JP2843084B2 - Processing condition setting device for laser processing - Google Patents

Description

DETAILED DESCRIPTION OF THE INVENTION [Object of the Invention] (Industrial application field) The present invention relates to a laser for setting a processing condition suitable for a program shape when cutting a product having a predetermined shape from a plate material by laser processing. The present invention relates to a processing condition setting device for processing.

(Prior Art) Conventionally, when cutting a product having a predetermined shape from a plate material by laser processing, first, a material and a thickness of the plate material are selected to be processed, and a predetermined material to be cut into the selected plate material is selected. The program shape is created by the program shape creating means. And
While looking at the actual program shape created by the program shape creating means, the operator has set actual machining conditions based on his experience and intuition.

Furthermore, a trial cutting is performed in advance based on the set processing conditions, and after the operator determines whether the set processing conditions are optimal, actual laser processing is performed.

(Problems to be Solved by the Invention) In the above-described conventional processing condition setting method, since the operator relies on his or her experience and intuition, it takes a great deal of time to set the optimum processing conditions. There was a problem that it took time. Therefore, it did not reach the point where the optimum processing conditions were automatically set.

SUMMARY OF THE INVENTION An object of the present invention is to improve the above-mentioned problems by using a laser processing method that enables the setting of optimum processing conditions easily, in a short time, and automatically without relying on the experience and intuition of an operator. Another object of the present invention is to provide a processing condition setting device.

[Constitution of the Invention] (Means for Solving the Problems) In view of the conventional problems as described above, the present invention provides cutting of laser processing from the material and thickness of a plate material input from an input device and necessary program data. A program shape creating means for creating a path and a program shape, a program shape / memory for temporarily storing an actual program shape created by the program shape creating means, and a plurality of difficulty shape patterns for determination are registered in advance. A difficulty shape pattern determination table, a shape determination means for comparing a program shape described in the program shape / memory with a difficulty shape pattern registered in the difficulty shape pattern determination table, and a plurality of difficulty levels. Each processing condition corresponding to the shape pattern and each corresponding to multiple ease shape patterns A processing condition table in which processing conditions are set, and a processing condition for difficulty shape pattern or a processing condition for ease shape pattern is output to an output device based on a result determined by the shape determination means. It is.

Hereinafter, embodiments of the present invention will be described in detail with reference to the drawings.

Referring to FIG. 1, a processing condition setting device 1 for laser processing includes an input device 3, a program shape creating means 5, an actual program shape / memory 7, a difficulty shape pattern determination table.
9, shape determination means 11, processing condition table 13 and output device 1
It is composed of 5 and so on.

That is, the input device 3 is composed of, for example, a keyboard, a paper tape reader, or the like, and is used for inputting a material, a thickness, and necessary program data of the plate material W. The input device 3 includes a program shape creating means 5.
The program shape creating means 5 cuts, for example, a laser machining cut as shown in FIG. 2 from the material and thickness of the plate material W input from the input device 3 and necessary program data. A route is created.

That is, in FIG. 2, starting from the start point Sp of the plate material W, the product G is first cut through the mountain shape A, the uneven shape B, and further through the small hole shape C and the slit shape D so that the product G is cut by laser processing. The cutting path and the program shape are created at the beginning.

An actual program shape / memory 7 is connected to the program shape creating means 5, and the actual program shape created by the program shape creating means 5, such as a mountain shape A, Shape B,
The small hole shape C and the slit shape D are temporarily stored.

The actual program shape / memory 7 and the difficulty shape pattern determination table 9 are connected to a shape determination unit 11. As shown in FIG. 3, the difficulty shape pattern determination table 9 includes, for example, a peak shape a, a concave-convex shape b, of a difficulty shape pattern for determination on a plate material W made of a material SPC and a plate thickness of 1.0 t.
The small hole shape c and the slit shape d are registered in advance.

In the shape determining means 11, an actual program shape stored in the actual program shape / memory 7
The difficulty shape pattern registered in the difficulty shape pattern determination table 9 is compared and determined.

A processing condition table 13 is connected to the shape determining means 11, and an output device 15 is connected to the processing condition table 13. In the processing condition table 13, for example, as shown in FIG. 4, the optimum processing conditions are searched for and set based on the result determined by the shape determination means 11, and the processing conditions such as CRT and paper tape punch are set. This is output to the output device 15. The optimum processing conditions output to the output device 15 are output and stored in, for example, an NC device for controlling the laser processing device, and used for actual laser processing.

Next, the operation of the processing condition setting method for laser processing will be described with reference to the flowchart shown in FIG. In FIG. 5, in step S1, the input device 3 inputs the material, thickness and necessary program data of the plate material W to the program shape creating means 5. In step S2, the machining shape as shown in FIG. 2 is programmed by the program shape creating means 5 and the program shape is obtained.

In step S3, the actual program shape created by the program shape creating means 5 and the difficulty shape pattern as shown in FIG. It is.
In step 4, the mountain shape A and the mountain shape a are compared. That is, if the angle α of the mountain shape is α ≦ 20 °, the mountain shape A is determined to be the difficulty shape pattern in step S5, and the processing condition for the difficulty shape pattern is obtained from the processing condition table 13 shown in FIG.
E ₁ is searched. If the angle α is not α ≦ 20 (α> 20 °) in step S4, the mountain shape A is determined to be the ease shape pattern in step S6, and the ease shape pattern processing is performed from the work table 13 shown in FIG. conditions E ₂ is searched.

