JP2824281B2 - Method and apparatus for measuring insulation coating thickness of coated wire for bonding - Google Patents

Method and apparatus for measuring insulation coating thickness of coated wire for bonding

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Publication number
JP2824281B2
JP2824281B2 JP1180028A JP18002889A JP2824281B2 JP 2824281 B2 JP2824281 B2 JP 2824281B2 JP 1180028 A JP1180028 A JP 1180028A JP 18002889 A JP18002889 A JP 18002889A JP 2824281 B2 JP2824281 B2 JP 2824281B2
Authority
JP
Japan
Prior art keywords
wire
bonding
mercury
thickness
capacitor
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
JP1180028A
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Japanese (ja)
Other versions
JPH0344502A (en
Inventor
健一 栗原
祐人 伊賀
武彦 荏原
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Tanaka Denshi Kogyo KK
Original Assignee
Tanaka Denshi Kogyo KK
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Application filed by Tanaka Denshi Kogyo KK filed Critical Tanaka Denshi Kogyo KK
Priority to JP1180028A priority Critical patent/JP2824281B2/en
Publication of JPH0344502A publication Critical patent/JPH0344502A/en
Application granted granted Critical
Publication of JP2824281B2 publication Critical patent/JP2824281B2/en
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Expired - Lifetime legal-status Critical Current

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Description

【発明の詳細な説明】 [産業上の利用分野] 本発明は、ボンディング用被覆線の絶縁被覆膜厚測定
方法および装置に関する。
Description: TECHNICAL FIELD The present invention relates to a method and an apparatus for measuring the thickness of an insulation coating on a coated wire for bonding.

さらに詳しくは、金線の外周面に絶縁樹脂からなる絶
縁被覆膜を被覆したボンディング用被覆線における絶縁
被覆膜の膜厚を測定する方法の測定精度,測定効率等に
係る改良と、この方法を実施するに好適な装置とに関す
る。
More specifically, the method for measuring the film thickness of the insulating coating film on the bonding wire in which the outer peripheral surface of the gold wire is coated with the insulating coating film made of the insulating resin is improved with respect to the measurement accuracy and the measurement efficiency. An apparatus suitable for performing the method.

[従来の技術] 従来、ボンディング用被覆線の絶縁被覆膜厚測定方法
としては、例えば、ボンディング用被覆線を切断して顕
微鏡で測定する方法、マイクロメータでボンディング用
被覆線の外径を計測し金線の外径との差から算出測定す
る方法、ボンディング用被覆線の単位長の重量を計測し
金線の同単位長の重量との差から算出測定する方法が知
られている。
[Prior art] Conventionally, as a method of measuring the thickness of an insulation coating of a coated wire for bonding, for example, a method of cutting the coated wire for bonding and measuring it with a microscope, or measuring the outer diameter of the coated wire for bonding with a micrometer There are known a method of calculating and measuring the difference from the outer diameter of the gold wire, and a method of measuring the weight of a unit length of the covering wire for bonding and calculating and measuring the difference from the weight of the same length of the gold wire.

[発明が解決しようとする課題] 前述の従来のボンディング用被覆線の絶縁被覆膜厚測
定方法では、次のような問題点を有している。
[Problem to be Solved by the Invention] The above-mentioned conventional method for measuring the thickness of the insulating coating of the coated wire for bonding has the following problems.

即ち、顕微鏡を用いるものにあっては、ボンディング
用被覆線を切断するために測定に手間が掛り非効率的で
あり、絶縁被覆膜の膜厚が1μ以下では視覚的な測定が
困難になる。また、マイクロメータを用いるものにあっ
ては、通常直径30μ程度の極細のボンディング用被覆線
では変形しやすいため計測誤差が生ずる。また、単位長
の重量を計測するものにあっては、絶縁被覆膜の膜厚が
1μ程度の極薄のものでは測定精度が期待できない。
That is, in the case of using a microscope, the measurement is troublesome and inefficient in order to cut the covering wire for bonding, and visual measurement becomes difficult when the thickness of the insulating coating film is 1 μm or less. . Also, in the case of using a micrometer, a measurement error occurs because an extremely fine covered wire for bonding having a diameter of about 30 μ is easily deformed. In the case of measuring the weight per unit length, measurement accuracy cannot be expected if the thickness of the insulating coating film is as thin as about 1 μm.

