect of the present invention, a plurality of through holes are formed along both sides of the triplate line to conduct the first and second ground patterns, so that the triplate line is shielded. You.

The microwave package according to the third aspect of the present invention is divided into a transmitting circuit and a receiving circuit by at least first and second cavities, and is formed inside each of the first and second cavities. A groove for penetrating the first ground pattern and the second ground pattern, a portion of the groove on a side where the first and second cavities face each other, and a gap between the first and second ground patterns. The side metallization is applied to the part opposite to the triplate line formed on the insulating substrate, and the side metallization is applied to the base metal and the outer peripheral side of each insulating substrate. Interference between them is suppressed.

In the microwave package according to the fourth aspect of the present invention, the size of each of the first and second cavities is made not more than 1/2 with respect to the wavelength of the operating frequency, so that the cutoff frequency of the waveguide mode is reduced. And the maximum operating frequency increases.

In the microwave package according to the fifth aspect of the present invention, since the first and second cavities are displaced in the longitudinal direction of the microwave package main body, the width of the microwave package can be shortened. .

In the microwave package according to the present invention, the power supply / control signal external terminal and the microwave terminal are provided on the same surface at one end in the longitudinal direction of the microwave package body. The microwave packages can be arranged efficiently.

In the microwave package according to the present invention, since the microwave signal ground pattern and the base metal are connected by the side metallization pattern in the input / output section provided with the microwave terminal, the impedance of the input / output section is reduced. The alignment is improved.

In the microwave package according to the present invention, since the microwave signal ground pattern and the base metal are connected to each other by the side through holes in the input / output section provided with the microwave terminal, the impedance of the input / output section is reduced. The alignment is improved.

In the microwave package according to the ninth aspect of the present invention, since the microwave signal ground pattern and the base metal are connected via the via holes in the input / output section provided with the microwave terminal, the impedance matching state in the input / output section is provided. Is improved.

[0031]

[Embodiment 1] An embodiment of the present invention will be described below with reference to the drawings. In FIGS. 1A to 1C, reference numeral 20 denotes a base metal, 21, 21,..., Each a ceramic substrate, which is laminated on the upper surface of the base metal 20 and connected by brazing or the like. Each of the cavities 22a and 22b is a cavity, and is configured independently.

Each of 23a and 23b has a cavity 22
a, 22b, a triplate line, 5 is a transmitting high power amplifier, 6 is a receiving low noise amplifier, 7a, 7b
Are transmission / reception switching circuits. Each of the microwave terminals 8a and 8b is a microwave terminal. The microwave terminal 8a is provided at the left end of the ceramic substrate 21 in the drawing.
Is provided at the right end of the substrate 21 in the drawing.

Each of power supply / control signal external terminals 24a to 24f is provided along with the microwave terminal 8b at the right end of the drawing in the width direction. 25a to 25f are power / control signal internal terminals.
The internal power supply and control external terminals 24a to 24f are connected to each other by internal wiring provided between the stacks.

Reference numeral 26 denotes a side wall of the cavity that forms the cavities 22a and 22b. This cavity side wall 26
Are formed of ceramic substrates 21 stacked as shown in FIG.
a and 23b are patterned. 27,27, ...
Are inside the cavity side wall 26 and the outer periphery of the cavity portions 22a, 22b and the triplate lines 23a, 23a.
3b are through holes formed on both sides.

FIG. 3 is a cross-sectional view showing a portion where the through hole 27 is formed.
The ground patterns Gp ₁ and Gp ₂ formed on the ceramic substrates 21 and 21 with (or 23 b) therebetween are short-circuited by the through holes 27.

The upper and lower ground patterns Gp ₁ and Gp ₂ are short-circuited by the through holes 27, 27,.
a, 22b can be suppressed. That is, if the distance between the through holes 27, 27,... Is sufficiently smaller than the wavelength of the used frequency of the microwave, the section can be regarded as a microwave-continuous section, so that the shield is provided.

