JP2875899B2 - Mounting method of processing jig for core slider for thin film magnetic head - Google Patents

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a method of attaching a processing jig to a core slider for a thin film magnetic head (hereinafter referred to as a TFH core slider). The processing jig includes a block slider and a dummy slider of the TFH core slider. TFH which is supplied at the same time and is suitable for positioning and bonding both with high precision
The present invention relates to a method of attaching a processing jig to a core slider.

[0002]

2. Description of the Related Art A TFH core slider is cut into a block slider shape from a wafer substrate, temporarily fixed to a high-precision jig for processing (hereinafter referred to as a common jig) with wax, and then sequentially ground, grooved, and wrapped. Processing such as processing is performed. Since the THF core slider is ultra-precision-processed in a state of being bonded to a common jig by wax, uniformity of a wax coating film thickness, bonding with little distortion during solidification, high-strength bonding that can withstand the processing step, and the like are required. .

In the prior art, since a large number of block sliders are cut out from a wafer substrate, an orientation flat portion of the wafer remains on one side surface of the block slider cut out from the upper and lower portions of the wafer, forming a tape edge. . FIG. 5 shows the difference in the side surface shape of the block sliders 2 and 3 of the TFH core slider due to the cutting position from the wafer 1. In FIG. 5, the shape of one side surface of the block sliders 2 and 3 cut out from the four corners of the wafer 1 is a block slider 2 having a downward tapered edge shape and a block slider 3 having an upward tapered edge shape according to the position. FIG. 6 shows a state in which the block slider 4 and the dummy slider 5 of the TFH core slider are bonded to the common jig 6. FIG. 7 shows a TFH core slider 7.
FIG.

Further, in the prior art, hot melt type wax is frequently used for bonding a THF core slider,
The work relies on manual work. The contents of the manual work are as follows. That is, the block slider is placed on a common jig in a heated state to which liquid wax has been applied, a scrub operation is performed, and after positioning, a dummy slider is attached beside the block slider, and then gradually cooled on a cooling platen. It is carried out.

[0005] In the above prior art, those related to a method of bonding a thin film element to a wax include, for example, Japanese Unexamined Patent Publication No.
There is an invention disclosed in JP-A-191309.

[0006]

In the above prior art, in order to maximize the number of block sliders from one wafer substrate, when the block slider is cut from the wafer substrate, the uppermost and lowermost portions of the wafer substrate are cut. At, the core slider with the orientation flat taper is cut out in a block shape. Therefore, if the dummy slider is combined with a block slider having a tapered edge shape, the dummy slider and the block slider may be misaligned even if they are manually adjusted, and as a result, the dummy slider may move on the common jig. Dive underneath,
For example, the positioning accuracy may be degraded by riding on the block slider. Therefore, in a manual operation, it is difficult to combine and attach the dummy slider and the block slider on the common jig at the same time, and there is a problem that the mechanization is very difficult for the above-mentioned reason.

In the conventional manual method, hot melt type wax is used, so that the operation is carried out at a high temperature, and there is a problem in safety. Furthermore, due to manual work, there are variations in the positioning accuracy of adhesion of the dummy slider and the block slider on the common jig, variations in the thickness of the applied wax film, and variations in the adhesive strength. Therefore, there is a problem in that the processing accuracy of the block slider is degraded, which adversely affects the product quality, and that the grinding wheel of the grinding machine may be damaged.

A first object of the present invention is to mechanize the work of adhering a core slider and a dummy slider to a common jig, which has conventionally been performed manually, and to use a block-shaped core slider and a dummy core slider which are difficult to perform manually. It is another object of the present invention to provide a method of attaching a processing jig to a core slider for a thin film magnetic head which can be positioned and adhered to a prescribed position at the same time.

A second object of the present invention is to fabricate a core slider for a thin-film magnetic head capable of simultaneously positioning and bonding a block slider and a dummy slider each having a tapered edge on one side to a predetermined position with high precision. It is an object of the present invention to provide a jig mounting method.