本発明はこのような問題点を解決するためになされた
ものであり、その目的は、ボンディング用被覆線の絶縁
被覆膜の膜厚を極薄でも精度良く効率的に測定すること
のできるボンディング用被覆線の絶縁被覆膜厚測定方法
と、この方法を実施するに好適な装置とを提供すること
にある。
The present invention has been made in order to solve such problems, and an object of the present invention is to provide a bonding method capable of accurately and efficiently measuring the thickness of an insulating coating film of a coating wire for bonding even if the thickness is extremely thin. An object of the present invention is to provide a method for measuring the thickness of an insulation coating on a coated wire for use and an apparatus suitable for carrying out the method.

[課題を解決するための手段] 前述の目的を達成するため、本発明に係るボンディン
グ用被覆線の絶縁被覆膜厚測定方法は、金線の外周面に
絶縁被覆膜を被覆してなるボンディング用被覆線を水銀
に沈漬して、ボンディング用被覆線の金線側と水銀側と
の間にボンディング用被覆線の絶縁被覆膜が介装された
構造のコンデンサを形成し、このコンデンサ容量を検出
することによりボンディング用被覆線の絶縁被覆膜の膜
厚を算出測定することを特徴とする手段を採用する。
[Means for Solving the Problems] In order to achieve the above-mentioned object, a method for measuring the thickness of an insulating coating of a coated wire for bonding according to the present invention comprises coating an outer peripheral surface of a gold wire with an insulating coating. The covering wire for bonding is immersed in mercury to form a capacitor having a structure in which an insulating coating film of the covering wire for bonding is interposed between the gold wire side and the mercury side of the covering wire for bonding. Means is adopted in which the thickness of the insulating coating film of the coating wire for bonding is calculated and measured by detecting the capacitance.

また、本発明に係るボンディング用被覆線の絶縁被覆
膜厚測定装置は、金線の外周面に絶縁被覆膜を被覆して
なるボンディング用被覆線を連続的に巻取るローラと、
内部に水銀を貯留しボンディング用被覆線が水銀中を沈
漬通過可能にした水銀槽と、水銀槽の水銀とボンディン
グ用被覆線の金線との間に接続されたコンデンサ容量計
とを備えた手段を採用する。
In addition, the apparatus for measuring the thickness of the insulating coating of the coated wire according to the present invention is a roller that continuously winds the coated wire for bonding formed by coating the outer peripheral surface of the gold wire with the insulating coating film,
It has a mercury tank that stores mercury inside and allows the coated wire for bonding to sink and pass through the mercury, and a capacitor capacity meter connected between the mercury in the mercury tank and the gold wire of the coated wire for bonding. Adopt means.

[作用] 前述の手段によると、方法については、金線の外周面
に絶縁樹脂からなる絶縁被覆膜を被覆したボンディング
用被覆線の構造を利用して、ボンディング用被覆線を水
銀中に沈漬することによりコンデンサを形成してそのコ
ンデンサ容量を検出すると、このコンデンサ容量とこの
外の定値であるコンデンサ面積,絶縁被覆膜の材質の誘
電率等から絶縁被覆膜の膜厚を算出測定することができ
ることから、コンデンサ容量の検出を精密に行なえば絶
縁被覆膜の膜厚の厚薄にかかわらず測定手間等も掛らず
測定精度も良好となるため、絶縁被覆膜の膜厚が極薄で
も精度良く効率的に、かつ非破壊方式で測定することの
できるボンディング用被覆線の絶縁被覆膜厚測定方法を
提供するという目的が達成される。
[Operation] According to the above-mentioned means, the bonding wire is deposited in mercury by utilizing the structure of the bonding wire in which the outer peripheral surface of the gold wire is coated with an insulating coating film made of an insulating resin. When a capacitor is formed by immersion and the capacitance of the capacitor is detected, the thickness of the insulating coating film is calculated and measured from this capacitor capacity and other constant values such as the capacitor area and the dielectric constant of the material of the insulating coating film. Therefore, if the capacitance of the capacitor is accurately detected, regardless of the thickness of the insulating coating film, the measurement accuracy and the measurement accuracy are improved regardless of the thickness of the insulating coating film. An object of the present invention is to provide a method for measuring the thickness of an insulating coating of a coated wire for bonding which can be measured accurately, efficiently, and in a non-destructive manner even when the thickness is extremely thin.