The spacing between the through holes 27, 27,... May be about 程度 of the wavelength of the working frequency, and does not necessarily have to be constant.

Returning to FIG. 1, each of the microstrip lines 28a and 28b is a microstrip line, of which the microstrip line 28a connects the triplate line 23a to the reception low noise amplifier circuit 6, and the microstrip line 28b is a triplate line. The line 23b is connected to the transmission high power amplifier circuit 5. In this case, the microstrip line 28a (2
8b) and the triplate line 23a (23b) are formed by a pattern formed on the same surface of the ceramic substrate 21 as shown in FIG.

A cover 29 covers the cavities 22a and 22b. The cover 29 is shown only in the sectional view of FIG.

The present microwave package includes a cavity side wall 26, triplate lines 23a and 23b, microwave terminals 8a and 8b, and power / control signal external terminals 24a to 24.
f, power / control signal internal terminals 25a to 25f, microstrip lines 28a and 28b, and through hole 2
, 27,... Are replaced by a plurality of ceramic substrates 21, 21,.
And a metallized pattern formed on the inner layer and the surface layer.

The independent cavities 22a, 22
2b, the transmission high power amplifier circuit 5 and the transmission / reception switching circuit 7a are mounted in the cavity 22a.
2b includes a reception low noise amplifier circuit 6 and a transmission / reception switching circuit 7b.
Is implemented.

The transmission high power amplifier circuit 5 and the transmission / reception switching circuit 7a mounted on the cavity 22a and the power / control signal internal terminals 25d, 25e and 25f, the microwave terminal 8a and the microstrip line 28b are connected by wire bonding or the like. And a reception low-noise amplification circuit 6 and a transmission / reception switching circuit 7b similarly mounted in the cavity 22b.
Power / control signal internal terminals 25a, 25b, 25c,
Microwave terminal 8b and microstrip line 28
a is connected by a wire bond or the like.

The power / control signal internal terminals 25a-2
5f is connected to the power / control signal external terminals 24a to 24f via the internal wiring of the ceramic substrate 21. on the other hand,
The width L of the cavities 22a and 22b in the width direction is formed so as to be 波長 wavelength or less with respect to the maximum use frequency. In this case, the model of the structure of the cavity is shown in FIG.
, The cutoff frequency of the waveguide mode (λ
g) has a relationship of λg = 2a, so that the cut-off frequency λg can be increased by reducing the width a of the cavity. Therefore, it is possible to increase the maximum use frequency.

The ceramic substrates 21, 21,... Correspond to insulating substrates. The transmission high power amplifier 5 corresponds to a transmission circuit, and the reception low noise amplifier 6 corresponds to a reception circuit. The transmission / reception switching circuits 7a and 7b may be included in these transmission circuits and reception circuits. The cavities 22a and 22b correspond to the first and second cavities. Further, the ground patterns Gp ₁ ,
Gp ₂ corresponds to the first and second ground patterns.

Next, the operation will be described. FIG. 6 is a block diagram of the microwave package having the above configuration, and this figure shows a transmission state. First, the transmission high power amplifier circuit 5
, And then a control signal for switching the contacts is supplied to the transmission / reception switching circuits 7a and 7b. As a result, the contact positions of the transmission / reception switching circuits 7a and 7b become as shown in FIG.

After these processes are performed, a transmission microwave signal is supplied to the microwave terminal 8b and the transmission / reception switching circuit 7b mounted on the cavity 22b, the triplate line 23b, and the microstrip in the cavity 22a. The signal sequentially passes through the line 28a and is input to the transmission high power amplifier circuit 5. And after the high power amplification here,
The signal passes through the transmission / reception switching circuit 7a and is output from the microwave terminal 8a.

Next, the operation in the receiving state will be described. First, power is supplied to the reception low noise amplifier circuit 6,
Next, a control signal for switching the contacts is supplied to the transmission / reception switching circuits 7a and 7b. Thereby, the transmission / reception switching circuit 7
The contact positions of a and 7b are in a state opposite to the state shown in FIG.

