JP2857586B2 - Manufacturing method of green sheet laminated structure - Google Patents

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a ceramic green laminated structure and a method for manufacturing a ceramic multilayer circuit board.
More specifically, the present invention relates to a method of manufacturing a ceramic green sheet laminated structure having a resin film support and excellent dimensional change characteristics, and a method of manufacturing a high-precision, high-density ceramic multilayer circuit board using the same.

[0002]

2. Description of the Related Art When a conductor dielectric or the like is printed on a green sheet and dried, the green sheet shrinks by about 0.1 to 0.3%. Due to shrinkage, for example, the pattern of the lower layer and the pattern of the upper layer are displaced when printing and laminating, and when laminating green sheets, the positions of the guide holes and the guide pins do not match, causing lamination displacement. FIG. 4 shows that when the lower layer pattern 7 is printed and dried on the green sheet 3 having the guide holes 4, the upper layer pattern 8 printed thereon is misaligned with the lower layer pattern 7 because the green sheet contracts. Is generated. FIG. 5 shows that when the green sheet 3 having the guide holes is laminated on the laminating jig 8 having the guide pins 9 in all directions by aligning the guide pins 9 with the guide holes, the green sheet shrinks due to printing and drying, and the guide is formed. The position of the pin 9 does not match the position of the guide hole, and the guide hole is deformed as a result of forcible insertion into the guide pin. Is shown. Therefore, a green sheet which has been preliminarily heated to release and shrink the stress at the time of forming the green sheet has been used. However, even in this case, the shrinkage after printing and drying is 0.05 to
There was about 0.1%, which was insufficient.

As another method, there is a method of attaching a green sheet to a metal frame and fixing it. However, although shrinkage can be prevented, it is difficult in terms of cost in view of the cost of producing the frame and the cost of removing the adhesive from the collection frame. FIG. 6 shows a plan view and a cross-sectional view in which the green sheet 3 is attached and fixed to the metal frame 10 using the adhesive 11. On the other hand, in a process of manufacturing a ceramic circuit board by a green sheet method, a green sheet is formed on a film of polyester or the like, and the green sheet is provided for a subsequent step. In this method, a relatively inexpensive and heat-resistant film such as polyester is stuck on the green sheet. However, thermal shrinkage is about 0.1 to 0.2% due to the stress of the film itself, which solves the above problem. Is not effective. In this case, if a film having a high glass transition temperature such as polyphenylene sulfide is used instead of the polyester film, the shrinkage can be suppressed to about 0.05%. However, these heat-resistant films are generally expensive, and the It costs 10 times the material cost and is not realistic.

[0004]

SUMMARY OF THE INVENTION The present invention provides a high precision and high precision by using an inexpensive resin film having a small heat shrinkage in a process of manufacturing a ceramic circuit board using a resin film as a support for a green sheet. An object of the present invention is to provide a method for manufacturing a green sheet laminated structure for manufacturing a ceramic circuit board having a high density.

[0005]

Means for Solving the Problems As a result of intensive studies, the present inventors have wound up a resin film serving as a support for a green sheet into a roll and heat-treated at a temperature above the glass transition point of the resin and below the melting point. The present inventors have found that the above problems can be solved by heat setting, and have reached the present invention. That is, the present invention includes the following (1) to (3). (1) a method for producing a ceramic green sheet laminated structure, wherein (i) a step of providing an adhesive layer on one side of a resin film and winding it into a roll to form a roll-shaped resin film; Heating the resin film at a temperature not lower than the glass transition point of the resin and not higher than the melting point to form a resin film support; (iii) attaching a green sheet on the adhesive layer of the resin film support to a predetermined size; (Iv) forming a ceramic green sheet laminate, and (iv) forming a hole in the ceramic green sheet laminate, printing a conductor, and drying the ceramic green sheet laminate. (2) A ceramic characterized in that a predetermined number of ceramic green sheets obtained by removing the resin film support from the ceramic green sheet laminated structure obtained by the method described in (1) are sequentially laminated, and then fired. A method for manufacturing a multilayer circuit board. (3) A ceramic characterized in that an insulating layer and a conductor are printed and dried a predetermined number of times on the ceramic green sheet laminated structure obtained by the method described in (1), and then the resin film is peeled off and fired. A method for manufacturing a printed laminated circuit board.