また、装置については、水銀を水銀槽に貯留して、ロ
ーラで巻取られるボンディング用被覆線を水銀中に沈漬
通過するようにしたため前記方法の作用を有効に奏する
外に、長いボンディング用被覆線を連続的に測定する。
In addition, as for the device, mercury is stored in a mercury tank, and the bonding wire wound by a roller is immersed and passed through the mercury. The line is measured continuously.

[実施例] 以下、本発明に係るボンディング用被覆線の絶縁被覆
膜厚測定方法および装置の実施例を図面に基づいて説明
する。
Hereinafter, an embodiment of a method and an apparatus for measuring the thickness of an insulating coating of a coated wire for bonding according to the present invention will be described with reference to the drawings.

第1図〜第4図は、本発明に係るボンディング用被覆
線の絶縁被覆膜厚測定方法および装置の第1実施例を示
すものである。
FIGS. 1 to 4 show a first embodiment of a method and an apparatus for measuring the thickness of an insulation coating on a coating wire for bonding according to the present invention.

この実施例では、第1図に示すように、四弗化エチレ
ン樹脂等で筒形に形成され周壁に相対するスリット11,1
2が設けられた1個の水銀槽1と、水銀槽1内にスリッ
ト11,12へ達するように貯留された水銀(Hg)2と、金
(Au)線31の外周面にポリウレタン等の絶縁樹脂の絶縁
被覆膜32を被覆した測定対象のボンディング用被覆線3
を水銀槽1のスリット11,12に案内して水銀2中に沈漬
する一対のガイドローラ4,5と、導電材で形成され測定
対象のボンディング用被覆線3の端部の金線31が接続さ
れてボンディング用被覆線3を巻取るローラ6と(第2
図参照)、水銀槽1に設けられ水銀2に接触した電極7
と前記ローラ6とに接続したコンデンサ容量計8と、コ
ンデンサ容量計8に接続した記録計9とを備えた装置が
構成されている。
In this embodiment, as shown in FIG. 1, slits 11 and 1 formed in a cylindrical shape with a tetrafluoroethylene resin or the like and facing the peripheral wall.
One mercury tank 1 provided with 2, mercury (Hg) 2 stored in the mercury tank 1 so as to reach the slits 11 and 12, and insulation of polyurethane or the like on the outer peripheral surface of the gold (Au) wire 31. Bonding coated wire 3 to be measured covered with resin insulating coating film 32
And a pair of guide rollers 4 and 5 which are guided into the slits 11 and 12 of the mercury tank 1 to be immersed in the mercury 2, and a gold wire 31 formed at the end of the bonding wire 3 made of a conductive material and to be measured. A roller 6 which is connected and winds the covering wire 3 for bonding;
Electrodes 7 provided in mercury tank 1 and in contact with mercury 2
The apparatus comprises a condenser capacity meter 8 connected to the roller 6 and the roller 6, and a recorder 9 connected to the capacitor capacity meter 8.

この装置では、ローラ6を回転するとこれにボンディ
ング用被覆線3が巻取られるが、ボンディング用被覆線
3は巻取られる途中においてガイドローラ4,5に案内さ
れて水銀槽1のスリット11,12を通って水銀2に沈漬通
過することになる。従って、水銀槽1においては、第3
図に示すように、ボンディング用被覆線3の金線31側と
水銀2側との間にボンディング用被覆線3の絶縁被覆膜
32が介装された構造のコンデンサCが形成されることに
なる。
In this apparatus, when the roller 6 is rotated, the covering wire for bonding 3 is wound thereon. The covering wire for bonding 3 is guided by the guide rollers 4 and 5 during the winding and is slit by the slits 11 and 12 of the mercury tank 1. Immersed and passed through the mercury 2. Therefore, in the mercury tank 1, the third
As shown in the figure, an insulating coating film of the bonding wire 3 is provided between the gold wire 31 side and the mercury 2 side of the bonding wire 3.
A capacitor C having a structure in which 32 is interposed is formed.

このため、コンデンサ容量計8から電圧を掛けてこの
コンデンサCのコンデンサ容量を測定することができ
(第4図参照)、このコンデンサ容量とこの外の定値と
からボンディング用被覆線3の絶縁被覆膜32の膜厚を算
出測定することができる。
Therefore, the capacitance of the capacitor C can be measured by applying a voltage from the capacitor capacitance meter 8 (see FIG. 4), and the insulation coating of the bonding wire 3 is determined based on the capacitance and the other constant value. The thickness of the film 32 can be calculated and measured.