[0010]

According to the present invention, there is provided a method of attaching a processing jig to a core slider for a thin film magnetic head, comprising the steps of: positioning a dummy slider and a block slider; and bonding the dummy slider and the block slider to the processing jig. The method is applied to a method of mounting a jig for processing a slider, in which a dummy slider is moved in a height direction, and a side surface of a dummy slider is brought into contact with a side surface of a block slider. The positional relationship is determined, and while maintaining the determined positional relationship between the dummy slider and the block slider, the dummy slider and the block slider are transferred onto a processing jig which is in an overheated state on which wax has been stamped, and After positioning the dummy slider and block slider on the processing jig while maintaining the positional relationship between them, It is characterized by bonding the Suraida and blocks the slider in a common jig.

[0011]

According to the present invention, the side surface of the dummy slider is brought into contact with the side surface of the block slider, and in this state, the positional relationship between the dummy slider and the block slider is determined. Therefore, even in the case where the side surface of one side of the block slider has a tapered edge, it is possible to prevent a situation in which the dummy slider goes under the block slider. In addition, the block slider and the dummy slider can be positioned and adhered with high precision because they are transferred onto the processing jig and positioned and quenched while maintaining the predetermined positional relationship.

[0012]

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS The present invention will be described in more detail with reference to the embodiments shown in the accompanying drawings. FIG. 1 to FIG. 3 are diagrams showing the relationship between the dummy slider 5 and the block slider 4 on the alignment jig 16 in the process prior to the positioning and bonding.
Is a top view and FIGS. 2 and 3 are side views.

FIG. 4 shows an air pipe 8, a scrub shaft 9, a scrub shaft holder 10, a spring 11, a scrub pad 12, an X-direction positioning pin 13a, and a Y-direction positioning pin 13b of the positioning unit of the bonding apparatus according to the present embodiment. , A positioning reference piece 14 and a positioning table 15 are shown.

Next, the operation of one embodiment of the present invention will be described. FIG. 1 shows a dummy slider 5 on an alignment jig 16.
FIG. 1 shows a step pin 17 for adjusting the height of an air cylinder, an air cylinder 18 pressing the step pin 17, an air cylinder 20 pressing the lateral pressing pin 19, and a fixing pin 21. The step pin 17 is divided into two steps, a part higher than the height of the block slider 4 and a part lower than the height of the block slider 4 on the step pin alignment jig 16.
By pressing 7, the horizontal direction of the dummy slider 5 and the block slider 4 is aligned by the fixing pin 21.

FIG. 2 is a side view showing the relationship between the dummy slider 5 and the block slider 2 whose tapered edge portion on the side faces downward. Since the step pins 17 are lower than the height of the upper surface of the positioning jig 16, the dummy slider 5 is lower than the height of the block slider 2. When the lateral push pin 19 presses the dummy slider 5 against the block slider 2, the center of the side surface of the dummy slider 5 is aligned with the tapered edge of the side surface of the block slider 2. Therefore, it is possible to prevent the dummy slider 5 from climbing over the block slider 2.

FIG. 3 is a side view showing the relationship between the dummy slider 5 and the block slider 3 having a tapered edge portion facing upward. Since the step pins 17 are higher than the height of the upper surface of the alignment jig 16, the dummy slider 5 is higher than the block slider 3. When the lateral push pin 19 presses the dummy slider 5 against the block slider 3, the center of the side surface of the dummy slider 5 is aligned with the tapered edge of the side surface of the block slider 3. Therefore, it is possible to prevent the dummy slider 5 from getting under the block slider 3.

Next, the operation of the bonding apparatus shown in FIG. 4 will be described. The scrub pad 12 shown in FIG. 4 sucks up the block slider 4 and the dummy slider 5 by vacuum suction from the air pipe 8 in a state where the positional relationship on the alignment jig 16 in the previous process is preserved. To the surface of the common jig 6 in the overheated state. Liquid wax is uniformly applied to the surface of the common jig 6. After the transfer, the block slider 4 and the dummy slider 5 are scrubbed by receiving the operation of the scrub shaft 9 and the scrub shaft holding portion 10 in the X direction while applying pressure downward in the vertical direction by the spring 11. Next, the positioning reference piece 14 moves forward in the Y direction, and is moved toward the positioning reference piece 14 because the block slider 4 and the dummy slider 5 are held by the scrub pad 12. Accurate positioning is performed by the pressing force of the positioning pin 13b. Thereafter, the wax is solidified by rapid cooling by air while the positioning accuracy between the block slider 4 and the dummy slider 5 is maintained, and the bonding between the block slider 4 and the dummy slider 5 is completed. In order to remove distortion generated in the block slider 4 due to shrinkage of the wax due to rapid cooling, aging may be performed in a constant temperature bath after bonding.