After these processes are performed, the reception microwave signal supplied to the microwave terminal 8a is sequentially transmitted through the transmission / reception switching circuit 7a, the triplate line 23a, and the microstrip line 28a mounted on the cavity 22a. Input to the reception low noise amplifier circuit 6. Then, after the low noise amplification is performed, the signal passes through the transmission / reception switching circuit 7b and is output from the microwave terminal 8b.

As described above, in this embodiment, the cavities 22a and 22b are made independent from each other, and they are displaced in the longitudinal direction of the microwave package body.
The microwave terminals 8a and 8b and the power / control signal external terminals 24a to 24f are provided on the same surface at both ends in the longitudinal direction of the microwave package body. Also, the cavity 2
The through holes 27, 27,... Are formed on the cavity side walls 26 on the outer peripheral portions of 2a and 22b at intervals sufficiently smaller than the wavelength of the working frequency of the microwave.

Also, the triplate lines 23a and 23b are built in the cavity side wall 26, and the through holes 27, 27, and 27 are formed along both sides of these lines at intervals sufficiently smaller than the wavelength of the working frequency of the microwave. ... was formed. Furthermore, the width L of the cavity portions 22a and 22b in the width direction is set to 以下 or less of the wavelength of the working frequency of the microwave so as to increase the cutoff frequency.

Therefore, interference between the circuits is reduced, the resonance frequency in the waveguide mode is increased, and good microwave characteristics can be obtained over a high band.
Further, since the shape can be elongated, the occupied area when a number of packages are arranged and used in the width direction can be minimized.

Embodiment 2 FIG. Next, FIG. 7 is a configuration diagram of a microwave package according to another embodiment of the present invention. In this figure, the same parts as those in FIG. 1 described above are denoted by the same reference numerals.

In this embodiment, a part of the through hole 27 is replaced by grooves 34a, 34b formed along the inside of the cavities 22a, 22b and side metallizations 35a, 35b.
And through holes 2 provided on both sides of the triplate lines 23a and 23b.
.., 27,...

As shown in FIG. 8, the groove portions 34a (34b) penetrate between the upper and lower ground patterns Gp ₁ and Gp ₂ of the triplate line 23a (23b) and are metallized. In this case, the ground pattern Gp
Metallization is applied to short-circuit between ₁ and Gp ₂ .

Each of the side metallizations 35a and 35b short-circuits the ground patterns Gp ₁ and Gp ₂ as shown in FIG. By providing the grooves 34a, 34b and the side metallizations 35a, 35b, the through hole 2 is formed.
The shielding effect can be obtained as in the case where 7, 27,... Are provided.

Embodiment 3 FIG. Next, FIG. 9 is a configuration diagram of a microwave package according to another embodiment of the present invention. In this embodiment, the same parts as those in FIG. 1 are denoted by the same reference numerals.

In this embodiment, the cavities are further made independent, the cavities 22a for the transmission high power amplifier 5, the cavities 22b for the reception low noise amplifier 6, the transmission / reception switching circuit 7a 22c to the transmission / reception switching circuit 7b.
d was provided.

The interference between the cavities 22a to 22d is caused by the ground pattern Gp as in the first embodiment.
_1, a through hole between the Gp ₂ 27, 27, it is short-circuited to ..., thereby preventing by shielding.

Embodiment 4 FIG. Next, FIG. 10 is a configuration diagram of a microwave package according to another embodiment of the present invention. In this embodiment, a transmission / reception module is configured by using two of the micro packages of any of the first to third embodiments. Two microwave packages are mounted on the module case 40, and each of the microwave terminals 8a Are connected to microwave connectors 41a and 41b, and each microwave terminal 8b
Are connected to the distributor 42.

In the figure, reference numeral 43 denotes a power / control signal connector, and each terminal is connected via a distributor 42 to external power / control signal terminals 24a to 24f of each microwave package.
It is connected to the.