即ち、コンデンサ容量(C)は次式の関係を有する。 That is, the capacitor capacity (C) has the following relationship.

ただし、εは真空の誘電率であり、8.854×10
-12(F/M)の定値で表わされる。
Here, ε 0 is the dielectric constant of vacuum, and 8.854 × 10
-12 (F / M).

また、εはボンディング用被覆線3の絶縁被覆膜32
の誘電率であり、材質をポリウレタンとすると3.79であ
ることが知られている。
Ε r is the insulating coating film 32 of the bonding wire 3.
It is known that the dielectric constant is 3.79 when the material is polyurethane.

また、Sはコンデンサ面積であり、ボンディング用被
覆線3の絶縁被覆膜32の膜厚が極薄であるためコンデン
サCを構成する部分のボンディング用被覆線3の金線31
側と水銀2側との面積が近似するものとして、測定対象
となるボンディング用被覆線3の金線31の直径が30μで
水銀槽の内径が8mmとすると、π・30μ×10-6・8mm×10
-3=0.754×10-6となる。
S is the area of the capacitor, and since the thickness of the insulating coating film 32 of the covering wire 3 for bonding is extremely thin, the gold wire 31 of the covering wire 3 for bonding constituting the capacitor C is formed.
Assuming that the area of the mercury 2 side is similar to that of the mercury 2 side, if the diameter of the gold wire 31 of the bonding wire 3 to be measured is 30 μm and the inner diameter of the mercury tank is 8 mm, π · 30μ × 10 −6・ 8 mm × 10
-3 = 0.754 x 10-6 .

また、dはボンディング用被覆線3の絶縁被覆膜32の
膜厚である。
D is the thickness of the insulating coating film 32 of the bonding coating wire 3.

上記(a)式は、次のように変換される。 The above equation (a) is converted as follows.

この(b)式に前記定値等を代入すると、次のように
なる。
Substituting the constant values and the like into the equation (b) yields the following.

従って、次式が得られる。 Therefore, the following equation is obtained.

このため、前記装置構成へ測定対象となるボンディン
グ用被覆線3へ配設さえすれば、コンデンサ容量計8で
コンデンサ容量を検出するだけで、(c)式から簡単に
ボンディング用被覆線3の絶縁被覆膜32の膜厚を算出測
定することができる。なお、この算出測定の数値は、コ
ンデンサ容量計8の精度が精密であれば、かなり精度の
高いものとなる。
For this reason, as long as it is disposed on the bonding wire 3 to be measured in the above-described apparatus configuration, the insulation of the bonding wire 3 can be easily obtained from the equation (c) simply by detecting the capacitor capacitance with the capacitor capacitance meter 8. The thickness of the coating film 32 can be calculated and measured. It should be noted that the numerical value of this calculation and measurement is considerably high if the accuracy of the capacitor capacitance meter 8 is precise.

また、前記装置構成の実施例によると、ローラ6の回
転によりボンディング用被覆線3の全線に渡り連続的に
測定し、測定数値の変化を記録計9に記録することがで
きる。
Further, according to the embodiment of the above-described apparatus configuration, the measurement can be continuously performed over the entirety of the bonding covered wire 3 by the rotation of the roller 6, and a change in the measured value can be recorded in the recorder 9.

第5図,第6図は、本発明に係るボンディング用被覆
線の絶縁被覆膜厚測定方法および装置の第2実施例を示
すものである。
FIGS. 5 and 6 show a second embodiment of the method and the apparatus for measuring the thickness of the insulation coating of the coating wire for bonding according to the present invention.

この実施例では、第1実施例におけるコンデンサCを
直列に大小2個C1,C2接続してある。
In this embodiment, two large and small capacitors C 1 and C 2 are connected in series with the capacitor C of the first embodiment.

この実施例によると、測定ノイズが消去され測定精度
が向上する利点がある。
According to this embodiment, there is an advantage that measurement noise is eliminated and measurement accuracy is improved.