As is apparent from the above description, according to the above embodiment, the side surface of the tapered edge block slider cut out from the upper or lower part of the wafer substrate and the side surface of the dummy slider block the side surface of the dummy slider. When pressing the slider against the side and aligning it, align the height of the dummy slider with the tapered edge so that the side of the dummy slider is in contact with the tip of the tapered edge of the block slider. Therefore, the dummy slider can be surely aligned without getting under the block slider.

Further, according to the above embodiment, after positioning the block slider and the dummy slider on the alignment jig, the two are simultaneously sucked by the scrub pad while the wax is stamped and the common state of the heating state is applied. Conveyed to the surface of the jig, scrub both in the left and right direction simultaneously while holding the dummy slider and block slider with the scrub pad, then position them in the predetermined position, and then blast the cold and hot air at the same time to quickly cool the wax. By hardening, it is possible to effectively prevent displacement during bonding due to external factors such as vibration.

[0020]

According to the present invention, the block slider and the dummy slider can be automatically positioned and adhered to the processing jig in the manufacturing process of the THF core slider with high precision, so that the productivity is greatly improved and the quality is stabilized. Can be achieved.

[Brief description of the drawings]

FIG. 1 is a top view showing the relationship between a dummy slider and a block slider on a positioning jig.

FIG. 2 is a side view showing a relationship between a dummy slider and a block slider on a positioning jig.

FIG. 3 is a side view showing a relationship between a dummy slider and a block slider on a positioning jig.

FIG. 4 is a perspective view showing details of a positioning unit in the bonding device for the dummy slider and the block slider according to the embodiment.

FIG. 5 is an explanatory diagram showing a difference in a side surface shape of a block slider due to a cutting position from a wafer.

FIG. 6 is an explanatory view showing a state in which a block slider and a dummy slider of the TFH core slider are bonded on a common jig.

7 is a perspective view of the TFH core slider 7. FIG.

[Explanation of symbols]

 DESCRIPTION OF SYMBOLS 1 Wafer 2 Block slider 3 Block slider 4 Block slider 5 Dummy slider 6 Common jig 7 THF core slider 8 Air piping 9 Scrub shaft 10 Scrub shaft holding part 11 Spring 12 Scrub pad 13a X direction positioning pin 13b Y direction positioning pin 14 Positioning Reference piece 15 Positioning table 16 Positioning jig 17 Step pin 18 Air cylinder 19 Side push pin 20 Air cylinder 21 Fixing pin

Continuation of the front page (72) Inventor Tadao Miyagawa 2880 Kozu, Odawara-shi, Kanagawa Hitachi, Ltd. Odawara Plant (56) References JP-A-63-191309 (JP, A) (58) Fields investigated (Int .Cl. ⁶ , DB name) G11B 5/60 G11B 21/21 101

Claims (1)

(57) [Claims] In a method of mounting a processing jig of a core slider for a thin film magnetic head which positions a dummy slider and a block slider and is adhered to the processing jig, the dummy slider is moved in a height direction thereof, The side surface of the slider and the side surface of the block slider were brought into contact with each other. In this state, the positional relationship between the dummy slider and the block slider was determined, and the wax was stamp-applied while maintaining the determined positional relationship between the dummy slider and the block slider. The dummy slider and the block slider are transferred onto the processing jig in an overheated state, and positioned on the processing jig while maintaining the predetermined positional relationship between the dummy slider and the block slider, and then rapidly cooled. A core for a thin film magnetic head, wherein a dummy slider and a block slider are bonded to a common jig. Working jig mounting method Ida.