Embodiment 5 FIG. 11A and 11B show an input / output unit of a microwave package according to another embodiment of the present invention. FIG. 11A is a perspective view, FIG. 11B is a pattern diagram of a microwave signal ground layer, and FIG. FIG. 3C is a pattern diagram of the DC signal layer. It should be noted that FIG.
The same reference numerals are given to the parts common to. In addition, as shown in the figure, each ceramic substrate 21a, 21a
Reference numerals are assigned to b, 21c, and 21d.

In the drawing, each of 50a to 50f is a via hole, and external power / control signal terminals 24a to 24f
Signal patterns 51a to 51f of a DC signal layer 51 formed between the ceramic substrates 21c and 21d.
(See FIG. (C)). 52 is a microwave signal ground layer, which is a ceramic substrate 21b, 21c.
Is formed between. Reference numeral 52a denotes a microwave signal ground pattern of the microwave signal ground layer 52. Reference numeral 53 denotes a side metallization pattern, which establishes conduction between the microwave signal ground pattern 52a and the base metal 20 serving as a ground base.

[0063] Here, it described with reference to FIG. 12 the reasons for taking the conduction between the microwave signal ground pattern 52a and the base metal 20 is provided a side metalized pattern 53. If the microwave signal ground pattern 52a and the base metal 20 are not electrically connected at the input / output part, the electric field distribution viewed from the microwave terminal 8b is not shown.
The distribution is as shown by the arrow in FIG. This means that the microwave signal ground pattern 52a is not grounded at high frequencies. For this reason, the impedance changes in the input / output unit, a mismatch occurs, and the reflection increases.

Further, the DC signal patterns 51 a to 51 f of the DC signal layer 51 are
In the case where the microwave signal is located substantially immediately below 2a, the microwave signal may ride on the DC signal patterns 51a to 51f, and oscillation or resonance may occur.

Therefore, by establishing conduction between the microwave signal ground pattern 52a and the base metal 20 in the input / output section, the electric field distribution in the input / output section is shown in FIG.
As shown in FIG. As a result, impedance mismatch at the input / output unit does not occur , and reflection hardly occurs. Further, since the microwave signal does not leak into the DC signal layer 51, no oscillation or resonance occurs.

Embodiment 6 FIG. Next, FIG. 13 shows an input / output unit of a microwave package according to another embodiment of the present invention. FIG. 13 (a) is a perspective view, and FIG. 13 (b) is a pattern of a microwave signal ground layer. FIG. 3C is a pattern diagram of the DC signal layer. In this figure, the same parts as those in FIGS. 1 and 11 described above are denoted by the same reference numerals.

In this embodiment, the microwave signal ground pattern 52b and the base metal 20 are electrically connected by the side through holes 54, and the same operation and effect as those of the fifth embodiment are obtained.

Embodiment 7 FIG. 14A and 14B show an input / output unit of a microwave package according to another embodiment of the present invention. FIG. 14A is a perspective view, and FIG. 14B is a pattern of a microwave signal ground layer. FIG. 3C is a pattern diagram of the DC signal layer. In this figure, the same parts as those in FIGS. 1 and 12 described above are denoted by the same reference numerals.

In this embodiment, the microwave signal ground pattern 52a and the base metal 20 are connected to the microwave terminal 8
The conduction is achieved by the via holes 55a to 55c formed in the lower part of b, and the same operation and effect as those of the fifth and sixth embodiments are obtained.

Although the fifth to seventh embodiments have been described on the side of the micro terminal 8b, the same applies to the microwave terminal 8a.

[0071]

As described above, according to the first aspect of the present invention, at least the first and second cavities are divided into a transmission circuit and a reception circuit, and each of the first and second cavities is separated. Since a plurality of through holes are formed along the periphery to conduct the first and second ground patterns, interference between the transmission circuit and the reception circuit can be suppressed, and good microwave characteristics can be obtained. There is an effect that can be obtained.

According to the second aspect of the present invention, a plurality of through holes are formed along both sides of the triplate line so as to conduct the first and second ground patterns. There is an effect that the line can be shielded and good microwave characteristics can be obtained.