第7図,第8図は、本発明に係るボンディング用被覆
線の絶縁被覆膜厚測定方法および装置の第3実施例を示
すものである。
FIGS. 7 and 8 show a third embodiment of the method and the apparatus for measuring the thickness of the insulation coating of the coating wire for bonding according to the present invention.

この実施例では、第2実施例のコンデンサC1,C2に加
えて、さらに小型のコンデンサC3を並列に接続してあ
る。
In this embodiment, in addition to the capacitor C 1, C 2 of the second embodiment, are further connected to the capacitor C 3 of small parallel.

この実施例によると、測定ノイズがさらに有効に消去
され、測定精度がさらに向上する利点がある。
According to this embodiment, there is an advantage that the measurement noise is more effectively eliminated and the measurement accuracy is further improved.

以上、図示した実施例の外に、本発明に係るボンディ
ング用被覆線の絶縁被覆膜厚測定方法の実施にあたって
は、必ずしもローラ6によるボンディング用被覆線3の
巻取りで連続的に測定する必要はないものである。
As described above, in addition to the illustrated embodiment, in performing the method for measuring the thickness of the insulating coating of the coated wire for bonding according to the present invention, it is always necessary to continuously measure the winding of the coated wire 3 with the roller 6. Is not something.

また、本発明に係るボンディング用被覆線の絶縁被覆
膜厚測定装置では、コンデンサ容量計8のボンディング
用被覆線3の金線31等への接続を他の接続構造で行なう
ことも可能である。
Further, in the apparatus for measuring the thickness of the insulating coating of the coated wire for bonding according to the present invention, the connection of the coated wire 3 for bonding of the capacitor 8 to the gold wire 31 or the like can be performed by another connection structure. .

[発明の効果] 以上のように本発明に係るボンディング用被覆線の絶
縁被覆膜厚測定方法は、ボンディング用被覆線の構造を
利用してコンデンサを形成して、検出したコンデンサ容
量とこの外の定値等とでボンディング用被覆線の絶縁被
覆膜の膜厚を算出測定することから、コンデンサ容量の
検出を精密に行なえば絶縁被覆膜の膜厚の膜薄にかかわ
らず測定手間等も掛らず測定精度も良好となるため、絶
縁被覆膜の膜厚が極薄でも精度良く効率的に測定するこ
とができる効果があり、しかも非破壊方式で測定でき
る。
[Effects of the Invention] As described above, the method for measuring the thickness of the insulation coating of the coated wire for bonding according to the present invention uses the structure of the coated wire for bonding to form a capacitor, and detects the detected capacitor capacitance and the external capacitance. Calculate and measure the thickness of the insulation coating film of the bonding wire with the constant value of the above.If the capacitance of the capacitor is precisely detected, the measurement time and so on will be irrespective of the thickness of the insulation coating film. Since the measurement accuracy is improved without being applied, there is an effect that the measurement can be performed accurately and efficiently even when the thickness of the insulating coating film is extremely thin, and the measurement can be performed in a nondestructive manner.

さらに、本発明に係るボンディング用被覆線の絶縁被
覆膜厚測定は、前述の方法の効果達成に寄与することに
加えて、ローラでボンディング用被覆線を巻取ることに
より、ボンディング用被覆線の全線において連続的に測
定することができる効果がある。また、この効果によ
り、ボンディング用被覆線の絶縁被覆膜の膜厚の均等性
の度合等を把握することができる効果が生ずる。
Furthermore, in addition to contributing to the achievement of the effects of the above-described method, the measurement of the insulating coating film thickness of the bonding coated wire according to the present invention can be performed by winding the bonding coated wire with a roller. There is an effect that measurement can be continuously performed on all lines. Further, this effect produces an effect that the degree of uniformity of the film thickness of the insulating coating film of the coating wire for bonding can be grasped.