Next, in step S7, the uneven shape B and the uneven shape b are compared. That is, if β is β ≦ t (β: convex width, t: plate thickness), the process proceeds to step S9, and if β is not β ≦ t (β>
t) In step S8, it is determined whether β / γ ≧ 1 (γ: concave width). If beta / gamma ≧ 1 enters before the step S9, the difficulty shape pattern for machining conditions E ₃ Rates irregularities B machining condition table 13 shown in FIG. 4 is determined to difficulty shape pattern in step S9 Is done. If β / γ ≧ 1 is not satisfied in step S8 (β / γ <1), the uneven shape B is determined to be an easy shape pattern in step S10, and the unevenness shape B is determined from the processing condition table 13 shown in FIG. processing conditions E ₄ are retrieved.

In step S11, the small hole shape C and the small hole c are compared.
That is, if 2r ≦ t (r: radius), the small hole shape C is determined to be a difficulty shape pattern in step S12, and the machining condition for the difficulty shape pattern is obtained from the machining condition table 13 shown in FIG.
E ₅ is searched. If 2r ≦ t is not satisfied in step S11 (2r
> T), eyelet shape C at step S13 Ekido shape pattern for machining conditions E ₆ from the processing condition table 13 shown in FIG. 4 is determined Ekido shape pattern is searched.

Next, in step S14, the slit shape D is compared with the slit shape d. That is, if P ≦ nt (P: slit width, n: coefficient), step 16; if not P ≦ nt (P> nt), at step S15, l ≧ nt (1: length of slit) Make a decision. Step if l ≧ nt
S16 in enters the front, difficulty shape pattern for machining conditions E ₇ from the processing condition table 13 shown in FIG. 4 slit D is it is determined that the difficulty shape pattern is retrieved in step S16. If l ≧ nt is not satisfied in step S15 (l <nt), the slit shape D is determined to be the easy shape pattern in step S17, and the easy shape pattern processing condition E ₈ is determined from the working condition table 13 shown in FIG. Is searched.

In step S18, steps 5, 6, 9, 10, 12, 13, 16, and 17
Outputs optimal processing conditions based on each shape retrieved by
The data is output to 15 and further transferred to, for example, an NC device of a laser processing apparatus, whereby actual laser processing is performed.

As can be seen from the above-described operation, the optimum processing conditions suitable for each shape can be set simply, in a short time, and automatically without depending on the experience and intuition of the operator.

The present invention is not limited to the above-described embodiment, but can be embodied in other modes by making appropriate changes. In the present embodiment, the chevron shape, the concavo-convex shape, the small hole shape, and the slit shape are described as the program shapes. However, any other complicated program shapes are more effective. Further, in the present embodiment, it is more effective to perform the determination of the difficulty shape pattern by the determination of a plurality of stages of three or more stages as described in the determination of the two stages based on either the difficulty or the ease.

[Effects of the Invention] As can be understood from the above description of the embodiments, the gist of the present invention is as described in the appended claims. Therefore, in the present invention, necessary data is input from the input device 3. When input to the program shape creating means 5, the program shape creating means 5 programs a cutting path for laser processing and creates a program shape. Then, the program shape and the difficulty shape pattern registered in advance in the difficulty shape pattern determination table 9 are compared by the shape determination means 11, and the corresponding difficulty shape pattern is determined from the processing condition table 13 determined as the difficulty shape pattern. The corresponding processing condition for the ease shape pattern is output to the output device 15 from the processing condition table 13 which is determined as the ease shape pattern.

Therefore, according to the present invention, appropriate machining conditions can be automatically set according to the program shape without depending on the experience and intuition of the operator.

[Brief description of the drawings]

FIG. 1 is a block diagram showing a configuration of a processing condition setting device for laser processing, FIG. 2 is an explanatory view of a program shape as a processing path of one embodiment created by a program shape creating means, and FIG.
FIG. 4 is a diagram showing an example of a difficulty shape pattern registered in advance in the difficulty shape pattern determination table. FIG. 4 is a diagram showing an example of optimum processing conditions suitable for each shape stored in the processing condition table. 5 is a flowchart illustrating an operation of a method for setting processing conditions by laser processing. 1 Processing condition setting device 3 Input device 5 Program shape creating means 7 Actual program shape and memory 9 Difficulty shape pattern determination table 11 Shape determination means 13 Processing Condition table 15 …… Output device

Claims (1)

(57) [Claims] 1. A plate material (W) inputted from an input device (3).
Program shape creating means (5) for creating a cutting path and a program shape for laser processing from the material, plate thickness, and necessary program data of the workpiece, and temporarily storing the actual program shape created by the program shape creating means (5). And a difficulty shape pattern determination table (9) in which a plurality of difficulty shape patterns for determination are registered in advance.
Shape determining means (11) for comparing a program shape described in a memory (7) with a difficulty shape pattern registered in the difficulty shape pattern determination table (9);
Each processing condition corresponding to a plurality of difficulty shape patterns and each processing condition corresponding to a plurality of ease shape patterns are set, and the shape determination means (11)
A processing condition table (13) for outputting the processing condition for the difficulty shape pattern or the processing condition for the ease shape pattern to the output device (15) based on the result determined in (1). Processing condition setting device.