According to the third aspect of the present invention, the transmission circuit and the reception circuit are divided at least by the first and second cavities, and formed inside each of the first and second cavities. First ground pattern and second ground pattern
A groove through which the first and second cavities face each other;
In addition, side metallization is applied to a portion of the insulating substrate between the first and second ground patterns on the side facing the triplate line, and furthermore, the base metal and the side surface of the outer peripheral portion of each insulating substrate are provided. Since the configuration is such that the side metallization is performed, the same effect as the first aspect of the invention can be obtained.

According to the fourth aspect of the present invention, the cut-off frequency of the waveguide mode is increased by setting each dimension of the first and second cavities to 以下 or less with respect to the wavelength of the operating frequency. As a result, the maximum usable frequency can be increased, and the microwave characteristics can be obtained over a wide band.

According to the fifth aspect of the present invention, since the first and second cavities are arranged so as to be shifted in the longitudinal direction of the microwave package main body, the first and second cavities are arranged in the width direction of the microwave package. There is an effect that the dimensions can be shortened and a plurality of microwave packages can be arranged with a small occupation area.

According to the sixth aspect of the present invention, the power supply / control signal external terminal and the microwave terminal are provided on the same surface at one end in the longitudinal direction of the microwave package body. Therefore, there is an effect that the arrangement of a plurality of microwave packages can be facilitated.

According to the seventh aspect of the present invention, since the microwave signal ground pattern and the base metal are connected by the side metallization pattern in the input / output section provided with the microwave terminal, There is an effect that impedance matching in the section is achieved and reflection at the input / output section can be prevented. Further, since the microwave signal does not leak into the DC signal layer, there is an effect that oscillation or resonance can be prevented.

According to the eighth aspect of the present invention, the microwave signal ground pattern and the base metal are connected to each other by the side through holes in the input / output section provided with the microwave terminal. There is an effect similar to that of the invention described in Item 7.

According to the ninth aspect of the present invention, the microwave signal ground pattern is connected to the base metal by the via hole in the input / output section provided with the microwave terminal. The present invention has the same effect as the invention.

[Brief description of the drawings]

FIG. 1 is a configuration diagram of a microwave package according to an embodiment of the present invention.

FIG. 2 is an explanatory diagram of a part of a configuration of a microwave package according to one embodiment of the present invention;

FIG. 3 is an explanatory diagram of a part of a configuration of a microwave package according to one embodiment of the present invention;

FIG. 4 is an explanatory diagram of a part of a configuration of a microwave package according to one embodiment of the present invention;

FIG. 5 is an explanatory diagram of a cut-off frequency of a microwave package according to an embodiment of the present invention.

FIG. 6 is a block diagram of a microwave package according to an embodiment of the present invention.

FIG. 7 is a configuration diagram of a microwave package according to another embodiment of the present invention.

FIG. 8 is an explanatory view of a part of a configuration of a microwave package according to another embodiment of the present invention.

FIG. 9 is a configuration diagram of a microwave package according to another embodiment of the present invention.

FIG. 10 is a configuration diagram of a module configured by using a plurality of microwave packages according to an embodiment of the present invention.

FIG. 11 is a configuration diagram of an input / output unit of a microwave package according to another embodiment of the present invention.

FIG. 12 is an explanatory diagram of an electric field distribution in an input / output unit of a microwave package according to another embodiment of the present invention.

FIG. 13 is a configuration diagram of an input / output unit of a microwave package according to another embodiment of the present invention.

FIG. 14 is a configuration diagram of an input / output unit of a microwave package according to another embodiment of the present invention.

FIG. 15 is a configuration diagram of a conventional microwave package.