【図面の簡単な説明】[Brief description of the drawings]

第1図は本発明に係るボンディング用被覆線の絶縁被覆
膜厚測定方法および装置の第1実施例を示す斜視図,第
2図は第1図の要部拡大断面図、第3図は第1図の他の
要部の構造原理を示す断面図、第4図は第3図の電気回
路図,第5図は本発明に係るボンディング用被覆線の絶
縁被覆膜厚測定方法および装置の第2実施例を示す斜視
図、第6図は第5図の電気回路図、第7図は本発明に係
るボンディング用被覆線の絶縁被覆膜厚測定方法および
装置の第3実施例を示す斜視図、第8図は第7図の電気
回路図である。 1……水銀槽 2……水銀 3……ボンディング用被覆線 31……金線 32……絶縁被覆膜 6……ローラ 8……コンデンサ容量計 C……コンデンサ(コンデンサ容量)
FIG. 1 is a perspective view showing a first embodiment of a method and an apparatus for measuring the thickness of an insulation coating on a coating wire for bonding according to the present invention, FIG. 2 is an enlarged sectional view of a main part of FIG. 1, and FIG. FIG. 4 is a cross-sectional view showing the principle of the structure of another main part of FIG. 1, FIG. 4 is an electric circuit diagram of FIG. 3, and FIG. FIG. 6 is an electric circuit diagram of FIG. 5, and FIG. 7 is a third embodiment of a method and an apparatus for measuring the thickness of an insulation coating on a bonding wire according to the present invention. FIG. 8 is an electric circuit diagram of FIG. 1 ... Mercury tank 2 ... Mercury 3 ... Coating wire for bonding 31 ... Gold wire 32 ... Insulating coating film 6 ... Roller 8 ... Capacitor capacitance meter C ... Capacitor (capacitor capacity)

フロントページの続き (56)参考文献 特公 昭27−4230(JP,B1) (58)調査した分野(Int.Cl.6,DB名) G01B 7/08Continuation of the front page (56) References JP-B 27-4230 (JP, B1) (58) Fields investigated (Int. Cl. 6 , DB name) G01B 7/08

Claims (2)

(57)【特許請求の範囲】(57) [Claims] 【請求項1】金線の外周面に絶縁被覆膜を被覆してなる
ボンディング用被覆線を水銀に沈漬して、ボンディング
用被覆線の金線側と水銀側との間にボンディング用被覆
線の絶縁被覆膜が介装された構造のコンデンサを形成
し、このコンデンサ容量を検出することによりボンディ
ング用被覆線の絶縁被覆膜の膜厚を算出測定することを
特徴とするボンディング用被覆線の絶縁被覆膜厚測定方
法。
1. A bonding wire having an outer peripheral surface coated with an insulating coating film is immersed in mercury, and a bonding coating is provided between the gold wire side and the mercury side of the bonding wire. Forming a capacitor having a structure in which a wire insulating coating film is interposed, and calculating and measuring the thickness of the insulating coating film of the bonding coating wire by detecting the capacitance of the capacitor; Measurement method of insulation coating thickness of wire.
【請求項2】金線の外周面に絶縁被覆膜を被覆してなる
ボンディング用被覆線を連続的に巻取るローラと、内部
に水銀を貯留しボンディング用被覆線が水銀中を沈漬通
過可能にした水銀槽と、水銀槽の水銀とボンディング用
被覆線の金線との間に接続されたコンデンサ容量計とを
備えてなるボンディング用被覆線の絶縁被覆膜厚測定装
置。
A roller for continuously winding a bonding wire formed by coating an outer peripheral surface of a gold wire with an insulating coating film; a mercury stored inside the bonding wire; the bonding wire is immersed in the mercury; An apparatus for measuring the thickness of an insulated coating of a coated wire for bonding, comprising: a mercury tank that is enabled; and a capacitor capacitance meter connected between the mercury in the mercury tank and the gold wire of the coated wire for bonding.
JP1180028A 1989-07-11 1989-07-11 Method and apparatus for measuring insulation coating thickness of coated wire for bonding Expired - Lifetime JP2824281B2 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1180028A JP2824281B2 (en) 1989-07-11 1989-07-11 Method and apparatus for measuring insulation coating thickness of coated wire for bonding

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1180028A JP2824281B2 (en) 1989-07-11 1989-07-11 Method and apparatus for measuring insulation coating thickness of coated wire for bonding

Publications (2)

Publication Number Publication Date
JPH0344502A JPH0344502A (en) 1991-02-26
JP2824281B2 true JP2824281B2 (en) 1998-11-11

Family

ID=16076210

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1180028A Expired - Lifetime JP2824281B2 (en) 1989-07-11 1989-07-11 Method and apparatus for measuring insulation coating thickness of coated wire for bonding

Country Status (1)

Country Link
JP (1) JP2824281B2 (en)

Also Published As

Publication number Publication date
JPH0344502A (en) 1991-02-26

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