[0006] The resin film used as a support in the present invention is polyester (PEs), polyimide (PI), polyetheretherketone (PEEK), polyethersulfone (PES), polyphenylene sulfide (PP).
S), polyphenylene oxide (PPO), polyetherimide (PEI), and the like. Polyester is preferable in terms of price and versatility, and polyethylene terephthalate (PET) is particularly preferable. In the present invention, a resin film with an adhesive wound around a metal core and formed into a roll has a glass transition point or higher and a melting point of 3 to less.
Heat-fixed by heating for 24 hours is affixed to a green sheet to perform printing and drying. In the present invention, in particular, the reason why the resin film serving as a support is heat-set in a state of being wound up in a roll shape is, first, for example, that a polyester film having a glass transition point of 70 ° C. and a melting point of 240 ° C. After cutting into pieces, the stress can be removed by heating at 120 ° C. for 15 minutes to prevent the subsequent thermal shrinkage, but it is inconvenient because it cannot be handled repeatedly. Secondly, it is difficult to remove the stress due to the tension at the time of winding when heating in a roll for a short time, but in the case of heating for a long time, the crystallization of the polyester proceeds and the subsequent heat shrinkage should be reduced. It is considered that heat fixation is sufficient.

FIG. 1 shows a state in which a resin film with an adhesive layer is wound around an iron core 2 in a roll shape, and is heated and thermally fixed in this state. The heating temperature is the glass transition point (Tg) of the resin.
As described above, the heating is performed at a temperature equal to or lower than the melting point (Tm), and the heating time depends on the type and amount of the wound film.
The heat is sufficiently fixed in about 4 hours. FIG. 2 shows that the green sheet 3 cut and peeled from the green sheet wound up in a roll shape together with the film with the casting film is cut into a resin film 1 with an adhesive which is wound up in a roll shape and heat-fixed. The state of pasting is shown. The cutting of the resin film support in accordance with one green sheet may be performed before or after attaching the green sheet. FIG. 3 shows that a support 5 of the resin film with an adhesive layer obtained in FIG. 2 on which a green sheet 3 is attached is punched with a via 5 and a guide hole 4, and then the via is filled with a conductor. Then, a step of printing and drying a circuit pattern on the surface of the green sheet will be described. In the case of a single-layer ceramic circuit board, thereafter, the resin film support is peeled off and fired.

In the case of a multilayer circuit board, a green sheet laminated structure in which ceramic green sheets are provided on the adhesive layer of the resin film support obtained in FIG.
The resin film support is peeled off, sequentially laminated by a predetermined number, and fired. Alternatively, on a green sheet laminated structure in which ceramic green sheets are provided on the adhesive layer of the resin film support obtained in FIG.
A circuit pattern and an insulating layer composed of a resistor and a dielectric are printed and dried a predetermined number of times, and then fired. in this case,
The time when the resin film support is peeled off is preferably the time when printing and drying are completed. The ceramic circuit board of the present invention may be a single layer or a multilayer as long as ceramic is used as an insulator. In the case of a multilayer ceramic circuit board, a green sheet laminating method and a printing laminating method may be used.
Further, a circuit board having only one side of the board or a double-sided circuit board may be used. The ceramic material used in the present invention is not particularly limited, and examples thereof include alumina (Al ₂ O ₃ ), aluminum nitride (AlN), silicon carbide (SiC), and various ceramics containing these as main components. Further, a low-temperature fired ceramic in which glass powder is mixed with alumina ceramic can also be used. The conductor material used differs depending on the substrate material, and a high melting point metal such as molybdenum or tungsten is used for alumina and aluminum nitride. In the case of a substrate material that can be fired at a relatively low temperature, metals such as gold, silver, silver-palladium alloy, copper, and nickel are used.