[Explanation of symbols]

Reference Signs List 5 transmission high power amplification circuit (transmission circuit) 6 reception low noise amplification circuit (reception circuit) 8a, 8b microwave terminal 20 base metal 21 ceramic substrate (insulating substrate) 21a to 21d ceramic substrate (insulating substrate) 22a, 22b Cavities (first and second cavities) 22c, 22d Cavities 23a, 23b Triplate lines 24a to 24f Power / control signal external terminals 26 Cavity side walls 27, 27 ... Through holes 28a, 28b Microstrip lines 34a, 34b groove Gp _1, Gp ₂ ground pattern (first, second ground pattern) 51 a to 51 f DC signal pattern 52a~52c microwave signal ground pattern 53 side metallization pattern 54 side through hole 55a~55c hole

Continuation of the front page (58) Field surveyed (Int.Cl. ⁶ , DB name) H01L 23 / 12,25 / 00 H01P 3 / 08,5 / 08

Claims (9)

(57) [Claims] 1. A plurality of insulating substrates laminated on an upper surface of a base metal, and first and second cavities formed by each of the insulating substrates and separately mounting at least a transmitting circuit and a receiving circuit. First and second ground patterns formed on at least two of the insulating substrates inside the side walls of each of the first and second cavities; and the first and second cavities. wavelength distance used frequency of the microwave along the periphery of each 1
And a plurality of through holes formed at an interval of / 8 or less and short-circuiting the first and second ground patterns. 2. A tri-plate line formed on the insulating substrate between the first and second ground patterns at an interval of 間隔 or less of a wavelength distance of a working frequency of a microwave along both sides of the tri-plate line. 2. The microwave package according to claim 1, wherein a plurality of through-holes are provided for conducting the first and second ground patterns. 3. A plurality of insulating substrates laminated on an upper surface of a base metal, and first and second cavities formed by each of the insulating substrates and separately mounting at least a transmitting circuit and a receiving circuit. A first and a second ground pattern formed on at least two of the insulating substrates inside the cavity side walls of the first and the second cavity portions; The first and second cavities are formed inside each of the first and second cavities so that the first and second cavities penetrate therethrough.
A groove portion on the side facing the triplate line formed on the insulating substrate between the first and second ground patterns; And a side metallization pattern formed on a side surface of an outer peripheral portion of the base metal and each of the insulating substrates. 4. The apparatus according to claim 1, wherein a width dimension of each of said first and second cavities is set to 以下 or less with respect to a wavelength of a used frequency. The microwave package according to any of the above items. 5. The micro device according to claim 1, wherein the first and second cavities are arranged so as to be shifted in a length direction. Wave package. 6. A power supply / control signal external terminal for supplying a power supply and a control signal to each of the transmission circuit and the reception circuit, and a microwave signal input / output to the transmission circuit and the reception circuit. And a microwave terminal for performing the same is provided on the same surface at one end in the longitudinal direction of the microwave package body. The microwave package according to claim 5. 7. A base metal, and a DC signal pattern and a microwave signal ground pattern are sequentially formed upward from the base metal and stacked on the one surface of the base metal, and the microwave signal ground is formed. A microwave package including a plurality of insulating substrates on which microwave terminals for microwave signal input / output are formed in a pattern above the pattern, wherein the microwave signal ground pattern is provided on an input / output unit provided with the microwave terminals. A side surface metallization pattern for conducting between the base metal and the base metal is formed. 8. A base metal, and a DC signal pattern and a microwave signal ground pattern are sequentially formed upward from the base metal, and the microwave signal ground is formed on the base metal. A microwave package including a plurality of insulating substrates on which microwave terminals for microwave signal input / output are formed in a pattern above the pattern, wherein the microwave signal ground pattern is provided on an input / output unit provided with the microwave terminals. A side surface through-hole for electrically connecting the base metal to the base metal. 9. A base metal, and a DC signal pattern and a microwave signal ground pattern are sequentially formed upward from the base metal and stacked on the one surface of the base metal, and the microwave signal ground is formed. A microwave package including a plurality of insulating substrates on which microwave terminals for microwave signal input / output are formed in a pattern above the pattern, wherein the microwave signal ground pattern is provided on an input / output unit provided with the microwave terminals. A via hole for electrically connecting the base metal to the base metal.