[0009]

EXAMPLES The present invention will be described in more detail with reference to examples. A low-temperature fired ceramic will be described as an example, but the present invention is not limited to this. Example _{1 CaO-Al 2 O 3 -SiO} 2 -B 2 O 3 system was mixed with 60 wt% alumina 40 wt% glass, a binder, a plasticizer, a solvent is added, to make a slurry, a doctor blade conventional method A green sheet having a thickness of 0.2 mm was prepared by the method. On the other hand, an acrylic pressure-sensitive adhesive was applied to one side of a 50 μm-thick polyester (PET) film, dried, wound around an iron core and heated at 100 ° C. for 15 hours. As shown in Fig. 3, after cutting the green sheet and the pressure-sensitive adhesive PET film to a predetermined size, they are bonded together, drilled, printed with a conductor, dried at 80 ° C for 30 minutes, and measured for dimensional change. did. The pressure-sensitive adhesive had an adhesive strength of about 20 g / cm, and there was no adhesive residue on the green sheet after peeling from the green sheet.

Comparative Example 1 A green sheet was printed and dried without using a polyester support. Others were performed similarly to Example 1. Comparative Example 2 A green sheet cut to a predetermined size was heated at 100 ° C. for 3 hours without using a polyester support, and then printed and dried. Others were performed similarly to Example 1. Comparative Example 3 The same operation as in Example 1 was performed except that a polyethylene terephthalate (PET) film with an adhesive layer that had not been heat-treated was used. Table 1 shows the results of Examples and Comparative Examples.

[0011]

[Table 1]

[0012]

As described above, according to the present invention, shrinkage of printing and drying of a green sheet can be easily prevented at low cost, so that printing misalignment and laminating misalignment can be reduced. In this way, a green sheet having a low shrinkage rate can be obtained, and a high-precision, high-density ceramic circuit board can be manufactured.

[Brief description of the drawings]

FIG. 1 shows a resin film wound into a roll according to the present invention;

FIG. 2 shows a resin film support of the present invention and a cut green sheet;

FIG. 3 shows a green sheet processing step of the present invention;

FIG. 4 is a diagram showing a state of printing misalignment.

FIG. 5 is a diagram showing a state of lamination misalignment;

FIG. 6 shows a method using a frame.

[Explanation of symbols]

 Reference Signs List 1 resin film 2 iron core 3 green sheet 4 guide hole 5 via 6 conductive material

──────────────────────────────────────────────────続 き Continued on front page (58) Field surveyed (Int.Cl. ⁶ , DB name) H05K 3/46

Claims (3)

(57) [Claims] 1. A method for manufacturing a ceramic green sheet laminated structure, comprising: (1) providing an adhesive layer on one side of a resin film, winding the film into a roll, and forming a roll-shaped resin film; A step of heating the roll-shaped resin film at a temperature not lower than the glass transition point of the resin and not higher than the melting point to form a resin film support; (3) attaching a green sheet onto the adhesive layer of the resin film support, (4) A method for producing a ceramic green sheet laminate structure, comprising: a step of forming a hole in the ceramic green sheet laminate, printing a conductor, and drying the ceramic green sheet laminate. . 2. A method according to claim 1, wherein a predetermined number of ceramic green sheets obtained by removing the resin film support from the ceramic green sheet laminated structure obtained by the method according to claim 1 are sequentially laminated and then fired. Of manufacturing a ceramic multilayer circuit board. 3. After printing and drying an insulating layer and a conductor a predetermined number of times on the ceramic green sheet laminated structure obtained by the method according to claim 1, the resin film is peeled off.
A method for producing a ceramic printed laminated circuit board, characterized by firing.